PRODUCT SELECTION GUIDE

2014 PRODUCT SELECTION GUIDE
Mobile DRAM
Specialty DRAM
Code Storage Flash Memory
Winbond
Electronics Corporation is a worldwide leading supplier of specialty memory IC’s.
The company provides memory solution backed by the expert capabilities of design, manufacturing
and sales services.
Winbond’s
product portfolio, consisting of Mobile DRAM, Specialty DRAM and Code
Storage Flash, is widely used by tier-1 customers in consumer, communication, computer
peripheral and automotive markets. Our 300 mm wafer fab keeps pace with advanced process
technologies to provide high-quality memory IC products.
The Company was established in September 1987 and listed on Taiwan Stock Exchange in 1995
with headquarter in Central Taiwan Science Park, Taichung, Taiwan . Winbond also has subsidiaries in China, Hong Kong, Israel, Japan and the US.
CONTENTS
Mobile DRAM
Low Power SDR SDRAM
Low Power DDR SDRAM
Low Power DDR2 SDRAM
Pseudo SRAM
KGD
Specialty DRAM
03
05
06
07
08
SDRAM
DDR SDRAM
DDR2 SDRAM
DDR3 SDRAM
KGD
Code Storage Flash Memory
11
13
14
16
16
Serial Flash
Parallel Flash
NAND Flash
KGD
17
23
26
26
Mobile DRAM
The products listed above may not be available for all regions.
Please contact your local Winbond Sales Representative.
Low Power SDR SDRAM
Low Power DDR SDRAM
Low Power DDR2 SDRAM
Pseudo SRAM
KGD
Winbond Electronics Corporation is a leading supplier of semiconductor solutions to the consumer, computer,
communications, and electronics product markets. With the latest Buried World Line technology, Winbond
developed the mobile DRAM devices with a low IDD current value, which helps Winbond to extend mobile
DRAM memory applications beyond the mobile phone and tablet market to areas of mobile consumer
electronics and mobile communication.
Winbond mobile DRAM devices support both x16 and x32 data widths. Major features for the families of
products shown in the table below include the following: Sequential or Interleave burst、High Clock rate、
Standard Self Refresh、Partial-Array Self Refresh (PASR)、Automatic Temperature Compensated Self Refresh
Rate(ATCSR)、Deep Power-Down (DPD)、Programmable output buffer driver strength、and Temperature
sensor output (TQ). Please refer to the datasheets for specific features. They are ideal for portable
multimedia players, eBook Readers, automotive applications, consumer electronics, gaming devices, and mobile
devices.
01
www.winbond.com
Product
Density
I/O
Ball count
LPSDR
128Mb - 1Gb
LPDDR
128Mb - 1Gb
LPDDR2
256Mb - 2Gb
X16 / X32
PSRAM
64Mb- 256Mb
X16
Type
Dimension
X16
54
BGA
8x9
JEDEC standard
X32
90
BGA
8x13
JEDEC standard
X16
60
BGA
8x9
JEDEC standard
X32
90
BGA
8x13
JEDEC standard
168
PoP
12x12
JEDEC standard
134
BGA
10x11.5
JEDEC standard
54
BGA
6x8
-
SDRx16_54BGA
DDRx16_60BGA
SDR/DDRx32_90BGA
9 mm
13 mm
8 mm
8 mm
9 mm
8 mm
LPDDR2_168WFBGA
LPDDR2_134 VFBGA
11.5 mm
10 mm
12 mm
12 mm
Remark
擔當
創新
群效
Accountability / Innovation / Teamwork
02
Mobile DRAM
Low Power SDR SDRAM
128Mb LPSDR (PKG)
Part No.
Organization
W987D6HBGX
8Mbit x16
W987D2HBJX
4Mbit x32
W987D6HBGA
8Mbit x16
W987D2HBJA
4Mbit x32
Voltage
Speed Grade
Package
133 / 166 MHz
-25~85c / -40~85c
54VFBGA
133 / 166 MHz
-40~85c / -40~105c
54VFBGA (SAC305)
Speed Grade
Package
133 / 166 MHz
-25~85c / -40~85c
54VFBGA
133 / 166 MHz
-40~85c / -40~105c
54VFBGA (SAC305)
Speed Grade
Package
133 / 166 MHz
-25~85c / -40~85c
54VFBGA
133 / 166 MHz
-40~85c / -40~105c
54VFBGA (SAC305)
Speed Grade
Package
133 / 166 MHz
-25~85c / -40~85c
54VFBGA
133 / 166 MHz
-40~85c / -40~105c
54VFBGA (SAC305)
1.8V / 1.8V
90VFBGA
90VFBGA (SAC305)
Status1,2
Automotive
P
-
P
P
Status1,2
Automotive
P
-
P
S (Q2/'14)
Status1,2
Automotive
P
-
P
P
Status1,2
Automotive
S (Q2/'14)
-
S (Q2/'14)
S (Q2/'14)
256Mb LPSDR (PKG)
Part No.
Organization
W988D6FBGX
16Mbit x16
W988D2FBJX
8Mbit x32
W988D6FBGA
16Mbit x16
W988D2FBJA
8Mbit x32
Voltage
1.8V / 1.8V
90VFBGA
90VFBGA (SAC305)
512Mb LPSDR (PKG)
Part No.
Organization
W989D6KBGX
32Mbit x16
W989D2KBJX
16Mbit x32
W989D6KBGA
32Mbit x16
W989D2KBJA
16Mbit x32
Voltage
1.8V / 1.8V
90VFBGA
90VFBGA (SAC305)
1Gb LPSDR (PKG)
Part No.
Organization
W98AD6KBGX
64Mbit x16
W98AD2KBJX
32Mbit x32
W98AD6KBGA
64Mbit x16
W98AD2KBJA
32Mbit x32
Voltage
1.8V / 1.8V
90VFBGA
90VFBGA (SAC305)
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
03
www.winbond.com
Low Power DDR SDRAM
128Mb LPDDR (PKG)
Part No.
Organization
W947D6HBHX
8Mbit x16
W947D2HBJX
4Mbit x32
W947D6HBHA
8Mbit x16
W947D2HBJA
4Mbit x32
Voltage
Speed Grade
Package
166 / 200 MHz
-25~85c / -40~85c
60VFBGA
166 / 200 MHz
-40~85c / -40~105c
60VFBGA (SAC305)
Speed Grade
Package
166 / 200 MHz
-25~85c / -40~85c
60VFBGA
166 / 200 MHz
-40~85c / -40~105c
60VFBGA (SAC305)
1.8V / 1.8V
90VFBGA
90VFBGA (SAC305)
Status1,2
Automotive
P
-
P
P
Status1,2
Automotive
P
-
P
S (Q2/'14)
256Mb LPDDR (PKG)
Part No.
Organization
W948D6FBHX
16Mbit x16
W948D2FBJX
8Mbit x32
W948D6FBHA
16Mbit x16
W948D2FBJA
8Mbit x32
Voltage
1.8V / 1.8V
90VFBGA
90VFBGA (SAC305)
擔當
創新
群效
Accountability / Innovation / Teamwork
04
Mobile DRAM
512Mb LPDDR (PKG)
Part No.
Organization
W949D6KBHX
32Mbit x16
W949D2KBJX
16Mbit x32
W949D6KBHA
32Mbit x16
W949D2KBJA
16Mbit x32
Voltage
Speed Grade
Package
166 / 200 MHz
-25~85c / -40~85c
60VFBGA
166 / 200 MHz
-40~85c / -40~105c
60VFBGA (SAC305)
Speed Grade
Package
166 / 200 MHz
-25~85c / -40~85c
60VFBGA
166 / 200 MHz
-40~85c / -40~105c
60VFBGA (SAC305)
1.8V / 1.8V
90VFBGA
90VFBGA (SAC305)
Status1,2
Automotive
P
-
P
P
Status1,2
Automotive
P
-
P
P
1Gb LPDDR (PKG)
Part No.
Organization
W94AD6KBHX
64Mbit x16
W94AD2KBJX
32Mbit x32
W94AD6KBHA
64Mbit x16
W94AD2KBJA
32Mbit x32
Voltage
1.8V / 1.8V
90VFBGA
90VFBGA (SAC305)
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
Low Power DDR2 SDRAM
256Mb LPDDR2 (PKG)
05
Part No.
Organization
W978H6KBQX
16Mbit x16
W978H2KBQX
8Mbit x32
W978H6KBVX
16Mbit x16
W978H2KBVX
8Mbit x32
W978H6KBQA
16Mbit x16
W978H2KBQA
8Mbit x32
W978H6KBVA
16Mbit x16
W978H2KBVA
8Mbit x32
www.winbond.com
Voltage
Speed Grade
Package
Status1,2
Automotive
S(Q1/'14)
-
S(Q1/'14)
S (Q1/'14)
168 PoP
333 / 400 MHz
-25~85c / -40~85c
134 BGA
1.8V / 1.2V
168 PoP (SAC305)
333 / 400 MHz
-40~85c / -40~105c
134 BGA (SAC305)
512Mb LPDDR2 (PKG)
Part No.
Organization
W979H6KBQX
32Mbit x16
W979H2KBQX
16Mbit x32
W979H6KBVX
32Mbit x16
W979H2KBVX
16Mbit x32
W979H6KBQA
32Mbit x16
W979H2KBQA
16Mbit x32
W979H6KBVA
32Mbit x16
W979H2KBVA
16Mbit x32
Voltage
Speed Grade
Package
Status1,2
168 PoP
P
134 BGA
S(Q1/'14)
168 PoP (SAC305)
P
134 BGA (SAC305)
S(Q1/'14)
Package
Status1,2
Automotive
P
-
P
S (Q1/'14)
Status1,2
Automotive
P
N
Automotive
333 / 400 MHz
-25~85c / -40~85c
-
1.8V / 1.2V
333 / 400 MHz
-40~85c / -40~105c
S (Q1/'14)
1Gb LPDDR2 (PKG)
Part No.
Organization
W97AH6KBQX
64Mbit x16
W97AH2KBQX
32Mbit x32
W97AH6KBVX
64Mbit x16
W97AH2KBVX
32Mbit x32
W97AH6KBQA
64Mbit x16
W97AH2KBQA
32Mbit x32
W97AH6KBVA
64Mbit x16
W97AH2KBVA
32Mbit x32
Voltage
Speed Grade
168 PoP
333 / 400 MHz
-25~85c / -40~85c
134 BGA
1.8V / 1.2V
168 PoP (SAC305)
333 / 400 MHz
-40~85c / -40~105c
134 BGA (SAC305)
2Gb LPDDR2 (PKG)
Part No.
Organization
W97BH6KBQX
128Mbit x16
W97BH2KBQX
64Mbit x32
W97BH6KBVX
128Mbit x16
W97BH2KBVX
64Mbit x32
Voltage
Speed Grade
1.8V / 1.2V
333 / 400 MHz
-25~85c / -40~85c
Package
168 PoP
134 BGA
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
擔當
創新
群效
Accountability / Innovation / Teamwork
06
Mobile DRAM
Pseudo SRAM
64Mb Pseudo SRAM (PKG)
Part No.
Organization
W966D6HBG
4Mbit x16 CRAM
W956D6HBC
4Mbit x16 CRAM-ADM
Voltage
Speed Grade
Package
Status1,2
Automotive
1.8V / 1.8V
133MHz / 70ns
-40~85c
54VFBGA
P
-
Voltage
Speed Grade
Package
Status1,2
Automotive
1.8V / 1.8V
133MHz / 70ns
-40~85c
54VFBGA
P
-
Voltage
Speed Grade
Package
Status1,2
Automotive
1.8V / 1.8V
133MHz / 70ns
-40~85c
54VFBGA
P
-
128Mb Pseudo SRAM (PKG)
Part No.
Organization
W967D6HBG
8Mbit x16 CRAM
W957D6HBC
8Mbit x16 CRAM-ADM
256Mb Pseudo SRAM (PKG)
Part No.
Organization
W968D6DAG
16Mbit x16 CRAM
W958D6DBC
16Mbit x16 CRAM-ADM
Status1: P= Mass Production, S (Time)= Samples (Ready Time), UD (Time)= Under Development (Ready Time), N= Not recommended for new designs
RoHS2: All Winbond products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
07
www.winbond.com
KGD
Fully Cover all Consumer Application:
PND/GPS、Smart Phone、Industy PDA/POS、E-Reader、Portable Game Console、3.5G/4G Data Card、AP Router、Pico Porjecter、
Automotive、Touch Model、Smart TV、Smart Grid、Monitor System、IP Cam…etc. Providing KGD serves to SiP customers with complete
mobile DRAM product such as Mobile SDR、Mobile DDR、Mobile DDR2、pSRAM
Provide Diversification of Low Power Consumption Product:
Support DRAM density as:
-LPSDR/LPDDR: 128Mb to 1Gb
-LPDDR2: 256Mb to 2Gb
-pSRAM: 32Mb to 256Mb
and support steable, lower power consumption for mobile application
Wafer Level high Speed test:
Up to mobile SDR 333Mbps, mobile DDR1 400Mbps, mobile DDR2 1066Mbps, pSRAM 266Mbps
Winbond provides professional advices to KGD customers, including SiP package bonding & power.thermal, mobile DRAM simulation…etc
Excellent Quality Control:
100% Burn-In and Test, and qualification of AEC-Q100、TS16949、ISO9001/14001、OHSAS18001 for automotive customers
Product Life Time and Strong Engineering Support:
Owning a 12-inch Fab to quarantee stable long term support with EFA/PFA capability
Contact us: [email protected]
擔當
創新
群效
Accountability / Innovation / Teamwork
08
Specialty DRAM
The products listed above may not be available for all regions.
Please contact your local Winbond Sales Representative.
Density
•16~256Mb SDR
•32~256Mb DDR
•128Mb~2Gb DDR2
•1~2Gb DDR3
•1Gb GDDR3
09
www.winbond.com
Speed
•SDR-200
•DDR-500
•DDR2-1066
•DDR3-1600
•GDDR3-2000
SDRAM
DDR SDRAM
DDR2 SDRAM
DDR3 SDRAM
KGD
Package
•JEDEC standard
•Special BGA package support on SDR and DDR
for portable devices.
Interface
•x16/x32 SDR/DDR
•x8/x16 DDR2/DDR3
•x32 GDDR3
Support customized KGD solutions including RDL
& wild range power domains
I-temp/Automotive support on SDR/DDR/DDR2/
DDR3 products
擔當
創新
群效
Accountability / Innovation / Teamwork
10
Specialty DRAM
SDRAM
16Mb SDRAM
Part No.
Organization
W9816G6IB
1Mbit x16 W9816G6IH
1Mbit x16 Voltage
Speed Grade
3.3V±0.3V
-6/-6I
2.7V~3.6V
-7
3.3V±0.3V
2.7V~3.6V
W9816G6JH
1Mbit x16 3.3V±0.3V
Package
Status1,2
Automotive
VFBGA 60
P
P
TSOPII 50
P
P
TSOPII 50
UD(Q1/'14)
UD(Q2/'14)
Package
Status1,2
Automotive
TSOPII 86
P
P
VFBGA 60
P
P
TSOPII 54
P
P
TFBGA 54
P
P
TSOP II 54
P
S(Q2/'14)
-5
-6/-6I
-7/-7I
-5
-6/-6I
2.7V~3.6V
-7/-7I
Voltage
Speed Grade
64Mb SDRAM
Part No.
Organization
W9864G2JH
2Mbit x32
W9864G6JB
4Mbit x16
W9864G6JH
4Mbit x16
W9864G6JT
4Mbit x16
W9864G6KH
4Mbit x16
3.3V±0.3V
2.7V~3.6V
-7
3.3V±0.3V
-6/-6I/-6A
2.7V~3.6V
-7
3.3V±0.3V
www.winbond.com
-5
-6/-6I/-6A
2.7V~3.6V
-7/-7S
3.3V±0.3V
-6/-6I/-6A/-6K
3.3V±0.3V
2.7V~3.6V
11
-5
-6/-6I/-6A
-5
-6/6I
-7
128Mb SDRAM
Part No.
Organization
Voltage
W9812G6JB
8Mbit x16 3.3V±0.3V
W9812G6JH
8Mbit x16
3.3V±0.3V
Speed Grade
-6/-6I
-75/75I
Package
Status1,2
Automotive
TFBGA 54
P
P
TSOP II 54
P
P
TSOP II 54
P
S(Q2/'14)
Package
Status1,2
Automotive
TFBGA 90
P
P
TFBGA 54
P
P
TSOP II 54
P
P
-5
-6/-6I/-6A/-6K
-75
W9812G6KH
8Mbit x16
3.3V±0.3V
-5
-6/6I
2.7V~3.6V
-75
Voltage
Speed Grade
3.3V±0.3V
-6
256Mb SDRAM
Part No.
W9825G2JB
W9825G6JB
Organization
8Mbit x32 16Mbit x16
2.7V~3.6V
3.3V±0.3V
-6I
-75/75I
-6/-6I/-6A/-6K
-75
-5
W9825G6JH
16Mbit x16
3.3V±0.3V
-6/-6I/-6L/-6A/-6K
-75/75L
Status1: P= Mass Production, S(Time)=Samples(Ready Time), UD (Time)= Under Development(Ready Time), N=Not Recommended For New Design.
RoHS2 : All Winbond products are "Green", Halogen-Free and RoSH compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
擔當
創新
群效
Accountability / Innovation / Teamwork
12
Specialty DRAM
DDR SDRAM
64Mb DDR
Part No.
Organization
W9464G6JH
4Mbitx16 W9464G6KH
4Mbitx16
Voltage
Speed Grade
2.4V~2.7V
-4
2.5V±0.2V
-5/-5I
2.4V~2.7V
-4
2.5V±0.2V
-5/-5I
Voltage
Speed Grade
2.4V~2.7V
-4
2.5V±0.2V
-5/-5I
2.4V~2.7V
-4
Package
Status1,2
Automotive
TSOPII 66
P
P
TSOPII 66
P
S(Q2/'14)
Package
Status1,2
Automotive
TFBGA 60
P
P
TSOPII 66
P
P
TSOPII 66
P
S(Q2/'14)
128Mb DDR
Part No.
Organization
W9412G6JB
8Mbitx16
W9412G6JH
8Mbitx16
W9412G6KH
8Mbitx16
2.5V±0.2V
-5/-5I/-5K
-6I
2.4V~2.7V
-4
2.5V±0.2V
-5/-5I
256Mb DDR
Part No.
Organization
Voltage
Speed Grade
Package
Status1,2
Automotive
W9425G6JB
16Mbitx16
2.5V ±0.2V
-5/-5I
TFBGA 60
P
P
2.4V~2.7V
-4
2.5V ±0.2V
-5/-5I/-5A
TSOPII 66
P
P
W9425G6JH
16Mbitx16
Status1: P= Mass Production, S(Time)=Samples(Ready Time), UD (Time)= Under Development(Ready Time), N=Not Recommended For New Design.
RoHS2: All Winbond products are "Green", Halogen-Free and RoSH compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
13
www.winbond.com
DDR2 SDRAM
128Mb DDR2
Part No.
Organization
Voltage
Speed Grade
Status1,2
Package
Automotive
-18
W9712G6KB
8Mbitx16
1.8V±0.1V
-25/25I
P
TFBGA 84
P
-3
-18
W9712G8JB
16Mbitx8 1.8V±0.1V
-25
WBGA 60
P
P
Package
Status1,2
Automotive
TFBGA 128
P
P
WBGA 84
P
P
WBGA 60
P
P
Package
Status1,2
Automotive
WBGA 84
P
P
WBGA 60
P
P
-3
256Mb DDR2
Part No.
Organization
Voltage
W9725G2JB
8Mbitx32
1.8V±0.1V
Speed Grade
-25
-3
-18
W9725G6KB
16Mbitx16
1.8V±0.1V
-25/25I/25A/25K
-3
-18
W9725G8KB
32Mbitx8
1.8V±0.1V
-25
-3
512Mb DDR2
Part No.
Organization
Voltage
Speed Grade
-18
W9751G6KB
32Mbitx16
1.8V±0.1V
-25/25I/25A/25K
-3
-18
W9751G8KB
64Mbitx8
1.8V±0.1V
-25/25I
-3
擔當
創新
群效
Accountability / Innovation / Teamwork
14
Specialty DRAM
1Gb DDR2
Part No.
Organization
Voltage
Speed Grade
W971GG6JB
64Mbitx16
1.8V±0.1V
-25/25I/25L/25A/25K
Package
Status1,2
Automotive
WBGA 84
P
P
WBGA 84
P
UD
WBGA 60
P
P
WBGA 60
P
UD
-18
-3/-3A
-18
W971GG6KB
64Mbitx16
1.8V±0.1V
-25/25I
-3
-18
W971GG8JB
128Mbitx8
1.8V±0.1V
-25/25I/25A/25K
-3
-18
W971GG8KB
128Mbitx8
1.8V±0.1V
-25/25I
-3
2Gb DDR2
Part No.
Organization
Voltage
Speed Grade
Package
Status1,2
Automotive
WBGA 84
P
P
WBGA 60
P
P
-18
W972GG6JB
128Mbitx16
1.8V±0.1V
-25/25I/25A/25K -3/-3A
-18
W972GG8JB
256Mbitx8
1.8V±0.1V
-25/25I
-3
Status1: P= Mass Production, S(Time)=Samples(Ready Time), UD (Time)= Under Development(Ready Time), N=Not Recommended For New Design.
RoHS2: All Winbond products are "Green", Halogen-Free and RoSH compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
15
www.winbond.com
DDR3 SDRAM
1Gb DDR3
Part No.
Organization
Voltage
Speed Grade
Status1,2
Package
Automotive
-11
W631GG6KB
64Mbitx16
1.5V±0.075V
-12/12I/12A/12K
P
WBGA 96
P
-15/15I/15A/15K
-11
W631GG8KB
128Mbitx8
1.5V±0.075V
-12
WBGA 78
P
P
WBGA 96
P
P
WBGA 78
P
P
Package
Status1,2
Automotive
-15/15I
W631GU6KB 64Mbitx16
1.283V to 1.45V
W631GU8KB
128Mbitx8
1.283V to 1.45V
Organization
Voltage
-12/12I/12A/12K
-15/15I/15A/15K
-12/12I/12A/12K
-15/15I/15A/15K
2Gb DDR3
Part No.
Speed Grade
-11
W632GG6KB
128Mbitx16
1.5V±0.075V
-12/12I
P
WBGA 96
P
-15/15I/15A/15K
-11
W632GG8KB
256Mbitx8
1.5V±0.075V
-12/12I/12A/12K
WBGA 78
P
P
WBGA 96
P
P
WBGA 78
P
P
-15/15I/15A/15K
-12/12I/12A/12K
W632GU6KB 128Mbitx16
1.283V to 1.45V
W632GU8KB 256Mbitx8
1.283V to 1.45V
Part No.
Organization
Voltage
Speed Grade
Package
Status1,2
Automotive
W641GG2KB 32Mbitx32
1.8V±0.1V
-12/-14
WBGA 136
P
-
-15/15I/15A/15K
-12/12I/12A/12K
-15/15I/15A/15K
1Gb GDDR3
Status1: P= Mass Production, S(Time)=Samples(Ready Time), UD (Time)= Under Development(Ready Time), N=Not Recommended For New Design.
RoHS2: All Winbond products are "Green", Halogen-Free and RoSH compliant packaging. Refer to the datasheet for details and specifications.
Contact us: [email protected]
KGD
Fully Cover all Consumer Applications:
TV, STB, Networking, Storage, Printer, DSC/DV, GPS, Automotive…etc.
Providing KGD services to SiP customers with complete DRAM product portfolio such as SDRAM, DDR, DDR2, DDR3.
Wafer Level high speed test:
Up to DDR3 1600Mbps, DDR2 1066Mbps, DDR 500Mbps.
Winbond provides professional advices to KGD customers, including SiP package bonding & power/thermal, DRAM simulation,…etc.
Excellent KGD Quality Control:
With AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates for automotive customers.
Owning one 12-inch Fab6 to guarantee stable long-term delivery.
Please Contact [email protected]
擔當
創新
群效
Accountability / Innovation / Teamwork
16
Code Storage Flash Memory
The products listed above may not be available for all regions.
Please contact your local Winbond Sales Representative.
Serial Flash
Parallel Flash
NAND Flash
KGD
Serial Flash
SpiFlash® Memories with SPI, Dual-SPI, Quad-SPI and QPI
Winbond's W25X and W25Q SpiFlash® Multi-I/O Memories feature the popular Serial Peri pheral Interface (SPI),
densities from 512M-bit to 512K-bit, small erasable sectors and the industry's highest performance. The W25X
family supports Dual-SPI effectively doubling standard SPI clock rates. The W25Q family is a "superset" of the
25X family with Dual-I/O and Quad-I/O SPI for even higher performance. Clock rates up to 104MHz achieve
an equivalent of 416MHz (50M-Byte/S transfer rate) when using Quad-SPI. This is more than eight times the
performance of ordinary Serial Flash (50MHz) and even surpasses asynchronous Parallel Flash memories while
using fewer pins and less space. Faster transfer rates mean controllers can execute code (XIP) directly from
the SPI interface or further improve boot time when shadowing code to RAM. Additionally, some SpiFlash
devices offer the new Quad Peri pheral Interface (QPI) supporting true Quad Commands for improved XIP
performance and simpler controller circuitry. Additionally, new ultra-small form factor packages are ideal for
space constrained mobile and handheld applications.
17
www.winbond.com
Leading the Serial Flash Market in unit sales and revenue, Winbond TS16949 certified AEC-Q100
qualified memories now support automotive applications. The automobile has transformed into
the most sophisticated electronic device in the market. Digital displays in automotive dashboards
provide more information about the car, and improve safety. Instant-on and real time 2D/3D image
rendering is achieved with fast processors and SpiFlash memories. ADAS (Advanced Driver Assist
Systems), comfort, entertainment, and navigation is now available in the center console and this is
addressed with SpiFlash memories using small packages for space constrained systems and high
density for advanced applications. Please contact Winbond for automotive datasheet and support.
Tiny Serial Flash Packages
Winbond Industrial and Automotive Grade Memory
Temperature
Range
Part#
Example
Industrial
Industrial
Plus
Automotive
Grade 3
Automotive
Grade 2
-40℃~85℃
-40℃~105℃
-40℃~85℃
-40℃~105℃
W25Q80BVSSIG
W25Q80BVSSJG W25Q80BVSSBG W25Q80BVSSAG
AEC-Q100
Compliant
No
No
Yes
Yes
Change
Control
No
No
Optional
Optional
擔當
創新
群效
Accountability / Innovation / Teamwork
18
Code Storage Flash Memory
512Mbit (64MB)
Part No.
Features
Voltage
Clock (MHz)
Package(s)
Status1,2
Automotive
W25M512JV
Dual/Quad-SPI, QPI,
DTR, Enhanced3
2.7V - 3.6V
104
SOIC16 300mil, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix)
UD UD
256Mbit (32MB)
Part No.
Features
Voltage
Clock (MHz)
Package(s)
Status1,2
Automotive
W25Q256FV
Dual/Quad-SPI, QPI,
Enhanced3
2.7V - 3.6V
104
SOIC16 300mil, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix)
P
UD
W25Q257FV
Dual/Quad-SPI, QPI,
Enhanced3, 4-byte
addressing
2.7V - 3.6V
104
SOIC16 300mil, WSON8 8X6mm
P
N
W25Q256JV
Dual/Quad-SPI, QPI,
DTR, Enhanced3
2.7V - 3.6V
104
SOIC16 300mil, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix)
UD
UD
Voltage
Clock (MHz)
Package(s)
Status1,2
Automotive
P
N
P
N
UD
UD
P
N
128Mbit (16MB)
Part No.
19
Features
W25Q128FV
Dual/Quad-SPI,QPI,
Enhanced3
2.7V - 3.6V
104
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil
W25R128FV
Dual/Quad-SPI,QPI,
RPMC, Enhanced3
2.7V - 3.6V
104
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm,
VSOP8 208mil
W25Q128JV
Dual/Quad-SPI,QPI,
DTR, Enhanced3
2.7V - 3.6V
104
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil
W25Q128FW
Dual/Quad-SPI,QPI,
Enhanced3
1.65V - 1.95V
104
SOIC8 208mil, SOIC16 300mil,
VSOP8 208mil, WSON 6X5mm,
www.winbond.com
64Mbit (8MB)
Clock (MHz)
Package(s)
Status1,2
Automotive
2.7V - 3.6V
104
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil
P
N
2.7V - 3.6V
104
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm,
VSOP8 208mil
P
N
104
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 208mil
UD
N
104
SOIC8 208mil, WSON 6X5mm,
USON 4x3mm, VSOP8 208mil,
WLBGA8
P
UD
Part No.
Features
Voltage
W25Q64FV
Dual/Quad-SPI,QPI
Enhanced3
W25R64FV
Dual/Quad-SPI,QPI
RPMC, Enhanced3
Enhanced3, RPMC
W25Q64JV
Dual/Quad-SPI,QPI
DTR, Enhanced3
W25Q64FW
Dual/Quad SPI, QPI,
1.65V - 1.95V
Enhanced3
2.7V - 3.6V
32Mbit (4MB)
Clock (MHz)
Package(s)
Status1,2
Automotive
104
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil
P
N
104
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil
UD
UD
Dual/Quad SPI, QPI,
1.65V - 1.95V
Enhanced3
104
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON 8X6mm,
VSOP8 208mil
N P Dual/Quad SPI, QPI,
1.65V - 1.95V
Enhanced3
104
SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON 8X6mm,
VSOP8 208mil, XSON8 4x4mm
UD UD
Status1,2
Automotive
P
N
Part No.
Features
W25Q32FV
Dual/Quad-SPI, QPI,
Enhanced3
W25Q32JV
Dual/Quad-SPI, QPI,
DTR, Enhanced3
W25Q32DW
W25Q32FW
Voltage
2.7V - 3.6V
2.7V - 3.6V
16Mbit (2MB)
Part No.
Features
Voltage
Clock (MHz)
Package(s)
W25Q16DV
Dual/Quad-SPI
Enhanced3
2.7V - 3.6V
80/104
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 150mil, VSOP8 208mil
W25Q16CL
Dual/Quad SPI,
Enhanced3
2.3V - 3.6V
50/80
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil
P
N
SOIC8 150mil, SOIC8 208mil,
SOIC16 300mil, WSON 6X5mm, TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix),
VSOP8 150mil, VSOP8 208mil,
USON8 4x3mm, WLBGA8
P
P W25Q16DW
Dual/Quad SPI, QPI,
1.65V - 1.95V
Enhanced3
104
擔當
創新
群效
Accountability / Innovation / Teamwork
20
Code Storage Flash Memory
8Mbit (1MB)
Part No.
Features
Voltage
Clock (MHz)
Package(s)
Status1,2
Automotive
W25Q80BV
Dual/Quad-SPI
Enhanced3
2.7V - 3.6V
80/104
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, USON8 2X3mm
P
P W25Q80DV
Dual/Quad-SPI
Enhanced3
2.7V - 3.6V
80/104
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, USON8 2X3mm,
VSOP8 150mil
P
UD
W25Q80BL
Dual/Quad SPI,
Fast Write,
Enhanced3
2.3V - 3.6V
50/80
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil,
USON8 2X3mm
P
N
W25Q80DL
Dual/Quad SPI,
Fast Write,
Enhanced3
2.3V - 3.6V
50/80
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil,
USON8 2X3mm
UD
N
W25Q80BW
Dual/Quad SPI,
Fast Write
Enhanced3
1.65V - 1.95V
80
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil, USON8 4x3mm, WLBGA8
P
P W25Q80EW
Dual/Quad SPI,
Fast Write
Enhanced3
1.65V - 1.95V
80
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil, USON8 4x3mm, WLBGA8
UD
N
Voltage
Clock (MHz)
Status1,2
Automotive
P
N
4Mbit (512KB)
Part No.
21
Features
Package(s)
W25X40CL
Fast Write,
Dual SPI
2.3V - 3.6V
104
SOIC8 150mil, VSOP8 150mil,
USON 2X3mm, WSON 6X5mm,
SOIC8 208mil
W25Q40CL
Dual/Quad SPI,
Fast Write,
Enhanced3
2.3V - 3.6V
and
2.7V – 3.6V
104
SOIC8 150mil, SOIC8 208mil,
USON8 2X3mm
P
N
W25Q40BW
Dual/Quad-SPI
Fast Write,
Enhanced3
1.65V - 1.95V
80
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm,VSOP8 150mil,
USON8 2X3mm, USON8 4x3mm
P
P W25Q40EW
Dual/Quad-SPI
Fast Write,
Enhanced3
1.65V - 1.95V
80
SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm,VSOP8 150mil,
USON8 2X3mm, USON8 4x3mm
UD
N
www.winbond.com
2Mbit (256KB)
Part No.
Features
Voltage
Clock (MHz)
2.3 - 3.6V
and
2.7-3.6V
50/104
Status1,2
Automotive
SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm
P
N
Package(s)
W25X20CL
Fast Write,
Dual SPI
W25Q20BW
Dual/Quad SPI,
Fast Write,
Enhanced3
1.65 - 1.95V
80
SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm
P
N
W25Q20EW
Dual/Quad SPI,
Fast Write,
Enhanced3
1.65 - 1.95V
80
SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm
UD
N
Voltage
Clock (MHz)
Status1,2
Automotive
2.3 – 3.6V
and 2.7 – 3.6V
50/104
SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm
P
N
1.65 - 1.95V
80
SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm
UD
N
Voltage
Clock (MHz)
Status1,2
Automotive
2.3V - 3.6V
104
P
N
1Mbit (128KB)
Part No.
Features
W25X10CL
Fast Write,
Dual SPI
W25Q10EW
Dual/Quad SPI,
Fast Write
Package(s)
512Kbit (64KB)
Part No.
W25X05CL
Features
Fast Write,
Dual SPI
Package(s)
SOIC8 150mil, TSSOP8 173mil,
USON 2x3mm
Status1: P= Mass Production, S (Time)=Samples (Ready Time), UD (Time)=Under Development (Ready Time), N=Not recommended for new designs
RoHS2: All Winbond Flash products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers,
Complement Array Protection
Contact us: [email protected]
擔當
創新
群效
Accountability / Innovation / Teamwork
22
Code Storage Flash Memory
The products listed above may not be available for all regions.
Please contact your local Winbond Sales Representative.
Serial Flash
Parallel Flash
NAND Flash
KGD
Parallel Flash
Parallel Flash Memory – W29GL Family
Winbond's W29GL family of 3-Volt Page-Mode Parallel Flash memories are offered in densities from 512Mb to
32Mb and support industry standard interfaces, architectures and packages. They are drop-in replacements
to the popular “x29GL” products available in the industry, with no firmware change. The W29GL family also
offers faster program and erase times, which can improve production throughput and enable faster firmware
updates. Winbond’s Parallel Flash products are ideal for a wide variety of applications requiring the higher
performance of a parallel bus width and page mode operation.
23
www.winbond.com
W29GL Page Mode Parallel Flash Family
- 512Mb to 32Mb densities
- Compatible with Industry Standard x29GL products
- 2.7V to 3.6V operation; also supports VIO at 1.8V
- x8/x16 data bus configuration
- 70/90ns read access time, 25ns page mode access time
- Provides many sector protection mechanisms
o Offers additional security of code/data
o -40 to +85 operation range
Package Options
- Industry standard packages for 32Mb & 64Mb densities
o 48-pin TSOP (Top/Bottom Boot)
o 48-ball VFBGA (Top/Bottom Boot)
o 56-pin TSOP (High/Low Sector protect)
o 64-ball LFBGA (Top/Bottom Boot, High/Low Sector protect)
- Industry standard packages for 128Mb to 512Mb densities
o 56-pin TSOP (High/Low Sector protect)
o 64-ball LFBGA (High/Low Sector protect)
Special Features
- Drop-in replacement of Industry Standard x29GL
o No firmware change needed
- Saves 40% erase time and 60% program time
o Improves production throughput
o Faster firmware updates
Wide Range of Applications
- Networking, Storage, Set-Top-Box, DSL and Cable modems
- Wireless routers, Digital TV, Industrial, Automotive
- PC peri pherals, Printer, Mobile phones, Cameras and more
擔當
創新
群效
Accountability / Innovation / Teamwork
24
Code Storage Flash Memory
512Mbit3 (64MB)
Secure Sectors
Part No.
Boot/Uniform
Sectors
W29GL512PH
Sector
Location
Speed
(ns)
Package(s)
90
LFBGA64
TSOP56
Status1,2
Automotive
UD
UD
UD
UD
Package(s)
Status1,2
Automotive
LFBGA64
TSOP56
UD
UD
LFBGA64
TSOP56
UD
UD
Package(s)
Status1,2
Automotive
P
UD
High Sector
W29GL512PL
Uniform Sector
W29GL512SH
W29GL512SL
Low Sector
High Sector
Low Sector
256Mbit3 (32MB)
Secure Sectors
Part No.
Boot/Uniform
Sectors
Sector
Location
W29GL256PH
High Sector
W29GL256PL
Low Sector
Uniform Sector
W29GL256SH
W29GL256SL
High Sector
Speed
(ns)
90
TSOP56
Low Sector
128Mbit (16MB)
Secure Sectors
Part No.
Boot/Uniform
Sectors
W29GL128CH
Sector
Location
Speed
(ns)
LFBGA64
TSOP56
High Sector
Uniform Sector
W29GL128CL
90
LFBGA64
TSOP56
Low Sector
64Mbit (8MB)
Secure Sectors
Part No.
Boot/Uniform
Sectors
Sector
Location
W29GL064CB
Bottom Boot
Bottom two sectors
W29GL064CH
W29GL064CL
W29GL064CT
25
www.winbond.com
Uniform Sector
Top Boot
High Sector
Low Sector
Top two sectors
Speed
(ns)
Package(s)
Status1,2
Automotive
P
UD
LFBGA64
TFBGA48
TSOP48
70/90
LFBGA64
TSOP56
LFBGA64
TFBGA48
TSOP48
32Mbit (4MB)
Secure Sectors
Part No.
Boot/Uniform
Sectors
Sector
Location
W29GL032CB
Bottom Boot
Bottom two sectors
W29GL032CH
W29GL032CL
Uniform Sector
W29GL032CT
Top Boot
High Sector
Low Sector
Top two sectors
Speed
(ns)
Package(s)
Status1,2
Automotive
P
UD
LFBGA64
TFBGA48
TSOP48
70/90
LFBGA64
TSOP56
LFBGA64
TFBGA48
TSOP48
Status1: P= Mass Production, S (Time)=Samples (Ready Time), UD (Time)=Under Development (Ready Time), N=Not recommended for new designs
RoHS2: All winbond Flash products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Availability3: Please contact Winbond for avaliability of these products and packages.
Contact us: [email protected]
NAND Flash
We will be offering SLC NAND Flash products starting in 2014. For furthr information please contact Winbond sales.
[email protected]
KGD
We offer various types of Parallel Flash and Serial Flash KGD (Known Good Die) products. For further information please contact
[email protected].
擔當
創新
群效
Accountability / Innovation / Teamwork
26
Product Selection
Guide 2014
NOTE
27
www.winbond.com
www.winbond.com
Worldwide Sales Office
Winbond Electronics Corp. (CTSP Site)
No. 8, Keya 1st Rd., Daya Dist., Central Taiwan Science Park,
Taichung City, 42881, Taiwan.
Tel: 886-4-2521-8168
Jhubei Office
No. 539, Sec. 2, Wenxing Rd., Jhubei City,
Hsinchu County 30274, Taiwan.
Tel: 886-3-567-8168
Taipei Office
2F, No.192, Jingye 1st Rd., Zhongshan Dist.,
Taipei City 104, Taiwan
Tel: 886-2-8177-7168
Winbond Electronics Corporation America
2727 North First St., San Jose,
CA 95134, U.S.A.
Tel: 1-408-943-6666
Printerd in Taiwan Feb. 2014. All right reserved
Winbond Electronics (Suzhou) Limited
Room 515, International Corporation Garden(4 floor, District E),
No.2, Xugongqiao Road, Huaqiao Town, Kunshan City, Jiangsu Province, China
Tel: 86-512-8163-8168
Shenzhen Office
Tel: 86-755-3301-9858
Winbond Electronics (H.K.) Limited
Unit 9-11, 22F, Millennium City 2,
378 Kwun Tong Rd., Kowloon, Hong Kong
Tel: 852-2751-3126
Winbond Electronics Corporation Japan
Shin-Yokohama Square Bldg. 9F 2-3-12 Shin-Yokohama,Kouhoku-ku,
Yokohama, kanagawa 222-0033, Japan
Tel: 81-45-478-1881