Kit Manual

The following document contains information on Cypress products.
MB39C811-EVBSK-02
Energy Harvesting Starter Kit for Buck Power Management IC
with Bluetooth® Smart (Low Energy) Beacon
Operation Manual
Publication Number MB39C811-EVBSK-02_SS901-00028
Revision 2.0
Issue Date November 10, 2014
O p e r a t i o n
M a n u a l
PREFACE
This manual explains how to use the Starter Kit. Be sure to read this manual before using the product.
For mass production/evaluation PMICs for this product, consult with sales representatives or support
representatives.
Handling and use
Handling and use of this product and notes regarding its safe use are described in the manuals for products
bundled with the Starter Kit.
Follow the instructions in the manuals to use this product.
Keep this manual at hand so that you can refer to it anytime during use of this product.
Notice on this document
All information included in this document is current as of the date it is issued. Such information is subject to
change without any prior notice.
Please confirm the latest relevant information with the sales representatives.
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Caution of the products described in this document
The following precautions apply to the product described in this manual.
WARNING
Electric shock,
Damage
Electric shock,
Damage
Indicates a potentially hazardous situation which could result in death or serious injury and/or a
fault in the user’s system if the product is not used correctly.
Before performing any operation described in this manual, turn off all the power supplies to the
system.
Performing such an operation with the power on may cause an electric shock or device fault.
Once the product has been turned on, do not touch any metal part of it.
Doing so may cause an electric shock or device fault.
Indicates the presence of a hazard that may cause a minor or moderate injury, damages to this
CAUTION
product or devices connected to it, or may cause to loose software resources and other
properties such as data, if the device is not used appropriately.
Before moving the product, be sure to turn off all the power supplies and unplug the cables.
Cuts, Damage
Watch your step when carrying the product. Do not use the product in an unstable location such
as a place exposed to strong vibration or a sloping surface. Doing so may cause the product to
fall, resulting in an injury or fault.
Cuts
The product contains sharp edges that are left unavoidably exposed, such as jumper plugs.
Handle the product with due care not to get injured with such pointed parts.
Do not place anything on the product or expose the product to physical shocks. Do not carry the
Damage
product after the power has been turned on.
Doing so may cause a malfunction due to overloading or shock.
Since the product contains many electronic components, keep it away from direct sunlight, high
Damage
temperature, and high humidity to prevent condensation. Do not use or store the product where
it is exposed to much dust or a strong magnetic or electric field for an extended period of time.
Inappropriate operating or storage environments may cause a fault.
Damage
Use the product within the ranges given in the specifications.
Operation over the specified ranges may cause a fault.
To prevent electrostatic breakdown, do not let your finger or other object come into contact with
Damage
the metal parts of any of the connectors. Before handling the product, touch a metal object
(such as a door knob) to discharge any static electricity from your body.
When turning the power on or off, follow the relevant procedure as described in this document.
Damage
Before turning the power on, in particular, be sure to finish making all the required connections.
Furthermore, be sure to configure and use the product by following the instructions given in this
document. Using the product incorrectly or inappropriately may cause a fault.
Always turn the power off before connecting or disconnecting any cables from the product.
Damage
When unplugging a cable, unplug the cable by holding the connector part without pulling on the
cable itself. Pulling the cable itself or bending it may expose or disconnect the cable core,
resulting in a fault.
Because the product has no casing, it is recommended that it be stored in the original
Damage
packaging. Transporting the product may cause a damage or fault. Therefore, keep the
packaging materials and use them when re-shipping the product.
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Table of Contents
1.
2.
3.
4.
DESCRIPTION ............................................................................................................................... 6
FEATURES .................................................................................................................................... 7
APPLICATIONS ............................................................................................................................. 7
Setup .............................................................................................................................................. 8
4.1
Contents in a package......................................................................................................... 8
4.2
Preparation.......................................................................................................................... 8
4.2.1
Preparation of Receiver ...................................................................................... 8
4.2.2
Setup of Receiving (iPhone or Smart Phone etc…) ........................................... 9
4.3
Other
......................................................................................................................... 10
4.3.1
Method of Rewriting Beacon IDs ...................................................................... 10
5.
Specification of Energy Harvesting PMIC (MB39C811) ................................................................ 16
5.1
Recommended Operating Conditions ............................................................................... 16
5.2
DC Characteristics ............................................................................................................ 17
5.3
Block Diagram ................................................................................................................... 18
6.
Specification of Starter Kit ............................................................................................................ 19
6.1
Layout of the Board ........................................................................................................... 19
6.2
Input/Output Pin Description ............................................................................................. 20
6.3
Switch Description ............................................................................................................. 21
6.4
Jumper Description ........................................................................................................... 21
6.5
Circuit
......................................................................................................................... 22
6.6
BOM List ......................................................................................................................... 23
6.7
Layout
......................................................................................................................... 24
7.
Sample Software for BLE Beacon ................................................................................................ 26
7.1
State Change Diagram of Sample Software ...................................................................... 26
8.
Programing and Debug ................................................................................................................ 28
8.1
Structure of Files ............................................................................................................... 28
8.2
Programing and executing using JTAG Debugger ............................................................ 30
8.2.1
Example for JTAG Converter Cable ................................................................. 30
8.2.2
KEIL integrated development tool (MDK-ARM) ................................................ 32
9.
APPENDIX ................................................................................................................................... 34
9.1
Assemble Case ................................................................................................................. 34
10. Ordering Information..................................................................................................................... 36
11. Major Changes ............................................................................................................................. 37
Figures
Figure 1-1 Diagram of the Starter Kit.......................................................................................................... 6
Figure 5-1 Block Diagram ......................................................................................................................... 18
Figure 8-1 Build target .............................................................................................................................. 33
Figure 8-2 Write to FLASH ....................................................................................................................... 33
Figure 8-3 Start Debugger ........................................................................................................................ 33
Figure 8-4 Execute the program ............................................................................................................... 33
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Tables
Table 4-1 Commands List ......................................................................................................................... 12
Table 5-1 Recommended Operating Conditions ....................................................................................... 16
Table 5-2 DC Characteristics .................................................................................................................... 17
Table 6-1 Input/Output Pin Description ..................................................................................................... 20
Table 6-2 Switch Description .................................................................................................................... 21
Table 6-3 Jumper Description ................................................................................................................... 21
Table 6-4 Output Voltage Setting .............................................................................................................. 21
Table 7-1 Flow of sample software ........................................................................................................... 27
Table 10-1 Ordering Information ............................................................................................................... 36
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MB39C811-EVBSK-02
Energy Harvesting Starter Kit for Buck Power Management IC
with Bluetooth® Smart (Low Energy) Beacon
Operation Manual
1. DESCRIPTION
The MB39C811-EVBSK-02 is an evaluation board that contains Energy Harvesting Power Management IC,
MB39C811 (Buck DC/DC converter) with Bluetooth® Smart (Low Energy), which can be used in application
on the Solar and Piezoelectric Energy Harvester. The MB39C811 has a wide input range from 4V up to 23V,
and the output voltages are selectable from 1.5V to 5V. The board contains a Programmable (application
block only) Bluetooth® Smart module, Fujitsu Component: MBH7BLZ02-109004, which allows BLE
(Bluetooth Low Energy) Beacon and wireless data communications.
Figure 1-1 Diagram of the Starter Kit
Transmitter
Receiver
BLE Beacon
PCB size
45mm
iPhone4S/5S/5C (iOS7 or later)
Android4.3 or later
25mm
Windows8 etc..
Supported Bluetooth4.0 equipment or later
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2. FEATURES












Installed Energy Harvesting Power Management IC: MB39C811
Programmable (application block only) Bluetooth® Smart Module: MBH7BLZ02-109004 (*1)
Transmit BLE Beacon using Solar energy and Vibration energy only
Transmit about 1 second intervals under 500lx
Support a lot of energy inputs
- Solar Cell
- Piezo Electric
- USB Bus Power
- Coin Battery (Expandable: For Hybrid)
- NFC: Near Field Communication (Expandable: Power supply only)
- Commercial Power Supply: AC85~265V (Expandable: Need additional resister)
Installed Temperature Sensor
Installed USB Serial Converter IC for changing Beacon IDs
Attached Solar Cell for Evaluation
Attached Case & USB Cable
Schematic, BOM List, Layout Data, Sample Software
Installed Expandable Terminal.
- Reset Button for MCU (Standard mount)
- JTAG Connector for MCU Program
- Expandable Sensor Interface (I2C/GPIO)
- DIPSW (Expandable)
- LED (Expandable)
Small Size PCB: 45mm × 25mm
*1 Need the "Software Development Kit (SDK)" of Nordic semiconductor to program the software.
To get SDK on WEB site of Nordic semiconductor, use "Product Key" including in this starter
kit.
3. APPLICATIONS









Battery-less BLE Beacon
AC Power supply BLE Beacon
Wireless Sensor node for IoT
BEMS/HEMS/FEMS
Active RFID
Solar Energy Harvesting
Wireless Illumination Control
Wireless HVAC Sensors
Security System
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4. Setup
4.1
Contents in a package
No.
Contents
Description
PCB
1
MB39C811-EVBSK-02
(*1)
Energy Harvesting with BLE Board
Solar Panel (*2)
Case
2
USB Cable
TDK: BCS4630B9
or
Qty
Note
1
Installed
1
Panasonic: AM-1801
TAKACHI: PS-65
1
USB Mini Converter Cable
1
Installed
either one
Installed
*1 : Check the radio law of each country to use it. Please access to Fujitsu Component about detail of BLE
module.
*2 : The solar panel is sample for operation check. It isn’t guaranteed the electrical characteristics, etc.
Please be careful because the solar panel doesn't have the guard film of surface.
2
1
Solar Panel
PCB
Case
OR
BCS4630B9
4.2
AM-1801
Preparation
Requirement for preparation
 MB39C811-EVBSK-02 Starter Kit
 iPhone4S/5 etc.. (iOS7 or later), Android4.3 or later
4.2.1
1set
1device
Preparation of Receiver
1. Place a MB39C811-EVBSK-02 under office light about 500lx.
2. After placing, the Beacon packet is transmitted automatically. Regarding to receiver data, please refer
to next step.
Place under office light about 500lx
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Setup of Receiving (iPhone or Smart Phone etc…)
Note:
−
Need supported Bluetooth v4.0 equipment which is iOS7 or Android 4.3 or later, to check operation.
1.
The default setting is following.
- UUID
- Major
- Minor
- TX power
- RSSI
- Advertise interval
- Bluetooth company
11111111-1111-1111-1111-111111111111
1
1
4dBm
-61dBm
100ms
0x0059 (Nordic Semiconductor ASA)
2.
Set the Bluetooth setting to "ON" on your equipment.
3.
Check the BLE Beacon operation using an application. The following are example of application for
iOS and Android.
For iOS, install either following application on App Store.
- Beecon
©BeaconSandwich
- eBeacon
©Jaalee Inc
- LightBlue
©Punch Through Design LLC
- Particle Detector
©KS Technologies LLC
For Android, install either following application on Play Store.
- iBeacon Detector
©youten
- iBeacon Finder
©Mobisfera
- iBeacon Scanner
©ixsoft, inc.
- iBeacon Maps
©Hint Solutions
4.
After installed, execute these applications.
5.
Set "Proximity UUID", "Major", "Minor" while refer the default setting. To learn detail, refer to the
operation manual for each application.
6. The set of receiving will be finished when can check BLE beacon data on an application.
If can't check the data, retry checking as shown in below.
- Check Bluetooth setting on your equipment
- Check "Proximity UUID", "Major" and "Minor" on an application.
- If use iOS8 equipment or later, it can't occasionally receive BLE data, otherwise "Bluetooth
Company" is 0x004C (Apple, Inc.). Refer to "4.3.1 Method of Rewriting Beacon IDs" to change
"Bluetooth Company" to 0x004C.
- Restart your receiver equipment.
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O p e r a t i o n
4.3
M a n u a l
Other
4.3.1
Method of Rewriting Beacon IDs
1.
Prepare attached USB mini converter cable, MB39C811-EVBSK-02 and PC for rewriting ID.
2.
Install a serial communication tool named "Tera Term" and so on.
3.
Download the driver for "USB serial converter IC (FT232RL)", and then defreeze it to any directory
on PC.
FTDI maker website (FT232 Driver is available)
http://www.ftdichip.com/
4.
Open the case of MB39C811-EVBSK-02. Insert your fingernail to case, then open case.
5.
Connect USB cable both PC and MB39C811-EVBSK-02 board. There is no problem that connect
USB cable while a solar cell is connected.
USB Cable
6.
The driver Installation starts automatically and the message window will pop appear.
7. When the following window appears, the installation is completed.
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8. After the device driver installation, make sure that new COM port was added in the Windows Device
Manager.
Start Menu > Control Panel > Device Manager
9. Execute installed serial communication tool.
(Operation check information: Windows7 SP1 32bit, Tera Term Version 4.74)
10. Select USB serial port (COMxx) that was added in the Windows Device Manager.
11. The setting of a serial communication tool is following.
Menu > Setup > Serial Port…
Baud rate
Data
Parity
Stop
Flow control
: 9600
: 8 bit
: none
: 1 bit
: none
Menu > Setup > Terminal…
New-line
Receive
Transmit
Local echo
Other
: AUTO
: CR+LF
: Check
: Default
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12. Push a MCU reset button. At this time, the mode is changed to ID rewriting mode, and then stop the
BLE Beacon transmitter.
MCU Reset Button
13. The "Start…." message is appeared on a serial communication tool window, and then changes to the
command waiting mode. The detail of a serial command is following.
Table 4-1 Commands List
No.
Commands Name
Description
Default
[1]
UUID
Read/Write of UUID
1111111-1111-1111-1111-111111111111 [hex]
[2]
MAJOR
Read/Write of MAJOR
0x0001
[3]
MINOR
Read/Write of MINOR
0x0001
[4]
TXPWR
Read/Write of Transmitter Power Strength
+4 dBm
[5]
RSSI
Read/Write of Receiver Power Strength for
distance 1m (RSSI)
-61 dBm
[6]
ITRVL
Read/Write of Advertise Interval
100ms
[7]
COID
Read/Write of Bluetooth Company
0x0059 (Nordic Semiconductor ASA)
[8]
ERASE
Default parameters
-
[9]
EXIT
Finish the command waiting mode, and then
retransmit the BLE Beacon data
-
[10]
VER
Display Firmware Version
-
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[1] Read/Write of UUID
[1-1] Read
Read UUID data. Default: 11111111-1111-1111-1111-111111111111
<Example>
UUID⏎
(echo) UUID
(output) -> UUID: 11111111-1111-1111-1111-111111111111
[1-2] Write
Write UUID data.
<Example>
UUID EEEEDDDD-CCCC-BBBB-AAAA-999988887777⏎
(echo) UUID EEEEDDDD-CCCC-BBBB-AAAA-999988887777
(output) -> New UUID: EEEEDDDD-CCCC-BBBB-AAAA-999988887777
[2] Read/Write of MAJOR
[2-1] Read
Read MAJOR.
Default: 0x0001
<Example>
MAJOR⏎
(echo) MAJOR
(output) -> MAJOR: 0001
[2-2] Write
Write MAJOR.
<Example>
MAJOR 1A2F⏎
<- Input HEX data
(echo) MAJOR 1A2F
(output) -> New MAJOR: 1A2F
[3] Read/Write of MINOR
[3-1] Read
Read MINOR.
Default: 0x0001
<Example>
MINOR⏎
(echo) MINOR
(output) -> MINOR: 0001
[3-2] Write
Write MINOR.
<Example>
MINOR 2C3D⏎
<- Input HEX data
(echo) MINOR 2C3D
(output) -> New MINOR: 2C3D
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[4] Read/Write of Transmitter Power Strength
[4-1] Read
Read Power Strength.
Default: +4dBm
<Example>
TXPWR⏎
(echo) TXPWR
(output) -> TX power in dBm: 4
[4-2] Write
Set Power Strength.
Set Value: -40, -30, -20, -16, -12, -8, -4, 0, 4
<Example>
TXPWR -40⏎
(echo) TXPWR -40
(output) -> New TX power in dBm: -40
[5] Read/Write of Receiver Power Strength for distance 1m (RSSI)
[5-1] Read
Read RSSI.
Default: -61dBm
<Example>
RSSI⏎
(echo) RSSI
(output) -> RSSI in dBm: -61
[5-2] Write
Set RSSI.
<Example>
RSSI -90⏎
(echo) RSSI -90
(output) -> New RSSI in dBm: -90
[6] Read/Write of Advertise Interval
[6-1] Read
Read Advertise Interval. Default: 100ms
<Example>
ITRVL⏎
(echo) ITRVL
(output) -> Advertise Interval in msec: 100
[6-2] Write
Set Advertise Interval.
Set Value: 100~10240 ms
<Example>
ITRVL 10240⏎
(echo) ITRVL 10240
(output) -> New Advertise Interval in msec: 10240
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[7] Read/Write of Bluetooth Company
[7-1] Read
Read Bluetooth Company.
Default: 0x0059 (Nordic Semiconductor ASA)
<Example>
COID⏎
(echo) COID
(output) -> Company ID: 0059
[7-2] Write
Write Bluetooth Company.
<Example>
COID 004C⏎
<- Input HEX data
(echo) COID 004C
(output) -> New Company ID: 004C
[8] ERASE
Erase the flash memory in MCU. After erase, all value will be default parameters.
<Example>
ERASE⏎
(echo) ERASE
(output) Erase completed!
[9] EXIT
Finish the command waiting mode, and then retransmit the BLE Beacon data.
<Example>
EXIT⏎
(echo) EXIT
(output) ---
[10] VER
Display Firmware Version.
<Example>
VER⏎
(echo) VER
(output) -> MB39C811-EVBSK-02 Sample Firmware, Version 1.0
[*] Input another command (Error Handling)
TEST
(echo) TEST
(output) Command format error!!
14. Enter "EXIT" command when all settings are finished, and then retransmit the BLE Beacon data.
The changed IDs are transmitted by solar energy when disconnect the USB cable.
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5. Specification of Energy Harvesting PMIC (MB39C811)
The following is the specification of Energy Harvesting Power Management IC (MB39C811) on this starter kit.
Regarding to newest information, refer to the datasheet of MB39C811 (DS405-00013).
5.1
Recommended Operating Conditions
Table 5-1 Recommended Operating Conditions
Parameter
VIN pin input voltage
AC pin input voltage
Input voltage
Operating ambient
temperature
Symbol
VVIN
VPV
Condition
VIN pin
AC1_1 pin, AC1_2 pin,
AC2_1 pin, AC2_2 pin
Value
Unit
Min
Typ
Max
2.6
-
23
V
-
-
23
V
VVB
VSI
S0 pin, S1 pin, S2 pin
0
-
VFB
VOUT pin
0
-
5.5
V
-40
-
+85
°C
Ta
-
(*1)
V
*1 : Output Voltage for internal circuit
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5.2
M a n u a l
DC Characteristics
Table 5-2 DC Characteristics
(Ta= -40°C to +85 °C, VVIN=7.0 V, L1=22 μH, C2=47 μF)
Parameter
Symbol
Condition
VVIN = 2.5 V (UVLO),
Ta = + 25 °C
Quiescent current
IVIN
VVIN = 4.5 V (sleep mode),
Ta = + 25 °C
VVIN = 18 V (sleep mode),
Ta = + 25 °C
S2 = L, S1 = L, S0 = L
IOUT = 1mA
S2 = L, S1 = L, S0 = H
IOUT = 1mA
S2 = L, S1 = H, S0 = L
IOUT = 1mA
S2 = L, S1 = H, S0 = H
Preset output voltage
VVOUT
IOUT = 1mA
S2 = H, S1 = L, S0 = L
IOUT = 1mA
S2 = H, S1 = L, S0 = H
IOUT = 1mA
S2 = H, S1 = H, S0 = L
IOUT = 1mA
S2 = H, S1 = H, S0 = H
IOUT = 1mA
Peak switching current
Maximum Output current
IPEAK
IOUTMAX
Ta = 25°C
Value
Unit
Min
Typ
Max
-
550
775
nA
-
1.5
2.25
μA
-
1.9
2.85
μA
1.457
1.5
1.544
V
1.748
1.8
1.852
V
2.428
2.5
2.573
V
3.214
3.3
3.386
V
3.506
3.6
3.694
V
3.993
4.1
4.207
V
4.383
4.5
4.617
V
4.870
5.0
5.130
V
200
250
400
mA
100*
-
-
mA
3.8
4.0
4.2
V
4.94
5.2
5.46
V
6.84
7.2
7.56
V
2.6
2.8
3.0
V
3.8
4.0
4.2
V
5.7
6.0
6.3
V
S2 = L, S1 = L, S0 = L
S2 = L, S1 = L, S0 = H
UVLO release voltage
(Input Power-Good detection
S2 = L, S1 = H, S0 = L
VUVLOH
voltage)
S2 = L, S1 = H, S0 = H
S2 = H, S1 = L, S0 = L
S2 = H, S1 = L, S0 = H
S2 = H, S1 = H, S0 = L
S2 = H, S1 = H, S0 = H
S2 = L, S1 = L, S0 = L
S2 = L, S1 = L, S0 = H
UVLO detection voltage
(Input Power-Good reset
S2 = L, S1 = H, S0 = L
VUVLOL
voltage)
S2 = L, S1 = H, S0 = H
S2 = H, S1 = L, S0 = L
S2 = H, S1 = L, S0 = H
S2 = H, S1 = H, S0 = L
S2 = H, S1 = H, S0 = H
VIN pin shunt voltage
VSHUNT
-
19
21
23
V
VIN pin shunt current
ISHUNT
-
100
-
-
mA
Output Power-Good detection
voltage (Rising)
Output Power-Good reset
voltage (Falling)
VOPGH
To preset voltage ratio
90
94
98
%
VOPGL
To preset voltage ratio
65.5
70
74.5
%
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O p e r a t i o n
Parameter
Symbol
Power supply output voltage for
internal circuit
VVB
M a n u a l
Value
Condition
VVIN = 6 V to 20 V
Min
Typ
Max
-
5.0*
-
Unit
V
*: This parameter is not be specified. This should be used as a reference to support designing the circuits.
5.3
Block Diagram
C1
CVIN
VIN
DCOUT2
DCOUT1
Figure 5-1 Block Diagram
AC1_1
SHUNT
DCGND1
AC1_2
AC2_1
LX
L1
C2
CVOUT
DCGND2
AC2_2
PGND
ERR
CMP
S2,S1,S0
VOUT
CONTROL
3
VOUT
CTL
VOUT
VIN
BGR
IPGOOD
UVLO
VB
C3
CVB
OPGOOD
VB REG.
PGOOD
UVLO_VB
18
CONFIDENTIAL
MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014
O p e r a t i o n
M a n u a l
6. Specification of Starter Kit
6.1
Layout of the Board
TOP
Expandable power terminal
Power IC:MB39C811
Temp sensor
BLE module:MBH7BLZ02-109004
USB min connector
Jumper for output
voltage setting
(Default:2.5V)
Expandable sensor, I/O terminal
Reset button
USB Serial IC:FT232RQ
JTAG terminal for program
BUTTOM
Expandable coin battery folder
(For Hybrid)
Real Time Clock
Land for TDK Solar Cell (BCS4630B9)
November 10, 2014, MB39C811-EVBSK-02_SS901-00028-2v0-E
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19
O p e r a t i o n
6.2
M a n u a l
Input/Output Pin Description
Table 6-1 Input/Output Pin Description
Circuit Pin No.
Silk-Printed Name
CN001
I/O
Description
I
Bridge Rectifier1 AC input pin1
I
Bridge Rectifier1 AC input pin2
DC
I
Solar Cell Input (Inputting to either SolarP or CN003)
AC2_G
GND
-
GND pin
SolarP
SolarP
I
Input TDK Solar Cell (Inputting to either SolarP or CN003)
SolarN
SolarN
-
GND pin for TDK Solar Cell
AC
CN002
CN003
INCapV
INcap
-
Expandable input capacitor +pin
INCapG
GND
-
Expandable input capacitor -pin
OUTCapV
OUTcap
-
Expandable output capacitor +pin
OUTCapG
GND
-
Expandable output capacitor -pin
PIO7
-
I/O
GPIO_7 of BLE module
PIO8
-
I/O
GPIO_8 of BLE module
PIO9
-
I/O
GPIO_9 of BLE module
PIO10
-
I/O
GPIO_10 of BLE module
JTAG1
-
-
Power Pin for JTAG
JTAG2
-
-
SWDIO pin of BLE module
JTAG3
-
-
SWDCLK pin of BLE module
JTAG4
GND
-
GND pin for JTAG
Detail of Input/Output Pin
GND
CON03
CON02
CON01
INcapV
GND
GND
OUTcapV
PIO7
GND
20
CONFIDENTIAL
PIO8
JTAG3
PIO9
JTAG2
PIO10
JTAG1
MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014
O p e r a t i o n
6.3
M a n u a l
Switch Description
Table 6-2 Switch Description
Circuit Pin No.
Silk-Printed Name
SW21
SW21
6.4
Reset Button for BLE module
SW22
SW22
Description
Expandable DIPSW
(No mounted)
Jumper Description
Table 6-3 Jumper Description
Circuit Pin No.
Default
Description
Settings
JP01 (*2)
Output Voltage Setting Switching H/L for S0 Pin of MB39C811
L (*1)
JP02 (*2)
Output Voltage Setting Switching H/L for S1 Pin of MB39C811
H (*1)
JP03 (*2)
Output Voltage Setting Switching H/L for S2 Pin of MB39C811
L (*1)
Bridge Rectifier1 Select "Open" or "Short"
JP04
Open :
DC Output Pin (DCOUT1)
Short :
DC Power Input Pin (VIN)
Short (*1)
Bridge Rectifier2 Select "Open" or "Short"
JP05
Open :
DC Output Pin (DCOUT2)
Short :
DC Power Input Pin (VIN)
Short (*1)
JP06
Connect the MB39C811 output and Load
Short (*1)
JP07
Connect the Coin battery and Load
Open (*1)
*1: Set "Open/Short" and "H/L" by soldering.
*2: Set the output voltage from the "Table 6-4 Output Voltage Setting". The default value is 2.5V.
Table 6-4 Output Voltage Setting
JP03
JP02
JP01
(S2 pin)
(S1 pin)
(S0 pin)
L
L
L
L
L
H
L
2.5
Preset Output Voltage [V]
Note
L
1.5
Do not use (*1)
H
1.8
Default
L
H
H
3.3
H
L
L
3.6
H
L
H
4.1
Do not use (*1)
H
L
L
4.5
Do not use (*1)
H
H
H
5.0
Do not use (*1)
*1: Do not use these voltages setting, because BLE module voltage is from 1.8V to 3.6V.
November 10, 2014, MB39C811-EVBSK-02_SS901-00028-2v0-E
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21
O p e r a t i o n
6.5
M a n u a l
Circuit
22
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MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014
O p e r a t i o n
6.6
M a n u a l
BOM List
No
Qty
1
1
C01
C3216X5R1E226MT
22μF/25V
TDK
2
4
C06 C11 C21 C24
C1005JB1H104K
0.1μF/50V
TDK
3
1
C04
C2012X5R1A226M
22μF/10V
TDK
4
1
C07
C2012JB1C475K
4.7μF/16V
TDK
5
1
C08
C3216X5R1E476M160AC
47μF/25V
C02 C03 C05
Non mount
6
-
Reference
Parts Number
Description
Manufacture
TDK
-
7
2
C12 C13
C1005JB1C105K
1μF/16V
TDK
8
2
C22 C23
C1005CH1H100J
10pF/50V
TDK
9
-
Non mount
-
Non mount
-
Non mount
CN01
Non mount
1
CN11
UX60SC-MB-5ST
USB mini connector
Hirose
11
1
IC11
FT232RQ
USB serial converter
FTDI
12
1
IC22
TMP102
Temperature sensor
TI
13
1
L01
LPS4018-223MLB
22μH
Coilcraft
14
1
LED11
HSMG-C170
LED Green
15
-
LED21
Non mount
16
1
M01
MB39C811
Energy Harvesting PMIC
Spansion
17
1
M21
MBH7BLZ02-109004
Bluetooth LE module
Fujitsu Component
18
3
Q01 Q02 Q03
EM6M2
Nch+Pch MOSFET
ROHM
19
5
R01 R03 R04 R05 R06
RK73H1ETTD1004F
1MΩ
KOA
20
-
R02 R22 R23
Non mount
21
1
R07
RK73H1ETTD000
0Ω
KOA
22
1
R27
RK73H1ETTD1003F
100kΩ
KOA
23
2
R24 R25
RK73H1ETTD2201F
2.2kΩ
KOA
24
1
R11
RK73H1ETTD1001F
1kΩ
KOA
25
1
R21
RK73H1ETTD1000F
100Ω
KOA
26
1
R26
RK73H1ETTD3302F
33kΩ
KOA
27
1
SW21
SKRPACE010
Push Switch
SW22
Non mount
-
-
-
10
28
Avago
-
-
-
Non mount
-
Non mount
ALPS
-
29
1
X21
ABS10-32.768kHz
32.768k X'tal
ABRACON
30
1
ZD01
PLVA662A
Voltage regulator diode
NXP
November 10, 2014, MB39C811-EVBSK-02_SS901-00028-2v0-E
CONFIDENTIAL
Note
23
O p e r a t i o n
6.7
M a n u a l
Layout
Top Silk
Layer1
24
CONFIDENTIAL
Bottom Silk
Layer2
MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014
O p e r a t i o n
M a n u a l
Layer3
November 10, 2014, MB39C811-EVBSK-02_SS901-00028-2v0-E
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Layer4
25
O p e r a t i o n
M a n u a l
7. Sample Software for BLE Beacon
7.1
State Change Diagram of Sample Software
Power on reset
FLASH boot
UUID/ Major /Minor etc…
USB disconnect
After pushing the reset button,
USB connection
Yes
it changes over to USB
command mode
check?
No
"EXIT" command
Initialize BLE stack
Initialize the Advertising
Transmit BLE Data
Start Advertising
Energy management mode
Event
Energy shortage
Sleep mode
Energy charging
Energy shortage
Power off
26
CONFIDENTIAL
MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014
O p e r a t i o n
M a n u a l
Table 7-1 Flow of sample software
No.
Items
1
Initial
2
Boot
3
Mode select
4
BLE setting
Contents
Data branch
Power on reset
-
Initialize the ports of FLASH
-
Read the data of BLE beacon from FLASH
Checking the USB cable
L: disconnect -> No.4
PIO19 of BLE module (H: connect, L: disconnect)
H: connect -> No.8
Initialize the BLE stack
Initialize the Advertising
-
Start the Advertising
5
6
7
Energy
management
Energy
It will turn off the power by the power gating when it is in energy shortage
in capacitance
After turning off the power, it changes over to the charging process
charging
After finishing the charging process, it is turned on by the power gating again
Sleep <->
Transmit the BLE beacon data by the value of Advertising interval setting
Transmit
Repeat this process during enough energy.
USB
8
After transmitting the BLE beacon packets, it changes over to sleep mode.
command
mode
Enough energy -> No.7
After this, repeat No.1~No.6
-
After resetting MCU, wait the USB command
Change over to No.4 by "EXIT"
It changes over to BLE setting when inputted the "EXIT" command
command
November 10, 2014, MB39C811-EVBSK-02_SS901-00028-2v0-E
CONFIDENTIAL
Energy shortage -> No.6
27
O p e r a t i o n
M a n u a l
8. Programing and Debug
8.1
Structure of Files
This program is made based on the "Software Development Kit (SDK)" of Nordic Semiconductor. It is
including only difference information of SDK. To get SDK on WEB site of Nordic semiconductor, use
"Product Key" including in this starter kit.
The following is structure of files for this project. Overwrite all files on SDK's folder of Nordic semiconductor.
It is based on nRF51 SDK v.6.0.0.
Note:
−
Don't rewrite the "Soft Device (S110)" provided from WEB of Nordic Semiconductor.
If rewrote it, must re-get the radio law of each country.
nrf51822
│
├─Board
│
│
│
└─mb39c811_evbsk_02
│
├─ble_app_ibeacon
│
│
│
main.c
│
│
│
pstorage_platform.h
│
│
└─arm
│
│
ble_app_ibeacon.uvopt
│
│
ble_app_ibeacon.uvproj // Keil uVision project
│
├─Include
│
│
│
eh_common.h
│
│
│
twi_master_config.h
│
│
├─boards
│
│
│
│
│
└─ext_sensors
│
│
│
└─Source
│
│
flash_custom.c
│
│
twi_temp.c
│
│
uart_cmd.c
│
└─ext_sensors
│
└─tmp102
mb39c811_evbsk_02.h
tmp102.h
│
tmp102.c
├─Include
│
28
CONFIDENTIAL
boards.h
MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014
O p e r a t i o n
M a n u a l
└─Source
└─simple_uart
simple_uart.c
November 10, 2014, MB39C811-EVBSK-02_SS901-00028-2v0-E
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29
O p e r a t i o n
8.2
M a n u a l
Programing and executing using JTAG Debugger
Requirement for preparation
 MB39C811-EVBSK-02 Board (accessory)
 USB Mini Converter Cable (accessory)
 PC which is installed the KEIL integrated development tool (MDK-ARM)
https://www.keil.com/
 ICE for ARM programming (Recommend SEGGER J-Link series)
http://www.segger.com/jlink-debug-probes.html
 JTAG Converter Cable (Need making yourself)
1pcs
1pcs
1pcs
1pcs
1pcs
Note:
−
8.2.1
The following is example for JTAG Converter Cable. Regarding to making cable, please make sure
self-responsibility.
Example for JTAG Converter Cable
1. Make the JTAG Converter Cable as shown in below. It is example of ARM Standard 20pin JTAG.
JTAG1 - VCC
2.54mm 4pin Connector
JTAG2 - SWDIO
Connect
any
GND pin
JTAG3 - SWDCLK
GND - GND
2. Example of completed cable as shown in below.
MB39C811-EVBSK-01
Boar side
30
CONFIDENTIAL
JTAG ICE side
MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014
O p e r a t i o n
M a n u a l
3. Connect to the ICE for ARM programing. Please be careful of 1pin position.
1pin marking
That’s the end of making JTAG Converter Cable.
November 10, 2014, MB39C811-EVBSK-02_SS901-00028-2v0-E
CONFIDENTIAL
31
O p e r a t i o n
8.2.2
M a n u a l
KEIL integrated development tool (MDK-ARM)
1. Install MDK-ARM on your PC at first,.
2. Install SDK of Nordic semiconductor, as shown in "8.1 Structure of Files".
3. Connect JTAG Cable which made by "8.2.1 Example for JTAG Converter Cable". To touch JTAG Cable
to the land of board, connect it little slanted.
JTAG1(VCC)
GND
ICE
4. Connect the USB Mini Converter Cable to PC. At this time, the LED on board will be bright as shown in
below.
ICE
LED
USB mini cable
5. KEIL integrated development tool is opened when you execute the "xxxxxxxx.uvproj" file in ARM folder,
nrf51822¥Board¥mb39c811_evbsk_02¥ble_app_ibeacon¥arm¥ble_app_ibeacon.uvproj
and then the program is builded when click the "Build target" or "Rebuild all target files" on "Project".
32
CONFIDENTIAL
MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014
O p e r a t i o n
M a n u a l
Figure 8-1 Build target
Build
Rebuild
6. Write to FLASH and execute the program. To write the program to FLASH, push "LOAD" button, as
shown in Figure 8-2.
Figure 8-2 Write to FLASH
Write to FLASH
The debugger starts by clicking "d" button as shown in below.
Figure 8-3 Start Debugger
Start Debugger
To execute the program, push "execute" button after start debugger, as shown in Figure 8-4.
Figure 8-4 Execute the program
Execute
That’s the end of programing by KEIL integrated development tool.
November 10, 2014, MB39C811-EVBSK-02_SS901-00028-2v0-E
CONFIDENTIAL
33
O p e r a t i o n
M a n u a l
9. APPENDIX
9.1
Assemble Case
Notes:
−
−
The following step is already finished by initial packing. Please use it as reference information.
Show the method of assemble case about TDK:BCS4630B9 only.
Picture of completion case
Requirement for preparation
 MB39C811-EVBSK-02 Starter Kit
 Soldering iron, Solder (For connecting solar cell to board)
 Double sided tape (For putting solar cell on case)
1set
1set
1device
1. Prepare a case (TAKACHI: PS-65) and Solar Cell (TDK: BCS4630B9).
2. Bring the flat surface of case to top.
3. Put a double sided tape on solar cell of other side.
4. Put a solar cell to the flat surface of case. Please be careful about direction.
Case hole is right side
Solar cell terminal is under side
34
CONFIDENTIAL
MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014
O p e r a t i o n
M a n u a l
5. Remove a lid of case.
6. Bring putted solar cell to other side, and then connect it to SolarP/SolarN land on
MB39C811-EVBSK-02 board using soldering iron.
SolarN land
SolarP land
7. Put the board into case, and then revert a lid of case.
If need to fix the board to case, please use "TAKACHI: EM-1.6 (sold separately)" and so on. However it
is 2 fixing holes only.
That's the end of the Assemble case.
November 10, 2014, MB39C811-EVBSK-02_SS901-00028-2v0-E
CONFIDENTIAL
35
O p e r a t i o n
M a n u a l
10. Ordering Information
Table 10-1 Ordering Information
36
CONFIDENTIAL
Part number
Version
MB39C811-EVBSK-02
Rev 1.0
Note
MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014
O p e r a t i o n
M a n u a l
11. Major Changes
Page
Section
Change Results
Revision 1.0
-
-
-
-
P.6
1. DESCRIPTION
Initial release
Revision 2.0
Changed from "Bluetooth Low Energy" to "Bluetooth®
Smart (Low Energy)".
Modified the description of BLE module.
P.7
2. FEATURES
P.8
4.1 Contents in a package
Modified the description of BLE module, and Note.
P.9
4.2.2 Setup of Receiving
P.12
4.3.1 Method of Rewriting Beacon IDs
Added "Table4-1 Commands List".
P.14
4.3.1 Method of Rewriting Beacon IDs
Added "[7] Read/Write of Bluetooth company".
P.28
8.1 Structure of Files
Added the solar cell of Panasonic:AM-1801.
Modified some recommended Application.
Added the method of rechecking.
Modified the description.
Added the Note.
Added "pstorage_platform.h" file.
P.35
9.1 Assemble Case
November 10, 2014, MB39C811-EVBSK-02_SS901-00028-2v0-E
CONFIDENTIAL
Added the Note.
37
O p e r a t i o n
38
CONFIDENTIAL
M a n u a l
MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014
O p e r a t i o n
M a n u a l
SS901-00028-2v0-E
Spansion  Support Tool Manual
MB39C811-EVBSK-02
Energy Harvesting Starter Kit for Buck Power Management IC
with Bluetooth® Smart (Low Energy) Beacon
Operation Manual
November 2014 Rev. 2.0
Published: Spansion Inc.
Edited:
Communications
November 10, 2014, MB39C811-EVBSK-02_SS901-00028-2v0-E
CONFIDENTIAL
39
O p e r a t i o n
M a n u a l
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and
manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial
satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with
above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury,
damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire
protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document
represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan,
the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective
government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product
under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The
information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability,
fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or
statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document.
Copyright © 2014 Spansion
All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM and
combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names
used are for informational purposes only and may be trademarks of their respective owners.
40
CONFIDENTIAL
MB39C811-EVBSK-02_SS901-00028-2v0-E, November 10, 2014