- Comchip Technology

MATERIAL DATA SHEET
Material #
SOD-123 series
Product Line
Date
2013/3/8
Rev. date
D
No.
1
2
3
Construction
element
Lead
Frame
Wire
Mold
Compound
Material group
Material weight
(mg)
SDI
KangQiang
HuaWei
2.469
0.01
6.783
4
Wafer
YanDong
0.350
5
Plating
YSTIN
0.142
Total weight
9.754
Comchip Technology CO., LTD.
Material
CAS
if applicable
Average mass
(%)
Nickel
7440-02-0
41.00%
Manganese
7439-96-5
0.70%
Cobalt
7440-48-4
0.40%
Silicon
7440-21-3
0.20%
Chromium
7440-47-3
0.05%
Copper
7440-50-8
0.05%
Carbon
7440-44-0
0.01%
Iron
7439-89-6
56.59%
Silver
7440-22-4
1.00%
Copper
7440-50-8
100%
Silica Fused
60676-86-0
80.00%
Epoxy resin
29690-82-2
10.00%
Phenolic Resin
9003-35-4
7.50%
Brominated epoxy resin
40039-93-8
2.00%
Carbon Black
1333-86-4
0.50%
Silicon
7440-21-3
95.50%
Gold
7440-57-5
3.50%
Aluminum
7429-90-5
1.00%
Tin
7440-31-5
100.00%
www.comchiptech.com
TEL: +886-2-86776675
FAX: +886-2-86776672
1/1
Sum(%)
25.313
0.10
69.54
3.59
1.46
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