UPD5713TK

CMOS INTEGRATED CIRCUIT
PD5713TK
WIDE BAND SPDT SWITCH
DESCRIPTION
The PD5713TK is a CMOS MMIC for wide band SPDT (Single Pole Double Throw) switch which were developed
for mobile communications, wireless communications and another general-purpose RF switching application.
This device can operate frequency from 0.05 to 2.5 GHz, having the low insertion loss and high isolation.
This device is housed in a 6-pin lead-less minimold (1511) package. And this package is able to high-density
surface mounting.
FEATURES
• Supply voltage
: VDD = 1.8 to 3.6 V (2.8 V TYP.)
• Switch control voltage
: Vcont (H) = 1.8 to 3.6 V (2.8 V TYP.)
: Vcont (L) = 0.2 to +0.4 V (0 V TYP.)
• Low insertion loss
: Lins1 = 0.6 dB TYP. @ f = 0.05 to 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
: Lins2 = 0.8 dB TYP. @ f = 1.0 to 2.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
: Lins3 = 0.95 dB TYP. @ f = 2.0 to 2.5 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• High isolation
: ISL1 = 32.5 dB TYP. @ f = 0.05 to 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
: ISL2 = 25 dB TYP. @ f = 1.0 to 2.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
: ISL3 = 22.5 dB TYP. @ f = 2.0 to 2.5 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• Handling power
: Pin (1 dB) = +21.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
: Pin (0.1 dB) = +17.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• High-density surface mounting : 6-pin lead-less minimold package (1.5  1.1  0.55 mm)
APPLICATIONS
• Mobile communications
• Wireless communications
• Another general-purpose RF switching applications
ORDERING INFORMATION
Part Number
PD5713TK-E2
Order Number
PD5713TK-E2-A
Package
Marking
6-pin lead-less minimold
(1511) (Pb-Free)
C3Q
Supplying Form
 Embossed tape 8 mm wide
 Pin 1, 6 face the perforation side of the tape
 Qty 5 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: PD5713TK-A
Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
Document No. PU10627EJ01V0DS (1st edition)
Date Published September 2006 NS CP(K)
PD5713TK
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
1
OUTPUT1
2
GND
3
OUTPUT2
4
Vcont
5
INPUT
6
VDD
TRUTH TABLE
Vcont
INPUTOUTPUT1
INPUTOUTPUT2
Low
OFF
ON
High
ON
OFF
ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Supply Voltage
VDD
0.5 to +4.6
V
Switch Control Voltage
Vcont
0.5 to +4.6
V
Vcont (H)
 VDD
+0.5
V
Input Power
Pin
+23
dBm
Operating Ambient Temperature
TA
45 to +85
C
Storage Temperature
Tstg
55 to +150
C
Voltage Difference
RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
VDD
+1.8
+2.8
+3.6
V
Switch Control Voltage (H)
Vcont (H)
+1.8
+2.8
+3.6
V
Switch Control Voltage (L)
Vcont (L)
0.2
0
+0.4
V
Supply Voltage
Remark VDD  0.4 V  Vcont (H)  VDD + 0.2 V
2
Data Sheet PU10627EJ01V0DS
PD5713TK
ELECTRICAL CHARACTERISTICS
(TA = +25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, DC cut capacitors = 1 000 pF, unless otherwise
specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
Lins1
f = 0.05 to 1.0 GHz

0.6
0.8
dB
Insertion Loss 2
Lins2
f = 1.0 to 2.0 GHz

0.8
1.0
dB
Insertion Loss 3
Lins3
f = 2.0 to 2.5 GHz

0.95
1.2
dB
Isolation 1
ISL1
f = 0.05 to 1.0 GHz
30
32.5

dB
Isolation 2
ISL2
f = 1.0 to 2.0 GHz
22
25

dB
Isolation 3
ISL3
f = 2.0 to 2.5 GHz
20
22.5

dB
Input Return Loss
RLin
f = 0.05 to 2.5 GHz
13
17

dB
Output Return Loss
RLout
f = 0.05 to 2.5 GHz
13
17

dB
+13.0
+17.0

dBm
f = 1.0 GHz

+21.0

dBm
0.1 dB Loss Compression
Input Power
1 dB Loss Compression
Input Power
Pin (0.1 dB) f = 1.0 GHz
Note 1
Pin (1 dB)
Note 2
Supply Current
IDD
VDD = Vcont = 2.8 V, RF off

0.01
1.0
A
Switch Control Current
Icont
VDD = Vcont = 2.8 V, RF off

0.01
1.0
A
Switch Control Speed
tSW
f = 1.0 GHz

30
100
ns
Notes 1. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of
linear range.
2. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Caution This device is used it is necessary to use DC cut capacitors.
The value of DC cut capacitors should be chosen to accommodate the frequency of operation,
bandwidth, switching speed and the condition with actual board of your system.
Data Sheet PU10627EJ01V0DS
3
PD5713TK
EVALUATION CIRCUIT
Remark C0 = 1 000 pF
Caution This IC has pull down resistance between RF line and GND, witch fixes electric potential of RF
line to 0 V, then the IC cannot be used for DC switching.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
4
Data Sheet PU10627EJ01V0DS
PD5713TK
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
USING THE EVALUATION BOARD
Symbol
Values
C1, C2, C3
1 000 pF
C4, C5
1 000 pF
Data Sheet PU10627EJ01V0DS
5
PD5713TK
TYPICAL CHARACTERISTICS
(TA = +25C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, DC cut capacitors = 1 000 pF,
unless otherwise specified)
Remark The graphs indicate nominal characteristics.
6
Data Sheet PU10627EJ01V0DS
PD5713TK
Remark The graphs indicate nominal characteristics.
Data Sheet PU10627EJ01V0DS
7
PD5713TK
MOUNTING PAD DIMENSIONS
6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm)
Remark The mounting pad layouts in this document are for reference only.
8
Data Sheet PU10627EJ01V0DS
PD5713TK
PACKAGE DIMENSIONS
6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm)
Data Sheet PU10627EJ01V0DS
9
PD5713TK
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220C or higher
Preheating time at 120 to 180C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260C or below
: 10 seconds or less
: 60 seconds or less
: 12030 seconds
: 3 times
: 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
: 260C or below
: 10 seconds or less
: 120C or below
: 1 time
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
10
Data Sheet PU10627EJ01V0DS
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