1/4 STRUCTURE Silicon Monolithic Integrated Circuit PRODUCT NAME Multi-Channel Power IC ＢＤ８１６５ＭＵＶ TYPE ・Built-in 5-channel outputs for TFT-LCD Display ・Built-in VCOM AMP FEATURES ●ABSOLUTE MAXIMUM RATINGS (Ta=25℃) PARAMETER Supply Voltage 1 Supply Voltage 2 Supply Voltage 3 SYMBOL LIMITS VCC,PVCC2,3 SW1 Voltage UNIT 15 V LDVCC1 7 V HVCC 20 V VSW1 22 V Tjmax 150 ℃ Junction Temperature Pd 4826*1 mW Power Dissipation Operating Temperature Range Topr -40～105 ℃ Storage Temperature Range Tstg -55～150 ℃ *1 Decreased in done 38.6mW/℃ for operating above Ta≧25℃, mounted on 70×70×1.6mm 4 layer Glass-epoxy PCB.(back foil 70.0mm×70.0mm) ●OPERATING CONDITIONS (Ta=-40℃～+105℃) Parameter Supply Voltage 1 Supply Voltage 2 Supply Voltage 3 SW1 Voltage Symbol MIN MAX Unit VCC,PVCC2,3 4.2 14 V LDVCC1 - 5.5 V HVCC 6 18 V VSW1 - 18 V Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority. REV. D 2/4 ●ELECTRICAL CHARACTERISTICS（Unless otherwise specified, Ta=25℃,VCC=12V,HVCC=15V） Limit Parameter Symbol Unit Condition MIN TYP MAX 【DC/DC BLOCK】 Feed Back Voltage 1 VFB1 1.230 1.250 1.270 V Feed Back Voltage 2 VFB2 1.225 1.250 1.275 V Feed Back Voltage 3 VFB3 0.882 0.900 0.918 V FB Input Bias Current IFB -1.2 0.1 1.2 uA COMP Source Current ICSO 15 40 65 uA COMP Sink Current ICSI -65 -40 -15 uA MAX Duty MDT 80 90 % 【LDO1,LDO3 BLOCK】 LDO Feed Back Voltage LDFB 1.231 1.25 1.269 V Drop Voltage 1 DPLD1 0.3 1.0 V LDFB1=1.0V, Io=500mA Drop Voltage H 0.4 0.9 V DPLDH LDFB_H=1.0V, Io=100mA 【Charge Pump BLOCK】 Feed Back Voltage CPFB 1.225 1.25 1.275 V Drop Voltage 1 DPCPP 0.14 0.35 0.78 V Io=100mA Drop Voltage 2 DPCPN 0.28 0.7 1.55 V Io=100mA 【Operational Amplifier BLOCK】 Input Offset Voltage VOFF -15 0 15 mV VCOM Output Current ICOM 60 150 mA Load Regulation ⊿Vo -15 1 15 mV Io=+1mA～-1mA Maximum Output Voltage VoH HVCC-1.0 HVCC-0.8 V Io=-1mA, IN=HVCC-0.8V Minimum Output Voltage VoL 0.1 0.16 V Io=1mA, IN=0V 【WHOLE】 Reference Voltage VREF 2.46 2.53 2.60 V Oscillation Frequency FSW 550 650 750 kHz UVLO Voltage UVLO 0.88 1.17 V Average Supply Current (VCC,PVCC2,3) ICC 5 11 mA No Switching Average Supply Current (HVCC) HICC 1.0 4 mA No Switching ○This product is not designed for protection against radioactive rays. ● PHYSICAL DIMENSION・MARKING (VQFN048V7070) BD8165 LOT NO Marking (UNIT:mm) REV. D 3/4 SW1 DTC1 PGATE FB1 COMP1 CTL1 SCP VCC UVLO VREF FB2 COMP2 DTC2 PVCC2 BOOT2 ●BLOCK DIAGRAM PG2 STEP降圧 DOWN SW2 PG1 STEP UP 昇圧 VREF CONVERTER コンバータ PROTECT CONVERTER コンバータ PGND1 CTL2 CPFB1 POSITIVE 正チャージ REG CPPG CHARGE PUMP ポンプ REG C1 LDFB1 VCP1 LDCTL1 LDO 1 LDPG1 HVCC LDVCC1 VCP2 LDO1 負チャージ NEGATIVE C2 GND CHARGE PUMP ポンプ OSC CPFB2 LDO 3 STEP DOWN 降圧コンバータ CONVERTER CTL3 SW3 HVCC BOOT3 VCOM IN+ IN- LDD_H LDFB_H PVCC3 COMP3 FB3 DTC3 PG3 ●PIN No. & FUNCTION TABLE PIN NO. 1 PIN NAME FUNCTION PIN NO. 25 PIN NAME FUNCTION BOOT3 Boot strap Terminal 3 COMP1 Error Amp Output 1 2 PG3 Power Good Output 3 26 FB1 Feed Back Input 1 3 DTC3 DUTY Control Input 3 27 CTL1 Control Input 1 4 COMP3 Error Amp Output 3 28 SCP Short Protection Current Output 5 FB3 Feed Back Input 3 29 VCC Power Supply Input 6 PVCC3 Power Supply Input 30 UVLO UVLO Input 7 LDFB_H LDO Feed Back Input H 31 VREF Reference Voltage Output 8 LDO_H LDO Output H 32 FB2 Feed Back Input 2 9 IN+ COM Input + 33 COMP2 Error Amp Output 2 10 IN- COM Input - 34 DTC2 DUTY Control Input 2 11 VCOM COM Output 35 PVCC2 Power Supply Input 12 CPFB2 Charge Pump Feed Back Input 2 36 BOOT2 Boot strap Terminal 2 13 C2 Charge Pump Input2 37 PG2 Power Good Output 2 14 VCP2 Charge Pump LDO Output 2 38 SW2 Power Switch Output 2 15 HVCC Power Supply Input 39 CTL2 Control Input 2 16 VCP1 Charge Pump LDO Output 1 40 REG Boot strap Regulator Output 17 C1 Charge Pump Output 1 41 LDFB1 LDO Feed Back Input 1 18 CPPG CP Power Good Output 42 LDCTL1 LDO1 Control Input 19 CPFB1 Charge Pump Feed Back Input 1 43 LDPG1 LDO1 Power Good Output 20 PGND1 Ground 44 LDO1 LDO Output 1 21 PG1 Power Good Output 1 45 LDVCC1 Power Supply Input 22 SW1 Power Switch Output 1 46 GND Ground 23 PGATE Pch Gate Drive Output 47 CTL3 Control Input 3 24 DTC1 DUTY Control Input 1 48 SW3 Power Switch Output 3 REV. D 4/4 Operation Notes 1. Absolute maximum range This product are produced with strict quality control, but might be destroyed in using beyond absolute maximum ratings. Open IC destroyed a failure mode cannot be defined (like Short mode, or Open mode). Therefore physical security countermeasure, like fuse, is to be given when a specified mode to be beyond absolute maximum ratings is considered. 2. Ground potential GND terminal should be a lowest voltage potential every state. Please make sure all pins which is over ground even if include transient feature. 3. Setting of heat Use a setting of heat that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.. 4 . Short Circuit between Terminal and Soldering Don’t short-circuit between Output pin and the power supply pin, Output pin and GND pin, or the power supply pin and GND pin.When soldering the IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 5 . Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 6. Ground wiring patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring patterns of any external components. 7. This IC is a monolithic IC which has P+ isolation in the P substrate and between the various pins. A P-N junction is formed from this P layer and the N layer of each pin. For example, when a resistor and a transistor is connected to a pin. Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits as well as operation faults and physical damage. Accordingly, you must not use methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin. （PinＢ） Ｂ （PinＢ） Ｃ ～ ～ resister （PinＡ） Ｅ Ｃ ～ ～ Ｂ ＧＮＤ Ｐ＋ Ｐ＋ Ｐ Ｐ＋ BI-POLAR IC near-by other element Ｐ＋ Ｎ Ｎ （PinＡ） Ｐsubstrate parasitic diode ＧＮＤ ＧＮＤ parasitic diode or transistor Ｎ Ｎ Ｅ ～ ～ SIMPLIFIED STRUCTURE OF Ｎ Parasitic diode ＧＮＤ parasitic diode or transistor 8. Over current protection circuit The over-current protection circuits are built in at output, according to their respective current outputs and prevent the IC from being damaged when the load is short-circuited or over-current. But, these protection circuits are effective for preventing destruction by unexpected accident. When it’s in continuous protection circuit moving period don’t use please. And for ability, because this chip has minus characteristic, be careful for heat plan. 9. Built-in thermal circuit A temperature control circuit is built in the IC to prevent the damage due to overheat. Therefore, all the outputs are turned off when the thermal circuit works and are turned on when the temperature goes down to the specified level. 10.Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. 11.Discontiguous mode The DC/DC converters of this IC are designed for being used in contiguous current mode, normally. The special consideration on adjusting the inductance or the resistive output load to avoid the discontiguous current mode should be properly done. REV. D Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. 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