SPECIFICATION FOR APPROVAL REF. : SB1045□□□□L□-□□□ ABC'S DWG NO. PROD. SMD Power Inductor NAME REV. 20140527-D PAGE 1 Ⅰ﹒Configuration and dimensions： C 101 B A G I F J H E I D （PCB Pattern） Unit：m/m A B C D E F 10.0±0.3 10.0±0.3 4.50±0.3 2.40 typ. 2.00 typ. 6.00 typ. G 2.80 ref. H I J 10.40 ref. 2.40 ref. 5.60 ref. Ⅱ﹒Description： a﹒Ferrite drum core construction. b﹒Enamelled copper wire：F class c﹒Product weight： 1.45g（ref.） d﹒Moisture sensitivity Level 1 e﹒Products comply with RoHS' requirements Peak Temp：245℃ max. Max. Peak Temp - 5℃：30sec max. Max time above 217℃ ：60sec~150sec max. Temperature Rising Area f﹒Halogen free available. Preheat Area +4.0℃ / sec max. 150 ~ 200℃ / 60 ~ 120sec Reflow Area Forced Cooling Area +3.0℃ / sec max. -(1.0 ~ 5.0)℃ / sec max. Peak Temperature: 245℃ 250 Ⅲ﹒General specification： a﹒Storage temp.：-40℃ ----+125℃ b﹒Operating temp.：-40℃----+125℃ (Temp. rise included) c﹒Resistance to solder heat：245℃.10 secs. AR-001C Temperature ( ℃ ) 217℃ 60sec~150sec 200 60sec max. 150 60sec~120sec 100 50 0 50 100 150 Time ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF. : SB1045□□□□L□-□□□ ABC'S DWG NO. PROD. SMD Power Inductor NAME REV. 20140527-D PAGE 2 Ⅳ﹒Electrical characteristics： L Q (uH) ref. DWG No. SB10452R7ML□-□□□ 2.7±20% SB10454R5ML□-□□□ 4.5±20% SB10456R8ML□-□□□ 6.8±20% SB1045100ML□-□□□ 10.0±20% SB1045150ML□-□□□ 15.0±20% 22.0±20% SB1045220ML□-□□□ 33.0±20% SB1045330ML□-□□□ 47.0±20% SB1045470ML□-□□□ 68.0±20% SB1045680ML□-□□□ SB1045101KL□-□□□ 100.0±10% SB1045151KL□-□□□ 150.0±10% SB1045221KL□-□□□ 220.0±10% 330.0±10% SB1045331KL□-□□□ SB1045471KL□-□□□ 470.0±10% SB1045681KL□-□□□ 680.0±10% SB1045102KL□-□□□ 1000.0±10% 25 25 22 26 26 22 20 21 21 14 16 15 12 12 13 25 1). ：Packaging information： Code 2). ""：Reference code 3). Electrical specifications at 25℃ 4). Irms base on temp. rise 40℃ max. 5). Isat base on △L/L0A=10% typ. □□□ AR-001C Test Freq. L Q (Hz) (MHz) 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 100K/0.1V 7.96 7.96 7.96 2.52 2.52 2.52 2.52 2.52 2.52 0.796 0.796 0.796 0.796 0.796 0.796 0.252 SRF ( MHz ) typ. RDC (Ω) max. Irms Isat (A) (A) 68.7 44.2 35.8 27.8 23.7 19.4 15.8 13.6 11.1 9.7 7.1 6.4 4.6 4.2 3.6 2.9 0.026 0.033 0.040 0.050 0.068 0.088 0.110 0.165 0.225 0.300 0.500 0.680 0.950 1.280 1.920 2.700 4.80 4.20 3.50 3.20 2.50 2.20 1.90 1.60 1.30 1.10 0.85 0.72 0.62 0.52 0.43 0.38 6.20 5.20 4.20 3.60 3.00 2.60 2.10 1.85 1.50 1.30 1.05 0.85 0.70 0.58 0.46 0.40 SPECIFICATION FOR APPROVAL REF. : SB1045□□□□L□-□□□ ABC'S DWG NO. PROD. SMD Power Inductor NAME REV. 20140527-D PAGE Ⅴ﹒Curve： SB10452R7ML□ 70.0 3.0 60.0 2.5 50.0 △ T (℃ ) L (uH) 2.0 1.5 1.0 40.0 30.0 20.0 0.5 10.0 0.0 0.0 0.0 1.0 2.0 3.0 4.0 IDC (A ) 5.0 6.0 0.0 7.0 1.0 2.0 3.0 4.0 IDC (A ) 5.0 6.0 7.0 35.0 70.0 30.0 60.0 25.0 50.0 20.0 40.0 △ T (℃ ) L (uH) SB1045330ML□ 15.0 30.0 10.0 20.0 5.0 10.0 0.0 0.0 0.0 0.5 1.0 1.5 IDC (A) 2.0 2.5 0.0 3.0 0.5 1.0 1.5 IDC (A ) 2.0 2.5 3.0 SB1045331KL□ 350.0 80.0 300.0 70.0 60.0 250.0 △ T (℃ ) L (uH) 50.0 200.0 150.0 40.0 30.0 100.0 20.0 50.0 10.0 0.0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.00 0.10 0.20 IDC (A ) IDC (A ) 0.6 0.8 1.0 0.30 0.40 0.50 SB1045102KL□ 70.0 1,200.0 60.0 1,000.0 50.0 △ T (℃ ) L (uH) 800.0 600.0 400.0 30.0 20.0 200.0 10.0 0.0 0.0 0.00 0.10 0.20 0.30 IDC (A) AR-001C 40.0 0.40 0.50 IDC (A) 3 SPECIFICATION FOR APPROVAL REF. : SB1045□□□□L□-□□□ ABC'S DWG NO. PROD. SMD Power Inductor NAME REV. 20140527-D PAGE 4 Ⅵ﹒Packaging information： ( 1 ) Configuration T Cover tape N A B 2.0±0.5 ∮C ∮C D G Embossed carrier ※Carrier tape width : D P:16 m/m End 101 Leader no component 360 m/m Min. 101 4 m/m 101 Start 101 Trailer no component 400 m/m Min. Components User ditrection of feed ( 2 ) Dimensions Unit:m/m Style A B C D 13 - 24 330 21±0.8 13±0.5 24 G 26 +0 N 60 T -0 30.4 ( 3 ) Q'TY & G.W. Per package Inner : Reel Code B AR-001C Outer : Carton Q'TY (pcs) G.W. (gw) Style Q'TY (pcs) G.W. (Kg) Size (cm) 700 2000 13 - 24 2,800 9.0 38 x 37 x 22 SPECIFICATION FOR APPROVAL REF. : ABC'S DWG NO. PROD. SMD Power Inductor NAME REV. SB1045□□□□L□-□□□ 20140527-D PAGE 5 Ⅶ﹒Reliability test： Item 1.High Temperature Exposure Reference documents MIL-STD-202 Method 108 Test Condition 1.Temperature: 125℃ 2.Time:96 hours. 1.Temperature: -40℃ ~ 125℃ 2.Temperature Cycling JESD22 Method JA-104 2.Number of cycle:96 cycle 3.Dwell time:30 minutes 3.Biased Humidity Test MIL-STD-202 Method 103 1.Temperature: 85±5 ℃ 2.Time:96 Hours 3.Humidity: 85±5% RH. 1.Temperature: 125℃ 2.Time:96 hours. 3.Apply rated current. 4.Operational Life MIL-PRF-27 5.Exeternal Visual MIL-STD-883 Method 2009 constructions, marking and 6.Physical Dimensions JESD22 Method JB-100 Inspect product workmanship. Test Specification 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 1.No pollution on the surface of products. 2.Clear marking. 3.No crack. Verify physical dimensions to the applicable product detail specification. Per product specification standard 7.Resistance to solvents MIL-STD-202 Method 215 Immerse into solvent for 3±0.5 minutes & brush 10 times for 3 cycles. 1.No body change in apperarance. 2.No marking blurred. 3.Inductance shall not change more than ±10%. 8.Vibration Test MIL-STD-202 Method 204 1.Frequency and Amplitued : 10-2000-10 Hz, 1.5 mm. 2.Direction:X, Y, Z 3.Test duration:2 hours for each direction, 6 hours in total. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 9.Resistance To Soldering Heat Test MIL-STD-202 Method 210 1.Highest temperature：245±5℃ 2.Time（temp.≧ 217℃）：60~150 Second. 3.IR reflow times：3 times. 10.Rated current MIL-STD-202 Method 330 11.Temperature rise MIL-PRF-27 12.Over load MIL-PRF-27 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. Apply rated current for 5 second. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. Apply rated current for 10 minutes. 2.Inductance shall not change more than ±10%. 1.No mechanical and electrical damage. Apply double as rated current for 5 minutes. (It's not application to some special design) 2.Inductance shall not change more than ±10%. 1.Baking in pre-testing： 155±5℃ / 16Hours±30 min. 2.Peak temperature：240±5℃ 3.Time（temp.≧217℃）：60~150 second. 4.IR reflow times：1 times. The terminal shall be at least 95% covered with fresh solder. User Spec. 1.Operating temperature：-40℃~125℃ 2.Room temperature：25℃. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±10%. MIL-STD-202 Method 201 1.DC:500V 2.Time:1minutes 16.Drop JESD22-B111 Packaged & Drop down from 1m.In 1 angle 1ridges & 2 surfaces orientation. 17.Terminal Strength Test JIS-C-6429 1.Apply push force to samples mounted on PCB. 2.Force of 1.8 kg for 60±1 seconds. 13.Solderability Test 14.Electrical Characteriazation 15.Withstanding Voltage Test AR-001C J-STD-002 1.During the test no breakdown. 2.The characteristic is normal after test. 1.No case deformation or change in appearance. 2.Inductance shall not change more than ±10%. After test, inductors shall be no mechanical damage.