ROHM BU97941FV

BU97941FV
Datasheet
Multifunction LCD Segment Driver
BU97941FV
MAX 104 segments (SEG26×COM4)
●Features
„ Integrated RAM for display data (DDRAM):
26 x 4 bit (Max 104 Segments)
„ LCD drive output:
4 Common output, 26 Segment output
„ Integrated 4ch LED driver circuit
„ Support standby mode
„ Integrated Power-on-Reset circuit (POR)
„ Integrated Oscillator circuit
„ No external component
„ Low power consumption design
„ Independent power supply for LCD driving
●Key Specifications
■ Supply Voltage Range:
+1.8V to +3.6V
■ LCD drive power supply Range:
+2.7V to +5.5V
■ Operating Temperature Range:
-40°C to +85°C
■ Max Segments:
104 Segments
■ Display Duty:
Static, 1/3, 1/4 selectable
■ Bias:
Static, 1/3
■ Interface:
3wire serial interface
W (Typ.) x D (Typ.) x H (Max.)
●Package
●Applications
„
Telephone
„
FAX
„
Portable equipment (POS, ECR, PDA etc.)
„
DSC
„
DVC
„
Car audio
„
Home electrical appliance
„
Meter equipment
etc.
SSOP-B40
13.60mm x 7.80mm x 2.00mm
●Typical Application Circuit
VLED=5.0V
*About resistor value
Determine the optimal value
based on the applied current
With 25mA as max per 1 port
VLCD
LED1
LED2
LED3
LED4
VDD
5.0V
LCD
BU979 41FV
3.3V
SEG0 to SEG25
VSS
CSB
SD
SCL
COM0 to COM3
Signal input from controller
Figure 1.
○Product structure：Silicon monolithic integrated circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･14･001
Typical application circuit
○This product is not designed protection against radioactive rays.
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TSZ02201-0A0A2D300080-1-2
1.Jun.2012 Rev.001
BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
●Block Diagram / Pin Configuration / Pin Description
40
1
COM0……COM3
SEG0……SEG25
LED4...LED1
VLCD
common
driver
LCD voltage
Generator
Segment
driver
LED
Driver
SEG1
SEG13
COM2
SEG14
COM1
SEG15
COM0
SEG16
VLCD
Command register
Data Decoder
SEG17
VDD
SEG18
SD
serial inter face
SEG19
SCL
SEG20
CSB
External clock line
IF FILTER
CSB
SEG2
SEG10
SEG0
DDRAM
VSS
SEG3
SEG9
COM3
VSS
VDD
SEG4
SEG8
SEG12
common
counter
Power On Reset
SEG5
SEG7
SEG11
LCD
BIAS
SELECTOR
OSCILLATOR
SEG6
SD
SCL/CLKIN
SEG21
VSS
SEG22
LED4
SEG23
LED3
SEG24
LED2
SEG25
LED1
Figure 3.
21
20
Figure 2. Block Diagram
Pin Configuration (TOP VIEW)
Table 1 Pin Description
Pin Name
Pin No.
I/O
Setting
when not in
use
CSB
26
I
VDD
Chip select: "L" active
SCL
27
I
VSS
Serial data transfer clock
SD
28
I
VSS
Input serial data
VDD
29
-
-
Power supply for LOGIC
VSS
25
-
-
External clock input terminal (for display/PWM using
selectable)
Support Hi-Z input mode at internal clock mode
VLCD
30
-
-
GND
COM0 to 3
31 to 34
O
OPEN
Power supply for LCD
SEG0 to 25
1 to 20
35 to 40
O
OPEN
COMMON output for LCD
LED1 to 4
21 to 24
O
OPEN
LED driver output
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Function
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TSZ02201-0A0A2D300080-1-2
1.Jun.2012 Rev.001
BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
●Absolute Maximum Ratings (VSS=0V)
Item
Symbol
Ratings
Unit
Remarks
Power supply Voltage1
VDD
-0.3 to +4.5
V
Power supply
Power supply Voltage2
VLCD
-0.5 to +7.0
V
Voltage for Liquid crystal Drive
Power supply Voltage2
VLED
-0.5 to +7.0
V
Voltage for LED driving port terminal
*1
Allowable loss
Pd
0.8
W
Input Voltage Range
Operating Temperature
Range
Storage Temperature
Range
Output Current
VIN
-0.5 to VDD+0.5
V
Topr
-40 to +85
℃
Tstg
-55 to +125
℃
Iout1
5
mA
SEG Output
Iout2
5
mA
COM Output
Iout3
50
mA
LED Output (per 1 port)
*Decreases 8mW per 1℃ when using at 1 Ta=25℃ or higher. （During ROHM standard board mounting）
（Board size：74.2mm×74.2mm×1.6mm
Material：FR4 Glass-epoxy board
Copper foil： Land pattern only）
●Recommended Operating Ratings(Ta=-40°C to +85°C,VSS=0V)
Item
Symbol
MIN
TYP
MAX
Unit
Remarks
Power supply Voltage1
VDD
1.8
-
3.6
V
Power supply
Power supply Voltage2
VLCD
2.7
-
5.5
V
Voltage for Liquid crystal Drive
Output Current
Iout1
-
-
25
mA
LED Output (per LED1 port)
Iout2
-
-
100
mA
LED Output (LED port current total sum)
●Electrical Characteristics
DC Characteristics (Ta=-40°C to +85°C、VDD=1.8V to 3.6V、VLCD=2.7V to 5.5V、VSS=0V )
Limit Value
Item
Symbol
Unit
Condition
MIN
TYP
MAX
“H” level input voltage
VIH
0.8VDD
VDD
V
SD, SCL, CSB
“L” level input voltage
VIL
VSS
0.2VDD
V
SD, SCL, CSB
Hysteresis width
VH
0.2
V
SCL, VDD=3.3V、Ta=25°C
SD,SCL, CSB,
“H” level input current
IIH1
5
uA
VI=3.6V
LED off leak
OFF LEAK
5
0
5
uA
LED VI=5.5V
VLCD
Iload=-50uA, VLCD=5.0V
VOH1
V
-0.4
SEG0 to SEG25
“H” level output voltage
(*2)
VLCD
Iload=-50uA, VLCD=5.0V、
VOH2
V
-0.4
COM0 to COM3
Iload= 50uA, VLCD=5.0V、
VOL1
0.4
V
SEG0 to SEG25
“L” level output voltage
Iload= 50uA, VLCD=5.0V、
VOL2
0.4
V
(*2)
COM0 to COM3
Iload=20mA、VLCD=5.0V、
VOL4
0.11
0.5
V
LED1 to 4
Iload=+/-50uA, VLCD=5.0V, SEG0 to 25,
VOUT1
2.73
3.33
3.93
V
COM0 to 3
output voltage (*2)
Iload=+/-50uA, VLCD=5.0V, SEG0 to 25,
VOUT2
1.07
1.67
2.27
V
COM0 to 3
Input pin ALL ’L’,
IstVDD
3
10
uA
Display off, Oscillation off
Input pin ALL ’L’,
IstVLCD
0.5
5
uA
Display off, Oscillation off
Supply current (*1)
VDD=3.3V、Ta=25°C、
IVDD1
8
15
uA
1/3bias、fFR=64Hz、Output open
VLCD=5.0V、Ta=25°C、
IVLCD1
10
15
uA
1/3bias、fFR=64Hz、Output open
＊1 During Power save mode 1、Frame inversion.
＊2 Iload：When setting the load of 1 pin only.
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TSZ02201-0A0A2D300080-1-2
1.Jun.2012 Rev.001
BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
●Electrical Characteristics – continued
Oscillation Frequency Characteristics (Ta=-40°C to +85°C、VDD=1.8V to 3.6V、VLCD=2.7V to 5.5V、VSS=0V )
Limit Value
Item
Symbol
Unit
Condition
MIN
TYP
MAX
Frame Frequency 1
fFR1
76.5
85
93.5
Hz
VDD=3.3V、Ta=25°C、fFR=85Hz setting
Frame Frequency 2
fFR2
68
85
97.0
Hz
VDD=2.5V to 3.6V fFR=85Hz setting
Frame Frequency 3
fFR3
59.7
-
68
Hz
VDD=1.8V to 2.5V fFR=85Hz setting
MPU Interface Characteristics (Ta=-40°C to +85°C、VDD=1.8V to 3.6V、VLCD=2.7V to 5.5V、VSS=0V )
Limit Value
Item
Symbol
Unit
Condition
MIN
TYP
MAX
Input Rise Time
ｔｒ
50
ns
Input Fall Time
ｔf
50
ns
SCL Cycle
tSCYC
250
ns
“H” SCL pulse width
tSHW
50
ns
“L” SCL pulse width
tSLW
50
ns
SD Setup Time
tSDS
50
ns
SD Hold Time
tSDH
50
ns
CSB Setup Time
tCSS
50
ns
CSB Hold Time
tCSH
50
ns
“H” CSB pulse width
tCHW
50
ns
tCHW
CSB
tCSS
tCSH
tSCYC
tf
tr
tSLW
SCL
tSHW
tSDS
tSDH
SD
Figure 4. Serial Interface Timing
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TSZ02201-0A0A2D300080-1-2
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BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
●I/O equivalent circuit
VLCD
VDD
VSS
VSS
VDD
VLCD
SEG0-25
COM0-3
CSB, SD,
SCL,
CLKIN
VSS
VSS
LED1-4
VSS
Figure 5. I/O equivalent circuit
●Example of recommended circuit
VLED=5.0V
*About resistor value
Determine the optimal value
based on the applied current
With 25mA as max per 1 port
VLCD
LED1
LED2
LED3
LED4
VDD
5.0V
LCD
BU979 41FV
3.3V
SEG0 to SEG25
VSS
CSB
SD
SCL
COM0 to COM3
Signal input from controller
Figure 6. Recommended circuit example
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TSZ02201-0A0A2D300080-1-2
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BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
●Function Description
○Command・Data Transfer Method
○3-SPI（3-wire Serial Interface）
This device is controlled by 3-wire signal: CSB, SCL, SD.
SD, SCL input are enabled with CSB = “L”. Also, interface counter is initialized with CSB = “H”, and the next command or
data can be inputted. Each command starts with Command or data judgment bit (D/C) as MSB data, and continuously in
order of D6 to D0 are followed after CSB=”L. Internal data is latched at the rising edge of SCL, it will be converted to 8bits
parallel data at the falling edge of 8th CLK.
If CSB is set to “H” when the data is less than 8bit, command and data being transferred will be cancelled.
When inputting again, please set CSB to “L”. Then, be sure to input command for 1byte.
Also, when it becomes input state of DDRAM data through RAMWR command, command cannot be inputted.
When inputting again, please start up CSB.
If CSB is set to ”H”, the data input state is cancelled and by setting ”CSB” to ”L” again, command will be received.
1st byte Command
2nd byte Command
3rd byte Command
CSB
SCL
D/C
SD
D6
D5 D4
D3
D2
D1 D0 D/C D6
D5
Figure 7.
D4
D3
D2
D1
D0 D/C D6
D5
D4
D3
D2 D1 D0 D/C
D6
3-SPI Data Transfer Format
○ Write and Transfer Method of Display Data
This device has display data ram of 26×4＝104bit.
The handling of display data with write and the handling of DDRAM data and Address and display are as follows:
1st Byte
2nd Byte
Command Command Command
10000011
00000000
10100000
a b c
RAM Write
Address set
d
e
f
onwards
g
h
i
j
k
l
m n
o
p
…
Display da ta
Binary 8bit data is written to DDRAM. The address where the write begins is set with the Address set command, and
address is automatically incremented per 4bit data.
Next, by transferring data, data can be written continuously to DDRAM.
(When continuously writing data to DDRAM, after writing to the final address 19h（SEG25）, address will return to 00h
(SEG0) through auto increment.)
DDRAM address
BIT
00
01
02
03
0
a
e
i
m
COM0
1
b
f
j
n
COM1
2
c
g
k
o
COM2
3
d
h
l
p
SEG
0
SEG
1
SEG
2
SEG
3
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
04
05
06
07
・・・
17h
18h
19h
COM3
SEG
4
SEG
5
6/22
SEG
6
SEG
7
SEG
23
SEG
24
SEG
25
TSZ02201-0A0A2D300080-1-2
1.Jun.2012 Rev.001
BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
Writing to RAM is done per 4bit. When CSB is set to ‘H’ when less than 4bit, the writing of RAM is cancelled. （Transfer of
command is done per 8bit.）
1st byte Command / 2nd byte Command
Command
Display data
CSB
SCL
SD
Address Set Command
RAM WRITE Command
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0
Internal Signal
RAM write
Address 00h
Address 01h
Address 02h
RAM write per 4bit
1st byte Command / 2nd byte Command
When CSB='H' is set and
less than 4bit, writing
is cancelled.
Display data
Command
CSB
SCL
SD
Address Set Command
RAM WRITE Command
D7 D6 D5 D4 D3 D2 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4
Internal Signal
RAM write
Address 00h
Address 30h
Address 31h
Address 00h
Returns to 0 through
auto increment
Figure 8. Display Data Transfer Method
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TSZ02201-0A0A2D300080-1-2
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BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
○LCD Driver Bias / Duty Circuit
Voltage is generated for LCD drive.
Buffer amplifier is integrated low power consumption is possible.
＊Line, frame inversion can be set via MODESET command.
＊1/4, 1/3, static duty can be set via DISCTL command.
For each liquid crystal drive waveform, see ”Liquid crystal Drive Waveform”.
○Reset Initial State
The Reset Initial State after executing Software Reset is as follows:
・ Display is turned OFF.
・ Each command register enters Reset state.
・ DDRAM address is initialized.
(DDRAM data is not initialized. Therefore, it is recommended to write initial values to all DDRAM before Display on.）
●Command / Function Table
Function Description Table
NO Command
Function
1
Mode Set (MODESET)
Liquid crystal Drive setting
2
Display control (DISCTL)
LCD setting1
3
Address set (ADSET)
LCD setting2
4
LED control (LEDCTL)
LED board ON/OFF setting
5
RAM WRITE (RAMWR)
RAM Write Start setting
6
All Pixel ON (APON)
All display ON
7
All Pixel OFF (APOFF)
All display OFF
8
All Pixel On/Off mode off (NORON)
Normal display APON/APOFF setting release）
9
Software Reset (SWRST)
Software reset
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TSZ02201-0A0A2D300080-1-2
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BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
●Command Description
D/C (MSB) is bit for command or data judgment.
For details, see 3-wire Serial Interface Command, Data Transfer Method.
○Mode Set Command (MODESET)
MSB
LSB
D/C
D6
D5
D4
D3
D2
D1
D0
Hex
Reset
1st byte Command
1
0
0
0
0
0
0
1
81h
-
2nd byte Command
0
0
0
0
P3
P2
P1
P0
-
00h
Display setting
Setting
P3
Reset state
Display OFF
0
○
Display ON
1
Display OFF
：
Display ON
：
Oscillation circuit operation OFF, Liquid crystal power supply circuit operation OFF with frame
cycle. Display OFF state (Output：VSS level)
Oscillation circuit operation ON, Liquid crystal power supply circuit ON. Read operation from
DDRAM starts. Display ON state with frame cycle.
＊LED board is not affected by the ON/OFF state of Display.
The output state of LED port is determined by the setting of the LEDCTL command.
Liquid crystal Drive Waveform Setting
Setting
P2
Reset state
Frame inversion
0
Line inversion
1
○
Power save mode (Low current consumption mode) setting
Setting
P1
P0
Reset state
Power save mode1
0
0
Power save mode2
0
1
Normal mode
1
0
High power mode
1
1
○
＊Use high power mode at VLCD＞3V or higher.
(Reference Current Consumption Data)
Current
Setting
Consumption
Power save mode 1
×1.0
Power save mode 2
×1.7
Normal mode
×2.7
High power mode
×5.0
＊The current consumption data above is reference data and changes according to panel load.
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TSZ02201-0A0A2D300080-1-2
1.Jun.2012 Rev.001
BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
○Display control command (DISCTL)
MSB
LSB
D/C
D6
D5
D4
D3
D2
D1
D0
Hex
Reset
1st byte Command
1
0
0
0
0
0
1
0
82h
-
2nd byte Command
0
0
0
0
P3
P2
P1
P0
-
02h
Duty setting
Setting
P3
P2
Reset state
1/4duty (1/3bias)
0
0
○
1/3duty (1/3bias)
0
1
Static (1/1bias)
1
*
(*: Don’t care)
When 1/3duty, the display / blink data for COM3 are invalid.
(COM3: same waveform with COM1)
When 1/1duty (Static), the display / blink data for COM1 to 3 are invalid.
(COM1 to 3: same waveform with COM0)
Be careful in sending display data.
For sample output waveform of SEG/COM with duty setting, see "Liquid crystal Drive Waveform".
Frame Frequency Setting
Setting
(When 1/4,1/3,1/1duty)
(128Hz, 130Hz, 128Hz)
P1
P0
0
0
(85Hz, 86hz, 64Hz)
0
1
(64Hz, 65Hz, 48Hz)
1
0
(51Hz, 52Hz, 32Hz)
1
1
Reset state
○
The relationship with frame frequency (FR), internal osc frequency and dividing number is below:
Divide
FR [Hz]
DISCTL
(P1,P0)
1/4duty
1/3duty
1/1duty
1/4duty
1/3duty
1/1duty
(0,0)
160
156
160
128
131.3
128
(0,1)
240
237
320
85.3
86.4
64
(1,0)
320
315
428
64
65
47.9
(1,1)
400
393
640
51.2
52.1
32
When calculating the OSC frequency from the measurement value of frame frequency, use the following equation:
“ OSC frequency = Frame Frequency (Measurement value) × Dividing number”
Dividing number：Using the values of Frame Frequency setting (P1,P0) and duty setting(P3,P2), determine the
values from the table above.
Ex)
(P1,P0) = (0,1) 、(P3,P2) = (0,1) ⇒ Dividing number= 237
＊1：The value of FR in the table above is the Frame Frequency calcuated as OSC Frequency = 20.48KHz (typ).
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TSZ02201-0A0A2D300080-1-2
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BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
○Address set command (ADSET)
MSB
MSB
LSB
D/C
D6
D5
D4
D3
D2
D1
D0
Hex
Reset
1st byte Command
1
0
0
0
0
0
1
1
83h
-
2nd byte Command
0
0
0
P4
P3
P2
P1
P0
-
00h
Sets the address that starts the writing to RAM for normal display.
Address can be set from 00h to 1Bh.
Setting is prohibited for addresses not written above.
Address during Reset is 00h.
When writing to RAM, a separate RAM WRITE setting is needed.
○LED control command (LEDCTL)
MSB
MSB
LSB
D/C
D6
D5
D4
D3
D2
D1
D0
Hex
Reset
1st byte Command
1
0
0
0
0
1
0
1
85h
-
2nd byte Command
0
0
0
0
P3
P2
P1
P0
-
00h
Sets the drive of the LED port. Setting during Reset is 00h.
The relationship between each parameter and the Drive board is as follows:
LED1
P0
LED2
P1
LED3
P2
LED4
P3
LED ON
1
1
1
1
LED OFF
0
0
0
0
＊ Please input CSB="H" after LEDCTL command is issued.
To avoid influence of noise and reset interface.
○RAM WRITE command (RAMWR)
MSB
1st byte Command
LSB
D/C
D6
D5
D4
D3
D2
D1
D0
Hex
Reset
1
0
1
0
0
0
0
0
A0h
-
2nd byte Command
Display data
Random
・・・・
n byte Command
Display data
Random
The input data after command setting is the data input for display.
Be sure to send this command after setting the ADSET command.
The display data is transferred per 4bit. (For details, see “Write and Transfer Method of Display Data.”)
○All Pixel ON command (APON)
MSB
1st byte Command
LSB
D/C
D6
D5
D4
D3
D2
D1
D0
Hex
Reset
1
0
0
1
0
0
0
1
91h
-
Regardless of the contents of DDRAM, the SEG output will enter all light up mode. (Pin that selects SEG output)
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Datasheet
MAX 104 segments (SEG26×COM4)
○All Pixel OFF command (APOFF)
MSB
1st byte Command
LSB
D/C
D6
D5
D4
D3
D2
D1
D0
Hex
Reset
1
0
0
1
0
0
0
0
90h
-
Regardless of the contents of DDRAM, the SEG output will enter all light up mode. (Pin that selects SEG output)
○All Pixel ON/OFF mode off (NORON)
MSB
1st byte Command
LSB
D/C
D6
D5
D4
D3
D2
D1
D0
Hex
Reset
1
0
0
1
0
0
1
1
93h
-
APON / OFF mode is cancelled and switches to normal display mode. (Pin that selects SEG output)
After reset, NORON is set and becomes normal display state.
○Software Reset command (SWRST)
MSB
1st byte Command
LSB
D/C
D6
D5
D4
D3
D2
D1
D0
Hex
Reset
1
0
0
1
0
0
1
0
92h
-
Resets software. This IC is in reset state.
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Datasheet
MAX 104 segments (SEG26×COM4)
●Liquid crystal Drive Waveform
1/4Duty
Line inversion
Frame inversion
SEGn SEGn+1SEGn+2SEGn+3
SEGn SEGn+1SEGn+2SEGn+3
COM0
stateA
COM0
stateA
COM1
stateB
COM1
stateB
COM2
COM2
COM3
COM3
1frame
1frame
Vreg
Vreg
COM0
COM0
VSS
VSS
Vreg
Vreg
COM1
COM1
VSS
VSS
Vreg
Vreg
COM2
COM2
VSS
VSS
Vreg
Vreg
COM3
COM3
VSS
VSS
Vreg
Vreg
SEGn
SEGn
VSS
VSS
Vreg
Vreg
SEGn+1
SEGn+1
VSS
VSS
Vreg
Vreg
SEGn+2
SEGn+2
VSS
VSS
Vreg
Vreg
SEGn+3
SEGn+3
VSS
VSS
Vreg
Vreg
stateA
stateA
(COM0-SEGn)
(COM0-SEGn)
-Vreg
-Vreg
Vreg
Vreg
stateB
stateB
(COM1-SEGn)
(COM1-SEGn)
-Vreg
-Vreg
Figure 9. LCD Drive Waveform during Line inversion
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Figure 10.LCD Drive Waveform during Frame inversion
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1.Jun.2012 Rev.001
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Datasheet
MAX 104 segments (SEG26×COM4)
1/3Duty
Frame inversion
Line inversion
SEGn SEGn+1 SEGn+2 SEGn+3
SEGn SEGn+1 SEGn+2 SEGn+3
COM0
stateA
COM0
stateA
COM1
stateB
COM1
stateB
COM2
COM2
COM3
COM3
When 1/3duty
1frame
1frame
Vreg
Vreg
COM0
COM0
VSS
VSS
Vreg
Vreg
COM1
COM1
VSS
VSS
Vreg
Vreg
COM2
COM2
VSS
VSS
Vreg
COM3
Vreg
COM3
When 1/3duty
COM3 waveform output
is same as COM1
VSS
VSS
Vreg
Vreg
SEGn
SEGn
VSS
VSS
Vreg
Vreg
SEGn+1
SEGn+1
VSS
VSS
Vreg
Vreg
SEGn+2
SEGn+2
VSS
VSS
Vreg
Vreg
SEGn+3
SEGn+3
VSS
VSS
Vreg
Vreg
stateA
stateA
(COM0-SEGn)
(COM0-SEGn)
-Vreg
-Vreg
Vreg
Vreg
stateB
stateB
(COM1-SEGn)
(COM1-SEGn)
-Vreg
Figure 11.
When 1/3duty
COM3 waveform output is same as COM1
COM3 waveform output is same as COM1
-Vreg
LCD Drive Waveform during Line inversion
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TSZ22111･15･001
Figure 12.
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LCD Drive Waveform during Frame inversion
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1.Jun.2012 Rev.001
BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
1/1Duty (Static)
Line inversion
Frame inversion
SEGn SEGn+1 SEGn+2 SEGn+3
COM0
COM1
SEGn SEGn+1 SEGn+2 SEGn+3
stateA stateB
COM0
COM1
When 1/1duty (Static)
When 1/1duty (Static)
COM1 ：same waveform as COM0
COM1 ： same waveform as COM0
COM2
COM2
COM2 ：same waveform as COM0
COM2 ：same waveform as COM0
COM3
stateA stateB
COM3
COM3 ：same waveform as COM0
1frame
COM3 ：same waveform as COM0
1frame
Vreg
Vreg
COM0
COM0
VSS
COM1
VSS
When 1/1duty
(Static)
Vreg
COM1 / COM0
is same waveform
Vreg
COM1
VSS
VSS
Vreg
Vreg
COM2 / COM0
is same waveform
COM2
COM2
VSS
VSS
Vreg
Vreg
COM3 / COM0
is same waveform
COM3
COM3
VSS
VSS
Vreg
Vreg
SEGn
SEGn
VSS
VSS
Vreg
Vreg
SEGn+1
SEGn+1
VSS
VSS
Vreg
Vreg
SEGn+2
SEGn+2
VSS
VSS
Vreg
Vreg
SEGn+3
SEGn+3
VSS
VSS
Vreg
Vreg
stateA
stateA
-Vreg
-Vreg
Vreg
Vreg
stateB
stateB
-Vreg
Figure 13.LCD Drive Waveform during Line inversion
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-Vreg
Figure 14.
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LCD Drive Waveform during Frame inversion
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BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
●Initialization Sequence
Execute the following sequence after power supply and start display after the IC has initialized.
Power supply
↓
CSB ‘H’ …Initialize I/F
↓
CSB ‘L’
…Start I/F Data Transfer
↓
Execute Software Reset from SWRST command
↓
MODESET (Display off)
↓
Various command setting
↓
RAM WRITE
↓
MODESET (Display on)
↓
Start display
＊After inserting power supply, each register value, DDRAM address and DDRAM data until Initialization sequence are
random.
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Datasheet
MAX 104 segments (SEG26×COM4)
●Caution during Power supply ON/OFF
○POR circuit
During power supply rise, because the IC internal circuit and reset pass through an area of unstable low voltage and VDD
starts up, there is a risk that the inside of the IC is not completely reset and wrong operation might occur. In order to
prevent this, P.O.R circuit and Software Reset functions are incorporated. In order to ensure that operation, do as follows
during power supply rise:
1. Set power up conditions to meet the recommended tR, tOFF and Vbot specs below in order to ensure POR operation.
（POR circuit uses VDET type）
(＊The voltage detection of POR differs depending on the used environment etc.
In order to make POR operate for sure, it recommended to make it Vbot = 0.5V or lower.)
VDD
Recommended conditions of tR, tOFF, Vbot
tR
VDET
tOFF
tR
tOFF
Vbot
VDET
10ms or lower
1ms or higher
0.5V or lower
TYP 1.2 V
Vbot
* VDET is integrated POR detection level
Figure 15. Rise Waveform
2. When the conditions are not met, do the following countermeasures after power supply ON:
(1) Set CSB to ’H’.
(2) Turn ON the CSB and execute SWRST command.
In order for the SWRST command to take effect for sure, it is recommended to start up CSB after 1ms after the VDD
level has reached 90%.
※Since the state is irregular until SWRST command input after power supply ON, countermeasure through Software
Reset is not the perfect substitute for P.O.R function so it is important to be careful.
VDD
CSB
M in 1m s
M in 50ns
SW RST com m and
Figure 16. SWRST command sequence
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Datasheet
MAX 104 segments (SEG26×COM4)
●Attention about using LEDCTL(85h) command
Please input CSB="H" after LEDCTL command is issued. To avoid influence of noise and reset interface.
Parameter
LEDCTL (85h)
2nd Command
CSB
SCL
1
SD
0
0
0
0
Figure 17.
1
0
1
0
0
0
0
P3 P2 P1 P0
D/C
D6 D5 D4 D3 D2 D1 D0 D/C
D6
Recommended sequence when using LEDCTL (85h) command
●Attention about input port pull down
Satisfy the following sequence if input terminals are pulled down by external resisters (In case MPU output Hi-Z).
Date transaction period with MPU
Input "L"
period
Input"Hi-Z"
period
CSB
SD
SCL
Figure 18. Recommended sequence when input ports are pulled down
BU97941FV adopts a 5V tolerant I/O for the digital input. This circuit includes a bus-hold function to keep the level of HIGH.
A pull down resistor of below 10KΩshall be connected to the input terminals to transit from HIGH to LOW because the
bus-hold transistor turns on during the input’s HIGH level. (Refer to the Figure 5. I/O Equivalent Circuit)
A higher resistor than approximate 10KΩcauses input terminals being steady by intermediate potential between HIGH and
LOW level so unexpected current is consumed by the system.
The potential depends on the pull down resistance and bus-hold transistor’s resistance.
As the bus-hold transistor turns off upon the input level cleared to LOW a higher resistor can be used as a pull down resistor
if a MPU set SD and SCL lines to LOW before it releases the lines.
The LOW period preceding MPU’s bus release shall be at least 50ns as same as a minimum CLK width ( tSLW ).
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MAX 104 segments (SEG26×COM4)
Datasheet
●Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit.
If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected.
The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown
due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply
terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
or the digital block power supply and the analog block power supply, even though these power supplies has the same level
of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the
diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For
the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor
to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the
constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig.
In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to
the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
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BU97941FV
MAX 104 segments (SEG26×COM4)
Datasheet
●Operational Notes - continued
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) No Connecting input terminals
In terms of extremely high impedance of CMOS gate, to open the input terminals causes unstable state. And unstable
state brings the inside gate voltage of p-channel or n-channel transistor into active. As a result, battery current may
increase. And unstable state can also causes unexpected operation of IC. So unless otherwise specified, input terminals
not being used should be connected to the power supply or GND line.
(13) Rush current
When power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current may
flow instantaneously. Therefore, give special condition to power coupling capacitance, power wiring, width of GND wiring,
and routing of connections.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to
help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
●Ordering Information
B
U
9
7
9
4
1
Part Number
F
V
-
Package
FV
:
E2
Packaging and forming specification
E2: Embossed tape and reel
(SSOP-B40)
SSOP-B40
●Physical Dimension Tape and Reel Information
SSOP-B40
<Tape and Reel information>
13.6 ± 0.2
(MAX 13.95 include BURR)
2000pcs
Direction
of feed
0.5 ± 0.2
1
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
20
0.15 ± 0.1
0.1
1.8 ± 0.1
Embossed carrier tape
Quantity
21
5.4 ± 0.2
7.8 ± 0.3
40
Tape
0.1
S
0.65
0.22 ± 0.1
0.08
M
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
SSOP-B40(TOP VIEW)
Part Number Marking
BU97941
LOT Number
1PIN MARK
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BU97941FV
Datasheet
MAX 104 segments (SEG26×COM4)
●Revision History
Date
1.Jun.2012
Revision
001
Changes
New Release
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.