Device Material Content

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
1.48%
0.0489
Mold
36.73%
1.212
D/A Epoxy
0.21%
0.60%
0.0197
Solder Balls
19.89%
0.656
Foil
18.87%
22.23%
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
(90nm and 65nm products)
MSL: 3
Peak Reflow Temp: 250°C
Substance
CAS #
Silicon chip
7440-21-3
Die size: 8.11 x 8.34 mm
Notes / Assumptions:
32.61%
1.84%
1.47%
0.07%
0.73%
1.076
0.0606
0.0485
0.0024
0.0242
Silica (Fused or Amorphous)
Epoxy resin
Phenol resin
Carbon Black
Other
60676-86-0
1333-86-4
-
Mold Compound Density between 1.8 and 2.1 grams/cc
85 to 95% Silica Fused or Amorphous (LSC uses 88.8% in our calculation)
1.5 to 8% Epoxy resin (LSC uses 5% in our calculation)
3 to 6% Phenol resin (LSC uses 4% in our calculation)
Carbon Black appox. 0.2%
Others approx. 2%
0.16%
0.01%
0.02%
0.01%
0.0054
0.0003
0.0008
0.0003
Silver (Ag)
Epoxy Resin
Diester
Functionalized Ester
7440-22-4
-
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 78% in our calculation)
1 to 10% Epoxy Resin (LSC uses 5% in our calculation)
5 to 20% Diester (LSC uses 12% in our calculation)
1 to 10% Functionalized Ester (LSC uses 5% in our calculation)
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per solder ball
0.0069
Wire
Substrate
672 fpBGA
3.30
Grams
19.19%
0.60%
0.10%
0.633
0.0197
0.0033
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
12.83%
6.04%
0.424
0.199
Glass fiber
BT Resins
65997-17-3
-
Copper (Cu)
7440-50-8
Qualified Solder ball compositions:
Sn96.5/Ag3/Cu0.5
0.623
0.734
60 to 75% glass fiber (LSC uses 68% in our calculation)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. B4