UT54ACS169/UT54ACTS169 - Aeroflex Microelectronic Solutions

Standard Products
UT54ACS169/UT54ACTS169
4-Bit Up-Down Binary Counters
Datasheet
November 2010
www.aeroflex.com/logic
PINOUTS
FEATURES
‰ Fully synchronous operation for counting and programming
‰ Internal look-ahead for fast counting
‰ Carry output for n-bit cascading
‰ Fully independent clock circuit
‰ 1.2μ CMOS
- Latchup immune
‰ High speed
‰ Low power consumption
‰ Single 5 volt supply
‰ Available QML Q or V processes
‰ Flexible package
- 16-pin DIP
- 16-lead flatpack
‰ UT54ACS169 - SMD 5962-96560
‰ UT54ACTS169 - SMD 5962-96561
16-Pin DIP
Top View
16
VDD
2
15
RCO
3
14
B
C
4
5
13
12
QA
QB
D
ENP
6
7
11
10
VSS
8
9
U/D
1
CLK
A
QC
QD
ENT
LOAD
16-Lead Flatpack
Top View
DESCRIPTION
The UT54ACS169 and the UT54ACTS169 are synchronous 4bit binary counters that feature an internal carry look-ahead for
cascading in high-speed counting applications. Synchronous
operation is provided by having all flip-flops clocked simultaneously so that the outputs change coincident with each other
when instructed by the count-enable inputs and internal gating.
Synchronous operation helps eliminate the output counting
spikes that are normally associated with asynchronous (ripple
clock) counters. The clock input triggers the four flip-flops on
the rising (positive-going) edge of the clock.
The counters are fully programmable (i.e., the outputs may each
be preset high or low). The load input circuitry allows loading
with the carry-enable output of cascaded counters. Loading is
synchronous; applying a low level at the load input disables the
counter and causes the outputs to agree with the data inputs after
the next clock pulse.
1
16
VDD
CLK
2
15
RCO
A
3
14
QA
B
4
13
QB
C
5
12
QC
D
6
11
QD
ENP
7
10
ENT
VSS
8
9
LOAD
Transitions at ENP or ENT are allowed regardless of the level
of the clock input.
The counters feature a fully independent clock circuit. Changes
at control inputs (ENP, ENT, LOAD, U/D) that modify the operating mode have no effect on the contents of the counter until
clocking occurs. The function of the counter (whether enabled,
disabled, loading, or counting) will be dictated solely by the
conditions meeting the stable setup and hold times.
The carry look-ahead circuitry provides for cascaded counters
for n-bit synchronous application without additional gating. Instrumental in accomplishing this function are two count-enable
inputs and a carry output. Assert both count enable inputs (ENP
and ENT) to count. The direction of the count is determined by
the level of the U/D input. When U/D is high, the counter counts
up; when low, it counts down. Input ENT is fed forward to
enable the carry output. The ripple carry output
RCO enables a low-level pulse while the count is zero (all inputs
low) counting down or maximum (15) counting up. The lowlevel overflow carry pulse can be used to enable successive cascaded stages.
U/D
The devices are characterized over full military temperature
range of -55°C to +125°C.
1
LOGIC SYMBOL
LOAD
U/D
ENT
(9)
(1)
(10)
(7)
ENP
(2)
CLK
A
(3)
(4)
B
(5)
C
(6)
D
FUNCTION TABLE
CTRDIV 16
M1 (LOAD)
M2 (COUNT)
M3 (UP)
M4 (DOWN)
3,5CT = 15
G5
4,5CT = 0
G6
(15)
RCO
2,3,5,6+/C7
2,3,5,61,7D
(1)
(2)
(4)
(8)
(14)
(13)
(12)
(11)
QA
QB
QC
QD
Note:
1. Logic symbol in accordance with ANSI/IEEE Std 91-1984 and IEC
Publication 617-12.
2
OUTPUT
LOAD
ENP
ENT
U/D
CLK
Count Up
H
L
L
H
↑
Count Down
H
L
L
L
↑
Load Preset
L
X
X
X
↑
Inhibit
H
H
H
X
X
H
X
X
X
X
LOGIC DIAGRAM
CLK
U/D
(2)
(1)
DQ
C
Q
LOAD (9)
ENP
ENT
(14)
Q0
(7)
DQ
(10)
C
Q
A
(13) Q
1
(3)
DQ
(4)
C
B
Q
(12)
C
Q2
(5)
DQ
C
Q
(11)
D
(6)
Q3
(15) RCO
3
OPERATIONAL ENVIRONMENT1
PARAMETER
LIMIT
UNITS
Total Dose
1.0E6
rads(Si)
SEU Threshold 2
80
MeV-cm2/mg
SEL Threshold
120
MeV-cm2/mg
Neutron Fluence
1.0E14
n/cm2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
LIMIT
UNITS
VDD
Supply voltage
-0.3 to 7.0
V
VI/O
Voltage any pin
-.3 to VDD +.3
V
TSTG
Storage Temperature range
-65 to +150
°C
TJ
Maximum junction temperature
+175
°C
TLS
Lead temperature (soldering 5 seconds)
+300
°C
ΘJC
Thermal resistance junction to case
20
°C/W
II
DC input current
±10
mA
PD
Maximum power dissipation
1
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMIT
UNITS
VDD
Supply voltage
4.5 to 5.5
V
VIN
Input voltage any pin
0 to VDD
V
TC
Temperature range
-55 to + 125
°C
4
DC ELECTRICAL CHARACTERISTICS 7
(VDD = 5.0V ±10%; VSS = 0V 6, -55°C < TC < +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
VIL
VIH
IIN
PARAMETER
CONDITION
MIN
Low-level input voltage 1
ACTS
ACS
High-level input voltage 1
ACTS
ACS
MAX
UNIT
0.8
.3VDD
V
.5VDD
.7VDD
V
Input leakage current
ACTS/ACS
VIN = VDD or VSS
Low-level output voltage 3
ACTS
ACS
IOL = 8.0mA
IOL = 100μA
High-level output voltage 3
ACTS
ACS
IOH = -8.0mA
IOH = -100μA
Short-circuit output current 2 ,4
ACTS/ACS
VO = VDD and VSS
-200
Output current10
VIN = VDD or VSS
8
mA
(Sink)
VOL = 0.4V
Output current10
VIN = VDD or VSS
-8
mA
(Source)
VOH = VDD - 0.4V
Ptotal
Power dissipation 2, 8, 9
CL = 50pF
2.3
mW/
MHz
IDDQ
Quiescent Supply Current
VDD = 5.5V
10
μA
Quiescent Supply Current Delta
For input under test
1.6
mA
VOL
VOH
IOS
IOL
IOH
ΔIDDQ
ACTS
-1
1
μA
0.40
0.25
V
.7VDD
VDD-0.25
V
200
mA
VIN = VDD - 2.1V
For all other inputs
VIN = VDD or VSS
VDD = 5.5V
CIN
COUT
Input capacitance 5
ƒ = 1MHz @ 0V
15
pF
Output capacitance 5
ƒ = 1MHz @ 0V
15
pF
5
Notes:
1.Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: VIH = VIH(min) + 20%, - 0%; VIL = VIL(max) + 0%, 50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to VIH(min) and VIL(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density ≤ 5.0E5 amps/cm2, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and VSS at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose ≤ 1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
6
AC ELECTRICAL CHARACTERISTICS 2
(VDD = 5.0V ±10%; VSS = 0V 1, -55°C < TC < +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
PARAMETER
MINIMUM
MAXIMUM
UNIT
tPLH
CLK to RCO
2
23
ns
tPHL
CLK to RCO
4
28
ns
tPLH
CLK to any Q
4
24
ns
tPHL
CLK to any Q
4
24
ns
tPLH
ENT to RCO
1
15
ns
tPHL
ENT to RCO
2
16
ns
tPLH
U/D to RCO
2
16
ns
tPHL
U/D to RCO
2
16
ns
fMAX
Maximum clock frequency
71
MHz
tSU1
A, B, C, D setup time before CLK ↑
9
ns
tSU2
LOAD , ENP, ENT, U/D
Setup time before CLK ↑
9
ns
tH1
Data hold time after CLK ↑
2
ns
tH2
All synchronous inputs hold time after CLK ↑
2
ns
tW
Minimum pulse width
CLK high
CLK low
7
ns
Notes:
1. Maximum allowable relative shift equals 50mV.
2. All specifications valid for radiation dose ≤ 1E6 rads(Si).
3. Based on characterization, hold time (tH1) of 0ns can be assumed if data setup time (tSU1) is >10ns. This is guaranteed, but not tested.
7
PACKAGING
Side-Brazed Packages
8
FLATPACK PACKAGES
9
UT54ACS169/UT54ACTS169: SMD
5962 * ***** ** * * *
Lead Finish: (Notes 1 & 2)
A = Solder
C = Gold
X = Optional
Package Type:
X = 16-lead ceramic bottom-brazed dual-in-line Flatpack
C = 16-lead ceramic side-brazed dip
Class Designator:
Q = QML Class Q
V = QML Class V
Device Type:
01
Drawing Number:
96560 = UT54ACS169
96561 = UT54ACTS169
Total Dose: (Notes 3 & 4)
R = 1E5 rads(Si)
F = 3E5 rads(Si)
G = 5E5 rads(Si)
H = 1E6 rads(Si)
Notes:
1. Lead finish (A,C, or X) must be specified.
2. If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold).
3. Total dose radiation must be specified when ordering. QML Q and QML V not available without radiation hardening. For prototype inquiries, contact factory.
4. Device type 02 is only offered with a TID tolerance guarantee of 3E5 rads(Si) or 1E6 rads(Si) and is tested in accordance with MIL-STD-883 Test Method 1019
Condition A and section 3.11.2. Device type 03 is only offered with a TID tolerance guarantee of 1E5 rads(Si), 3E5 rads(Si), and 5E5 rads(Si), and is tested in
accordance with MIL-STD-883 Test Method 1019 Condition A.
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Aeroflex Colorado Springs - Datasheet Definition
Advanced Datasheet - Product In Development
Preliminary Datasheet - Shipping Prototype
Datasheet - Shipping QML & Reduced Hi-Rel
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reserves the right to make changes to any products and
services herein at any time without notice. Consult Aeroflex
or an authorized sales representative to verify that the
information in this data sheet is current before using this
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