ROHM RSB33V

Data Sheet
Bi direction ESD Protection Diode
RSB33V
Applications
ESD Protection
Dimensions (Unit : mm)
Land size figure (Unit : mm)
0.1±0.1
0.05
0.9MIN.
0.8MIN.
1.25±0.1
2.5±0.2
1.7±0.1
2.1
Features
1)Small mold type. (UMD2)
2)High reliability.
3)Bi-directionality.
UMD2
Constructions
Silicon epitaxial planer
0.7±0.2
0.1
0.3±0.05
Structure
ROHM : UMD2
JEDEC : SOD-323
JEITA : SC-901A
dot (year week factory)
Taping dimensions (Unit : mm)
0.3±0.1
φ1.55±0.05
2.0±0.05
4.0±0.1
1.40±0.1
2.8±0.1
2.75
8.0±0.2
3.5±0.05
1.75±0.1
4.0±0.1
φ1.05
1.0±0.1
Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
Power dissipation
Pd
Junction temperature
Tj
Storage temperature
Tstg
Electrical characteristics (Ta=25°C)
Parameter
Symbol
VZ
Zener voltage
Reverse current
Junction capacitance
Limits
200
150
Unit
mW
°C
°C
−55 to +150
Min.
Typ.
Max.
Unit
29.7
-
36.3
V
IZ=1mA
Conditions
IR
-
-
0.1
μA
Ct
-
-
30
pF
VR=25V
VR=0V , f=1MHz
*Zener voltage (Vz)shall be measured at 40ms after loading current.
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© 2011 ROHM Co., Ltd. All rights reserved.
1/4
2011.11 - Rev.A
Data Sheet
RSB33V
10
10
apply voltage
apply voltage
ZENER CURRENT:Iz(mA)
ZENER CURRENT:Iz(mA)
Ta=150°C
1
Ta=150°C
Ta=25°C
Ta=125°C
Ta=−25°C
0.1
1
Ta=125°C
Ta=25°C
0.1
Ta=75°C
Ta=−25°C
Ta=75°C
0.01
0.01
25
30
35
40
45
25
30
1000
45
Ta=150°C
Ta=150°C
100
REVERSE CURRENT:IR (nA)
100
REVERSE CURRENT:IR (nA)
40
1000
apply voltage
10
Ta=125°C
1
0.1
Ta=75°C
0.01
Ta=125°C
10
1
Ta=75°C
0.1
Ta=25°C
apply voltage
0.01
Ta=25°C
0.001
0.001
0
5
10
15
20
25
REVERSE VOLTAGE:VR(V)
VR-IR CHARACTERISTICS(1)
30
0
100
5
10
15
20
REVERSE VOLTAGE:VR(V)
VR-IR CHARACTERISTICS(2)
25
30
100
apply voltage
f=1MHz
apply voltage
f=1MHz
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
35
ZENER VOLTAGE:Vz(V)
Vz-Iz CHARACTERISTICS(2)
ZENER VOLTAGE:Vz(V)
Vz-Iz CHARACTERISTICS(1)
10
1
10
1
0
5
10
15
20
25
0
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© 2011 ROHM Co., Ltd. All rights reserved.
5
10
15
20
25
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS(2)
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS(1)
2/4
2011.11 - Rev.A
Data Sheet
RSB33V
40
10
Ta=25°C
IZ=1mA
n=30pcs
ZENER VOLTAGE:Vz(V)
36
34
32
30
AVE:32.73V
28
AVE:34.52V
26
apply voltage
Ta=25°C
VR=25V
n=30pcs
9
REVERSE CURRENT:IR(nA)
38
apply voltage
8
7
5
4
AVE:1.38nA
3
24
2
22
1
20
0
AVE:0.39nA
IR DISPERSION MAP
Vz DISPERSION MAP
10000
10
9
8
DYNAMIC IMPEDANCE:Zz(Ω)
CAPACITANCE BETWEEN TERMINALS:Ct(pF)
apply voltage
apply voltage
6
Ta=25°C
f=1MHz
VR=0V
n=20pcs
7
6
5
AVE:9.07pF
4
3
apply voltage
AVE:8.86pF
apply voltage
1000
100
apply voltage
2
1
10
0
0.1
1
ZENER CURRENT(mA)
Zz-Iz CHARACTERISTICS(1)
Ct DISPERSION MAP
1000
1000
TRANSIENT
THERMAL IMPEDANCE:Rth(°C/W)
On glass-epoxy substrate
DYNAMIC IMPEDANCE:Zz(Ω)
10
100
10
apply voltage
0.1
1
ZENER CURRENT(mA)
Zz-Iz CHARACTERISTICS(2)
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© 2011 ROHM Co., Ltd. All rights reserved.
100
Rth(j-c)
10
1
0.001
1
10
Rth(j-a)
0.01
0.1
1
10
100
1000
TIME(s)
Rth-t CHARACTERISTICS
3/4
2011.11 - Rev.A
Data Sheet
RSB33V
30
30
No break at 30kV
No break at 30kV
25
AVE:26.5kV
20
15
AVE:6.3kV
10
apply voltage
ELECTROSTATIC
DISCHARGE TEST ESD [kV]
ELECTROSTATIC
DISCHARGE TEST ESD [kV]
25
5
0
20
15
AVE:8.9kV
10
apply voltage
5
C=200pF
R=0Ω
C=150pF
R=330Ω
0
C=100pF
R=1.5kΩ
ESD DISPERSION MAP(1)
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© 2011 ROHM Co., Ltd. All rights reserved.
C=200pF
R=0Ω
C=150pF
R=330Ω
C=100pF
R=1.5kΩ
ESD DISPERSION MAP(2)
4/4
2011.11 - Rev.A
Notice
Notes
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© 2011 ROHM Co., Ltd. All rights reserved.
R1120A