BU21049GUL
4-wire Resistive
Touch Screen Controller
BU21049GUL
●General Description
Unlike most resistive touch screen controllers, the
BU21049GUL 4-wire resistive touch-screen controller
generate data to enable dual touch detection.
The Host processor can use data to detect single point
coordinates and dual coordinates.
●Features
■ Enables single touch and dual touch using
standard 4-wire resistive touch screen
■ I2C like interface for interfacing to the host
processor
■ 12-bit Resolution
■ Single 1.65V to 3.60V Supply.
■ Power on reset
■ Auto power down control
■ Built-in clock oscillation circuit
●Key Specifications
■ Power supply voltage
■ Temperature range
■ Standby current
■ Sleep current
■ Operating current
■ Coordinate resolution
●Packages
VCSP50L2
1.65V～3.6.0V
-20[℃]～85[℃]
1.0uA (Max.)
100uA (Typ.)
0.8mA(Typ.)
12bit
2.00 ㎜ × 2.00 ㎜ × 0.55(max) ㎜
●Applications
■ Equipment with a built in the user interface of 4-wire
resistive touch screen
■ Portable information equipment like as Smart phone,
Table, PDA.
■ Audio-visual equipment like as Digital still camera,
Digital video camera, portable TV.
■ PC/ PC peripheral equipment like as Laptop, Touch
screen monitor, printer.
●Typical Application Circuits
○Product structure：Silicon monolithic integrated circuit
.www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product is not designed protection against radioactive rays
1/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●Pin Configuration
●Pin Description
Top View
1
2
3
4
A
YP
XN
YN
AD0
B
XP
PGND
AD1
SDA
C
D
PVDD
VREF
AUX
GND
RSTB
VDD
SCL
INT
Pin
No
A1
Pin
Name
YP
I/O
YP channel input
D
A2
XN
I/O
XN channel input
D
A3
YN
I/O
YN channel input
D
A4
AD0
I
Slave address input bit0
A
B1
XP
I/O
XP channel input
D
B2
PGND
-
Ground for touch screen drivers
-
B3
AD1
I
Test input(*1)
A
B4
SDA
I/O
C
C1
PVDD
-
C2
AUX
I
Serial data(*2)
Power supply for touch screen
drivers.
Auxiliary channel input
D
C3
RSTB
I
System reset(*3)
A
C4
SCL
I
Serial clock(*2)
Regulator output
logic.(*4)
Ground
I/O
D1
VREF
-
D2
GND
-
D3
VDD
-
D4
INT
O
(*1)
(*2)
(*3)
(*4)
Equivalent
circuit
Description
-
for
control
Power supply
Interrupt output. Pin polarity with
active low.
B
AD1 connect to GND.
SCL and SDA need pull-up with over 2.2kΩ resister.
RSTB connect to VDD if not control.
VREF bypass to GND with a 1.0uF capacitor and cannot connect to supply.
●Equivalent circuit
PAD
PAD
Fig.A
Fig.B
PAD
PAD
Fig.C
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Fig.D
2/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●Block diagram
PVDD
VDD
LD O
LD O
VREF
OSC
P E N IR Q
XP
XN
YP
YN
Touch
S c re e n
D riv e rs
& I/F
M
U
SAR
ADC
X
C o n tro l
L o g ic
&
2 w ire
S e ria l
I/F
IN T
SDA
SCL
AD0
AD1
AUX
POR
PGND
RSTB
GND
●OVERVIEW
The BU21049GUL is a touch screen controller corresponding to a 4-wire resistive touch screen.
12-bit SAR A/D converter, clock oscillating circuit, power on reset circuit and LDO for inside blocks is built in one by one,
and it operates with a 1.65V - 3.60V single power supply.
The BU21049GUL can detect single point coordinates and touch pressure as existing 4-wire resistive touch screen
controllers, and can generate data based on the prearranged touch screen parameters to detect dual coordinates.
Communication with the BU21049GUL is used 2-wire serial interface. The BU21049GUL operate as i2c slave device.
The host processor can get control of the BU21049GUL by write to registers in the BU21049GUL and can select 2
operation mode which command control or automatic control. In automatic control, the BU21049GUL scan a touch screen
and covert to touch data when touch screen is touched. The touch data is saved in the internal registers and read by the
host processor at any time.
・Preprocess
The A/D converting is continuously done some times in one driving time. The data is median average processed.
The median average processing is done that sorting the data and calculation that takes the average from the center of the
sorting data. There is some effective for reduce noise influence.
・Interrupt control
The BU21049GUL will output an interrupt signal to the host processor with the INT pin, if a touch is detected. (In automatic
control, after scan of the 1st touch data is completed).
The INT pin polarity with active low.
・Power control
After a conversion function is completed, the BU21049GUL will be a power down automatically in order to reduce current
consumption. In automatic control, it return from a power down and restart scan automatically by operating a touch screen
during a power down.
・Power on reset
The BU21049GUL builds in the power-on-reset circuit.
The RSTB pin can short VDD, if the host processor is not control the RSTB pin. If shorted, registers of the BU21049GUL
initialization with power-on.
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
3/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Unit
VDD
-0.3～4.5
V
Power supply voltage for
touch screen
PVDD
-0.3～4.5
V
Digital input voltage
VIN1
-0.3～VDD+0.3
V
AD0,AD1,SDA,
SCL and RSTB
AUX input voltage
VIN2
GND-0.3～2.5
V
AUX
Voltage input to
touch screen Interface
VIN3
GND-0.3～2.5
V
XP,YP,XN and YN
Package power dissipation
Pd
750
mW
Storage temperature range
Tstg
-50～125
℃
Power supply voltage
Conditions
(*1)
(*1) Ambient temperature reduces a permission loss by 7.50mW per case more than 25 degree Celsius, 1degree Celsius.
●RECOMMENDED OPERATING CONDITIONS
Rating
Parameter
Symbol
Typ
Max
VDD
1.65
3.00
3.60
V
PVDD
1.65
-
VDD
V
Topr
-20
25
85
℃
Power supply voltage
Power supply voltage for
touch screen
Unit
Min
Operating temperature
Conditions
VDD≧PVDD
●ELECTRICAL CHARACTERISTICS (Ta=25℃, VDD=PVDD=3.00V, GND=0.00V, unless otherwise noted)
Parameter
Symbol
Rating
Min
Typ
Max
Unit
Low-level input voltage
VIL
GND-0.3
-
VDD*0.2
V
High-level input voltage
VIH
VDD*0.8
-
VDD+0.3
V
Low-level output voltage1
VOL1
-
-
GND+0.4
V
Low-level output voltage2
VOL2
-
-
VDD*0.2
V
High-level output voltage1
High-level output voltage2
Standby current
Sleep current
Active current
Resolution
Differential non-linearity error
Integrate non-linearity error
VOH1
VOH2
Ist
Islp
Iact
Ad
DNL
INL
VDD-0.4
VDD*0.8
-
100
0.8
12
-
1.0
200
2.0
V
V
uA
uA
mA
Bit
LSB
LSB
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
-3
-5
4/23
+3
+5
Conditions
AD0,AD1,SDA,SCL and
RSTB
AD0,AD1,SDA,SCL and
RSTB
SDA(IL=5mA),INT(IL=3mA),
VDD≧2.0V
SDA(IL=5mA),INT(IL=3mA),
VDD < 2.0V
INT,IL=-3mA VDD≧2.0V
INT,IL=-3mA VDD < 2.0V
RSTB=L
RSTB=H
No Load
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●Host interface AC timing
The slave address for 2-wire serial interface is selectable from “40h” or “41h” by “AD0” input.
AD0 = “L” : Slave Address = 40h
AD0 = “H” : Slave Address = 41h
.
2-wire serial I/F AC timing characteristics (Ta=25℃, VDD=PVDD=3.00V, GND=0.00V, unless otherwise noted)
Parameter
Rating
Symbol
Unit
MIN
TYP
MAX
fSCL
0
-
400
kHz
tHD:STA
0.6
-
-
us
SCL “L” period
tLOW
1.3
-
-
us
SCL “H” period
tHIGH
0.6
-
-
us
Data hold time
tHD:DAT
0.0
-
-
us
Data setup time
tSU:DAT
0.1
-
-
us
STOP condition setup time
tSU:STO
0.6
-
-
us
SCL clock frequency
START condition hold time
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/23
Condition
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●Host interface specification
The BU21049GUL operates as I2C slave device. The host processor transmit address byte after start condition when start
communication with the BU21049GUL. In case of operate convert function or write to register of the BU21049GUL, the host
processor transmit command byte after receive acknowledge of address byte. Communication with the BU21049GUL is
end when receive stop condition.
Address byte
Slave address for 2-wire interface is placed in the upper 7-bit of address byte and the last bit is READ/WRITE.
The upper 6-bit of slave address is fixed to “100000”, and the last bit of slave address is selected by “AD0” input.
Serial interface slave address byte
MSB
D7
D6
D5
1
0
0
Bit D1: A0
Slave address bit0 (AD0)
D4
0
D3
0
D2
0
LSB
D0
R/W
D1
A0
Bit D0: R/W
1=read (reading data)
0=write (writing data)
Command byte
The BU21049GUL operates depend on command byte. The host processor set CID (D7) to 1 when perform convert
function or set CID(D7) to 0 when perform register access..
Serial interface Command byte 1(CID=1)
MSB
D7
D6
D5
D4
D3
D2
1
CF
CMSK
Bit D7: Command Byte ID
1= Command Byte 1(start conversion function according to CF(Bit D6-D3)
LSB
D0
STP
D1
PDM
Bits D6-D4: CF
Convert function select as detailed the below.
BU21049GUL Convert function List
CF
0x0
0x1
Description
Touch screen scan function: X, Y, Z1 and Z2 coordinates and converted.
NOP
0x2
0x3
Auxiliary input converted.
Reserved
0x4
0x5
Free scan function: Drivers status and input of A/D assignment by Host.
Calibration: Paramters which used dual touch detection calibrated.
0x6
NOP
0x7
0x8
NOP
X+, X- drivers status.
0x9
0xA
Y+, Y- drivers status.
Y+, X- drivers status.
0xB
0xC
0xD
0xE
0xF
NOP
Touch screen scan function: X coordinate converted.
Touch screen scan function: Y coordinate converted.
Touch screen scan function: Z1 and Z2 coordinates converted.
Reserved
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
6/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
CF= 0000 : Automatic scan
The BU21049GUL periodically scan touch screen and convert without the host processor while detecting touch. When
touch is not detected, BU21049GUL stop function and keep power down state until detect next pen-down.
The order of scan process is Z1, Z2, X and Y.
CF= 0001, 0110, 0111, 1011
No operation. (“PDM” and “STP” is valid.)
CF= 0100 : Free scan mode
Selectable the driver (X+, X-, Y+, Y-) state and convert input(X+, X-, Y+, Y-, AUX) as optionally by register setting.
CF= 0101 : Calibration
Calibrate parameter for dual touch detection. To activate dual touch function, need to set CF=0101 and execute calibration
command after power on.
CF= 1000, 1001, 1010: Drivers status control
Activate analog circuit and panel driver corresponding to each command. BU21049GUL keep this state until receive other
SCAN instruction or be set “STP”.
CF= 1100, 1101, 1110: Manual scan
Convert coordination which corresponding to each command. BU21049GUL change state to power down after complete
conversion when “PDM” is set “0”, and if “PDM” is set “1”, keep power on.
CF= 0011, 1111
Reserved.
Bit D2：CMSK
0=Execute convert function.
1=NOT execute convert function, only use for reading the convert result.
Bit D1：PDM
Power down control
0= Power down after converter function stop.
1= NOT power down after converter function stop.
Bit D0：STP
1=The BU21049GUL abort current running conversion and change state to power down. STP is automatically set “0”.
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
7/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
Serial interface Command byte 0(CID=0)
MSB
D7
0
D6
D5
D4
ADDR[3:0]
D3
D2
PAGE
D1
SWRST
LSB
D0
STP
Bit D7: Command Byte ID
0= Command Byte 0(read/write data registers address specified by ADDR(Bit D6-D3).
Bits D6-D3: ADDR
D2: PAGE
“ADDR” and “PAGE” can select access register address as the below.
BU21049GUL Register map
PAGE ADDR
0x0
0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
0x8
0x9
0xA
0xB
0xC
0xD
1
INI
0x20
0xA6
0x04
0x10
0x10
0x10
0x00
0x00
0x00
0x0F
0x0F
0x72
0x00
0x00
7
RSV0
MAV
6
RSV0
5
CALIB
AVE
INTVL_TIME
4
INTRM
3
RSV0
-
2
RSV0
1
RSV0
SMPL
TIME_ST_ADC
0
RSV0
EVR_X
EVR_Y
EVR_XY
RSV0
RSV0
RM8
TEST
STRETCH
AUTO
PU90K
PVDD
PDM
0xE
0xF
0x0
DUAL
-
BUSY
RSV0
PIMIR_X
PIMIR_Y
PIDAC_OFS
AVDD
ACTIVE
CALIB
_DONE
TOUCH
0x02
HW_IDH
0x49
HW_IDL
0x00 SW_YP_ SW_YP_ SW_YN_ SW_YN_ SW_XP_ SW_XP_ SW_XN_ SW_XN_
POW
GND
POW
GND
POW
GND
POW
GND
0x1
VREFN_XN VREFN_YN SW_AUX SW_YPM SW_YNM SW_XPM SW_XNM
0x00
RSV
Reserved
0x2-0xF
-
(*1)RSV0 must be set 0.
(*2)INI= Initial value
Bit D1: SWRST
1= The BU21049GUL initialize all register, stop all operation and change state to power down. SWRST is automatically set
“0”.
Bit D0: STP
1= The BU21049GUL abort current running conversion and change state to power down. STP is automatically set “0”.
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
8/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
WRITE CYCLE
The 7-bit slave address is placed in the upper of address byte and Read/Write bit is in the LSB. The BU21049GUL issue an
acknowledgement after address byte if access is correct. After received the acknowledgement, HOST can send command
byte. When HOST received an acknowledgement of command byte from BU21049GUL, HOST continuously sends a write
data byte or issues a STOP condition.
S: START condition
P: STOP condition
A: ACK
N: NACK
READ CYCLE
The LSB of address byte is READ bit. The BU21049GUL send back data byte followed by an acknowledge at read mode.
The send back data is conversion result or register value. (It’s depend on last command byte)
HOST needs to resend conversion command with setting “CMSK=1” if HOST read register value before read conversion
result. BU21049GUL send back next data byte if BU21049GUL receive the acknowledge from HOST after sending data
byte. HOST finish read access by issuing a START condition (or STOP condition) followed by a not-acknowledge(NACK)
when HOST received last data byte.
S: START condition
P: STOP condition
A: ACK
N: NACK
SCL STRETCH
If HOST read conversion result while BU21049GUL is operating conversion, the BU21049GUL notify HOST by
SCL_STRETCH function.(*1) The SCL_STRECH is released when conversion function was finished.
SCL
SDA
1
0
0
0
0
0
1
A
C
K
D7
D6
Slave address & Read cycle
STATU
S
finish
(idle)
Convert function is running
Stretch(SCL=L)
(*1)Force SCL to “L” after ACK of slave address.
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
9/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●Power supply and reset timing specification
The BU21049GUL will be in standby state, if the RSTB pin is low, and the host processor cannot communicate with the
BU21049GUL. If pass the time(defined by Tdelay) after the RSTB pin is set to high, the BU21049GUL will be in idle state
and comes to be able to perform communication with the host processor.
The RSTB pin is connectable with power supply by the power-on-reset circuit.
Typ. 3.0V
VDD
PVDD
Typ. 3.0V
0V
Trise
RSTB
VDD*0.2
0V
Tdelay
Enable
(Internal signal)
‘H’(Enable)
‘L’(Disable)
‘L’(Disable)
Twait
Toff
Power-on-reset AC timing characteristics (Ta=25℃, VDD=PVDD=3.00V, GND=0.00V, unless otherwise noted)
Parameter
Symbol
Rating
Unit
Condition
MIN
TYP
MAX
Trise
0.01
-
10
ms
RSTB delay time
Tdelay
0
-
-
ms
Enable delay time
Twait
-
-
1
ms
VREF Cload=1.0uF
Toff
1
-
30
us
VREF Cload=1.0uF
VDD rise time
RSTB time
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
10/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●Specification of touch detection
The BU21049GUL builds in the touch detection function for outputting the interrupt signal to the INT pin during detect touch.
The equivalent circuit schematic of a touch detection function is shown in the following figure.
PVDD
50kΩ
Short when touch
screen is touched
INT
90kΩ
PU90K
(register)
YP
Control
Logic
XP
High when XP or YP
dirvers ON
YN
ON
PGND
GND
When the touch panel is connected to the panel interface terminal (XP, XN, YP, YN), XP pin is connected to PVDD through
internal pull-up resistance inside IC, the YN pin connects with PGND, and the BU21049GUL will be in a standby state at the
no-touch. At this time, the INT pin outputs "H" by an internal pull-up.
Since the XP pin and the YN pin are connected through the contact resistance of a touch screen when a touch screen is
touched, the resistance ratio of internal pull-up resistance and touch screen resistance detects the voltage drop of the XP
pin, and it outputs "L" from the INT pin.
Moreover, when a touch is detected and the XP pin or the YP pin changes into a drive state by each scanning operation,
internal pull-up resistance is separated from the XP pin, and the "L" output of the INT pin is held.
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●Control flow chart
The BU21049GUL has two operational modes, the command mode which operates by control of a host processor, and the
auto mode which operates by automatic control.
To use a two-point detection function, it is necessary to compensate the circuit for two-point detection of the BU21049GUL
firstly in the state which set the panel parameter (register Addr.0x3, 0x4). Compensation of the circuit for two-point detection
is performed by transmitting an exclusive command (CF=0101) from the host processor. The host processor should
initialize each register after power-on. At the time of two-point detection, please enable the interrupt signal from IC after
performing parameter correction.
Table. The BU21049UL Power-on sequence
step
1
state
Power-on
2
operation
Supply power and release reset.
Set disable (mask) interruption of the BU21049GUL.
After waiting time of reset release, initializate each register of the BU21049GUL via
I2C bus from the host processor.
initialization 1
（For 2 points
detecition only）
initialization 2 The host processor check not being touched in the touch screen from the INT pin or
（For 2 points
status register in the BU21049GUL. The host processor repeat this step as logn as a
detecition only） touch is detected.
The host processor transmit the calibration command(CF=0101) via I2C bus.
The BU21049GUL operates calibration of 2 point touch detection parameters and set
CALIB_DONE of status register to 1.
It stands by until BIT of a definite period or CALIB_DONE is turned on.
initialization 3 In the case of control with auto mode:
(For Auto mode
Transmit the SCAN-XYZ command via I2C bus.
only)
In the case of control with command method:
Especially nothing
Normal
The host processor enable an interrupt from the BU21049GUL and operates the other
(finish)
process or keep idle state until an interrupt detected.
3
4
5
6
7
8
Calibration flow
HOST
CALIB
(CF=0x5)
Read
Status
INT
tConv1
tConv1
tCalib
tConv1
tConv1
tCalib
Sample and Conversion
for X coordinate
Sample and Conversion
for Y coordinate
Calibrate
parameters
Sample and Conversion
for X coordinate
Sample and Conversion
for Y coordinate
Calibrate
parameters
BU21049
Detecting
touch
Detecting
touch
(*1) Even if a dashed line part does not perform, it does not have influence on operation.
tPON = 710us
tDLY1 = 1.5us
tADC = 18us
tDLY2 = 1.0us
tTIME_ST_ADC = register (addr.0x2)
tSMPL = register (addr.0x1)
tConv1 = tPON + tDLY1 + (tTIME_ST_ADC + (tADC * tSMPL) + tDLY2)
tCalib = 1 internal clock
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
12/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
Command mode
The BU21049GUL operates according to the control (command) by the host processor completely.
In order to take touch data, as long as touch pressure is ON, the host processor needs to continue controlling the
BU21049GUL. Moreover, since it is necessary to certainly transmit a command for taking touch data, processing of a host
interface becomes active compared with an auto system between ON of touch pressure.
Table. Command method sequence
step
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
touch screen operation
not touched The BU21049GUL is in idle state(power down).
The host processor operates the other process or keep the idle state.
touched
The BU21049GUL detect a touch and transmit interrupt to the host processor.
The host processor disable interrupt from the BU21049GUL.
The host processor transmit command of X data conversion via I2C bus.
The BU21049GUL turns on X drivers and makes the X-axis of the touch screen turn on electricity.
The BU21049GUL converts the X data from the touch screen ad transmits via I2C bus.
The host processor receives center data and 2 points data(total 4 byte).
When not detecting 2 points, only center data(2 byte) is received.
When the host processor need 2 or more data by filter processing etc., it repeats step 4~7.
The host processor transmit command of Y data conversion via I2C bus.
After the BU21049GUL turns off X drivers, it turns on Y drivers and makes the Y-axis of the touch screen turn
on electricity.
The BU21049GUL converts the Y data from the touch screen ad transmits via I2C bus.
The host processor receives center data and 2 points data and ghost data(total 6 byte).
When not detecting 2 points, only center data(2 byte) is received.
When the host processor need 2 or more data by filter processing etc., it repeats step 8~11.
The host processor transmit command of Z data conversion via I2C bus.
After the BU21049GUL turns off Y drivers, it turns on Z drivers(*1) and makes the Z-axis of the touch screen
turn on electricity.
The BU21049GUL converts the Z data from the touch screen ad transmits via I2C bus.
The host processor receives Z data(total 4 byte).
When the host processor need 2 or more data by filter processing etc., it repeats step 12~15.
The host processor calculates all the data and covert into touch coordinates.
The host processor checks the touch pressure from the INT pin or status register in the BU21049GUL. Step
4～16 repeated when there is touch pressure.
not touched turn back to step 1.
(*1) Z driver: YP=VDD, XN=GND state
(*2) Refer to the dual coordinates conversion (p. 17) for the conversion on coordinates from read data.
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
Touch screen scan flow 1 (X and Y scan)
Turn On
X+ and XDrivers
(CF=0x8)
HOST
Read
result of
SCAN X
SCAN X
(CF=0xC)
Turn On
Y+ and YDrivers
(CF=0x9)
Read
result of
SCAN Y
SCAN Y
(CF=0xD)
INT
tConv1
tConv1
BU21049
Detecting
touch
Waiting for
scan command
Sample and Conversion
for X coordinate
Detecting
touch
Waiting for
scan command
Sample and Conversion
for Y coordinate
Detecting
touch
Touch screen scan flow 2 (Z1 and Z2 scan)
Turn On
X+ and YDrivers
(CF=0xA)
HOST
Read
result of
SCAN Z1
SCAN Z
(CF=0xE)
Read
result of
SCAN Z2
INT
tConv1
tConv2
BU21049
Detecting
touch
Waiting for
scan command
Sample and Conversion
for Z1 coordinate
Sample and Conversion
for Z2 coordinate
Detecting
touch
tPON = 710us
tDLY1 = 1.5us
tADC = 18us
tDLY2 = 1.0us
tTIME_ST_ADC = register (addr.0x2)
tSMPL = register (addr.0x1)
tConv1 = tPON + tDLY1 + (tTIME_ST_ADC + (tADC * tSMPL) + tDLY2)
tConv2 = tDLY1 + (tADC * tSMPL) + tDLY2
(*1) Time is calculated with the oscillating frequency of the internal OSC is 8MHz.
(*2) In the case of PDM=1, tPON(s) is set to zero except for the first time.
(*3) A dashed line part is required only when set apply time to a panel more than tTIME_ST_ADC.
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
Auto mode
The BU21049GUL takes all of the detected touch pressure and the touch data by automatic control. An interrupt signal is
transmitted to the timing which the 1st data taken after detecting touch pressure completed.
In order for the BU21049GUL to continue taking touch data without control of the host processor, the host processor does
not need to control a touch screen.
Auto mode operation is started to the timing which received SCAN-XYZ (CF=0000) from the host processor. The INT pin is
not concerned with a touch state, but is set to “H” until the 1st touch data is acquired after a start of operation.
Table. Auto method sequence
step
1
2
3
4
5
6
7
8
9
10
11
touch screen operation
not touched The BU21049GUL is in idle state(power down).
The host processor operates the other process or keep the idle state.
The BU21049GUL detect a touch and turn on Z drivers(*1).
touched
The BU21049GUL converts the Z data from the touch scren and saves a result to temporary.
After the BU21049GUL turn off Z drivers, it turns on X drivers and makes the X-axis of the touch screen
turn on electricity.
The BU21049GUL converts the X data from the touch scren and saves a result to temporary.
After the BU21049GUL turn off X drivers, it turns on Y drivers and makes the Y-axis of the touch screen
turn on electricity.
The BU21049GUL converts the Y data from the touch scren and saves a result to temporary.
The BU21049GUL checks touch pressure.
When touch pressure is detected, all conversion result copied to internal registers in the BU21049GUL,
transmit interrupt signal to the host processor and it turn back to step 2.
When touch pressure is undetected, all conversion result are cancelled, transmission of an interrupt signal
is stopped, and it turn back to step 1.
The host processor does the mask of the interruption after receiving an interrupt signal.
The host processor received all touch data and 2 points data(total 14 byte) via I2C bus and convert to
touch coordinates.(*2)
When not detecting 2 points, only touch data(8 byte) is received.
The host processor checks the touch pressure from the INT pin or status register in the BU21049GUL.
Trun back to step 10 when there is touch pressure.
(*1) Z driver: YP=VDD, XN=GND state
(*2) Refer to the dual coordinates conversion (p. 17) for the conversion on coordinates from read data.
Touch screen scan flow 3(XYZ scan)
HOST
Read
result of SCAN XYZ
SCAN XYZ
(CF=0x0)
INT
tConv3
tINTVL
BU21049
Detecting
touch
Z1 coordinate
Sample and Conversion
Z2 coordinate
X coordinate
Y coordinate
Wait (INTVL_TIME)
Sample and Conversion
Z1 coordinate
Z2.
tPON = 710us
tDLY1 = 1.5us
tADC = 18us
tDLY2 = 1.0us
tTIME_ST_ADC = register (addr.0x2)
tINTVL = register (addr.0x2)
tSMPL = register (addr.0x1)
tConv3 = tPON + tDLY1 + (tTIME_ST_ADC + (tADC * tSMPL) + tDLY2) * 3
(*1) Time is calculated with the oscillating frequency of the internal OSC is 8MHz.
(*2) In the case of PDM=1, tPON(s) is set to zero except for the first time.
(*3) An order of taking each touch data, etc. cannot be changed.
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●dual coordinates conversion
The touch position of dual touch is convertible for coordinates because the host processor processes the data which the
BU21049GUL outputs. The data outputted changes with the commands received from the host processor as shown in
Table1. The host processor should take data from the BU21049GUL by the burst read via I2C. When reception is stopped
and it resumes before taking all the data, it is again outputted from Byte0.
When using it only by single point detection, it may be end reception to the timing which take each coordinates.
Table1. The output data list of each command
Byte
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Command method
X data taking
Command method
Y data taking
Command method
Z data taking
X
coordinate
X 2 points
paramter
Y
coordinate
Y 2 points
paramter
Ghost
parameter
-
Z1
coordinate
Z2
coordinate
Dummy
-
Auto method
X coordinate
Y coordinate
Dummy
Z1 coordinate
-
Z2 coordinate
X 2 points
paramter
Y 2 points
paramter
Ghost
parameter
Dummy
Table2. The output data format list
DATA
Bit07
X[11]
Y[11]
Z1[11]
Z2[11]
Bit06
X[10]
Y[10]
Z1[10]
Z2[10]
Bit05
X[9]
Y[9]
Z1[9]
Z2[9]
ByteH
Bit04 Bit03
X[8]
X[7]
Y[8]
Y[7]
Z1[8] Z1[7]
Z2[8] Z2[7]
Bit02
X[6]
Y[6]
Z1[6]
Z2[6]
Bit01
X[5]
Y[5]
Z1[5]
Z2[5]
Bit00
X[4]
Y[4]
Z1[4]
Z2[4]
Bit07
X[3]
Y[3]
Z1[3]
Z2[3]
Bit06
X[2]
Y[2]
Z1[2]
Z2[2]
Bit05
X[1]
Y[1]
Z1[1]
Z2[1]
ByteL
Bit04 Bit03
X[0]
0
Y[0]
0
Z1[0]
0
Z2[0]
0
Bit02 Bit01 Bit00
X coordinate
0
0
0
0
0
0
Y coordinate
Z1 coordinate
0
0
0
0
0
0
Z2 coordinate
X 2 points
PX[9]
PX[8] PX[7] PX[6] PX[5] PX[4] PX[3] PX[2] PX[1] PX[0]
0
0
0
0
0
SPX
parameter
Y 2 points
PY[9]
PY[8] PY[7] PY[6] PY[5] PY[4] PY[3] PY[2] PY[1] PY[0]
0
0
0
0
0
SPY
parameter
Ghost
GH[11] GH[10] GH[9] GH[8] GH[7] GH[6] GH[5] GH[4] GH[3] GH[2] GH[1] GH[0]
0
0
0
SGH
parameter
(*1)The ByteH is the even number Byte. The ByteL is the odd number Byte. It means that X coordinates are ByteH=Byte0 and ByteL=Byte1 when it is taken
with a command method.
X coordinate: Touched coordinate of X. It becomes gravity center coordinate of 2 points at dual touch.
X = ByteH * 16 + ByteL / 16
Y coordinate: Touched coordinate of Y. It becomes gravity center coordinate of 2 points at dual touch.
Y = ByteH * 16 + ByteL / 16
Z1 coordinate: Touched coordinate of Z1. It’s used when calculate touch pressure.
Z1 = ByteH * 16 + ByteL / 16
Z2 coordinate: Touched coordinate of Z2. It’s used when calculate touch pressure.
Z2 = ByteH * 16 + ByteL / 16
The X dual parameter: It is the pointer of table which used when calculate 2 points distance of X-axis.
PX = ByteH * 4 + ByteL / 64 (In the case of SPX=0)
PX = 0x400 – (ByteH * 4 + ByteL / 64) (In the case of SPX=1)
The Y dual parameter: It is the pointer of table which used when calculate 2 points distance of Y-axis.
PY = ByteH * 4 + ByteL / 64 (In the case of SPY=0)
PY = 0x400 – (ByteH * 4 + ByteL / 64) (In the case of SPY=1)
Ghost parameter: It is a value for judging a touch position (the direction of inclination) at dual touch.
GH = ByteH * 16 + ByteL / 16 (In the case of SPY=0)
GH = 0x1000 – (ByteH * 16 + ByteL / 16) (In the case of SPY=1)
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
Table3. Dual coordinates conversion flow
step
1
operation
All the data is acquired and conveted according to procedure (p.16).
2
3
If required, a filter etc. will be processig to data.
If only 1-point touch detection, conversion is end.
4
2 points touch detection:
2 points touch is detected comparing PX、PY and GH with threshold.
If 2-point touch is not detected, conversion is end.
X-axis 2-point distance calculation 1:
Data is acquired from the distance conversion table using the maximum of 2 points
distance determined beforehand.
The data is set to PRMX1.
X-axis 2-point distance calculation 2:
Data is acquired from the distance conversion table using PX.
The data is set to PRMX2.
X-axis 2-point distance calculation 3:
The 2 points distance of X-axis (DX) calculated.
DX = 2048 * (PRMX2 / PRMX1)
Y-axis 2-point distance calculation 1:
Data is acquired from the distance conversion table using the maximum of 2 points
distance determined beforehand.
The data is set to PRMY1.
Y-axis 2-point distance calculation 2:
Data is acquired from the distance conversion table using PY.
The data is set to PRMY2.
Y-axis 2-point distance calculation 3:
The 2 points distance of Y-axis (DY) calculated.
DY = 2048 * (PRMY2 / PRMY1)
X-axis 2-point touch coordinate conversion:
X-axis 2-point touch coordinate convert from center position(X) and distance(DX).
X1 = X + DX
X2 = X - DX
Y-axis 2-point touch coordinate conversion:
Y-axis 2-point touch coordinate convert from center position(Y), distance(DY) and
ghost value(GH).
When GH more than threshold.
Y1 = Y + DY
Y2 = Y - DY
When GH less than threshold.
Y1 = Y - DY
Y2 = Y + DY
It is generated, and since they are not exact coordinates, if 2-point coordinates are
required, they process offset etc.
5
6
7
8
9
10
11
12
13
14
www.rohm.co
conversion is end.
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●Register description
PAGE=0, ADDR=0x0
D7
RSV0
D6
RSV0
D5
CALIB
D4
INTRM
D3
RSV0
D2
RSV0
D1
RSV0
D0
RSV0
Bits D7-D6, D3-D0: RSV0
Reserved. Set 0 these bits.
Bit D5 : CALIB
Internal parameter setting-1 for calibration of dual touch detection
0= NOT use calibration result
1= Use calibration result
Bit D4 : INTRM
Setting of INT states in case that BU21049GUL is active after convert operation by “PDM” setting.
0= depend on “pen-down”
1= always output “0”
PAGE=0, ADDR=0x1 : CFR1
D7
MAV
D6
D5
AVE
D4
D3
-
D2
D1
SMPL
D0
Bit D7: MAV
Median Average Filter
0= Off
1= On
Bits D6-D4: AVE
AVE+1= The number of average samples setting for MAV. If AVE more than SMPL, it is even out SMPL.
Bits D2-D0: SMPL
SMPL+1= The number of conversion samples setting for MAV.
Ex. In the case of CFR1 = 0xA6 (the number of average samples is 3 and the number of conversion samples is 7)
Conversion result
{ 1676, 1688, 1656, 1677, 1659, 1702, 4095 }
Sorted result
{ 1656, 1659, 1676, 1677, 1688, 1702, 4095 }
Chose 3 center data
{ 1656, 1659, 1676, 1677, 1688, 1702, 4095 }
Average above 3 data = ( 1676 + 1677 + 1688 ) / 3 =1680 (vs averaged all six data = 2022)
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
PAGE=0, ADDR=0x2 : CFR2
D7
D6
D5
INTVL_TIME[3:0]
D4
D3
D2
D1
TIME_ST_ADC[3:0]
D0
Bits D7-D4: INTVL_TIME
This is waiting time setting between conversion be completed and start next conversion.
(Only usable setting at conversion function=0x0.)
In the using case, set value as four or more.
INTVL_TIME setting table
value
0x0～0x3
0x4
0x5
0x6
0x7
0x8
0x9
0xA
0xB
0xC～0xF
time
Reserved
0.256ms
1.024ms
2.048ms
4.096ms
5.120ms
8.912ms
10.240ms
15.360ms
20.480ms
※Above showed time are calculated with the oscillating frequency of the internal OSC is 8MHz.
Bit D3-D0 : TIME_ST_ADC
This is waiting time setting between apply voltage to panel and starting A/D conversion.
TIME_ST_ADC setting table
value
0x0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
0x8
0x9
0xA
0xB
0xC
0xD
0xE
0xF
time
8us
20us
30us
40us
50us
60us
70us
80us
90us
100us
200us
250us
300us
360us
400us
500us
※Above showed time are calculated with the oscillating frequency of the internal OSC is 8MHz.
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
19/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
PAGE=0,ADDR=0x3 ～ 0x5: EVR
D7
D6
D5
D4
D3
EVR_*[7:0]
D2
D1
D0
Bits D7-D0: EVR_*
Gain setting 1 for dual touch detection. When using 2 points detection function, it is necessary to set here before conversion.
It corresponds X, Y and XY (Z). EVR_XY is not necessary to change from initial value.
PAGE=0, ADDR=0x9, 0xA: PIMIR
D7
-
D6
-
D5
-
D4
D3
D2
PIMIR_*[4:0]
D1
D0
Bits D7-D0: PIMIR_*
Gain setting 2 for dual touch detection. It is not necessary to change from initial value.
It corresponds X and Y.
PAGE=0, ADDR=0xB: CFR3
D7
RM8
D6
STRETCH
D5
PU90K
D4
DUAL
D3
D2
D1
PIDAC_OFS[3:0]
D0
Bit D7: RM8
Coordinate resolution setting
0= 12bit
1= 8bit
Bit D6: STRETCH
SCL_STRETCH function setting
0= off
1= on
Bit D5 : PU90K
Internal pull-up resistance for touch detection setting
0= about 90kΩ
1= about 50kΩ
Bit D4: DUAL
Dual touch detection function setting
0= Off
1= On
Bits D3-D0: PIDAC_OFS
Dual touch detection circuit adjustment setting. It is not necessary to change from initial value.
PAGE=0, ADDR=0xC: LDO
D7
-
D6
D5
PVDD[2:0]
D4
D3
-
D2
D1
AVDD[2:0]
D0
Bits D6-D4: PVDD
Regulator for apply to panel output setting.
By increasing voltage, the effect which reduces the influence of the exogenous noise from a panel interface terminal is
acquired.
PVDD setting table
value
0
1
2
3
4
5
6
7
output
1.500V
1.556V
1.615V
1.680V
1.750V
1.826V
1.909V
2.000V
Bits D2-D0: AVDD
The output voltage setting of the analog circuit regulator.
The relationship of setting value and output voltage is same as PVDD.
It is not possible to change from initial value when use with VDD or PVDD lower supply than 2.5V.
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
20/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
PAGE=0, ADDR=0xD: STATUS (Read only)
D7
D6
D5
D4
D3
D2
TEST
AUTO
PDM
-
BUSY
ACTIVE
D1
CALIB
_DONE
D0
TOUCH
Bit D7: TEST
This bit will become “1” during TEST mode.
Bit D6: AUTO
This bit will become “1” at conversion function 0.
Bit D5: PDM
PDM setting value of command byte1.
Bit D3: BUSY
This bit will become “1” during IC converting coordinate data.
Bit D2: ACTIVE
This bit will become “1” when internal analog circuit is active.
Bit D1: CALIB
This bit will become “1” in case that dual touch detection parameter adjustment is finished by command (CF=0x5).
This bit will be clear when write “1” to this bit.
Bit D0: TOUCH
This bit will become “1” when detect pen-down at internally.
PAGE=0, ADDR=0xE: HW_ID1 (Read only)
D7
D6
D5
D4
D3
D2
D1
D0
D3
D2
D1
D0
D3
SW_XP_
POW
D2
SW_XP_
GND
D1
SW_XN_
POW
D0
SW_XN_
GND
HW_IDH
Bits D7-D0: HW_IDH
High 8bit of IC’s ID
PAGE=0, ADDR=0xF: ID (Read only)
D7
D6
D5
D4
HW_IDL
Bits D7-D0: HW_IDL
Low 8-bit of IC’s ID
PAGE=1, ADDR=0x0: FREE_SW1
D7
SW_YP_
POW
D6
SW_YP_
GND
D5
SW_YN_
POW
D4
SW_YN_
GND
Bits D7-D0: SW_**_POW(GND)
Driver setting at conversion function 4(Free scan)
Drive to “+” by set POW and “-”by set GND, Must not set “+”and“-”to one terminal at the same time.
** = the corresponding terminal name
PAGE=1, ADDR=0x1: FREE_SW2
D7
RSV
D6
D5
VREFN_XN VREFN_YN
D4
SW_AUX
D3
SW_YPM
D2
SW_YNM
D1
SW_XPM
D0
SW_XNM
Bits D7 – D5: RSV0
Reserved. They must be set “0”.
Bit D4: SW_AUX
Bit D3-D0: SW_**M
A/D input setting at conversion function 4(Free scan)
** = the corresponding terminal name
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
21/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC's
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply
terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an
electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem
including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Rush current
The IC with some power supplies has a capable of rush current due to procedure and delay at power-on. Pay attention to
the capacitance of the coupling condensers and the wiring pattern width and routing of the power supply and the GND
lines.
(13) Others
In case of use this LSI, please peruse some other detail documents, we called, Technical note, Functional description,
Application note.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
22/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
BU21049GUL
●Ordering Information
B
U
2
1
0
4
9
G
U
L
-
E
2
Package
Tape and Reel information
GUL: VCSP50L2
E2: Embossed carrier tape
●Physical Dimension Tape and Reel Information
VCSP50L2(BU21049GUL)
1PIN MARK
2.00±0.05
0.55MAX
0.1±0.05
2.00±0.05
<Tape and Reel information>
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.25±0.05
S
16- φ 0.25±0.05
Tape
0.06 S
0.05 A B
A
(φ0.15)INDEX POST
B
C
B
P=0.5×3
D
A
1
0.25±0.05
2
3
1pin
4
P=0.5×3
(Unit : mm)
Reel
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
1 PIN MARK
U049
LOT No.
www.rohm.co
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
23/23
TSZ02201-0Y1Y0F300010-1-2
31.JAN.2012 Rev.001
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.