Technical & Applications Information

CotoMOS
®
Technical & Applications Information
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COTO TECHNOLOGY, INC.
page | 75
TECHNICAL & APPLICATIONS INFORMATION
RECOMMENDED PC BOARD PATTERN & PACKAGING (all dimensions in mm)
MECHANICAL DRAWINGS
DIP 4
PC BOARD PATTERNS
SMD
DIP
4-Ø0.80
7.62
1.14 Max.
0.5
2.54
10.3 Max.
6.4
0.25
9.54
7.87
6.4
A
2.54
1.3
5.0 Max.
1.2
5.0 Max
1.2
SMD
8.70
PACKAGE
STYLE
1.90
1.5
0.1
3.9
3.4
3.4
0.25
0.5
2.54
3.0
2.54
DIP 6
SMD
9.1 Max.
1.2
1.2
5.08
8.70
1.90
7.62
0.5
IDENTIFIES PIN #1
2.54
10.3 Max.
6.4
9.54 Max.
0.25
6.4
7.87 Max.
6-Ø0.80
B
SMD
1.3
9.1 Max.
DIP
0.25
2.54
4.1
0.5
IDENTIFIES PIN #1
1.5
5.08
3.4
3.0
2.54
2.54
3.9 Max.
2.54
0.5
5.08
DIP 8
SMD
10.1 Max.
10.1 Max.
1.2
1.2
DIP
SMD
7.62
1.3
1.90
7.62
0.5
0.25
2.54
IDENTIFIES PIN #1
2.54
8.70
10.3 Max.
6.4
9.54 Max.
7.87 Max.
6.4
C
0.25
8-Ø0.80
IDENTIFIES PIN #1
7.62
0.5
3.4
0.1
3.9 Max.
4.1
0.5
1.5
2.54
2.54
2.54
3.0
2.54
7.62
SOP 4
SOP 8
4.6 Max.
76 | page
1.27
0.5
0.15
7.62
0.76
2.54
2.54
2.54
2.55 Max.
IDENTIFIES PIN #1
0.15
0.76
2.54
2.0
2.0
2.54
0.15
2.55 Max.
5.72
5.72
7.1 Max.
4.4
1.27
0.5
4.4
7.1 Max.
0.4
2.54
IDENTIFIES PIN #1
0.15
SOP 8
9.7 Max.
0.4
D
SOP 4
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RECOMMENDED PC BOARD PATTERN & PACKAGING (all dimensions in mm)
PACKAGE
TYPE
TAPE SHAPE & DIMENSIONS
F1.5
QUANTITY
2
0.3
2.3
4 Pin SOP
7.2
Feed Direction
R1
F80
F250
7.5
12
5.5
1.75
4
REEL SHAPE & DIMENSIONS
F1.5
12
Feed Direction
R2
12.6
Index Mark
1000 pcs.
2 F21
2.2
F13
Index Mark
F1.5
2
0.3
2.3
8 Pin SOP
7.5
Feed Direction
R1
F80
F250
10.4
7.5
16
1.75
4
F1.55
12
16.6
Index Mark
1000 pcs.
2 F21
Feed Direction
R2
2.2
F13
Index Mark
F1.5
2
0.3
4.0
4 Pin SMD
10.6
Feed Direction
R1
F100
F330
5.3
7.5
16
1.75
4
F1.5
16
17.5
Index Mark
1000 pcs.
2 F21
Feed Direction
R2
2.2
F13
Index Mark
4
2
0.3
4.45
6 Pin SMD
10.4
F100
F330
9.6
11.5
16
1.75
F1.5
F1.5
16
1000 pcs.
2 F21
Feed Direction
T
17.5
2.2
F13
Index Mark
F1.5
2
0.3
4.0
8 Pin SMD
R1
10.6
Feed Direction
F1.5
16
R2
F100
F330
10.3
7.5
16
1.75
4
Feed Direction
17.5
Index Mark
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1000 pcs.
2 F21
2.2
F13
Index Mark
COTO TECHNOLOGY, INC.
page | 77
TECHNICAL & APPLICATIONS INFORMATION
TESTING AND RELIABILITY
The CotoMOS® Series of Solid State Relays are designed with the
highest level of quality and reliability in mind. Each model is comprehensively tested and meets the strictest of standards as dictated by
many international safety organizations. The CotoMOS® Series Solid
State Relays are recognized by the following agencies:
• Underwriters Laboratories (UL) FPQU2.E351594
• Canadian Standards Association (CSA) FPQU8.E351594
An additional expression of a device’s reliability is the FIT rate (Failure in Time: equal to the number of expected failures in 109 hours).
This is easily found by using the equation:
ESD INFORMATION
Coto Solid State Relays are tested for ESD susceptibility using
two different methods: The Human Body Model (HBM), and the
Charged Device Model (CDM).
The MTBF for all 2-channel, dual channel, and telecom devices is
approximately 1.2 million hours @ 25°C (833 FIT’s).
The HBM is associated with a person who acquires a charge from
walking on a carpet, working with plastic, or sitting on an upholstered chair. The charge that is stored on the person’s body is
discharged through the relay to ground.
The CDM is associated with a charge that is stored on the device
itself. The stored energy is then discharged through one pin to
ground.
All relays are tested using both methods. The testing is performed
in 500V increments up to 2000V. All devices reliably pass both
methods of testing. This however, does not mean that the devices
are ESD immune. As with all solid state devices, care should still be
taken during the handling and use of the devices.
MEAN TIME BETWEEN FAILURES (MTBF) INFORMATION
Mean Time Between Failures (MTBF) is defined as the number of
hours of operation a typical device will see before it is expected to
become inoperative. The MTBF is typically calculated by testing a
representative sample of devices and calculating the average time to
failure. Because the CotoMOS® Series is made with solid state components, performing an extended life test is not feasible due to the
expected length of time before failure; therefore, MTBF is theoretically calculated. A theoretical MTBF can be calculated by summing
the expected MTBF of each individual wire bond and solid state
component.
FIT rate = 109 ÷ MTBF
The MTBF for all single channel devices is approximately 2.3 million
hours @ 25°C (435 FIT’s).
(The theoretical information was compiled from Hybrid Circuit
Design and Manufacture; Roydn Jones)
QUALIFICATION TESTING
Coto Solid State Relays are designed to and meet the highest industry standards as specified by agencies such as Underwriters Laboratories (UL) and Canadian Standards Association (CSA). Before a relay
is approved as a standard product, it must first successfully complete
a battery of mechanical and electrical qualification tests. These tests
audit the relays under various conditions to verify functionality. The
following is a list of qualification tests performed on the CotoMOS®
Series solid state relays:
• Steady State Life
• Moisture Resistance
• Temperature Cycle
• Temperature Shock
•Solderability
• Solvent Resistance
•Capacitance
•ESD
• Physical Dimensions
• Lead Integrity Bond Strength
• Die Shear Strength
• Flammability and Oxygen Index
For example: The CT126 has 6 wire bonds, 1 LED, 1 PDA, and 2
MOSFETs. The typical failure rate for wire bonds is 0.000005 per
1000 hours of operation. Each of the four discrete components has a
typical failure rate of 0.0001 per 1000 hours. This is a total expected
failure rate of 0.00043 per 1000 hours of operation. The MBTF
is calculated by dividing the time (1000 hours) by the failure rate
(0.00043). This equates to approximately 2.3 million hours between
failures.
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TESTING AND RELIABILITY
PRODUCTION TESTING
In addition to comprehensive qualification testing performed on each
model number, each individual relay undergoes 100% parametric
testing. As each relay is tested, the results are logged and test reports
are generated for each production lot. In addition, Coto compiles
test information from several lots over a period of time to track relay
quality and reliability, reporting data in several forms including
Pareto graphs, histograms, and individual performance details. The
following is a list of tests performed on each part:
• LED Forward Voltage VF
• LED Reverse Current IR
• On-Resistance Drain to Drain ROn
• Off-State Leakage Current ILeak
• Turn On Time TOn
• Turn Off Time TOff
• I/O Breakdown Voltage VI/O
• Operate Current IFon
• Release Current IOFF
• Release Voltage VOFF
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COTO TECHNOLOGY, INC.
page | 79
TECHNICAL & APPLICATIONS INFORMATION
GLOSSARY OF TERMS
INPUT CHARACTERISTICS
SYM.
Operation LED Current - Turn on
IFon
LED Forward Voltage
VF
Continuous LED Current
I F
LED Reverse Voltage
VR
Amount of current required to flow across the input of the relay to guarantee turn-on.
Amount of voltage drop as a result of the input LED.
Current applied to the input of the relay.
Maximum amount of voltage that the input LED can withstand in the reverse
biased direction.
OUTPUT CHARACTERISTICS
Switching Voltage
Switching Current
On Resistance Drain to Drain
Off State Leakage Current
Turn On Time
Turn Off Time
Output Capacitance
Maximum steady state load voltage; DC or AC-peak
Maximum steady state load current; DC or AC-peak
Contact resistance when the switch is in the closed state
Amount of current flow through the switch when the switch is in the open state.
Amount of time from the application of the input signal to the closure of the switch.
Amount of time from the removal of the input signal to the opening of the switch.
Amount of capacitance across the output of the relay when in the open state.
SYM.
VL
IL
ROn
IOff
TOn
TOff
COut
GENERAL CHARACTERISTICS SYM.
I/O Breakdown Voltage
VI/O
I/O Capacitance
Total Power Dissipation
PT
Operating Temperature
TOpt
Storage Temperature
TStg
Pin Soldering Temperature
TS
Breakdown voltage rating between the input and output of the relay
Amount of capacitance between the input and the output of the relay
Maximum steady state load power
Ambient temperature range in which the relay will operate. (See derating curves or call
factory to determine performance at specific temperatures.)
Ambient temperature range to store the relays without permanent damage occurring.
Maximum allowable temperature for soldering relays into position
MISCELLANEOUS TERMS
LED: PDA: MOSFET: DIP: SMD: SOP:
Light Emitting Diode.
Photo Diode Array.
Metal Oxide Semiconductor Field Effect Transistor.
Dual-in-line Package.
Surface Mount Device.
Small Outline Package
80 | page
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INPUT CURRENT AND RESISTOR SELECTION
Proper selection of the input current for the solid state relays is vital
for ensuring the relay’s proper operation over the entire expected
operating temperature range. The value of the input resistor, which
determines the input current, can be calculated by using the following formula:
Vcc - VF
= IFon
RIN
This circuit will not have an effect on the turn-off time of a relay.
Fig. 1: RIN : LED Current Selection Resistor (required) to
obtain 5 to 20 mA. Optional RC Network: 1μf capacitor
and 180 Ω Resistor
Optional RC Network
Vcc (+5V)
RIN
LOAD
LS
TTL
Where: VCC = DC supply voltage
VF = LED Forward Voltage
(See data pages for this value)
R IN = The input resistor value, and
IFon = Operate LED Current
CotoMOS Series Relay
Several factors go into selecting an input current that best suits a specific application. Three main criteria are the temperature at which
the circuit will operate, the required operate time of the relay, and
the amount of current available from the power supply.
SUMMARY
When selecting the input current, all design variables must be considered. This includes the operating temperature range, the application’s required turn-on time, the power supply limitations, the tolerance of the resistors, and the worst case voltage drop of the LED.
HIGH TEMPERATURE CONSIDERATIONS
The efficiency of the relay decreases as the temperature increases.
Therefore, the ambient temperature plus the expected junction
temperature need to be evaluated to make a proper selection. As
a general rule, the amount of temperature increase expected at the
junction is:
T = 100°C x Watts
where T = the temperature rise (in °C) and Watt = the amount of
power across the output of the relay. For applications that will see
excessive temperatures (>70°C), the recommended input current is
20mA.
EFFECTS ON SWITCHING TIME
The amount of current applied to the input LED is directly related to
the switching time of the MOS FET switch. A higher current at the
input can be translated into faster switching at the output. This relationship is more evident in models that do not have current limiting.
MINIMIZING INPUT CURRENT
When current from the power supply is limited, an RC network can
be added to the input circuit (See Figure #1) to minimize the current
needed to drive the relay. This RC network provides a pulse of current at the time of operate. This current pulse quickly turns the relay
on. After the inrush current through the RC network subsides, the
quiescent current flow through the input resistor (R IN) sustains the
relay in the on position. This RC network can also be used to improve the turn-on time of the relay (as described in previous section).
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COTO TECHNOLOGY, INC.
page | 81
TECHNICAL & APPLICATIONS INFORMATION
AC MODE AND DC MODE
All CotoMOS® Series Single Channel devices have the convenience
of being wired for AC operation (AC Mode) or one of three different
DC operating configurations (DC Mode). The following is an explanation of the four different modes of operation:
FIG. 1: AC MODE
Connecting the load to be switched between pins 4 and 6 of the
SSR will allow for switching of an AC signal or a DC signal in either
polarity. The operting parameters for this configuration are noted in
the data pages of the specific model numbers under the “AC Mode”
headings.
FIG. 2: DC MODE
If the load to be switch is DC and the (+) polarity is always applied
to the same pin, the relay can be wire in the DC Mode. In this
configuration, the (-) side of the load is connected to pin #5 and
the (+) side of the load is connected to pins 4 and 6. The operting
parameters for this configuration are noted in the data pages of the
specific model numbers under the “DC Mode” headings. Using
this configuration, the designer can take advantage of the improved
performance: the DC Mode on-resistance is 25% of the AC Mode
and the switching current capability is doubled.
FIG. 3 AND 4: DC MODE MODIFIED
The inherent features of the relay allow the designer to configure the
relay as noted in figures 3 and 4. In each case, the (-) side of the load
is connected to pin #5 and the (+) side of the load is connected to
either pin #4 or pin #6. In either of these cases, the on resistance is
50% of the AC Mode and the allowable switching current increases
by about 40%. The relay can also be configured as a two pole device
by combining figures #3 and #4. This assumes that the low side of
both loads are common to each other.
Fig. 1: AC Mode
Vin
1
2
6
5
3
4
V(L) [AC]
LOAD
Fig. 2: DC Mode
Vin
I(F)
1
2
6
5
3
4
LOAD
+
V(L) [AC]
-
Fig. 3 and 4: DC Mode Modified
Vin
Vin
82 | page
I(F)
I(F)
I(F)
1
2
6
5
3
4
1
2
6
5
3
4
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-
LOAD
LOAD
V(L) [AC]
+
+
V(L) [AC]
-
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PROTECTING SSR’S FROM OVERVOLTAGE TRANSIENTS
OVERVOLTAGE SUPPRESSION DEVICES
Solid state relays (SSR’s) rely on overvoltage suppression devices such
as metal oxide varistors (MOVs, Zenor Diodes, Suppresser Diodes)
to protect their outputs from voltage extremes such as overvoltage transients. Any voltage that exceeds the SSR’s DC or Peak-AC
maximum load voltage rating could potentially damage the SSR. A
number of overvoltage suppressers, used to protect the SSR against
transients, are available. Each type of suppresser has unique inherent
characteristics. When choosing an appropriate suppression device,
tradeoffs between voltage overshoot, current handling capability,
capacitance, leakage current, physical size, surface-mount capability,
failure mode, and price need to be considered. Most suppressers can
be categorized into one of four groups. The following is a list of the
four common suppresser groups and their characteristics.
placed across the contacts of the relay (Position #1) is highly recommended. The TVS will protect the relay from any voltage transients
when the relay is off.
INPUT
CotoMOS
Series
LOAD
OUTPUT
TVS
TVS
Solid State
Relay
POSITION 1
POSITION 2
TVS
POSITION 3
OUTPUT
A third TVS could be added, shunting both the load and the relay
(Position #3). This TVS would keep excessive AC source surge
currents away from the load and SSR. This technique is commonly
used in industrial and telecom applications.
Zener Diodes: These devices clamp voltages at their reverse
avalanche breakdown value. They can be used back-to-back for
bi-directional clamping. Characteristics: low-voltage overshoot,
small size, surface-mount versions available, short-circuit failure
mode, inexpensive.
If the load is not inductive, the circuit can be simplified by eliminating the TVS in positions #1 and #2. Also, if extraneous voltage
spikes are never expected to exceed the SSR breakdown voltage, a
single TVS in position #1 would be sufficient to protect the relay.
Metal Oxide Varistors (MOVs): The MOV is a voltage dependent variable resistor. The MOVs behave in a similar manner
to the back-to-back zener diodes. Characteristics: inexpensive,
capable of handling large surge currents, surface-mount versions
available, short-circuit failure mode, high capacitance, high
leakage.
SUPPRESSION DEVICE SELECTION
The first selection criteria is whether to use a suppression device
that clips the overvoltage and then crowbars the energy, or one that
clamps (zeners) an overvoltage. A crowbar device is necessary when
the application’s typical operating voltage approaches the SSR’s
maximum load voltage rating. The crowbar protectors pull any
transient voltage low keeping the voltage overshoot to a minimum.
In contrast, an MOV device typically has overshoot; therefore, the
MOV rated breakover voltage should be significantly less than the
relays maximum load voltage rating.
Gas Discharge Tubes: The miniature microgap gas tube clips
voltage and then crowbars energy after its sparkover threshold is
exceeded. Characteristics: capable of handling large surge currents, low capacitance, low leakage current, open failure mode.
Semiconductor Suppressers: These devices are transient suppressers integrating SCR type thyristor and zener functions.
These solid-state suppressers clip voltage and then crowbar
energy after their zener threshold voltage is achieved. Characteristics: low-voltage overshoot, capable of handling large surge
currents, low capacitance, low leakage current, short-circuit
failure mode, expensive.
SUPPRESSION TECHNIQUES
There are various techniques available to protect an SSR and load
from an overvoltage condition. Figure 1 shows an SSR controlling an inductive load. To protect the relay from inductive flyback
energy, a transient voltage suppresser (TVS) is placed across the load
(Position #2). When the relay turns the load off, flyback energy is
shunted across the coil by the TVS, thus eliminating extreme voltage
potentials. This TVS will not protect the relay from transients generated from other sources however. To fully protect the relay, a TVS
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Another important difference between a crowbar and a clamp
suppresser is impressed voltage. A crowbar protector minimizes
power dissipated in the SSR when a fault occurs by becoming a low
impedance. If a crowbar protector is placed directly across the SSR’s
outputs, only a few volts will be across the SSR, thus keeping current
flow through the SSR to a minimum. A clamp suppresser, such
as an MOV, allows the full clamp voltage across the SSR output.
COTO SSRs with current limiting minimize current flow through
the SSR when high clamp voltage is present. Care must be taken to
ensure that the breakover voltage or clamping voltage of a voltage
suppression device never exceeds the SSR breakdown voltage
Other electrical considerations are suppresser capacitance, leakage,
and failure mode. The capacitance and leakage of a suppression
device may effect the performance of the circuit. The failure mode
is important when a TVS becomes damaged during operation. An
open failure mode gives the false impression of having protection on
the SSR. A short circuit failure mode, however, is easily detected
and the SSR never goes unprotected.
COTO TECHNOLOGY, INC.
page | 83
TECHNICAL & APPLICATIONS INFORMATION
GENERAL APPLICATION INFORMATION
TELECOMMUNICATIONS
Solid state relays can be used in several different telecommunications
applications including Fax Machines, Modems, PBX, and Central
Office switching. In all cases, the requirements are similar: high
voltage standoff, high input/output isolation, safety agency certification (UL, CSA, etc.), long life expectancy, and low power consumption. SSRs meet all of these requirements including 5000Vrms I/O
isolation on H models.
DATA ACQUISITION / PROCESS CONTROL /
INSTRUMENTATION
Solid state relays are ideally suited for many instrumentation and
control applications. Their high reliability and long life expectancy
make them suitable for many applications where frequent, repeatable
switching is required. Coto’s solid state relays also have inherently
low thermal electromotive force (EMF) voltages generated across
their output. This makes them useful for low level data collection
applications such as thermocouple scanners.
PCMCIA APPLICATIONS
As electronics devices become increasingly smaller, the demand for
relays to meet this requirement increases. Coto’s SSRs are available
in a low profile package for surface mount applications which must
meet strict size constraints. The low profile SOP package has a max
height of 2.55mm, which is suitable for PCMCIA applications. See
the detailed package drawings on pages 76-77.
SECURITY / GENERAL PURPOSE
Coto solid state relays are completely immune to magnetic and
electro-static interference which may impede the proper operation of
mechanical relays. This characteristic makes them ideal for applications where false triggering and noise on the signal path are undesirable. In addition, there robust construction and solid state circuitry
make them highly resistant to shock and vibration. This ensures a
continuous signal in turbulent environments. All of these features
make the CotoMOS® series solid state relays ideal for many different
security and general purpose applications.
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CURRENT VS. VOLTAGE (IV) CHARACTERISTIC CURVES
Figure 1: Typical IV curve for SSR operating in the
AC Mode. (See information regarding AC Mode of Operation on page 82.
Current
ILMAX
IK
IK
ILMAX
Voltage
Figure 2: Typical IV curve for SSR operating in the
DC Mode. (See information regarding DC Mode of Operation on page 82.
ILMAX
Current
On State
Off State
Voltage
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COTO TECHNOLOGY, INC.
page | 85
TECHNICAL & APPLICATIONS INFORMATION
STACKING COTO TECHNOLOGY SOLID STATE RELAYS TO OBTAIN HIGHER SWITCHING VOLTAGES
INTRODUCTION
Standard CotoMOS® solid state relays (SSR) provide switching
capability up to 600 VDC/peak AC in 4-pin, 6-pin and 8-pin DIP
and SOP packages. Higher switching voltages can be achieved when
relays are wired in series (stacked). By adhering to the following recommendations, the SSRs can easily be stacked to achieve switching
capabilities into the kilovolt range.
Figure 2 (A) depicts a simple electrical model of the relays in the
off-state. The 380 V zener diodes represent the avalanche breakdown
value of the switches. Compared to the high impedances of the off
MOSFET switches, the voltage drop across RL is insignificant and
each switch will equally standoff 300 V. Figure 2 (B) shows a simple
electrical model with both relays on. Each relay drops 2.4 V, and the
remaining 595.2 V is passed on to the load.
Fig. 2: Simple Output Model of Low-Side Driver
Stacking Relays
Electrical parameters that must be considered when stacking relays
are ON-resistance, load voltage, and load current. ON-resistance of
the stacked relay becomes the sum of the individual ON-resistances
of each relay. Likewise, total load voltage or standoff voltage becomes the sum of the individual load voltages. It is advantageous to
choose relays with equivalent load voltages because the relays will
equally block the applied voltage. Maximum allowable load current
is equivalent to the lowest rated load current of the stacked relays.
All of these electrical parameters are important during the dynamic
switching and while in the quiescent state. The primary design concern when stacking relays is maintaining a balanced distribution of
the load voltage during switching.
Voltage Sharing
Figure 1 shows two C231S relays in a low-side driver configuration.
Fig. 1: Low-Side Driver Configuration
+600V
270W
C231S
+5V
S1
C231S
S2
TTL
GATE
RL
5kW
The input LEDs are wired in series to obtain simultaneous control
from the logic gate. The C231S relay has a rated voltage of 350 V,
and when two are stacked they have potential of switching 700V.
86 | page
+600V
380
380
S1
+600V
8 pF
S1
20W
1010W
S2
8 pF
S2
20W
1010W
RL
5kW
40 pF
40 pF
RL
5kW
A. Off-State
B. On-State
Switching: The stacked relay models in Figure 3 will function
properly is switches S1 and S2 turn on and off simultaneously; in actuality, this would be an ideal case. Even though Coto SSRs exhibit
a tight ton and toff distribution, individual SSRs will still exhibit
distinct ton/toff times that need to be considered. Differences in the
timing can be minimized (but not entirely eliminated) by increasing
LED drive current to approximately 15mA or 20 mA. An extreme
case of timing mismatch would be where S1 is fully on while S2
is still off (Figure 3). If this occurs, the full 600 V of power source
would be applied directly across S2 and drive it into avalanche breakdown. In this instance, an avalanche current of 120 mA could flow,
possibly damaging or destroying the switch. The actually differences
in ton and toff will fall somewhere between the ideal and extreme
cases. This difference is enough to warrant the use of some form of
external conditioning.
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STACKING COTO TECHNOLOGY SOLID STATE RELAYS TO OBTAIN HIGHER SWITCHING VOLTAGES
Fig. 3: Simple Output Model of High-Side Driver with
Mismatched ton
+600V
40 pF
S1
20W
8 pF
S2
To achieve the 600V switching each MOV must be rated for 300V
DC continuous voltage or greater. A Harris Corporation MOV
model V230LA4 meets this requirement. Its varistor voltage a 1 mA
ranges from 324V to 396 V. To uses this MOV, the load voltage of
the individual relays needs to increase to 400 V. To protect against
high-current transients that could drive the MOV to even higher
varistor clamp voltages, a third SSR may be required. In this case,
perhaps a more attractive alternative would be to use a solid-state
suppression device. Solid state suppression devices exhibit lower
clamp voltage ration values that MOVs. The P3300AA61 Sidactor
from Teccor Corp. has a breakover voltage of 330V. This part allows
300 V continuous voltage without exceeding the 350 V load voltage
rating of model C231S, even under high-surge current conditions.
10
380
10W
RL
5kW
Fig. 5: A 1200 Low-Side Driver
CT330
4
V230LA4
3
1 2
(+) (-)
+12V
V230LA4
+600V
270W
17kW
5
CT330
6
820W
C231S
7
Fig. 4: Low-Side Driver with MOV Protection
8
+1200V
1 2 3 4
(+) (-) (+) (-)
Voltage Suppression
A method in preventing the SSRs from avalanching is to place
a metal oxide varistor (MOV) across the outputs of the relay. A
properly selected MOV suppression device will keep the relay from
ever exceeding avalanche breakdown. MOV selection is very critical.
The maximum standoff voltage of the stacked relay now becomes
the sum of the MOV’s maximum continuous voltage rating. If the
MOV’s continuous rating is exceeded, it could conduct substantial
current when the stacked relay is supposed to be off. This would create an undesirable leaky operation and eventually destroy the MOV.
Also, the SSR’s load voltage rating must not be compromised under
worst case conditions.
A 1200 V Relay
Applying this information, it is very easy to see how a 1200 V relay
can be constructed using two CT330 400 V relays. By stacking the
outputs of these two relays and using four V230LA4 MOVs (capable
of DC operation up to 300 V) for dynamic voltage sharing and
protection, we achieve a relay capable of switching 1200 V and 70
mA (see Figure 6). Similarly, even higher voltage and current relays
can be created by stacking the desired type and appropriate number
of relays.
C231S
CT330
+5V
S1
V230LA4
V230LA4
C231S
V230LA4
V230LA4
S2
TTL
GATE
2N2222
RL
5kW
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COTO TECHNOLOGY, INC.
page | 87
TECHNICAL & APPLICATIONS INFORMATION
CT130/CS130 GRAPHS
Load current Vs.
Ambient temperature
On resistance Vs.
Ambient temperature
Turn on time Vs.
Ambient temperature
50
3.0
2.5
120
40
80
60
Turn on time, ms
2
On resistance, W
Load current, A
100
30
20
1.5
1
40
10
0.5
20
-20
0
20
40
60
85
0
-40
100
-30
0
20
40
60
85
Ambient temperature, ºC
Ambient temperature, ºC
Turn off time Vs.
Ambient temperature
LED operate current Vs.
Ambient temperature
0
-40
100
0.4
4
0.4
LED turn off current, mA
0.5
0.2
3
2
1
0.1
0
-40
-20
0
20
40
60
85
20
40
60
85
100
85
100
0.3
0.2
0.1
0
-40
100
0
LED Turn off current Vs.
Ambient temperature
5
0.3
-20
Ambient temperature, ºC
0.5
LED operate current, mA
Turn off time, ms
0
-40
-20
0
Ambient temperature, ºC
20
40
60
85
0
-40
100
-20
0
Ambient temperature, ºC
LED forward voltage Vs.
Ambient temperature
20
40
60
Ambient temperature,rC)
ºC
Voltage Vs. current characteristics
of output at MOS portion
Off state leakage current
1.5
100
1.3
-3
10
80
60
Off state leakage current, A
Current,A
LED dropout voltage, V
1.4
40
20
-5
1.2
-4
-3
-2
-1
0
1
2
1.1
3
4
5
Voltage,V
-20
-40
-60
1.0
-6
10
-9
10
-80
-12
10
-100
0
-40
-20
0
20
40
60
85
100
0
50
100
150
200
250
300
350
400
Load voltage (V)
Ambient temperature, ºC
LED foward current Vs.
turn on time characteristics
LED foward current Vs.
turn off time characteristics
1.2
0.12
1.0
0.10
0.8
0.08
Applied voltage Vs.
output capacitance characteristics
200
0.6
0.4
0.06
0.04
100
50
0.02
0.2
0
Output capacitance, pF
Turn off time, ms
Turn on time, ms
150
0
10
20
30
40
LED foward current (mA)
88 | page
50
60
0
0
10
20
30
40
LED foward current (mA)
50
60
0
0
10
20
30
40
50
Applied voltage (V)
tel: (401) 943.2686
|
fax: (401) 942.0920
C247S/C347S GRAPHS
Load current Vs.
Ambient temperature
On resistance Vs.
Ambient temperature
1.0
On resistance, W
0.75
0.5
0.4
4
0.3
0.2
3
2
0.1
0.25
0
-40
-20
0
20
40
60
80
1
0
-40
100
-20
0
20
40
60
80
Ambient temperature, ºC
Ambient temperature, ºC
Turn off time Vs.
Ambient temperature
LED operate current Vs.
Ambient temperature
0
-40
100
5
0.4
4
4
0.2
3
2
1
0.1
0
-40
-20
0
20
40
60
80
20
40
60
80
100
80
100
3
2
1
0
-40
100
0
LED Turn off current Vs.
Ambient temperature
5
0.3
-20
Ambient temperature, ºC
0.5
LED operate current, mA
Turn off time, ms
5
LED turn off current, mA
Load current, A
1.25
0.5
Turn on time, ms
1.5
Turn on time Vs.
Ambient temperature
-20
0
Ambient temperature, ºC
20
40
60
80
0
-40
100
-20
0
Ambient temperature, ºC
LED forward voltage Vs.
Ambient temperature
Voltage Vs. current characteristics
of output at MOS portion
1.5
20
40
60
Ambient temperature, ºC
Off state leakage current Vs.
Load voltage characteristics
2
-4
Current, A
LED dropout voltage, V
1
1.3
10mA
-0.6
-0.4
-0.2
0
0.2
0.4
Voltage, V
0.6
1.2
-1
Off state leakage current, A
10
1.4
-6
10
-8
10
-10
10
1.1
-12
10
1
-40
-20
0
20
40
60
80
-2
100
1
0
20
LED foward current Vs.
turn off time characteristics
500
2
0.4
400
1.5
1
0.5
Output capacitance, pF
0.5
0.3
0.2
10
20
30
80
100
40
50
LED foward current (mA)
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0
300
200
100
0.1
0
60
Applied voltage Vs.
output capacitance characteristics
2.5
Turn off time, ms
Turn on time, ms
LED foward current Vs.
turn on time characteristics
0
40
Load voltage (V)
Ambient temperature, ºC
0
10
20
30
40
50
LED foward current (mA)
COTO TECHNOLOGY, INC.
0
0
10
20
30
40
50
60
Applied voltage (V)
page | 89