MATERIAL DATA SHEET - Comchip Technology

MATERIAL DATA SHEET
Material #
CDBUR & CDBU series (0603) (Halogen Free)
Product Line
SOD-523F
Date
2014/1/27
Rev.
G
COMPONENT DETAILS
No.
1
2
3
4
5
Construction
element
FR-4 Board
Wafer
Al wire
Silver paste
Molding
Compound
Material group
Material weight
(mg)
Substrate/
Terminal
Diode
Conductor
Welding
Outer
Total weight
Material
CAS
if applicable
Average mass
(%)
Copper
7440-50-8
29.34%
Nickel
7440-02-0
4.762%
Gold
7440-57-5
0.155%
Continuous Filament Fiber Glass
65997-17-3
65.74%
Silicon
7440-21-3
92.00%
Aluminum
7429-90-5
1.30%
Titanium
7440-32-6
0.20%
Gold
7440-57-5
6.50%
Aluminum
7429-90-5
99.00%
Silicon
7440-21-3
<1%
Modified Epoxy Resin
29690-82-2
5~25%
Silver
7440-22-4
76~85%
Imidazole
827-43-0
1~4%
1.357
0.029
0.001
0.006
1.881
Amide
461-58-5
1~4%
Silica
60676-86-0
70~90%
Epoxy Resin
29690-82-2
6~16%
Phenolic Resin
9003-35-4
5~15%
Carbon Black
1333-86-4
0.1~1%
Sum(%)
Traces
41.45
0.89
0.03
8%
0.18
88%
88%
57.45
6%
5%
0%
3.274
99%
Comchip Technology CO., LTD.
www.comchiptech.com
TEL: +886-2-86776675
FAX: +886-2-86776672
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