AEC-Q100G Qualification Summary Objective: Freescale PN: Part Name: Technology: Package: Fab / Assembly / Final Test Sites: Maskset#: Rev#: Die Size (in mm) WxLxT Part Operating Temp. Grade: 64ld LQFP Pictus 256k New Product Introduction Qualification Customer Name(s): PN(s): Design Engr: Phone #: Product Engr: Phone #: Prod. Package Phone #: NPI PRQE: Phone #: MPC5602P Pictus 256k 0.09um CMOS90 Z3 core LQFP 64 10x10 x 1.4 Pitch 0.5 FSL-ATMC / FSL-TJN-FM FSL-TJN-FM M22Y 0 3.576 x 3.563 x 0.3302 125°C Ta Grade 1 Trace/DateCode General Market Summary Revision # Date: Christoph Patzelt QUARTZ Tracking #: Moyra Peterson Chris Sanderson J.M. Liu 1.4 8th March 2013 212020 (Signature/Date shown below may be electronic) PPE Approval N/A Signature & Date: NPI PRQE Plan Approval Douglas Blackwood Signature & Date: 10th October 2011 Douglas Blackwood DD82200 QTZZB1111A CAB Approval 09201375M Signature & Date: Neil Ross 13th October 2011 TESTS HIGHLIGHTED IN YELLOW WERE PERFORMED FOR THIS STUDY This testing is performed by Freescale FSL-EKB and FSL-TJN where noted in the Comments GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS STRESS TEST Reference J=JESD22 Test Conditions (Surface Mount Devices Only - PC required for THB, HAST, AC, UHST, TC, PC+PTC) JESD22- Preconditioning : A113 MSL 3 @ 260°C, +5/-0°C J-STD-020 Pre and Post CSAM SS=11 units per lot per stress test PC End Point Requirements TEST @ RHC Minimum Sample Size # of Lots Total Units All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC Results LotID-(#Rej/SS) NA=Not Applicable Pass by similarity HAST JESD22A110 PC before HAST required for SMDs. Highly Accelerated Stress Test, Biased: HAST = 130°C/85%RH for 96 hrs. Bias = 5.5V TEST @ RH 77 0 0 Pass by similarity AC JESD22A102 PC before AC required for SMDs. Autoclave: AC = 121°C/100%RH/15 psig for 96 hrs TEST @ R 77 0 0 Pass by similarity TC JESD22A104 AEC Q100Appendix 3 PC before TC required for SMDs TEST @ HC Temperature Cycle: WBP =/> 3 grams TC = -65°C to 150°C for 500 cycles. WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used. 77 0 0 Pass by similarity JESD22A105 For SMD devices only. Preconditioning plus Power Temperture Cycle: TEST @ RH 22 0 0 JESD22A105 Power Temperature Cycle: PTC = ?°C to ?°C for 1000 cycles; Bias = ? High Temperature Storage Life: 150°C for 1008 hrs TEST @ RH 23 0 0 TEST @ RHC 77 1 77 Comments Generic Data Performed in TJN 212211: Lot 1 0/231 Bolero 256k 64ld 212211: Lot 2 0/231 Bolero 256k 64ld 212211: Lot 3 0/231 Bolero 256k 64ld Generic Data Performed in TJN 212211: Lot 1 0/77 Bolero 256k 64ld 212211: Lot 2 0/77 Bolero 256k 64ld 212211: Lot 3 0/77 Bolero 256k 64ld Generic Data Performed in TJN 212211: Lot 1 0/77 Bolero 256k 64ld 212211: Lot 2 0/77 Bolero 256k 64ld 212211: Lot 3 0/77 Bolero 256k 64ld Generic Data Performed in TJN 212211: Lot 1 0/77 Bolero 256k 64ld 212211: Lot 2 0/77 Bolero 256k 64ld 212211: Lot 3 0/77 Bolero 256k 64ld All Post 500TC wirepulls >3g PTC HTSL JESD22A103 STRESS TEST Reference HTOL JESD22A108 Low power device, not required. Lot1: 0/77 Performed in EKB TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS Test Conditions High Temperature Operating Life: Ta= 125°C for 1008 Bias: Vdd I/O= 5.0V nom : 6.0V Stress Vdd core = 1.2V nom : 1.58V Stress End Point Requirements Minimum Sample Size # of Lots Total Units Results LotID-(#Rej/SS) NA=Not applicable Comments TEST @ RHC 77 0 0 Pass by similarity, performed Generic Data on 100ld Pictus 256k Performed in EKB 212019: Lot 1 0/77 Pictus 256k 100ld (4048hrs) 212019: Lot 2 0/77 Pictus 256k 100ld (1008hrs) 212019: Lot 3 0/77 Pictus 256k 100ld (1008hrs) 212209: Lot 1 0/77 Bolero 256k 100ld (1008hrs) TEST @ RHC 800 0 0 Pass by similarity TEST @ RHC 77 0 0 Pass by similarity, performed Generic Data on 100ld Pictus 256k Performed in EKB 212019: Lot 1 0/77 Pictus 256k 100ld 212019: Lot 2 0/77 Pictus 256k 100ld 212019: Lot 3 0/77 Pictus 256k 100ld TEST @ RHC 77 0 0 Pass by similarity, performed Generic Data on 100ld Pictus 256k Performed in EKB 212019: Lot 1 0/77 Pictus 256k 100ld 212019: Lot 2 0/77 Pictus 256k 100ld 212019: Lot 3 0/77 Pictus 256k 100ld NVM cycling @125°C, as shown in EDR below, is required NVM in Checkerboard ELFR AEC Q100- Early Life Failure Rate: 008 Ta = 125°C for 48 hrs; Bias: Vdd I/O= 5.0V nom : 6.0V Stress Vdd core = 1.2V nom : 1.58V Stress 10% of NVM cycling @125°C, as shown in EDR below, is required NVM in Checkerboard EDR AEC Q100- NVM Endurance, Data Retention, 005 C-Flash: 256k Array @ 125°C (2x16k, 3x32k, 1x128k) 100K W/E for 16k block size 10K W/E for 32k block size 1K W/E for 128k block size Generic Data Performed in EKB 212019: Lot 1 0/400 Pictus 256k 100ld 212019: Lot 2 0/400 Pictus 256k 100ld 212209: Lot 1 0/800 Bolero 256k 100ld 212657: Lot 1 0/787 Bolero 1.5M 176ld 212658: Lot 1 0/813 Bolero 1.5M 144ld D-Flash: 64Kb Block @ 125°C 100K W/E for 16k block size NVM in Checkerboard 504, 1008hrs @ 150°C NVM Endurance, Data Retention, C-Flash 0: 256k Array @ -40°C (2x16k, 3x32k, 1x128k) 100K W/E for 16k block size 10K W/E for 32k block size 1K W/E for 128k block size D-Flash: 64Kb Block @ -40°C 100K W/E for 16k block size NVM in Checkerboard 504, 1008hrs @ 150°C FORMPPAP004XLS 1 of 3 Freescale Rev U Freescale PN: MPC5602P Part Name: Pictus 256k Customer Name(s): General Market PN(s): Summary Revision # Date: 1.4 8th March 2013 TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS STRESS TEST Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results LotID-(#Rej/SS) NA=Not applicable Comments WBS AEC Q100- Wire Bond shear 001 Cpk = or > 1.67 30 bonds from minimum 5 units 1 5 Lot1: Cpk= 2.79 Performed in TJN WBP MilStd883- Wire Bond Pull 2011 Cond. C or D Cpk = or > 1.67 30 bonds from minimum 5 units 1 5 Lot1: Cpk= 3.06 Performed in TJN SD JESD22B102 Solderability; 8hr. Steam age (1 hr. for Au-plated leads) prior to test. If production burn-in is done, samples must also undergo burn-in. >95% lead coverage of critical areas 15 1 15 Lot1: 0/15 Performed in TJN PD JESD22B100 Physical Dimensions PD per 98A drawing Cpk = or > 1.67 10 3 30 (w) (l) (h) Lot1: Cpk= 3.14 2.56 2.43 Lot2: Cpk= 2.43 1.99 3.12 Lot3: Cpk= 3.97 4.03 3.47 Performed in TJN 10 (5 balls from a min. of 10 devices) 0 0 N/A, not required for SM devices. 5 (10 leads from each of 5 parts) 0 0 N/A, not required for SM devices. AEC-Q100- Solder Ball Shear; Cpk = or >1.67 010 Performed on all solder ball mounted packages e.g. PBGA, Chip Scale, Micro Lead Frame (but NOT Flip Chip). Two 260°C reflow cycles before shear. SBS LI JESD22B105 STRESS TEST Reference Lead Integrity Not required for surface mount devices; Only required for through-hole devices. No lead breakage or cracks TEST GROUP D - DIE FABRICATION RELIABILITY TESTS Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Electro Migration EM NBTI Negative Bias Temperature Instability TDDB Time Dependent Dielectric Breakdown HCI Hot Carrier Injection SM Stress Migration Results LotID-(#Rej/SS) NA=Not applicable Comments Derivative Device on qualified Process. Report available on request Derivative Device on qualified Process. Report available on request Derivative Device on qualified Process. Report available on request Derivative Device on qualified Process. Report available on request Derivative Device on qualified Process. Report available on request TEST GROUP E - ELECTRICAL VERIFICATION TESTS STRESS TEST Reference Test Conditions Minimum Sample Size # of Lots Total Units All All All TEST @ RH 2KV min. 3 units per Voltage level 0 0 Pass by similarity, performed Generic data on 100ld Pictus 256k Performed in KLM Performed on Pictus 256k 100ld 212019: 500V 0/3 212019: 1000V 0/3 212019: 1500V 0/3 212019: 2000V 0/3 AEC-Q100- ElectroStatic Discharge/ ESD 003 Machine Model Classification: (MM) Test @ 50 / 100 / 150 / 200 / 250 Volts CLASSIFICATION See AEC-Q100-003 for classification levels. TEST @ RH 250V min. 3 units per Voltage level 0 0 Pass by similarity, performed Generic data on 100ld Pictus 256k Performed in KLM Performed on Pictus 256k 100ld 212019: 50V 0/3 212019: 100V 0/3 212019: 150V 0/3 212019: 200V 0/3 AEC-Q100- ElectroStatic Discharge/ ESD 011 Charged Device Model Classification: (CDM) Test @ 250 / 500 / 750 Volts CLASSIFICATION See AEC-Q100-011 for classification levels. TEST @ RH Corner pins =/> 750V; All other pins =/> 500V 3 units per Voltage level 1 9 Lot1: 250V 0/3 500V 0/3 750V 0/3 Performed in TJN TEST @ RH 6 1 6 Lot1: 0/6 Performed in TJN 30 0 0 Pass by similarity, performed Generic data on 100ld Pictus 256k Performed in EKB 212019: Pictus 256k ED performed on 100ld: Pre- and Post Functional / Parametrics Test software shall meet requirements of AECQ100-007. Testing performed to the limits of device specification in temperature and limit value. AEC-Q100- ElectroStatic Discharge/ ESD 002 Human Body Model Classification: (HBM) Test @ 500 / 1000 / 1500 / 2000Volts CLASSIFICATION See AEC-Q100-002 for classification levels. TEST Freescale 48A End Point Requirements 0 Fails Results LotID-(#Rej/SS) NA=Not applicable Lot1: DD82200 Comments Timed RO of 96hrs MAX. LU JESD78 plus AEC-Q100004 ED AEC-Q100- Electrical Distribution 009, Freescale TEST @ RHC Cpk = or > 1.67 FG AEC-Q100- Fault Grading 007 FG shall be = or > 90% for qual units CHAR GL Latch-up: Test per JEDEC JESD78 with the AEC-Q100-004 requirements. Ta= Operating Temperature Maximum AEC-Q003 Characterization: Performed on new technologies and part families. AEC-Q100- Electro-Thermally Induced Gate Leakage; 006 155°C, 2.0 min, +400/-400 V FORMPPAP004XLS TEST @ R 6 Y 99% Y Report Available Performed in EKB Lot1: 0/6 Performed in KLM 1 2 of 3 6 Freescale Rev U Freescale PN: MPC5602P Part Name: Pictus 256k SAE EMC J1752/3 Radiated Emissions AEC Q100SC 012 Customer Name(s): General Market PN(s): 1 SER JEDEC Unaccelerated: JESD89-1 or Accelerated: JESD89-2 & JESD89-3 STRESS TEST Reference Electromagnetic Compatibility <40dBuV (see AEC Q100 Appendix 5 for test applicability; 150kHz - 1GHz done on case-by-case basis per customer/Freescale agreement) Short Circuit Characterization Applicable to all smart power devices. This test and statistical evaluation (see section 4 of Q100012) shall be performed per agreement between user and supplier on a case-by-case basis. Soft Error Rate Applicable to devices with memory sizes 1Mbit SRAM or DRAM based cells. Either test option (unaccelerated or accelerated) can be performed, in accordance to the referenced specifications. This test and its accept criteria is performed per agreement between user and supplier on a case-bycase basis. Final test report shall include detailed test facility location and altitude data. Summary Revision # Date: Pass 1.4 8th March 2013 Performed in ATX 1 1 10 0 0 Not applicable to microcontroller 3 0 0 Not applicable to microcontroller with RAM < 1Mbit TEST GROUP F - DEFECT SCREENING TESTS Test Conditions End Point Requirements Minimum Sample Size # of Lots Total Units Results LotID-(#Rej/SS) NA=Not applicable PAT AEC Q001 Part Average Testing Has PAT been established for this part? Implemented SBA AEC Q002 Statistical Bin Analysis Has SBYA been established for this part? Implemented Generic Quartz 212019 212209 212211 212657 212658 Data: Device MPC5602P MPC5602P MPC5602D MPC6507B MPC6507B Mask 0M22Y 1M18Y 1M18Y 0M03Y 0M03Y Revision 1.0 1.1 1.2 1.3 1.4 FORMPPAP004XLS Title Pictus Bolero Bolero Bolero Boler0 256k 256k 256k 1.5M 1.5M 100ld 100ld 64ld 176ld 144ld NPI Qualification NPI Qualification NPI Qualification Qualification Qualification Revision Date 15th May 2009 15th April 2011 10th October 2011 13th October 2011 8th March 2013 Fab FSL-ATMC FSL-ATMC FSL-ATMC FSL-ATMC FSL-ATMC Assembly FSL-KLM FSL-KLM FSL-TJN ASE-CL FSL-KLM Mould SUMITOMO EME-G700E SUMITOMO EME-G700E CEL9200HF10M HITACHI CEL-9240 SUMITOMO EME-G700E Description Original issue Updated Spec cycling requirements Added results Added CAB Approval Updated format for Web publishing Die Size 3.737x3.564x0.33mm 3.778x3.411x0.33mm 3.778x3.411x0.33mm 5.082x5.301x0.33mm 5.082x5.301x0.33mm Comments CAB 09201374M 09191268M 09191271M 11161323M 11161323M Douglas Douglas Douglas Douglas Douglas 3 of 3 Blackwood Blackwood Blackwood Blackwood Blackwood Freescale Rev U