MATERIAL DATA SHEET SMD Diodes Specialist Material # CPDQR series(0402) (Halogen Free) Product Line SOD-923F Date 2011/8/25 Rev. H COMPONENT DETAILS No. 1 2 3 4 5 Construction element FR-4 Board Wafer Al wire Silver paste Molding Compound Material group Material weight (mg) Substrate/ Terminal Diode Conductor Welding Outer Total weight Comchip Technology CO., LTD. Material CAS if applicable Average mass (%) Copper 7440-50-8 43.00% Nickel 7440-02-0 3.68% Gold 7440-57-5 0.10% Continuous Filament Fiber Glass 65997-17-3 53.22% Silicon 7440-21-3 97.948% Aluminum 7429-90-5 2.00% Titanium 7440-32-6 0.001% Silver 7440-22-4 0.001% SiO2 14808-60-7 0.05% Aluminum 7429-90-5 99.00% Silicon 7440-21-3 1.00% Modified Epoxy Resin 29690-82-2 5~25% Silver 7440-22-4 76~85% Imidazole 827-43-0 1~4% Amide 461-58-5 1~4% Silica 60676-86-0 70~90% Epoxy Resin 129915-35-1 6~16% Phenolic Resin 26834-02-6 5~15% Carbon Black 1333-86-4 0.1~1% 0.223 0.029 0.001 0.005 0.511 29.00% TEL: +886-2-86776675 FAX: +886-2-86776672 3.77% 0.13% 0.65% 66.45% 0.769 www.comchiptech.com Sum(%) 1/1 Traces