1/4 Structure Silicon Monolithic Integrated Circuit Product Name Compound LED Driver for cellular phone Type BD60910GU Features Boost DC/DC for LED back lighting Constant current driver for LED back lighting Auto Luminous Control (ALC) ●Absolute Maximum Ratings（Ta=25℃） Parameter Symbol Limits Unit Pins Maximum voltage 1 VMAX1 7 V Maximum voltage 2 VMAX2 15 V VLED Maximum voltage 3 VMAX3 32.6 V VOUT, SW Pd 1250 mW Topr -40 ~ +85 o C -55 ~ +150 o C Power Dissipation Operating Temperature Range Storage Temperature Range Tstg except for VLED, VOUT, SW o o note）Power dissipation deleting is 10mW/ C, when it’s used in over 25 C. (It’s deleting is on the board that is ROHM’s standard) Dissipation by LSI should not exceed tolerance level.of Pd. ●Operating conditions（VBAT≧VIO, Ta=-40～85℃） Parameter VBAT input voltage VIO pin voltage Symbol Limits Unit VBAT 2.7～5.5 V VIO 1.65～3.3 V * Radiation-proof is not designed. REV. A 2/4 ● Electrical Characteristics (Unless otherwise specified, Ta=25°C, VBAT=3.6V, VIO=1.8V) Parameter Symbol 【Circuit Current】 VBAT Circuit current 1 VBAT Circuit current 2 IBAT1 IBAT2 VBAT Circuit current 3 IBAT3 VBAT Circuit current 4 IBAT4 Min. Typ. Max. Unit 0.1 0.5 1.0 3.0 μA μA - 2.5 5.0 mA - 0.4 1.0 mA Condition RESETB=0V, VIO=0V RESETB=0V, VIO=1.8V LED=ON, ILED=15mA setting Vo=24V Only ALC block ON ADCYC=0.52s setting Except sensor current 【LED Driver】 LED current Step (Setup) LED current Step (At slope) ILEDSTP1 128 ILEDSTP2 Step 256 Step LED Maximum current IMAXWLED - 25.6 - mA LED current accuracy IWLED -7% 15 +7% mA ILED=15mA setting 【DC/DC】 VLED pin feedback voltage Over current protection Oscillator frequency Vfb - 0.3 - V OCP - 650 - mA fosc 0.8 1.0 1.2 MHz Over Voltage Protection detect voltage OVP1 OVP2 OVP3 OVP4 OVP5 30 - 31 27 24 21 18 32 - V V V V V Maximum Duty Mduty 92.5 - - % VOUT open protection OVO - 0.7 1.4 V LOW level input voltage VIL -0.3 - HIGH level input voltage VIH 2 【I C input (SDA, SCL)】 Hysteresis of Schmitt trigger input LOW level output voltage (SDA) at 3mA sink current Input current 【RESETB】 Vhys 0.75 × VIO 0.05 × VIO - 0.25 × VIO VBAT +0.3 V V - - V VOL 0 - 0.3 V lin -3 - 3 μA LOW level input voltage VIL -0.3 - HIGH level input voltage VIH Input current 【ALC】 Iin - IoS 3.0 2.6 - VISS 0 - ROFFS ADRES ADINL -3 1.0 8 - ADDNL -1 RSSENS 1 VoS SBIAS Output current SBIAS Discharge resister at OFF ADC resolution ADC non-linearity error ADC differential non-linearity error SSENS Input impedance - 2.850 2.470 - SBIAS Output voltage SSENS Input range 0.75 × VIO -3 0.25 × VIO VBAT +0.3 3 3.150 2.730 30 VoS x 255/256 1.5 V V μA Input voltage = 0.1×VIO~0.9×VIO V V mA Io=200μA < Initial value > Io=200μA Vo=3.0V V +3 kΩ bit LSB - +1 LSB - - MΩ REV. A Input voltage = 0.1×VIO~0.9×VIO 3/4 ● Electrical Characteristics (Unless otherwise specified, Ta=25°C, VBAT=3.6V, VIO=1.8V) 【WPWMIN】 L level input voltage VILA -0.3 - H level input voltage VIHA 1.4 - IinA - PWpwm VOLS Input current PWM input minimum High pulse width 【GC1, GC2】 L level output voltage H level output voltage VOHS 3.6 0.3 VBAT +0.3 10 μA 50 - - μs VoS -0.2 - 0.2 V IOL=1mA - - V IOH=1mA ●Outside size figure D60910 LOT No. VCSP85H3（24pin） （unit:mm） REV. A V V Vin=1.8V 4/4 VOUT GNDP GNDP SW VBAT2 ●Pin List VBAT1 ● Block Diagram PIN I/O Level Shift I2C interface DC/DC WPWMIN D5 VBAT2 E4 SW D1 VIO C3 VOUT C1 GND1 A4 VLED E2 GND2 B4 SBIAS A3 LEDGND B5 SSENS E3 GNDP B3 GC1 GND1 D4 GNDPS C4 GC2 GND2 C5 SGND A1 T1 D3 RESETB A5 T2 C2 SDA E5 T3 D2 SCL E1 T4 OVP Digital Control Feed Back WPWMIN VLED External PWM LEDGND SBIAS SSENS SGND Sensor I/F GC2 TSD ALC VREF IREF T4 T3 T2 GC1 T1 PIN NAME B1 OCP SCL SDA PIN VBAT1 VIO RESETB PIN NAME A2 ● Cautions on use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power supply and ground line Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and ground lines. Especially, when there are ground pattern for small signal and ground pattern for large current included the external circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) Ground voltage Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric transient. (4) Short circuit between pins and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin and the power supply or the ground pin, the ICs can break down. (5) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6) Input pins In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage lower than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8) Thermal shutdown circuit (TSD) This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (9) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (10) About the pin for the test, the un-use pin Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a function manual and an application notebook. And, as for the pin that doesn't specially have an explanation, ask our company person in charge. (11) Rush Current Rush current may flow in instant in the internal logic unfixed state by the power supply injection order and delay. Therefore, be careful of power supply coupling capacity, a power supply and the width of grand pattern wiring, and leading about. (12) DC/DC converter Please select the low DCR inductors to decrease power loss for DC/DC converter. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. 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