- Comchip Technology

MATERIAL DATA SHEET
Material #
SOD-123 series (Halogen Free)
Product Line
Date
2011/10/15
Rev. date
E
No.
1
2
3
4
5
Construction
element
Lead
Frame
Wire
Mold
Compound
Wafer
Plating
Material group
Material weight
(mg)
SDI
Heraeus
HuaWei
YanDong
2.469
0.01
CAS
if applicable
Average mass
(%)
Nickel
7440-02-0
41.00%
Manganese
7439-96-5
0.70%
Cobalt
7440-48-4
0.40%
Silicon
7440-21-3
0.20%
Chromium
7440-47-3
0.05%
Copper
7440-50-8
0.05%
Carbon
7440-44-0
0.01%
Iron
7439-89-6
56.59%
Silver
7440-22-4
1.00%
Aurum
7440-57-5
100.00%
Silica Fused
60676-86-0
60~90%
Silica amorphous
7631-86-9
5~20%
Eoxy resin
Trade Secret
2~10%
Phenolic Resin
Trade Secret
2~10%
Carbon Resin
01333-86-4
<1%
Flame Retardand
Trade Secret
<5%
Silicon
7440-21-3
95.50%
6.783
YSTIN
0.142
9.754
Sum(%)
25.31
0.10
69.54
0.350
Total weight
Comchip Technology CO., LTD.
Material
Gold
7440-57-5
3.50%
Aluminum
7429-90-5
1.00%
Tin
7440-31-5
100.00%
www.comchiptech.com
TEL: +886-2-86776675
FAX: +886-2-86776672
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