1/4 Structure Silicon Monolithic Integrated Circuit Product Name Power supply for CCD camera / White LED driver / RGB LED driver of mobile phone Type BD6023AGU Features A system power supply for the CCD camera module Built-in white LED driver for the LCD back light and RGB LED driver o ○Absolute Maximum Ratings (Ta=25 C) Parameter Symbol Rating Maximum Applied Voltage 1 VMAX1 20(*1) Maximum Applied Voltage 2 VMAX2 16(*2) Maximum Applied Voltage 3 VMAX3 15(*3) Maximum Applied Voltage 4 VMAX4 -13.5(*4) Maximum Applied Voltage 5 VMAX5 6(*5) Power Dissipation Pd 2500(*6) Operating Temperature Range Topr -30 to 85 Storage Temperature Range Tstg -55 to 150 (*1) VPLUS11, VPLUS12, VPLUS2 pin (*2) CAMP pin (*3) LEDR, LEDG, LEDB, BKLED, FLED1, FLED2 pin (*4) VNEG11, VNEG12, CAMN pin (*5) Except *1~ *4 pin o o (*6) Power dissipation deleting is 20mW/ C, when it’s used in over 25 C. It’s deleting is on the board that is ROHM’s standard. Unit V V V V V mW o C o C Condition Unit Condition o ○Recommended operating conditions (Ta=-30 to 85 C) Rating Min. Typ. Max. VBAT power supply voltage VBAT 2.7 3.6 4.5 VIO power supply voltage VIO 1.62 3.0 3.3 This product isn’t designed to protect itself against radioactive rays. Parameter Symbol REV. C V V 2/4 ○Electrical Characteristics o Unless otherwise specified, Ta=25 C, VBAT=3.6V, VIO=1.8V/3.0V, VCC=2.45V Parameter Symbol Min. Spec Typ. Max. Unit Circuit Current VBAT Circuit current 1 VBAT Circuit current 2 VBAT Circuit current 3 IQ1 IQ2 IQ3 - 0.5 0.1 6.2 3.0 3.0 9.3 µA µA µA VBAT Circuit current 5 IQ5 - 11 16 µA Condition RSTB=0V RSTB=0V, VIO=0V REGVCC ON (Energy save mode) REGVCC ON (Energy save mode) REG1 ON (Energy save mode) REG2 ON (Energy save mode) REGVCC ON (Normal Mode) SWREG1 ON (Vo=14V, Io=1mA) VBAT Circuit current 8 IQ8 - 26 39 mA SWREG3 ON (Vo=-10V, Io=1mA) (Add 30h=01h, Add 80h=01h) REGCP ON, REGCN ON SWREG1 (DC/DC for white LED and power supply for Camera ) FLED1 drive current 3 IFLED13 27.0 30.0 33.0 FLED2 drive current 3 IFLED23 27.0 30.0 33.0 BKLED drive current 3 IBKLED3 27.0 30.0 33.0 SWREG2 (DC/DC for RGB LED ) LEDR Drive current ILEDR22 135 150 165 (Large current) LEDG Drive current ILEDG22 135 150 165 (Large current) LEDB Drive current ILEDB22 135 150 165 (Large current) REGCP (15V/13V LDO) mA mA mA mA mA mA Output voltage 1 VO151 14.5 15.0 15.5 V Output voltage 2 VO152 12.5 13.0 13.5 V REGCN Add=80h Data=1Eh Add=80h Data=3Eh Add=90h Data=1Eh Add=A0h Data=0Ch Add=50h Data=1Eh Add=A0h Data=0Ah Add=60h Data=1Eh Add=A0h Data=09h Add=70h Data=1Eh Io=60mA, REGCPVSEL=0, VPLUS12=16V Io=60mA, REGCPVSEL=1, VPLUS12=14V (-8V/-7.5/-7V LDO) Io=100mA, VNEG12=-10V Output voltage 1 VO81 -8.5 -8.0 -7.5 V Output voltage 2 VO82 -8.0 -7.5 -7.0 V Output voltage 3 VO83 -7.5 -7.0 -6.5 V ICUR3 0.57 0.60 0.63 V Add=E0h, Data=FFh VO11 VO12 2.94 3.04 3.00 3.10 3.06 3.16 V V Io=150mA, REG1VSEL=0, REG1MD=1 VO21 VO22 1.74 2.45 1.80 2.50 1.86 2.55 V V Io=100mA, REG2VSEL=L, REG2MD=1 Constant current drive CURSENS pin control voltage 3 REG1 (3.0V/3.1V LDO) Output voltage 1 Output voltage 2 REG2 (1.8V/2.5V LDO) Output voltage 1 Output voltage 2 REV. C REGCNVSEL1=0, REGCNVSEL2=0 Io=100mA, VNEG12=-10V REGCNVSEL1=1/0, REGCNVSEL2=1 Io=100mA, VNEG12=-9V REGCNVSEL1=1, REGCNVSEL2=0 Io=150mA, REG1VSEL=1, REG1MD=1 Io=100mA, REG2VSEL=H, REG2MD=1 3/4 ○External dimensions ○Terminals PIN Type PIN Name PIN PIN Name PIN PIN Name A1 T1 C9 TESTO J1 VIO A2 GND2 C10 REG2O J2 TESTI A3 VBAT1 D1 REG1CNT J3 REG2VSEL A4 LEDR D2 REG2CNT J4 VCC A5 GND3 D9 VBAT3 J5 FLED2 A6 LEDB D10 VBAT4 J6 FLED1 A7 CAMN E1 CUR J7 TRSW1 A8 GND5 E2 CURSENS J8 SENSP1 A9 CAMP E9 IREF J9 SENSN1 A10 T2 E10 REG1O J10 GND8 B1 VPLUS2 F1 LEDCTL K1 T4 B2 GND1 F2 REGVCCCNT K2 GND11 B3 VBAT2 F9 SENSP3 K3 VBAT8 B4 TRSW2 F10 VREF K4 BKLED BD6023GU A LOT No. VCSP85H5 (64PIN) B5 LEDG G1 RSTB K5 GND10 B6 GND4 G2 CLK K6 VBAT7 B7 VNEG12 G9 VBAT5 K7 GND9 B8 GND6 G10 VBAT6 K8 VPLUS11 SENSN3 B9 GND7 H1 DATA K9 B10 VPLUS12 H2 STRB K10 C1 SENSN2 H9 VNEG11 - - C2 SENSP2 H10 TRSW3 - - (Unit : mm) ○Block diagram VBAT1～8 PWM Comp TRSW1 PWM Comp Driver SENSP1 + - SENSP2 SENSN2 SWREG1 SWREG2 Driver TRSW2 Current Limiter + - - + VPLUS2 OSC + - - + + ERR Amp + - Current Limiter OSC Over Voltage DET SENSN1 Over Voltage DET ERR Amp VPLUS11 + VPLUS12 SEL LEDB SEL LEDG LEDR BKLED FLED1 TESTO VREF Reference Voltage VREF IREF Reference Current IREF VCC LDO 2.45V FLED2 SWREG3 Current Limiter SENSP3 + SENSN3 Power Supply REGVCCCNT TRSW3 Driver VIO Over Voltage DET REG1CNT + + REG2VSEL VNEG11 ERR Amp PWM Comp REG2CNT + OSC VNEG12 REGCP Level CLK Shift VPLUS12 CPU I/F LDO 15V/13V VNEG12 LDO -8V/-7.5V/-7V CAMP REGCN DATA Control STRB CPU I/F REG1 Logic LDO 3.0V/3.1V CPU I/F RSTB CAMN REG1O REG2 LEDCTL LDO 1.8V/2.5V CPU I/F REG2O TESTI + - T1 8BIT DAC T2 T3 T4 GND1～11 REV. C CUR CURSENS T3 4/4 ○Cautions on use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power supply and GND line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current included the external circuits, please separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (4) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (5) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8) Thermal shutdown circuit (TSD) This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (9) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (10) LDO Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited because it has the possibility that a operation becomes unstable. (11) DC/DC converter Please select the low DCR inductors to decrease power loss for DC/DC converter. (12) Other cautions on use Please consult supplementary documents such as technical notebook, function manual and application design guide of this LSI. REV. C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. 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