- Comchip Technology

MATERIAL DATA SHEET
SMD Diodes Specialist
Material #
CDBZ series (0201) (Halogen Free)
Product Line
0201
Date
2012/11/28
Rev. date
A
NO.
Construction
element
Material group
Material weight
(mg)
Material
CAS
if applicable
Average mass
(%)
Sum(%)
1
Wafer
Wafer
0.015
Silicon
7440-21-3
1.00
0.77%
Iron
7439-89-6
2.1% ~2.6%
Phosphorus
7723-14-0
0.015% ~0.15%
Zinc
7440-66-6
0.05% ~0.2%
Lead
7439-92-1
<0.03%
Silver
7440-22-4
0.0738% ~1.998%
Copper
7440-50-8
Bal.
Silver
7440-22-4
>50%
Epoxy resin
TS ref# 10030
10%-20%
1,4-Butanedioldiglycidyl ether
2425-79-8
5%-10%
Amine
TS ref# 10039
1%-5%
Aurum
7440-57-5
1.00
Epoxy Resin-1
Trade Secret
2%~5%
Epoxy Resin-2
Trade Secret
0.5%~4%
Phenol Resin
Trade Secret
2%~5%
Silica
60676-86-0
80%~90%
Carbon Black
1333-86-4
appox.0.2%
Metal hydroxide
Trade Secret
1~10%
Others
N/A
max.2%
2
3
4
5
Lead Frame
Epoxy
Lead Frame
Epoxy
Wire
Wire
Mold Compound
Mold Compound
Total weight
Comchip Technology CO., LTD.
27.19%
0.531
0.3
15.36%
0.009
1.098
1.953
www.comchiptech.com
TEL: +886-2-86776675
FAX: +886-2-86776672
0.46%
56.22%