The most important thing we build is trust ADVANCED ELECTRONIC SOLUTIONS AVIATION SERVICES COMMUNICATIONS AND CONNECTIVITY MISSION SYSTEMS Custom Packaging Overview Aeroflex Plainview, Inc. dba Cobham Semiconductor Solutions March 2015 Commercial in Confidence Presenter: Cobham Semiconductor Solutions Experts in HiRel Power Regulation, Distribution and Battery Management High reliability, high performance, RadHard • ICs • Multi-Chip Modules • Subsystems For High Value/Mission Critical Applications: Space, Avionics & Defense 75% 2 Medical and Other 12% Commercial Wireless Communications 13% Cobham plc World Class Manufacturing Facility Plainview, L.I., N.Y. 100,000 Sq Ft. including ~25,000 Sq ft –Clean Room ~ 25,000 Sq ft –Eng/QA Lab ~ 6,000 Sq ft –RF Eng Lab 3 Cobham plc Vertically Integrated Solutions 1. Radiation Performance LEO, MEO, HEO, GEO & Deep Space in a Single Device 2. Increases our competitiveness & GM in value added modules, slices and boxes 3. Entrée into new low voltage designs Custom Application Solutions Space Board-Level Solutions RHDs, PDMs, VRGs, RDCs * Space Hybrids * Chip-on-Board * Discrete Modules Footprint Compatible with Existing MUX Series Multi-Chip-Modules Packages. Provides 16, 32, 48, 64 channels for Low Voltage Applications on Demand. 4 1Mrad(Si) Series RHD VRG8691/92 High Current-Low Voltage LDO Comparators * Cell Balancing (BEUs) * Battery Health Monitoring RHD Series Vertical Integration into Plainview Space Products Portfolio Increases Competitiveness & Profitability Digital-to-Analog Converters Op-Amps Space Boxes Precision Current Source Resolver to Digital Multiplexers Price→ Cobham plc Cobham Semiconductor Solutions is a leading supplier of a standard and custom multi-chip modules for space and military applications 5 Cobham plc Digital MCMs • Leading Supplier of • • 6 Microelectronic Modules to All Major US Aerospace Concerns Leading Supplier of Data Communication Modules for Space, Airborne, Telecom, & Commercial Aviation Markets Leading Supplier of RISC Multi Chip Modules for Defense Applications Cobham plc ACT-5271SC-F10-M21C HTCC Hermetically Sealed MCM 2 MB SC: (Sync Burst Cache RAM), 4ea CPU Cycle FIFO: 2 FPGA Control CPLD Cache TAG RAM Configuration Serial PROM: FPGA PLL CLK Driver 7 MIPS uP: RM5271 7Cobham plc Hermetically Sealed Die Cavity + SMT 2 RadHard Mixed-Signal ASICs tooled by Cobham JY04B ASIC from Cobham – FPGA Net List Conversion 8 Cobham plc Packaged devices within a hybrid CT2216, HTCC Package in a Hermetically Sealed Kovar Package IC Packaged in HTCC ARX1633, Glass Frit bonded package with an 80C51 uP in a Hermetically Sealed Kovar Package Programmable Device 9 Cobham plc Ring Frame Hybrids • Ring Frame Packages: – Cost Effective – Lightweight – Leadless Packages – Low Resistance Paths – 25 Amps DC, 150 Amps, 10 ms – Space Qualified – Integral Substrate – Low Package Tooling Cost • Features a hermetically sealed ring frame hybrid with SMT attached components on a common ceramic substrate Die are hermetically sealed under this metal housing which is solder sealed to a ring frame on the ceramic. 3/27/2015 Cobham plc 10 Flip Chip Process Development • • • • • • • Equipment ASIC vs. Power PC Assembly – Fixturing (ASIC) Post Reflow x-ray Sonoscan Cross Section – Underfill Solder Bump Datacon 2200 apm+ 11 Air Vac DRS24NC SEC Omni Bonder Model 860 Samsung CP45 FV Cobham plc Original High Temperature Co-Fired Ceramic (HTCC) Package Design of Class “K” Module HTCC MCM MCM Installed on Next Higher Level Assembly THE OLD WAY OF DOING THINGS! 12 Cobham plc 12 THE NEW WAY OF DOING THINGS! Board installed in housing. Sealed, plug & play module shipped to our customer. Bare die SMT Chip Caps & Resistors Discrete Leaded Components & Connectors MODULE IN FULL SCALE PRODUCTION, >2,500 UNITS SHIPPED TO DATE 13 Cobham plc Chip On Board Successes • Analog Control Board • • • • for a Satellite Payload Double Sided SMT Single Sided COB High Density Nanonics SMT Connectors PWB is 6” sq. & Replaced 3 Separate PWBs RAD SHIELD • MMIC Control Circuit – • ~ 2” L x 0.5” W, note odd • 3/27/2015 shape >10,000 UNITS SHIPPED TO DATE Cobham plc 14 Chip On Board Power Supply Missile Application Chip & Wire Planar Magnetics MIL-Connectors Wedge Locks 3 Output Device 15 Cobham plc Plastic Strategy • Hybrid Killers – Die Scale Packaging – Non-Hermetic Reliability w/Plastic – Tooling Costs – Cost of Packages – FPGAs – ASICs 3/27/2015 • Advantages of a COB BGA Assembly – Counters Fear of Counterfeit Parts – Overcomes Lack of Lot Control – Full Traceability to Wafer Diffusion Lot – Visual Inspection of each Die – Flexibility to Achieve Obsolescence Avoidance – Eliminates possibility of Defective PEMs being “pop corned” – Consolidation of Supplier Base Cobham plc 16 Chip on Board BGA Assembly • • • • • • • • 17 3/27/2015 High I/O Count Ideal for Mixed Signal Applications Hermetic Seal over Die Island Suitable to 2 GHz Polyimide PWB for High Reliability Applications Low Mass allows device to be automatically picked & placed Ability to overcome Obsolescence MIL-PRF-38534 Qualification Cobham plc Power Conversion Capability Front End Push-Pull Driver for a Commercial Space Power Converter H-Bridge Front End Driver for a MILSTAR Power Converter Front End H-Bridge for a 15kW Low Output Voltage Converter Solid State Power Controller for F-22 Synchronous Rectifier for a 15kW Low Output Voltage Converter Cobham plc Space Grade DC-DC Converter Conventional Chip & Wire Hybrid Style DC/DC Converters Cobham plc 5101 Motor Driver, 500 VDC, 50A DC Rating • Features – – – – – 20 PACKAGE SIZE 3.0" x 2.1" x 0.39“ 4 QUADRANT CONTROL 6 STEP TRAPEZOIDAL DRIVE CAPABILITY ISOLATED UPPER & LOWER GATE DRIVERS MIL-PRF-38534 Screening, -55°C TO +125°C Cobham plc 5101 Motor Driver, 500VDC, 50A DC Rating Features -- PACKAGE SIZE 3.0" x 2.1" x 0.39“ -- 4 QUADRANT CONTROL -- 6 STEP TRAPEZOIDAL DRIVE CAPABILITY -- ISOLATED UPPER & LOWER GATE DRIVERS -- MIL-PRF-38534 Screening, -55°C TO +125°C 21 Cobham plc