MATERIAL DATA SHEET Material # CDBUR & CDBU series (0603) (Halogen Free) Product Line SOD-523F Date 2014/1/27 Rev. G COMPONENT DETAILS No. 1 2 3 4 5 Construction element FR-4 Board Wafer Al wire Silver paste Molding Compound Material group Material weight (mg) Substrate/ Terminal Diode Conductor Welding Outer Total weight Material CAS if applicable Average mass (%) Copper 7440-50-8 29.34% Nickel 7440-02-0 4.762% Gold 7440-57-5 0.155% Continuous Filament Fiber Glass 65997-17-3 65.74% Silicon 7440-21-3 92.00% Aluminum 7429-90-5 1.30% Titanium 7440-32-6 0.20% Gold 7440-57-5 6.50% Aluminum 7429-90-5 99.00% Silicon 7440-21-3 <1% Modified Epoxy Resin 29690-82-2 5~25% Silver 7440-22-4 76~85% Imidazole 827-43-0 1~4% 1.357 0.029 0.001 0.006 1.881 Amide 461-58-5 1~4% Silica 60676-86-0 70~90% Epoxy Resin 29690-82-2 6~16% Phenolic Resin 9003-35-4 5~15% Carbon Black 1333-86-4 0.1~1% Sum(%) Traces 41.45 0.89 0.03 8% 0.18 88% 88% 57.45 6% 5% 0% 3.274 99% Comchip Technology CO., LTD. www.comchiptech.com TEL: +886-2-86776675 FAX: +886-2-86776672 1/1