Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 1.48% 0.0489 Mold 36.73% 1.212 D/A Epoxy 0.21% 0.60% 0.0197 Solder Balls 19.89% 0.656 Foil 18.87% 22.23% with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. (90nm and 65nm products) MSL: 3 Peak Reflow Temp: 250°C Substance CAS # Silicon chip 7440-21-3 Die size: 8.11 x 8.34 mm Notes / Assumptions: 32.61% 1.84% 1.47% 0.07% 0.73% 1.076 0.0606 0.0485 0.0024 0.0242 Silica (Fused or Amorphous) Epoxy resin Phenol resin Carbon Black Other 60676-86-0 1333-86-4 - Mold Compound Density between 1.8 and 2.1 grams/cc 85 to 95% Silica Fused or Amorphous (LSC uses 88.8% in our calculation) 1.5 to 8% Epoxy resin (LSC uses 5% in our calculation) 3 to 6% Phenol resin (LSC uses 4% in our calculation) Carbon Black appox. 0.2% Others approx. 2% 0.16% 0.01% 0.02% 0.01% 0.0054 0.0003 0.0008 0.0003 Silver (Ag) Epoxy Resin Diester Functionalized Ester 7440-22-4 - Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 78% in our calculation) 1 to 10% Epoxy Resin (LSC uses 5% in our calculation) 5 to 20% Diester (LSC uses 12% in our calculation) 1 to 10% Functionalized Ester (LSC uses 5% in our calculation) Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per solder ball 0.0069 Wire Substrate 672 fpBGA 3.30 Grams 19.19% 0.60% 0.10% 0.633 0.0197 0.0033 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 12.83% 6.04% 0.424 0.199 Glass fiber BT Resins 65997-17-3 - Copper (Cu) 7440-50-8 Qualified Solder ball compositions: Sn96.5/Ag3/Cu0.5 0.623 0.734 60 to 75% glass fiber (LSC uses 68% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B4