212020

AEC-Q100G Qualification Summary
Objective:
Freescale PN:
Part Name:
Technology:
Package:
Fab / Assembly /
Final Test Sites:
Maskset#:
Rev#:
Die Size (in mm)
WxLxT
Part Operating
Temp. Grade:
64ld LQFP
Pictus 256k New Product Introduction Qualification
Customer Name(s):
PN(s):
Design Engr:
Phone #:
Product Engr:
Phone #:
Prod. Package
Phone #:
NPI PRQE:
Phone #:
MPC5602P
Pictus 256k
0.09um CMOS90 Z3 core
LQFP 64 10x10 x 1.4 Pitch 0.5
FSL-ATMC / FSL-TJN-FM
FSL-TJN-FM
M22Y
0
3.576 x 3.563 x 0.3302
125°C Ta
Grade 1
Trace/DateCode
General Market
Summary Revision #
Date:
Christoph Patzelt
QUARTZ Tracking #:
Moyra Peterson
Chris Sanderson
J.M. Liu
1.4
8th March 2013
212020
(Signature/Date shown below may be electronic)
PPE Approval N/A
Signature & Date:
NPI PRQE Plan Approval Douglas Blackwood
Signature & Date: 10th October 2011
Douglas Blackwood
DD82200
QTZZB1111A
CAB Approval 09201375M
Signature & Date: Neil Ross 13th October 2011
TESTS HIGHLIGHTED IN YELLOW WERE PERFORMED FOR THIS STUDY
This testing is performed by Freescale FSL-EKB and FSL-TJN where noted in the Comments
GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS
STRESS TEST
Reference
J=JESD22
Test Conditions
(Surface Mount Devices Only - PC required
for THB, HAST, AC, UHST, TC, PC+PTC)
JESD22- Preconditioning :
A113
MSL 3 @ 260°C, +5/-0°C
J-STD-020 Pre and Post CSAM SS=11 units per lot per stress
test
PC
End Point
Requirements
TEST @ RHC
Minimum
Sample Size
# of Lots
Total Units
All surface mount devices prior to THB, HAST,
AC, UHST, TC, PC+PTC
Results
LotID-(#Rej/SS)
NA=Not Applicable
Pass by similarity
HAST
JESD22A110
PC before HAST required for SMDs.
Highly Accelerated Stress Test, Biased:
HAST = 130°C/85%RH for 96 hrs.
Bias = 5.5V
TEST @ RH
77
0
0
Pass by similarity
AC
JESD22A102
PC before AC required for SMDs.
Autoclave:
AC = 121°C/100%RH/15 psig for 96 hrs
TEST @ R
77
0
0
Pass by similarity
TC
JESD22A104
AEC Q100Appendix 3
PC before TC required for SMDs
TEST @ HC
Temperature Cycle:
WBP =/> 3 grams
TC = -65°C to 150°C for 500 cycles.
WBP after TC on 5 devices from 1 lot; 2 bonds per
corner and one mid-bond per side on each device.
Record which pins were used.
77
0
0
Pass by similarity
JESD22A105
For SMD devices only.
Preconditioning plus Power Temperture Cycle:
TEST @ RH
22
0
0
JESD22A105
Power Temperature Cycle:
PTC = ?°C to ?°C for 1000 cycles;
Bias = ?
High Temperature Storage Life:
150°C for 1008 hrs
TEST @ RH
23
0
0
TEST @ RHC
77
1
77
Comments
Generic Data
Performed in TJN
212211: Lot 1 0/231 Bolero 256k 64ld
212211: Lot 2 0/231 Bolero 256k 64ld
212211: Lot 3 0/231 Bolero 256k 64ld
Generic Data
Performed in TJN
212211: Lot 1 0/77 Bolero 256k 64ld
212211: Lot 2 0/77 Bolero 256k 64ld
212211: Lot 3 0/77 Bolero 256k 64ld
Generic Data
Performed in TJN
212211: Lot 1 0/77 Bolero 256k 64ld
212211: Lot 2 0/77 Bolero 256k 64ld
212211: Lot 3 0/77 Bolero 256k 64ld
Generic Data
Performed in TJN
212211: Lot 1 0/77 Bolero 256k 64ld
212211: Lot 2 0/77 Bolero 256k 64ld
212211: Lot 3 0/77 Bolero 256k 64ld
All Post 500TC wirepulls >3g
PTC
HTSL
JESD22A103
STRESS TEST
Reference
HTOL
JESD22A108
Low power device, not required.
Lot1: 0/77
Performed in EKB
TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS
Test Conditions
High Temperature Operating Life:
Ta= 125°C for 1008
Bias:
Vdd I/O= 5.0V nom : 6.0V Stress
Vdd core = 1.2V nom : 1.58V Stress
End Point
Requirements
Minimum
Sample Size
# of Lots
Total Units
Results
LotID-(#Rej/SS)
NA=Not applicable
Comments
TEST @ RHC
77
0
0
Pass by similarity, performed Generic Data
on 100ld Pictus 256k
Performed in EKB
212019: Lot 1 0/77 Pictus 256k 100ld (4048hrs)
212019: Lot 2 0/77 Pictus 256k 100ld (1008hrs)
212019: Lot 3 0/77 Pictus 256k 100ld (1008hrs)
212209: Lot 1 0/77 Bolero 256k 100ld (1008hrs)
TEST @ RHC
800
0
0
Pass by similarity
TEST @ RHC
77
0
0
Pass by similarity, performed Generic Data
on 100ld Pictus 256k
Performed in EKB
212019: Lot 1 0/77 Pictus 256k 100ld
212019: Lot 2 0/77 Pictus 256k 100ld
212019: Lot 3 0/77 Pictus 256k 100ld
TEST @ RHC
77
0
0
Pass by similarity, performed Generic Data
on 100ld Pictus 256k
Performed in EKB
212019: Lot 1 0/77 Pictus 256k 100ld
212019: Lot 2 0/77 Pictus 256k 100ld
212019: Lot 3 0/77 Pictus 256k 100ld
NVM cycling @125°C, as shown in EDR below, is
required
NVM in Checkerboard
ELFR
AEC Q100- Early Life Failure Rate:
008
Ta = 125°C for 48 hrs;
Bias:
Vdd I/O= 5.0V nom : 6.0V Stress
Vdd core = 1.2V nom : 1.58V Stress
10% of NVM cycling @125°C, as shown in EDR
below, is required
NVM in Checkerboard
EDR
AEC Q100- NVM Endurance, Data Retention,
005
C-Flash: 256k Array @ 125°C
(2x16k, 3x32k, 1x128k)
100K W/E for 16k block size
10K W/E for 32k block size
1K W/E for 128k block size
Generic Data
Performed in EKB
212019: Lot 1 0/400 Pictus 256k 100ld
212019: Lot 2 0/400 Pictus 256k 100ld
212209: Lot 1 0/800 Bolero 256k 100ld
212657: Lot 1 0/787 Bolero 1.5M 176ld
212658: Lot 1 0/813 Bolero 1.5M 144ld
D-Flash: 64Kb Block @ 125°C
100K W/E for 16k block size
NVM in Checkerboard 504, 1008hrs @ 150°C
NVM Endurance, Data Retention,
C-Flash 0: 256k Array @ -40°C
(2x16k, 3x32k, 1x128k)
100K W/E for 16k block size
10K W/E for 32k block size
1K W/E for 128k block size
D-Flash: 64Kb Block @ -40°C
100K W/E for 16k block size
NVM in Checkerboard 504, 1008hrs @ 150°C
FORMPPAP004XLS
1 of 3
Freescale Rev U
Freescale PN: MPC5602P
Part Name: Pictus 256k
Customer Name(s): General Market
PN(s):
Summary Revision #
Date:
1.4
8th March 2013
TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS
STRESS TEST
Reference
Test Conditions
End Point
Requirements
Minimum
Sample Size
# of Lots
Total Units
Results
LotID-(#Rej/SS)
NA=Not applicable
Comments
WBS
AEC Q100- Wire Bond shear
001
Cpk = or > 1.67
30 bonds
from minimum
5 units
1
5
Lot1: Cpk= 2.79
Performed in TJN
WBP
MilStd883- Wire Bond Pull
2011
Cond. C or D
Cpk = or > 1.67
30 bonds
from minimum
5 units
1
5
Lot1: Cpk= 3.06
Performed in TJN
SD
JESD22B102
Solderability;
8hr. Steam age (1 hr. for Au-plated leads) prior to
test.
If production burn-in is done, samples must also
undergo burn-in.
>95% lead coverage
of critical areas
15
1
15
Lot1: 0/15
Performed in TJN
PD
JESD22B100
Physical Dimensions PD per 98A drawing
Cpk = or > 1.67
10
3
30
(w) (l)
(h)
Lot1: Cpk= 3.14 2.56 2.43
Lot2: Cpk= 2.43 1.99 3.12
Lot3: Cpk= 3.97 4.03 3.47
Performed in TJN
10
(5 balls from a
min. of 10
devices)
0
0
N/A, not required for SM devices.
5
(10 leads from
each of 5
parts)
0
0
N/A, not required for SM devices.
AEC-Q100- Solder Ball Shear;
Cpk = or >1.67
010
Performed on all solder ball mounted packages e.g.
PBGA, Chip Scale, Micro Lead Frame (but NOT
Flip Chip).
Two 260°C reflow cycles before shear.
SBS
LI
JESD22B105
STRESS TEST
Reference
Lead Integrity
Not required for surface mount devices;
Only required for through-hole devices.
No lead breakage or
cracks
TEST GROUP D - DIE FABRICATION RELIABILITY TESTS
Test Conditions
End Point
Requirements
Minimum
Sample Size
# of Lots
Total Units
Electro Migration
EM
NBTI
Negative Bias Temperature Instability
TDDB
Time Dependent Dielectric Breakdown
HCI
Hot Carrier Injection
SM
Stress Migration
Results
LotID-(#Rej/SS)
NA=Not applicable
Comments
Derivative Device on qualified
Process. Report available on
request
Derivative Device on qualified
Process. Report available on
request
Derivative Device on qualified
Process. Report available on
request
Derivative Device on qualified
Process. Report available on
request
Derivative Device on qualified
Process. Report available on
request
TEST GROUP E - ELECTRICAL VERIFICATION TESTS
STRESS TEST
Reference
Test Conditions
Minimum
Sample Size
# of Lots
Total Units
All
All
All
TEST @ RH
2KV min.
3 units per
Voltage level
0
0
Pass by similarity, performed Generic data
on 100ld Pictus 256k
Performed in KLM
Performed on Pictus 256k 100ld
212019: 500V 0/3
212019: 1000V 0/3
212019: 1500V 0/3
212019: 2000V 0/3
AEC-Q100- ElectroStatic Discharge/
ESD
003
Machine Model Classification:
(MM)
Test @ 50 / 100 / 150 / 200 / 250 Volts
CLASSIFICATION
See AEC-Q100-003 for classification levels.
TEST @ RH
250V min.
3 units per
Voltage level
0
0
Pass by similarity, performed Generic data
on 100ld Pictus 256k
Performed in KLM
Performed on Pictus 256k 100ld
212019: 50V 0/3
212019: 100V 0/3
212019: 150V 0/3
212019: 200V 0/3
AEC-Q100- ElectroStatic Discharge/
ESD
011
Charged Device Model Classification:
(CDM)
Test @ 250 / 500 / 750 Volts
CLASSIFICATION
See AEC-Q100-011 for classification levels.
TEST @ RH
Corner pins =/> 750V;
All other pins =/>
500V
3 units per
Voltage level
1
9
Lot1:
250V 0/3
500V 0/3
750V 0/3
Performed in TJN
TEST @ RH
6
1
6
Lot1: 0/6
Performed in TJN
30
0
0
Pass by similarity, performed Generic data
on 100ld Pictus 256k
Performed in EKB
212019: Pictus 256k ED performed on 100ld:
Pre- and Post Functional / Parametrics
Test software shall meet requirements of AECQ100-007.
Testing performed to the limits of device
specification in temperature and limit value.
AEC-Q100- ElectroStatic Discharge/
ESD
002
Human Body Model Classification:
(HBM)
Test @ 500 / 1000 / 1500 / 2000Volts
CLASSIFICATION
See AEC-Q100-002 for classification levels.
TEST
Freescale
48A
End Point
Requirements
0 Fails
Results
LotID-(#Rej/SS)
NA=Not applicable
Lot1: DD82200
Comments
Timed RO of 96hrs MAX.
LU
JESD78
plus
AEC-Q100004
ED
AEC-Q100- Electrical Distribution
009,
Freescale
TEST @ RHC
Cpk = or > 1.67
FG
AEC-Q100- Fault Grading
007
FG shall be = or >
90% for qual units
CHAR
GL
Latch-up:
Test per JEDEC JESD78 with the AEC-Q100-004
requirements.
Ta= Operating Temperature Maximum
AEC-Q003 Characterization:
Performed on new technologies and part families.
AEC-Q100- Electro-Thermally Induced Gate Leakage;
006
155°C, 2.0 min, +400/-400 V
FORMPPAP004XLS
TEST @ R
6
Y
99%
Y
Report Available
Performed in EKB
Lot1: 0/6
Performed in KLM
1
2 of 3
6
Freescale Rev U
Freescale PN: MPC5602P
Part Name: Pictus 256k
SAE
EMC
J1752/3 Radiated
Emissions
AEC Q100SC
012
Customer Name(s): General Market
PN(s):
1
SER
JEDEC Unaccelerated:
JESD89-1 or
Accelerated:
JESD89-2 &
JESD89-3
STRESS TEST
Reference
Electromagnetic Compatibility
<40dBuV
(see AEC Q100 Appendix 5 for test applicability;
150kHz - 1GHz
done on case-by-case basis per
customer/Freescale agreement)
Short Circuit Characterization
Applicable to all smart power devices. This test
and statistical evaluation (see section 4 of Q100012) shall be performed per agreement between
user and supplier on a case-by-case basis.
Soft Error Rate
Applicable to devices with memory sizes 1Mbit
SRAM or DRAM based cells. Either test option (unaccelerated or accelerated) can be performed, in
accordance to the referenced specifications. This
test and its accept criteria is performed per
agreement between user and supplier on a case-bycase basis. Final test report shall include detailed
test facility location and altitude data.
Summary Revision #
Date:
Pass
1.4
8th March 2013
Performed in ATX
1
1
10
0
0
Not applicable to microcontroller
3
0
0
Not applicable to microcontroller with RAM < 1Mbit
TEST GROUP F - DEFECT SCREENING TESTS
Test Conditions
End Point
Requirements
Minimum
Sample Size
# of Lots
Total Units
Results
LotID-(#Rej/SS)
NA=Not applicable
PAT
AEC Q001 Part Average Testing
Has PAT been
established for this
part?
Implemented
SBA
AEC Q002 Statistical Bin Analysis
Has SBYA been
established for this
part?
Implemented
Generic
Quartz
212019
212209
212211
212657
212658
Data:
Device
MPC5602P
MPC5602P
MPC5602D
MPC6507B
MPC6507B
Mask
0M22Y
1M18Y
1M18Y
0M03Y
0M03Y
Revision
1.0
1.1
1.2
1.3
1.4
FORMPPAP004XLS
Title
Pictus
Bolero
Bolero
Bolero
Boler0
256k
256k
256k
1.5M
1.5M
100ld
100ld
64ld
176ld
144ld
NPI Qualification
NPI Qualification
NPI Qualification
Qualification
Qualification
Revision Date
15th May 2009
15th April 2011
10th October 2011
13th October 2011
8th March 2013
Fab
FSL-ATMC
FSL-ATMC
FSL-ATMC
FSL-ATMC
FSL-ATMC
Assembly
FSL-KLM
FSL-KLM
FSL-TJN
ASE-CL
FSL-KLM
Mould
SUMITOMO EME-G700E
SUMITOMO EME-G700E
CEL9200HF10M
HITACHI CEL-9240
SUMITOMO EME-G700E
Description
Original issue
Updated Spec cycling requirements
Added results
Added CAB Approval
Updated format for Web publishing
Die Size
3.737x3.564x0.33mm
3.778x3.411x0.33mm
3.778x3.411x0.33mm
5.082x5.301x0.33mm
5.082x5.301x0.33mm
Comments
CAB
09201374M
09191268M
09191271M
11161323M
11161323M
Douglas
Douglas
Douglas
Douglas
Douglas
3 of 3
Blackwood
Blackwood
Blackwood
Blackwood
Blackwood
Freescale Rev U