Reliability Audit Program Q1 2013 Performance Douglas Blackwood Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 Table of Contents 1. LOOKUP TABLES Table1: Acronyms Table2: Manufacturing Site Codes 2. DESCRIPTION OF STRESS TESTS 3. ANALOG AND SENSORS 4. AUTOMOTIVE MICROCONTROLLERS 5. CELLULAR PRODUCTS GROUP 6. DIGITAL NETWORKS 7. MICROCONTROLLERS 8.. RADIO FREQUENCY 2 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 1. LOOKUP TABLES Table1: Acronyms AC Autoclave DRB Data Retention Bake H3T High Humidity High Temperature H3TGB High Humidity High Temperature Gate Bias HAST Highly Accelerated Stress Test HTB High Temperature Bake HTOL High Temperature operating Life HTRB High temperature Reverse Bias HTS High Temperature Stress PTHB Pressure Temperature Humidity Bias SD Solderability SSOL Steady State Operating Life TC Temperature Cycle THB Temperature Humidity Bias THS Temperature Humidity Storage TS Thermal Shock 3 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 Table2: Manufacturing Site Codes Site Location FSL-TJN-FM Freescale Tianjin Final Manufacturing No.15, Xing Hua Avenue, Xiqing Economic Development Area, Tianjin 300381, P.R.China FSL-KLM-FM Freescale Kuala Lumpur Final Manufacturing NO.2 Jalan SS 8/2, Free Industrial Zone, Sungai Way, 47300 Petaling Jaya, Selangor, Malaysia ATP2 Amkor Technology Philippines 2 CORPORATE HEADQUARTERS, 1900 South Price Road, Chandler, AZ USA 85248-1604 ASECHUNG ASE GROUP Chung-Li 550,Chung-Hwa Road, Section 1, Chung-Li, 320, Taiwan, R.O.C AITBATAM Advanced Interconnect Technologies (Batam) Asia Regional Office, No. 1 Maritime Square, #09-80 Harbour Front Centre, Singapore 099253 FSL-TLS-Fab Freescale Toulouse Fab 134 Avenue du General Eisenhower, BP 72329, 31023 Toulouse Cedex 1, France FSL-EKB-Fab Freescale East Kilbride Fab Colvilles Road, East Kilbride, Glasgow, Scotland G75 0TG, UK FSL-SND-Fab Freescale Sendai Fab 3-3-1 Ake-Dori, Izumi-Ku, Sendai-Shi 981-3293, Japan FSL-ATMC Freescale Austin Technology and Manufacturing Centre 3501 Ed Bluestein Boulevard, Austin, Texas 78721, USA FSL-OHT-Fab Freescale Oak Hill Fab 6501 William Cannon Drive West, Austin, Texas, 78735, USA FSL-TMP-Fab Freescale Tempe Fab 2100 East Elliot Road, Tempe, Arizona 85284, USA FSL-CHD-Fab Freescale Chandler Fab 1300 N Alma School Rd, Chandler AZ, 85224, USA TSMC3 Taiwan Semiconductor Manufacturing Company Limited Corporate Headquarters, No. 8, Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, Taiwan 300-77, R. O. C. TSMC4 Taiwan Semiconductor Manufacturing Company Limited Corporate Headquarters, No. 8, Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, Taiwan 300-77, R. O. C. UMCI United Microelectronics Corporation Singapore Worldwide Offices Headquarters, No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C. UMC8E United Microelectronics Corporation Taiwan Worldwide Offices Headquarters, No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C. SEMIDI Semi-Dice Taiwan CSM CROLS2 Chartered Semiconductor Manufacturing Ltd Corporate Office, 60 Woodlands Industrial Park, Street Two, Singapore 738406 Crolles2 Technology Alliance Freescale Semiconducteurs SAS Centre de Recherche Crolles 2, 870 Rue Jean Monnet, 38926 Crolles, France 4 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 2. DESCRIPTION OF STRESS TESTS Early Life Fail Rate (ELFR) - JESD22-A108 The purpose of this stress is to characterise the early failure rate portion of the bathtub curve. Devices used in this test are sampled directly after the standard production final test flow with no pre-screening. A dynamic electrical bias is applied to stimulate the device during the test in much the same way as HTOL below. High Temperature Operational Life Test (HTOL or HTRB) - JESD22-A108 This test is performed to accelerate failure mechanisms that are thermally activated through the application of temperature and the use of biased operating conditions. The temperature and voltage will vary with the product being stressed. However, the typical stress ambient is 125°C with the bias applied equal to or greater than the data sheet nominal value. All devices used in the HTOL test are sampled directly after final electrical test with no prior burn-in or other pre-screening unless called out in the normal production flow. Testing is performed with dynamic signal applied to the device for a typical duration of 1008hrs. Reject quantities at the test temperature are modified by the Chi_squared distribution function at 60%/90% confidence levels. The failure rates are then calculated and derated to the required temperature using the Arrhenius equation with a 0.54 eV activation energy assumed as an average for the failure mechanisms. Further details are given in the next section 'Calculation of Failure Rates'. Write/Erase Cycling (W/E) - JESD22-A117 This test is used to evaluate the effect of repeated programming and erasing excursions on EEPROM and FLASH devices without corruption of data. It is carried out at 125°C for EEPROM and 125°C for FLASH to the number of specified cycles per device. Program and erase times are according to data book. High Temperature Storage and Data Retention (HTS/DR) - JESD22 - A103 Used to determine the effect on the devices of long-term storage at the maximum specified temperature, also the data retention characteristics of EPROM, EEPROM and FLASH devices. In the case of EEPROM and FLASH devices this follows Write/Erase Cycling. Temperature Cycling (TC) - JESD22-A104 Temperature Cycling testing accelerates the effects of thermal expansion mismatch among the different components within a specific die and packaging system. During temperature cycling, devices are inserted into a cycling system and held at cold dwell temperature for the specified time. Following this cold dwell, the devices are transferred, mechanically, to the hot dwell chamber where they remain for the specified time. The system employs a circulating air environment to assure rapid stabilisation at the specified temperature. Thermal Shock (TS) - JESD22-A104 The objective of Thermal Shock is the same as for Temperature Cycling, however, thermal shock provides additional stress in the increased thermal conductivity of a liquid ambient. Temperature Humidity Bias (THB or H3TRB) - JESD22-A101 5 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 An environmental test performed at 85°C and a relative humidity of 85%To evaluate the resistance of the device to moisture-related failure mechanisms, such as corrosion. A static bias is applied in such a way as to maximise voltage potential gradients across the die while minimising device power dissipation. If moisture does penetrate the package and passivation, an electrolytic cell will be set up and corrosion will be rapid. Additionally, electricallyactivated failure mechanisms, i.e. dielectric breakdown can be encountered. Autoclave (AC) - JESD22-A102 A severe environmental (121°C, 100% Relative Humidity, 15psig) test to establish the integrity of the package and passivation in the presence of moisture and temperature. Pressure Temperature Humidity Stress (HAST) - JESD22-A110 This test is performed to accelerate the effects of moisture penetration with the dominant effect being corrosion. It detects similar failure mechanisms to THB but at a greatly accelerated rate. 6 Reliability Audit Program 3. Analog and Sensors 7 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY PACKAGE LQFP 80 14*14*1.4P0.65 MAPBGA 186 12*12*0.8P0.8 PQFN-EP 23 12*12*2.1 P.9 PQFN-EP 24 12*12*2.1 P.9 PWR QFN 16 12*12*2.1P0.9 PWR QFN 36 12SQ*2.1P0.8 QFN 16 6*6*1.98 P1 QFN32EP 5SQ*1.0P0.5 SOIC 32 300ML Precon Stress Read Point Samples Qty Rej MSL / 240°C TC 500 Cycles 1 45 0 Precon Stress Read Point Samples Qty Rej HTSL 504 Hours 1 45 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 1000 Cycles 1 77 0 HTOL 168 Hours 2 160 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 500 Cycles 1 77 0 HTOL 408 Hours 1 80 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 245°C TC 500 Cycles 1 45 0 BAKE 504 Hours 1 45 0 Precon Stress Read Point Samples Qty Rej MSL / 245°C TC 200 Cycles 1 77 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C UHST 96 Cycles 3 135 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 500 Cycles 1 45 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 500 Cycles 1 45 0 8 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE AMKOR K1 KOREA Package QFN 16 6*6*1.98 P1 KLMFM Package LQFP 80 14*14*1.4P0.65 TJNFM Package PQFN-EP 24 12*12*2.1 P.9 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C UHST 96 Cycles 3 135 0 Precon Stress Read Point Samples Qty Rej MSL / 240°C TC 500 Cycles 1 45 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 500 Cycles 1 77 0 HTOL 408 Hours 1 80 0 SOIC 32 300ML MSL 3 / 260°C TC 500 Cycles 1 45 0 PWR QFN 36 12SQ*2.1P0.8 MSL / 245°C TC 200 Cycles 1 77 0 MSL 3 / 260°C TC 1000 Cycles 1 77 0 HTOL 168 Hours 2 160 0 TC 500 Cycles 1 45 0 HTSL 504 Hours 1 45 0 TC 500 Cycles 1 45 0 BAKE 504 Hours 1 45 0 PQFN-EP 23 12*12*2.1 P.9 QFN32EP 5SQ*1.0P0.5 MSL 3 / 260°C MAPBGA 186 12*12*0.8P0.8 PWR QFN 16 12*12*2.1P0.9 MSL 3 / 245°C 9 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY STRESS TEST BAKE HTOL HTSL TC Techcode Device Read Point Samples Qty Rej % Rej O060APTS SC33984CPNAR2 504 Hours 1 45 0 0 U065PTXD SC33984CPNAR2 504 Hours 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej C027TXXQ MC10XS4200FKR2 168 Hours 1 80 0 0 F045BXXS MC06XS3517AFKR2 408 Hours 1 80 0 0 F045CXXS MC20XS4200FKR2 168 Hours 1 80 0 0 Techcode Device Read Point Samples Qty Rej % Rej H013LHTQ SC900892VLR2 504 Hours 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej C027TXXQ SC901524EPR2 500 Cycles 1 45 0 0 MC33888PNBR2 200 Cycles 1 77 0 0 MC33981BPNAR2 500 Cycles 1 45 0 0 MC10XS3535PNAR2 500 Cycles 1 77 0 0 SC900740PNAR2 1000 Cycles 1 77 0 0 MC33981BPNAR2 500 Cycles 1 45 0 0 MCZ33689DEWR2 500 Cycles 1 45 0 0 SC111525AFB317 500 Cycles 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej C027TXXQ SX2531WT1 96 Cycles 1 45 0 0 O150MWXS MMA6210KWR2 96 Cycles 1 45 0 0 MMA5124WR2 96 Cycles 1 45 0 0 SX2531WT1 96 Cycles 1 45 0 0 XTMS3NXS O060APTS U065PTXD UHST C027TXXT 10 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY FABRICATION FACILITY ATMC CHDFAB Tech code Stress Read Point Samples Qty Rej H013LHTQ HTSL 504 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej HTOL 168 Hours 1 80 0 TC 500 Cycles 1 45 0 C027TXXQ OHTFAB TLSFAB UHST 96 Cycles 1 45 0 C027TXXT UHST 96 Cycles 2 90 0 Tech code Stress Read Point Samples Qty Rej F045BXXS HTOL 408 Hours 1 80 0 O060APTS TC 1000 Cycles 1 77 0 O150MWXS UHST 96 Cycles 1 45 0 F045CXXS HTOL 168 Hours 1 80 0 Tech code Stress Read Point Samples Qty Rej 200 Cycles 1 77 0 500 Cycles 1 45 0 BAKE 504 Hours 1 45 0 XTMS3NXS TC O060APTS U065PTXD 11 TC 500 Cycles 1 77 0 BAKE 504 Hours 1 45 0 TC 500 Cycles 3 135 0 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY DEVICE TYPE MC06XS3517AFKR2 MC10XS3535PNAR2 MC10XS4200FKR2 MC20XS4200FKR2 MC33888PNBR2 Tech code Stress Read Point Samples Qty Rej F045BXXS HTOL 408 Hours 1 80 0 Tech code Stress Read Point Samples Qty Rej O060APTS TC 500 Cycles 1 77 0 Tech code Stress Read Point Samples Qty Rej C027TXXQ HTOL 168 Hours 1 80 0 Tech code Stress Read Point Samples Qty Rej F045CXXS HTOL 168 Hours 1 80 0 Tech code Stress Read Point Samples Qty Rej TC 200 Cycles 1 77 0 Stress Read Point Samples Qty Rej XTMS3NXS TC 500 Cycles 1 45 0 U065PTXD TC 500 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej U065PTXD TC 500 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej C027TXXT UHST 96 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej O150MWXS UHST 96 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej U065PTXD TC 500 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej O060APTS BAKE 504 Hours 1 45 0 U065PTXD BAKE 504 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej O060APTS TC 1000 Cycles 1 77 0 Tech code Stress Read Point Samples Qty Rej H013LHTQ HTSL 504 Hours 1 45 0 XTMS3NXS Tech code MC33981BPNAR2 MCZ33689DEWR2 MMA5124WR2 MMA6210KWR2 SC111525AFB317 SC33984CPNAR2 SC900740PNAR2 SC900892VLR2 12 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 SC901524EPR2 SX2531WT1 Tech code Stress Read Point Samples Qty Rej C027TXXQ TC 500 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej C027TXXQ UHST 96 Cycles 1 45 0 C027TXXT UHST 96 Cycles 1 45 0 13 Reliability Audit Program 4. Automotive Microcontrollers 14 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY PACKAGE LQFP 48 7*7*1.4P0.5 LQFP 100 14SQ1.4P0.5 C90 MAPBGA 208 17*17*0.8P1.0 TSSOP 20 4.4*6.5*1.P.65 TSSOP 16 4.4*5*1.0P0.65 TSSOP 28 4.4*9.7*0.9P.65 Precon Precon Precon Stress Read Point Samples Qty Rej HTOL 1008 Hours 1 45 0 Stress Read Point Samples Qty Rej DRB 1008 Hours 1 45 0 HTOL 1008 Hours 1 45 0 Stress Read Point Samples Qty Rej HTSL 1008 Hours 2 90 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 500 Cycles 1 45 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 1100 Cycles 1 45 0 HTOL 408 Hours 1 45 0 Precon Stress Read Point Samples Qty Rej MSL / 260°C TC 1100 Cycles 1 45 0 15 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE AMKOR P1 PHILIPPINES Package TSSOP 16 4.4*5*1.0P0.65 KLMFM Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 1100 Cycles 1 45 0 HTOL 408 Hours 1 45 0 TSSOP 28 4.4*9.7*0.9P.65 MSL / 260°C TC 1100 Cycles 1 45 0 TSSOP 20 4.4*6.5*1.P.65 MSL 3 / 260°C TC 500 Cycles 1 45 0 Precon Stress Read Point Samples Qty Rej DRB 1008 Hours 1 45 0 HTOL 1008 Hours 1 45 0 Stress Read Point Samples Qty Rej LQFP 48 7*7*1.4P0.5 HTOL 1008 Hours 1 45 0 MAPBGA 208 17*17*0.8P1.0 HTSL 1008 Hours 2 90 0 Package LQFP 100 14SQ1.4P0.5 C90 TJNFM Package Precon 16 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY STRESS TEST DRB HTOL HTSL Techcode Device Read Point Samples Qty Rej % Rej H009FXXQ SPC5604BF2MLL6 1008 Hours 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej H009FXXQ SC667051MLL 1008 Hours 1 45 0 0 E025FXXQ S9S08SC4E0MTGR 408 Hours 1 45 0 0 U050FXXD S908GZ60H0CFAER 1008 Hours 1 45 0 0 H009FHXQ SC667051MLL 1008 Hours 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej SC560004MVF92R2 1008 Hours 1 45 0 0 SC560006MMG92R 1008 Hours 1 45 0 0 Device Read Point Samples Qty Rej % Rej S9S08SG16E1VTJR 500 Cycles 1 45 0 0 SP117018MTGR 1100 Cycles 1 45 0 0 SC100690VDRER 1100 Cycles 1 45 0 0 H013FHL6 TC Techcode E025FXXQ U050FXXD 17 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY FABRICATION FACILITY ATMC Tech code H009FXXQ H009FHXQ Samples Qty Rej 1008 Hours 1 45 0 HTOL 1008 Hours 1 45 0 HTOL 1008 Hours 1 45 0 HTSL 1008 Hours 2 90 0 - 1 45 0 Stress Read Point Samples Qty Rej HTOL 408 Hours 1 45 0 500 Cycles 1 45 0 1100 Cycles 1 45 0 TC 1100 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej U050FXXD HTOL 1008 Hours 1 45 0 Tech code E025FXXQ TC U050FXXD TSMC FAB2 Read Point DRB PRECON H013FHL6 CHDFAB Stress 18 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY DEVICE TYPE S908GZ60H0CFAER S9S08SC4E0MTGR S9S08SG16E1VTJR SC100690VDRER SC560004MVF92R2 SC560006MMG92R SC667051MLL SP117018MTGR SPC5604BF2MLL6 Tech code Stress Read Point Samples Qty Rej U050FXXD HTOL 1008 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej E025FXXQ HTOL 408 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej E025FXXQ TC 500 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej TC 1100 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej H013FHL6 HTSL 1008 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej HTSL 1008 Hours 1 45 0 PRECON - 1 45 0 Tech code Stress Read Point Samples Qty Rej H009FXXQ HTOL 1008 Hours 1 45 0 H009FHXQ HTOL 1008 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej E025FXXQ TC 1100 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej H009FXXQ DRB 1008 Hours 1 45 0 U050FXXD H013FHL6 19 Reliability Audit Program 5. Cellular Products Groups 20 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY PACKAGE Precon LQFP 100 14*14*1.4P0.5 Stress Read Point Samples Qty Rej AC 96 Hours 1 45 0 TC 200 Cycles 1 45 0 21 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE KLMFM Package Precon LQFP 100 14*14*1.4P0.5 22 Stress Read Point Samples Qty Rej AC 96 Hours 1 45 0 TC 200 Cycles 1 45 0 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY STRESS TEST AC TC Techcode Device Read Point Samples Qty Rej % Rej I100XXXS MC68HC11FL0AFR2 96 Hours 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej I100XXXS MC68HC11FL0AFR2 200 Cycles 1 45 0 0 23 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY FABRICATION FACILITY SNDFAB Tech code I100XXXS 24 Stress Read Point Samples Qty Rej AC 96 Hours 1 45 0 TC 200 Cycles 1 45 0 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY DEVICE TYPE Tech code MC68HC11FL0AFR2 I100XXXS 25 Stress Read Point Samples Qty Rej AC 96 Hours 1 45 0 TC 200 Cycles 1 45 0 Reliability Audit Program 6. Digital Networks 26 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY PACKAGE Precon Stress Read Point Samples Qty Rej PRECON - 1 77 0 TC 1000 Cycles 1 77 0 Precon Stress Read Point Samples Qty Rej MSL 4 / 245°C TC 500 Cycles 1 45 0 850 Cycles 2 90 0 MSL 4 / ---- TH 1008 Hours 1 45 0 HTSL 1008 Hours 1 45 0 Stress Read Point Samples Qty Rej HTOL 72 Hours 1 45 0 Stress Read Point Samples Qty Rej PRECON - 1 45 0 TC 500 Cycles 1 45 0 Stress Read Point Samples Qty Rej PRECON - 1 45 0 UHST 264 Hours 1 45 0 FCPBGA 783 29SQ3.55P1.0 FTBGA 480 37*37*1.7P1.27 PBGA 256 23*23*1.22P1.27 Precon Precon PBGA 357 25*25*1.2P1.27 Precon TBGA 672 35*35*1.5P1.0 MSL 3 / 260°C 27 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE IBM CANADA Package Stress Read Point Samples Qty Rej PRECON - 1 77 0 TC 1000 Cycles 1 77 0 Precon Stress Read Point Samples Qty Rej MSL 4 / ---- TH 1008 Hours 1 45 0 MSL 4 / 245°C TC 500 Cycles 1 45 0 850 Cycles 2 90 0 HTSL 1008 Hours 1 45 0 PRECON - 1 45 0 UHST 264 Hours 1 45 0 HTOL 72 Hours 1 45 0 PRECON - 1 45 0 TC 500 Cycles 1 45 0 Precon FCPBGA 783 29SQ3.55P1.0 KLMFM Package FTBGA 480 37*37*1.7P1.27 TBGA 672 35*35*1.5P1.0 MSL 3 / 260°C PBGA 256 23*23*1.22P1.27 PBGA 357 25*25*1.2P1.27 28 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY STRESS TEST HTOL HTSL TC TH UHST Techcode Device Read Point Samples Qty Rej % Rej C016HXXT MPC852TVR100A 72 Hours 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej H013HXX6 MPC8270ZUUPEA 1008 Hours 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej H004HQWA MPC8569EVTAUNLB Precon 1 77 0 0 1000 Cycles 1 77 0 0 500 Cycles 1 45 0 0 850 Cycles 2 90 0 0 Precon 1 45 0 0 500 Cycles 1 45 0 0 H013HXX6 MPC8270ZUUPEA C032XXXT MPC860SRCZQ50D4 Techcode Device Read Point Samples Qty Rej % Rej H013HXX6 MPC8270ZUUPEA 1008 Hours 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej H013HQX6 MPC8349EVVAJFB Precon 1 45 0 0 264 Hours 1 45 0 0 29 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY FABRICATION FACILITY ATMC Tech code Stress Read Point Samples Qty Rej PRECON - 1 45 0 UHST 264 Hours 1 45 0 HTSL 1008 Hours 1 45 0 500 Cycles 1 45 0 850 Cycles 2 90 0 TH 1008 Hours 1 45 0 C016HXXT HTOL 72 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej PRECON - 1 77 0 TC 1000 Cycles 1 77 0 H013HQX6 H013HXX6 GF FAB7 SGP TC H004HQWA OHTFAB Tech code C032XXXT 30 Stress Read Point Samples Qty Rej PRECON - 1 45 0 TC 500 Cycles 1 45 0 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY DEVICE TYPE Tech code MPC8270ZUUPEA H013HXX6 MPC852TVR100A MPC8569EVTAUNLB Samples Qty Rej 1008 Hours 1 45 0 500 Cycles 1 45 0 850 Cycles 2 90 0 TH 1008 Hours 1 45 0 Stress Read Point Samples Qty Rej PRECON - 1 45 0 UHST 264 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej C016HXXT HTOL 72 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej PRECON - 1 77 0 TC 1000 Cycles 1 77 0 Stress Read Point Samples Qty Rej PRECON - 1 45 0 TC 500 Cycles 1 45 0 H013HQX6 H004HQWA Tech code MPC860SRCZQ50D4 Read Point HTSL TC Tech code MPC8349EVVAJFB Stress C032XXXT 31 Reliability Audit Program 7. Microcontrollers 32 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY PACKAGE Precon LQFP 64 10*10*1.4P0.5 MAPBGA 473 19*19*.8P.8 PDIP 28 PDIP 40 Stress HTSL Read Point Samples Qty Rej 504 Hours 2 90 0 1008 Hours 1 45 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C UHST 264 Hours 1 45 0 Precon Stress Read Point Samples Qty Rej TC 500 Cycles 1 45 0 Stress Read Point Samples Qty Rej TC 500 Cycles 1 45 0 Stress Read Point Samples Qty Rej HTOL 1008 Hours 3 135 0 HTSL 1008 Hours 2 90 0 Precon Precon PLCC 52 QFP 64 14*14*2.2P0.8 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 1000 Cycles 1 45 0 QFP44 10*10*2.0P0.8 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 900 Cycles 1 45 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 1000 Cycles 1 45 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 500 Cycles 1 45 0 MSL / 260°C TC 500 Cycles 1 45 0 SOIC 20W SOIC 28W 33 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE ASE CL TAIWAN Package SOIC 20W KLMFM Package QFP 64 14*14*2.2P0.8 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 1000 Cycles 1 45 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 1000 Cycles 1 45 0 HTOL 1008 Hours 3 135 0 HTSL 1008 Hours 2 90 0 Precon Stress Read Point Samples Qty Rej MSL 3 / 260°C TC 900 Cycles 1 45 0 MSL / 260°C TC 500 Cycles 1 45 0 MSL 3 / 260°C TC 500 Cycles 1 45 0 PLCC 52 TJNFM Package QFP44 10*10*2.0P0.8 SOIC 28W 504 Hours 2 90 0 HTSL 1008 Hours 1 45 0 UHST 264 Hours 1 45 0 PDIP 28 TC 500 Cycles 1 45 0 PDIP 40 TC 500 Cycles 1 45 0 LQFP 64 10*10*1.4P0.5 MAPBGA 473 19*19*.8P.8 MSL 3 / 260°C 34 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY STRESS TEST HTOL HTSL Techcode Device Read Point Samples Qty Rej % Rej I120JXXS SC109953FNER 1008 Hours 1 45 0 0 I120EJXS MC68711E20CFNE2 1008 Hours 2 90 0 0 Techcode Device Read Point Samples Qty Rej % Rej MC9S08AC60CPUE 504 Hours 1 45 0 0 MC9S08JM60CLH 1008 Hours 1 45 0 0 SC116009ACLH 504 Hours 1 45 0 0 MC68711E20CFNE2 1008 Hours 2 90 0 0 Device Read Point Samples Qty Rej % Rej MC705C8ACPE 500 Cycles 1 45 0 0 MC705JJ7CDWER 1000 Cycles 1 45 0 0 E025FXXQ I120EJXS TC Techcode I120EXXS UHST MC705JP7CPE 500 Cycles 1 45 0 0 MC705P6ACDWE 500 Cycles 1 45 0 0 SC667171MDWER 500 Cycles 1 45 0 0 E025FXXQ MC9S08AW60CFUER 1000 Cycles 1 45 0 0 U050FXXD MC908GP32CFBE 900 Cycles 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej H009HLX6 SCIMX31LCVMF4CR2 264 Hours 1 45 0 0 35 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY FABRICATION FACILITY CHDFAB Tech code Stress I120EXXS TC HTSL E025FXXQ Qty Rej 2 90 0 1000 Cycles 1 45 0 504 Hours 2 90 0 1008 Hours 1 45 0 1000 Cycles 1 45 0 TC 900 Cycles 1 45 0 HTOL 1008 Hours 1 45 0 HTOL 1008 Hours 2 90 0 HTSL 1008 Hours 2 90 0 Tech code Stress Read Point Samples Qty Rej I120EXXS TC 500 Cycles 2 90 0 U050FXXD TC 900 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej H009HLX6 UHST 264 Hours 1 45 0 I120JXXS I120EJXS TSMC FAB 12 Samples 500 Cycles TC U050FXXD SNDFAB Read Point 36 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY DEVICE TYPE Tech code MC68711E20CFNE2 MC705C8ACPE MC705JJ7CDWER MC705JP7CPE MC705P6ACDWE MC908GP32CFBE MC9S08AC60CPUE MC9S08AW60CFUER MC9S08JM60CLH SC109953FNER SC116009ACLH SC667171MDWER SCIMX31LCVMF4CR2 Stress Read Point Samples Qty Rej HTOL 1008 Hours 2 90 0 HTSL 1008 Hours 2 90 0 Tech code Stress Read Point Samples Qty Rej I120EXXS TC 500 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej I120EXXS TC 1000 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej I120EXXS TC 500 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej I120EXXS TC 500 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej TC 900 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej E025FXXQ HTSL 504 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej E025FXXQ TC 1000 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej E025FXXQ HTSL 1008 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej I120JXXS HTOL 1008 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej E025FXXQ HTSL 504 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej I120EXXS TC 500 Cycles 1 45 0 Tech code Stress Read Point Samples Qty Rej H009HLX6 UHST 264 Hours 1 45 0 I120EJXS U050FXXD 37 Reliability Audit Program 8. Radio Frequency 38 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY PACKAGE NI-1230S Precon Precon NI-780HS-4 NI-880S Precon Precon OM780-2 PLASTICS MSL 3 / 260°C Precon PLD-1.5 PWR QFN 16 5*5*2.1P0.8 PWR QFN 24 8*8*2.1P0.8 TO-272 WB-16 MSL 3 / 260°C Precon Precon Precon Stress Read Point Samples Qty Rej HTRB 1008 Hours 1 45 0 Stress Read Point Samples Qty Rej HTOL 504 Hours 1 45 0 HTRB 1008 Hours 1 45 0 Stress Read Point Samples Qty Rej HTRB 1008 Hours 2 90 0 Stress Read Point Samples Qty Rej TC 500 Cycles 1 45 0 THB 504 Hours 1 45 0 Stress Read Point Samples Qty Rej TC 500 Cycles 1 45 0 THB 504 Hours 1 45 0 HTRB 1008 Hours 1 45 0 Stress Read Point Samples Qty Rej HTOL 1008 Hours 3 135 0 Stress Read Point Samples Qty Rej HTRB 1008 Hours 1 45 0 Stress Read Point Samples Qty Rej HTRB 1008 Hours 1 45 0 39 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 PACKAGE RESULTS SUMMARY BY ASSEMBLY SITE ASE KR KOREA Stress Read Point Samples Qty Rej HTRB 1008 Hours 1 45 0 Stress Read Point Samples Qty Rej NI-880S HTRB 1008 Hours 2 90 0 TO-272 WB-16 HTRB 1008 Hours 1 45 0 PWR QFN 16 5*5*2.1P0.8 HTOL 1008 Hours 3 135 0 Package Precon PWR QFN 24 8*8*2.1P0.8 KLMFM Package Precon OM780-2 PLASTICS MSL 3 / 260°C NI-1230S NI-780HS-4 MSL 3 / 260°C PLD-1.5 40 TC 500 Cycles 1 45 0 THB 504 Hours 1 45 0 HTRB 1008 Hours 1 45 0 HTOL 504 Hours 1 45 0 HTRB 1008 Hours 1 45 0 TC 500 Cycles 1 45 0 THB 504 Hours 1 45 0 HTRB 1008 Hours 1 45 0 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY STRESS TEST HTOL Techcode Device Read Point Samples Qty Rej % Rej MMG3004N 1008 Hours 1 45 0 0 MMG3004NT1 1008 Hours 2 90 0 0 L035ATXD MRF8P20140WHSR3 504 Hours 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej MW7IC2240NBR1 1008 Hours 1 45 0 0 MW7IC915NT1 1008 Hours 1 45 0 0 L035HXXD MRF8S9260HSR3 1008 Hours 2 90 0 0 L037AHXD MW6S004NT1 1008 Hours 1 45 0 0 MRF8P20140WHSR3 1008 Hours 1 45 0 0 MRF8S21200HSR6 1008 Hours 1 45 0 0 P200JWXD HTRB L035AHXD L035ATXD TC THB Techcode Device Read Point Samples Qty Rej % Rej L035HXXD MRF8S9170NR3 500 Cycles 1 45 0 0 L037AHXD MW6S004NT1 500 Cycles 1 45 0 0 Techcode Device Read Point Samples Qty Rej % Rej L035HXXD MRF8S9170NR3 504 Hours 1 45 0 0 L037AHXD MW6S004NT1 504 Hours 1 45 0 0 41 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY FABRICATION FACILITY OHTFAB Tech code Stress Read Point Samples Qty Rej L035AHXD HTRB 1008 Hours 2 90 0 HTRB 1008 Hours 2 90 0 TC 500 Cycles 1 45 0 L035HXXD THB 504 Hours 1 45 0 HTRB 1008 Hours 1 45 0 TC 500 Cycles 1 45 0 THB 504 Hours 1 45 0 HTOL 504 Hours 1 45 0 HTRB 1008 Hours 2 90 0 Tech code Stress Read Point Samples Qty Rej P200JWXD HTOL 1008 Hours 3 135 0 L037AHXD L035ATXD WIN 42 Reliability Audit Program Report From: 01-Jan-2013 To: 31-Mar-2013 RESULTS SUMMARY BY DEVICE TYPE MMG3004N MMG3004NT1 MRF8P20140WHSR3 MRF8S21200HSR6 MRF8S9170NR3 MRF8S9260HSR3 Tech code Stress Read Point Samples Qty Rej P200JWXD HTOL 1008 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej P200JWXD HTOL 1008 Hours 2 90 0 Tech code Stress Read Point Samples Qty Rej HTOL 504 Hours 1 45 0 HTRB 1008 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej L035ATXD HTRB 1008 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej TC 500 Cycles 1 45 0 THB 504 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej L035HXXD HTRB 1008 Hours 2 90 0 L035ATXD L035HXXD Tech code MW6S004NT1 MW7IC2240NBR1 MW7IC915NT1 Stress Read Point Samples Qty Rej HTRB 1008 Hours 1 45 0 TC 500 Cycles 1 45 0 THB 504 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej L035AHXD HTRB 1008 Hours 1 45 0 Tech code Stress Read Point Samples Qty Rej L035AHXD HTRB 1008 Hours 1 45 0 L037AHXD 43