Application Specification Mezza-pede® Low Profile SMT Connector Rev. 2 – October 3, 2014 Application Specification Table of Contents 1.0 Introduction 3 2.0 Scope 3 3.0 Product Overview 3 4.0 Part Number Structure 6 5.0 Shipping 7 6.0 PC Board Design 7 7.0 PC Board Application Procedure 8 8.0 Solder Paste and Disposition 8 9.0 Solder Reflow 9 10.0 Double Sided Reflow 11 11.0 Cleaning 11 12.0 Protective – Pick and Place Cover Removal 11 13.0 Recommended Mating and Unmating Procedure 12 14.0 Storage 13 15.0 Revision History 14 Mezza-pede® SMT Connector, Rev. 2 Page 2 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification 1.0 Introduction The Mezza-pede® 1.0mm pitch Low Profile SMT Connector was designed for the mating and unmating of a PCB to a PCB, PCB to Flex cable, or Flex cable to Flex cable. 2.0 Scope This product application specification sheet covers the 1mm low profile SMT receptacle (socket) assembly and the SMT and thru-hole header assemblies. 3.0 Product Overview There are two (2) components that make up this connector system, a receptacle and a header. The receptacle incorporates a female shell with an internal contact, an insulator, and a terminal lead [see Fig. 1A]. The receptacle is the portion of the connector system that would typically be mounted to the PC board (main board). The header incorporates a male terminal, an insulator, and a terminal lead [see Figs. 1B and 1C]. The header is attached to a 2nd PC board (mating or daughter board) in stacking (mezzanine) board to board applications or to a flex circuit for cable to PCB applications. The board mount receptacle and SMT header are shipped in tape and reel packaging. A protective pick-and-place cover, which is to be removed after the solder-attach process and before product usage, is supplied as standard on the headers and optional on the receptacles [see Fig. 5]. This cover can be left in place for storage or for protection of the terminals/contacts during the handling processes. The flexible thru-hole headers are supplied in trays without pick-and-place covers. Contact Receptacle (Socket) Shell Insulator Leads Figure 1A Mezza-pede® SMT Connector, Rev. 2 Page 3 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification Terminal Ø 0.011 [0.18] Insulator Terminal Ø 0.011 [0.18] Lead SMT Header Thru-hole Header Insulator Figure 1B 3.1 3.2 3.3 3.4 Figure 1C Overall dimension in the “X” axis. [ Dimension “A” in Fig. 2] • 8 Position: 0.171/(4.34) • 14 Position: 0.290/(7.36) • 30 Position: 0.605/(15.37) • 36 Position: 0.722/(18.34) Overall dimension in the “Y” axis. [ Fig. 2] • 8 Position: 0.150/(3.81) • 14 Position: 0.150/(3.81) • 30 Position: 0.150/(3.81) • 36 Position: 0.150/(3.81) "B" dimension. [ Fig. 2] • • • • 8 Position: 0.118/(3.00) 14 Position: 0.236/(6.00) 30 Position: 0.551/(14.00) 36 Position: 0.669/(17.00) • • Spacing in the “X” axis is 0.039/(1.00) TYP. [Fig. 2] Spacing in the “Y” axis is 0.039/(1.00) TYP. [Fig. 2] Pitch: "Y" "X" Figure 2 14 Position shown for Ref. Mezza-pede® SMT Connector, Rev. 2 Page 4 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification 3.5 Stack Height (“Z”), which is the resultant distance between two (2) mated and stacked PCBs as measured from the bottom of the upper PC board to the top of the mating PC board, is 0.157/(4.00) approx. for the SMT version [Fig 3A] and 0.122/(3.10) for the through hole version [Fig 3B]. *Note: Mated height will vary depending on reflow profile, paste volume, and PC board pad size. .157/(4.00) .122/(3.10) Figure 3A 3.6 Figure 3B The low profile SMT connector system utilizes a screw-machined terminal that is pressed into and soldered to a terminal lead to assure a robust connection. This patented design allows the use of screw-machine technology along with metal forming technology. [Fig. 4] Solder Fillet Figure 4 3.7 3.8 The leads are plated with Matte Tin to be RoHS compliant. The removable cover (cap) is designed to facilitate automated pick-and-place and to protect the terminals during transportation, storage, and assembly. Covers are provided as a standard feature on the header [Fig. 5A] and an option on the receptacle [Fig. 5B]. This cover needs to be removed before the product can be put into use, but only after the solder reflow operation has taken place. Protective/pick-and-place cover SMT Header Mezza-pede® SMT Connector, Rev. 2 Receptacle (Socket) Page 5 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification Figure 5A Figure 5B 4.0 Part Number Structure 4.1 Part number structure Receptacle (Female, Socket) DHS Figure 6 Header (Male) DHAM DHA Figure 7 Mezza-pede® SMT Connector, Rev. 2 Page 6 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification 5.0 Shipping 5.1 Standard shipping for both the DHS and DHAM product line is in tape and reel. [Fig. 8] Figure 8 5.2 Standard shipping for the DHA product line is in trays. 6.0 PC Board Design Proper PC board design affects connector reliability and performance. The following recommendations are intended to ensure reliable electrical connections, while maximizing manufacturing yields and aiding in possible rework applications. 6.1 6.2 6.3 6.4 PC board pad size .024/(0.610) x 0.054/(1.37). Copper defined solder pads. Pad materials: Copper with Immersion Gold, Immersion Silver, OSP or HASL. Solder mask clearance must be greater than the PC board pad size and be registered properly so that .002" (0.05mm) minimum clearance is met all around the pad. 6.5 PC board vias should not be included in the solder pads. [Fig. 9] The connector side of the via shall be fully covered with solder mask. Solder mask may be truncated along interconnect trace. Mezza-pede® SMT Connector, Rev. 2 Page 7 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification Figure 9 7.0 PC Board Application 7.1 The protective cover attached to the SMT header (optional on the receptacle) can be used for vacuum pickup and placement with automated equipment. Placement by mechanical grippers that grip the outside of the insulator is acceptable but not preferred. 7.2 Receptacle and/or header will be placed so that solder leads are placed on top of or lightly pushed into the solder paste. Receptacle and/or header shall not be dragged into place, since this will track solder paste that may cause bridging and result in an electrical short. 7.3 Receptacle and/or header placement utilizes typical SMT placement procedures. 8.0 Solder Flux/Paste 8.1 To make the product easier to use, a no-clean RMA Flux is recommended. If using a solder paste, a no-clean solder paste is recommended. 8.2 Standard product requires the use of eutectic SnPb solder paste. 8.3 Recommended solder paste for lead-free, RoHS compliant product is 95.5Sn /4.0Ag /0.5Cu. 8.4 Recommended stencil thickness is .003 inches (0.08mm). 8.5 Recommend a rectangle aperture of .019 inches (0.48mm) X .043 inches (1.09mm) for a .003 inches (0.08mm) thick stencil. Mezza-pede® SMT Connector, Rev. 2 Page 8 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification 9.0 Solder Reflow All recommended temperatures are on top surface of the board, either inside or in close proximity to the Mezza-pede® SMT Connector. 9.1 For standard SnPb product: 9.1.1 9.1.2 9.1.3 9.1.4 9.1.5 9.1.6 9.1.7 To obtain temperature equalization at all the joint locations, soak at 130° C to 160° C before reflow for 120 seconds max. Reflow time above 183° C should be between 45 seconds and 75 seconds. Peak temperature should be between 210° C and 217° C. The maximum temperature on the board should not exceed 230° C for more than 10 seconds. A nitrogen environment of equal to or greater than 4,000 ppm O² can improve stability, but it is not required. Maximum ramp rate should be 3° C per second. See Figure 10A for sample profile. 9.2 For lead-free RoHS compliant product: 9.2.1 9.2.2 9.2.3 9.2.4 9.2.5 9.2.6 9.2.7 To obtain temperature equalization at all BGA locations, soak at 150° C to 210° C prior to reflow for 60-90 seconds. Reflow time above 219° C should be a maximum of 90 seconds. Peak temperature should be between 235° C and 250° C. The maximum temperature on the board should not exceed 260° C for more than 10 seconds. The maximum total cumulative time to ramp up, soak, and reflow the board shall be limited to 330 seconds. Nitrogen environment of equal to or greater than 4,000 ppm O² can improve stability, but it is not required. Maximum ramp rate should be <2.5° C per second. [Fig. 10B] Mezza-pede® SMT Connector, Rev. 2 Page 9 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification Figure 10A Figure 10B Mezza-pede® SMT Connector, Rev. 2 Page 10 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification 10.0 Double Sided Reflow The Mezza-pede® SMT Connector is suitable for double sided reflow. In all cases users should verify connector applicability for inverted reflow through process verification testing. 11.0 Cleaning The connector and board assembly can be washed with an appropriate cleaner to remove any residue or contaminants after reflow. Vacuum pickup caps should be removed before cleaning to reduce the chance of trapping cleaning solutions. 12.0 Protective Cover Removal To manually remove the protective/pick-and-place cover: 12.1 With the cover installed as shown in. [Fig. 11A] grab the cover with your fingers on two opposing sides. 12.2 Pull the cover up from the header or receptacle (socket) keeping the cover parallel to the insulator (wafer). [Fig. 11B] 12.3 Save protective cover as a terminal/contact protector during storage. Removal Direction Removal Direction SMT Header Removal Direction Removal Direction Receptacle (Socket) Figure 11A Mezza-pede® SMT Connector, Rev. 2 Figure 11B Page 11 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification 13.0 Recommended Mating and Unmating 13.1 Mating the two halves of the receptacle/header system: 13.1.1 13.1.2 13.1.3 13.1.4 Align the male terminals with the opening in the female shell. [Fig. 12A] Verify that all the male terminals are inside of the female shells. [Fig. 12B] Push down until the positive stop is contacted. [Fig. 12C] Verify that the pins are fully seated. Figure 12A Figure 12B Figure 12C Mezza-pede® SMT Connector, Rev. 2 Page 12 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification 13.2 Unmating the receptacle/header system: 13.2.1 There is no extraction tool available for this connector system. 13.2.2 To remove the header from the receptacle, grab the PCB as close as possible to the connector and pull up in a parallel direction to the receptacle. 13.2.3 Continue pulling up till the male terminals have cleared the female shell. 13.2.4 Replace protective cover onto header to protect male terminals from being damaged. Removal Direction Removal Direction Figure 13A Figure 13B 14.0 Storage 14.1 It is recommended to keep the protective covers in place, or re-install them, if parts will not be used for an extended period of time. 14.2 See section 12.0 for cover removal. Mezza-pede® SMT Connector, Rev. 2 Page 13 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm) Application Specification 15.0 Revision History REV. 0 1 2 DESCRIPTION New Release Added 30 pos., ®, and receptacle cover option Changed stencil aperture in section 8.5 Mezza-pede® SMT Connector, Rev. 2 BY G. Goodman G. Goodman G. Goodman DATE 2-24-09 5-9-13 10-3-14 Page 14 ©2009-2014, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. Product may be covered by patents issued and/or pending. Dim. shown: inch/(mm)