- Comchip Technology

MATERIAL DATA SHEET
Material #
CDSQR series(0402) (Halogen Free)
Product Line
SOD-923F
Date
2011/10/5
Rev.
G
COMPONENT DETAILS
No.
1
2
3
4
5
Construction
element
FR-4 Board
Wafer
Al wire
Silver paste
Molding
Compound
Material group
Material weight
(mg)
Substrate/
Terminal
Diode
Conductor
Welding
Outer
Total weight
Comchip Technology CO., LTD.
Material
0.223
0.029
0.001
0.005
0.511
CAS
if applicable
Average mass
(%)
Copper
7440-50-8
43.00%
Nickel
7440-02-0
3.677%
Gold
7440-57-5
0.099%
Lead
7439-92-1
0.002%
Continuous Filament Fiber Glass
65997-17-3
53.22%
Silicon
7440-21-3
90.40%
Aluminum
7429-90-5
0.10%
Gold
7440-57-5
9.50%
Aluminum
7429-90-5
99.00%
Silicon
7440-21-3
1.00%
Modified Epoxy Resin
29690-82-2
5~25%
Silver
7440-22-4
76~85%
Imidazole
827-43-0
1~4%
Amide
461-58-5
1~4%
Silica
60676-86-0
70~90%
Epoxy Resin
29690-82-2
6~16%
Phenolic Resin
9003-35-4
5~15%
Carbon Black
1333-86-4
0.1~1%
0.769
www.comchiptech.com
TE L: +886-2-86776675
FAX: +886-2-86776672
1/1
Sum(%)
29.0%
3.8%
0.1%
0.7%
66.4%
Traces