Application Guide Aluminum SMT Capacitors Reflow Soldering Temperature Profile: 5 seconds maximum Peak Temp. (see chart) Case Code Peak Temp (°C) A, B, C, D, E, F, G, H J, K, L, P R, S, U, X 240 230 200 °C 160 °C Maximum Time @ 200 °C (see chart) 120 seconds Preheat Max. Time @ 200 °C (Sec.) 40 30 Time Outline Drawing K 0.3 mm Max. A I D H P I W SMT & Chip Capacitors L Case Dimensions Case Code D ±0.5 L A ±0.2 H (max) (mm) I (ref) P (ref) K A 3.0 5.4 +.1,.2 3.3 4.5 1.5 0.55 ±0.1 0.60 0.35 +0.15 –0.20 B 4.0 *5.4 +.1,.2 4.3 5.5 1.8 0.65 ±0.1 1.00 0.35 +0.15 –0.20 W C 5.0 *5.4 +.1,.2 5.3 6.5 2.2 0.65 ±0.1 1.50 0.35 +0.15 –0.20 D 6.3 *5.4 +.1,.2 6.6 7.8 2.4 0.65 ±0.1 1.80 0.35 +0.15 –0.20 X 6.3 7.9 ±.3 6.6 7.8 2.6 0.65 ±0.1 1.80 0.35 +0.15 –0.20 E 8.0 6.2 ±.3 8.3 9.5 3.4 0.65 ±0.1 2.20 0.35 +0.15 –0.20 F 8.0 10.2 ±.3 8.3 10.0 3.4 0.90 ±0.2 3.20 0.70 ±0.20 G 10.0 10.2 ±.3 10.3 13.0 3.5 0.90 ±0.2 4.60 0.70 ±0.20 H 12.5 13.5 ±.5 13.5 15.0 4.7 0.90 ±0.3 4.40 0.70 ±0.30 J 10.0 13.5 10.3 12.0 3.5 0.90 ±0.2 4.60 0.70 ±0.20 K 10.0 16.5 10.3 12.0 3.5 0.90 ±0.2 4.60 0.70 ±0.20 L 12.5 16.5 ±.5 13.5 15.0 4.7 0.90 ±0.3 4.40 0.70 ±0.30 P 16.0 16.5 ±.5 17.0 19.0 5.5 1.20 ±0.3 6.70 0.70 ±0.30 R 18.0 16.5 ±.5 19.0 21.0 6.5 1.20 ±0.3 6.70 0.70 ±0.30 S 18.0 21.5 ±.5 19.0 21.0 6.5 1.20 ±0.3 6.70 0.70 ±0.30 U 16.0 21.5 17.0 19.0 6.7 1.20 ±0.3 6.70 0.70 ±0.30 *5.8 ±.3 for AFK and AHD Series Cornell Dubilier • 1605 E. Rodney French Blvd. • New Bedford, MA 02744 • Phone: (508)996-8564 • Fax: (508)996-3830 • www.cde.com 7.030 Application Guide Aluminum SMT Capacitors Tape Specifications Component Orientation Polarity Stripe (-) Cathode t ± 0.2 4 ± 0.1 1.75 ± 0.1 1.5 dia 0.4 F ± 0.1 W ± 0.3 B ± 0.2 A ± 0.2 P1 Case Code (mm) W A B P1 F t A 12.0 3.4 3.5 8.0 5.5 5.8 B 12.0 4.7 4.6 8.0 5.5 5.8 C 12.0 6.0 6.0 12.0 5.5 5.8 D 16.0 7.0 7.0 12.0 7.5 5.8 X 16.0 7.0 7.0 12.0 7.5 8.4 E 16.0 8.7 8.7 12.0 7.5 6.8 F 24.0 8.7 8.7 16.0 11.5 11.0 G 24.0 10.7 10.7 16.0 11.5 11.0 2.0±0.1 SMT & Chip Capacitors 0.2+0.05 4.0±0.1 1.5±0.1 0.5 0.75+0.1 D±0.2 1.75±0.1 F±0.1 W±0.3 C±0.5 A±0.5 S±0.1 P±0.1 B±0.5 Ca se Code W A B C (m m) D F P S J 32 10.7 10.7 14.5 14.5 14.2 20 28.4 K 32 10.7 10.7 14.5 18.5 14.2 20 28.4 H 32 14.0 14.0 18.0 14.5 14.2 24 28.4 L 32 14.0 14.0 18.0 17.5 14.2 24 28.4 P 44 17.5 17.5 23.0 17.5 20.2 28 40.4 R 44 19.5 19.5 26.0 17.5 20.2 32 40.4 S 44 19.5 19.5 26.0 22.5 20.2 32 40.4 U 44 17.5 17.5 23.0 22.5 20.2 28 40.4 Cornell Dubilier • 1605 E. Rodney French Blvd. • New Bedford, MA 02744 • Phone: (508)996-8564 • Fax: (508)996-3830 • www.cde.com 7.031 Application Guide Aluminum SMT Capacitors Reel Specifications E C B R: D 1.0 mm (.039 in.) t SMT & Chip Capacitors A W Ca se Code A B C (m m ) D E W t A, B size 380 ±2.0 50 m in 13.0 ±0.5 21.0 ±0.8 2.0 ±0.5 14 ±1.0 3.0 C, D, E, X size 380 ±2.0 50 m in 13.0 ±0.5 21.0 ±0.8 2.0 ±0.5 18 ±1.0 3.0 F, G size 380 ±2.0 50 m in 13.0 ±0.5 21.0 ±0.8 2.0 ±0.5 26 ±1.0 3.0 J, K, H, L size 330 ±2.0 50 m in 13.0 ±0.5 21.0 ±0.8 2.0 ±0.5 34 ±1.0 3.0 P, R, S, U size 330 ±2.0 50 m in 13.0 ±0.5 21.0 ±0.8 2.0 ±0.5 46 ±1.0 3.0 Land Pattern C A B B Case Code A (mm) B A 0.6 2.2 1.5 B 1.0 2.5 1.6 C 1.5 2.8 1.6 C D 2.2 3.0 1.6 E 2.2 4.5 1.6 F 3.2 4.0 2.0 G 4.6 4.3 2.0 J, K 4.0 4.5 2.0 H 4.0 5.7 2.0 L 4.0 5.7 2.0 2.5 P 6.0 6.5 U 6.0 6.5 2.5 R, S 6.0 7.5 2.5 Cornell Dubilier • 1605 E. Rodney French Blvd. • New Bedford, MA 02744 • Phone: (508)996-8564 • Fax: (508)996-3830 • www.cde.com 7.032 Application Guide Aluminum SMT Capacitors Cleaning Below is a table describing the acceptable cleaning agents for cleaning a PC board containing SMT aluminum electrolytic capacitors in vertical cylindrical cans (V-Chips). Cleaning Agent Water Base Alkaline Surface active agent Name M anufacturer Water Base Distilled Water Aqua Cleaner 210SEP Pine Alpha ST-100S Clean-thru 750H Clean-thru 750L Clean-thru 710M Sun-elec B-12 DK be-clean CW-5790 Sanel Aralawa a Kasei Kogyo Kao Corporation Sanyo Dasei Dai-ichi Kogyo Selyaku Recommended Use Level 1 2 2 2 2 2 2 2 Symptoms of Damage None None, though marking ink may fade Solvent Base Petroleum Based Hydrocarbon Alcohol base Silicon base Telpen base Henkel Hakusui 3 Techno-cleaner 219 Seiwa Sangyo 3 Axarel 32 Mitsui DFC 3 Swelling on sealing rubber, rinse and dry well after cleaning 1 3 3 3 None None if used in combination 3 Contains CFC's subject to environmental regulations Isoproyl Alcohol Techno-care FRW-17 Techno-care FRW-17 Toshiba Corporation (Techno-care FRV-100) Asashi-clean AKAshahi Glass 225AES HCFC141B-MS Dalkin Kogyo 3 Telpen-cleaner EC-7R Nippon Alpha Metals 3 SMT & Chip Capacitors Halogenated hydrocarbon Cold-cleaner P3-375 Swelled seal Use Level Number Recommendations 1 2 3 Cleaning is pos s ible Cleaning is pos s ible (marking may fade) Cleaning is pos s ible (Us e caution. 1 and 2 are better choices ) V-Chips may be immersed for 5 minutes, safely, in Level 1&2 solvents. Use Level 3 solvents with caution Do not use chlorine-based halogenated cleaning solvents, adhesives or coating agents. When halogenated chlorine-based solvents are used in the cleaning process, free chlorine is liberated from the solvent. This chlorine causes corrosion and deterioration of the aluminum inside the capacitor. Dangers of “Free-Chlorine”: After the solvent dries, the chlorine remains on the capacitor seal, the chlorine slowly permeates into the capacitor element causing corrosion and damage that happens slowly. It may take some time before a failure is apparent. A representation of the chemical reaction is on the following page. Cornell Dubilier • 1605 E. Rodney French Blvd. • New Bedford, MA 02744 • Phone: (508)996-8564 • Fax: (508)996-3830 • www.cde.com 7.033 Application Guide Aluminum SMT Capacitors Reaction of Free-chlorine and Aluminum Combined free chlorine and hydrogen become hydrochloric acid, but it has high dissociation and most of it becomes chlorine ions. These chlorine ions react with the aluminum. The order of the reactions is represented below. 1.) Hydration of oxide film 2Al(OH)3 AlO3 + 3H2O 2.) Reaction of hydrated oxide film and chlorine (Dissolution of film) AlCI3 + 3H2O Al(OH)3 + 3HCI 3.) Reaction of aluminum and hydrochloric acid (Dissolution of aluminum) Al + 3HCI AlCI3 + 3/2H2 4.) Precipitation of aluminum hydroxide Al(OH)3 + 3HCI AlCI3 + 3H2O The entire reaction can be summerized as the following: Al + Al2O3 + 3HCI3 + 3H2O 2Al(OH)3 + AlCI3 + AlCl3 + H3/2 Therefore the compounds produced by the reactions are aluminum hydroxide and hydrochloric acid from reaction #4; the hydrochloric acid is not consumed and acts as a catalyst. SMT & Chip Capacitors Solvents that should not be used Composition Boiling Point (ºC) Common Name 1.1.1 -Trichloroethane Trichloroethylene Tetrachloroethylene 74.1 87.2 121.1 Chlorosen Trichlene Perchloroenthylene Additional Cleaning Notes: 1.) Solvents containing CFC’s destroy the ozone layer and should be avoided to protect the global environment. 2.) To avoid solvent residue between the capacitor’s seal and the PC board, make sure the assembly is dried thoroughly immediately after cleaning. Coating Below is a list of coatings that are safe for use with V-Chips Manufacturer Hitachi Chemical Boxy Brown Dow Corning Nihon Zeon Material Coating Material Name Acrylic Urethane Acrylic Urethane Silicon Urethane Taffi -1141, Taffi -1147 Taffi -1154 Humi Seal 1B66 Humi Seal 1A27 Perugan Z, Perugan C Quinate System 160B Cornell Dubilier • 1605 E. Rodney French Blvd. • New Bedford, MA 02744 • Phone: (508)996-8564 • Fax: (508)996-3830 • www.cde.com 7.034