HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns (max.) – Industrial: 5/6ns (max) Pipelined output mode Counter enable and reset features Dual chip enables allow for depth expansion without additional logic Full synchronous operation on both ports – 7.5ns cycle time, 133MHz operation (9.6 Gbps bandwidth) – Fast 4.2ns clock to data out – 1.8ns setup to clock and 0.7ns hold on all control, data, and ◆ ◆ ◆ ◆ ◆ IDT70V3379S address inputs @ 133MHz – Data input, address, byte enable and control registers – Self-timed write allows fast cycle time Separate byte controls for multiplexed bus and bus matching compatibility LVTTL- compatible, single 3.3V (±150mV) power supply for core LVTTL- compatible, selectable 3.3V (±150mV)/2.5V (±125mV) power supply for I/Os and control signals on each port Industrial temperature range (-40°C to +85°C) is available for selected speeds Available in a 128-pin Thin Quad Plastic Flatpack (TQFP) and 208-pin fine pitch Ball Grid Array, and 256-pin Ball Grid Array Functional Block Diagram UBL UB R LB L LBR R/W L R/W R B B WW 0 1 L L CE0L B B WW 1 0 R R CE 0R CE1L CE1R OE L OER Dout0-8_L Dout9-17_L Dout0-8_R Dout9-17_R 32K x 18 MEMORY ARRAY I/O0 L - I/O1 7 L Din_L Din_R I/O0R - I/O17R CLKL CLKR A14L A 0L CNTRSTL ADS L CNTENL Counter/ Address Reg. ADDR_L ADDR_R Counter/ Address Reg. A14R A0R CNTRSTR ADS R CNTENR 4833 tbl 01 APRIL 2001 1 ©2001 Integrated Device Technology, Inc. DSC 4833/8 ,. IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Description: The IDT70V3379 is a high-speed32K x 18 bit synchronous Dual-Port RAM. The memory array utilizes Dual-Port memory cells to allow simultaneous access of any address from both ports. Registers on control, data, and address inputs provide minimal setup and hold times. The timing latitude provided by this approach allows systems to be designed with very short cycle times. With an input data register, the IDT70V3379 has been optimized for applications having unidirectional or bidirectional data flow Industrial and Commercial Temperature Ranges in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70V3379 can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) remains at 3.3V. Pin Configuration(1,2,3,4) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 I/O9L NC VSS NC NC NC A12L A8L NC VDD CLKL CNTENL A4L A0L OPTL NC VSS A NC VSS NC VSS NC A13L A9L NC CE0L VSS ADSL A5L A1L VSS VDDQR I/O8L NC B VDDQL I/O9R VDDQR VDD NC A14L A10L UBL CE1L VSS R/WL A6L A2L VDD I/O8R NC VSS C NC VSS I/O10L NC NC A11L A7L LBL VDD OEL CNTRSTL A3L VDD NC VDDQL I/O7L I/O7R D I/O11L NC VDDQR I/O10R I/O6L NC VSS NC E VDDQL I/O11R NC VSS VSS I/O6R NC VDDQR F NC VSS I/O12L NC NC VDDQL I/O5L NC G VDD NC VDDQR I/O12R VDD NC VSS I/O5R H VDDQL VDD VSS VSS VSS VDD VSS VDDQR J I/O14R VSS I/O13R VSS I/O3R VDDQL I/O4R VSS K NC I/O14L VDDQR I/O13L NC I/O3L VSS I/O4L L VDDQL NC I/O15R VSS VSS NC I/O2R VDDQR M NC VSS NC I/O15L I/O1R VDDQL NC I/O2L N I/O16R I/O16L VDDQR NC NC NC A12R A8R NC VDD CLKR CNTEN R A4R NC I/O1L VSS NC P VSS NC I/O17R NC NC A13R A9R NC CE0R VSS ADSR A5R A1R VSS VDDQL I/O0R VDDQR R NC I/O17L VDDQL VSS NC A14R A10R UBR CE1R VSS R/WR A6R A2R VSS NC VSS NC T VSS NC VDD NC NC A11R A7R LBR VDD OER CNTRSTR A3R A0R VDD OPTR NC I/O0L U 70V3379BF BF-208(5) 208-Pin fpBGA Top View(6) 4833 tbl 02 NOTES: 1. All VDD pins must be connected to 3.3V power supply. 2. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VIH (3.3V), and 2.5V if OPT pin for that port is set to VIL (0V). 3. All VSS pins must be connected to ground supply. 4. Package body is approximately 15mm x 15mm x 1.4mm, with 0.8mm ball pitch. 5. This package code is used to reference the package diagram. 6. This text does not indicate orientation of the actual part-marking. 6.42 2 IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges Pin Configuration(1,2,3,4) (con't.) 70V3379BC BC-256(5) 256-Pin BGA Top View(6) A1 NC B1 NC C1 NC D1 NC E1 A2 NC B2 NC C2 I/O9L D2 I/O9R E2 I/O10R I/O10L F2 F1 I/O11L G1 NC H1 NC J1 NC G2 NC H2 I/O12R J2 A3 NC B3 NC C3 VSS D3 NC E3 NC F3 A4 NC B4 NC C4 NC D4 VDD E4 VDDQL F4 I/O11R VDDQL G3 G4 I/O12L VDDQR H3 NC J3 H4 NC L1 I/O15L M1 K2 NC L2 NC M2 I/O16R I/O16L N1 NC P1 NC R1 NC T1 NC N2 I/O17R P2 I/O17L R2 NC T2 NC K3 J4 K4 I/O14L VDDQL L3 L4 I/O15R VDDQR M3 NC N3 NC P3 NC R3 NC T3 NC A6 A14L A11L B5 NC C5 A13L D5 M4 VDDQR N4 VDD P4 NC R4 NC T4 NC B6 A12L C6 A10L D6 A7 A8L B7 A9L C7 A7L D7 A8 A9 NC CE1L B9 B8 UB L C8 A11 OE L CNTENL B10 B11 CE 0L R/W L CNTRSTL C9 LB L NC D9 D8 A10 C10 C11 CLKL ADS L D10 D11 A12 A5L B12 A4L C12 A6L D12 A13 A2L B13 A1L C13 A3L D13 VDDQL VDDQL VDDQR VDDQR VDDQL VDDQL VDDQR VDDQR VDD E5 VDD F5 VDD G5 VSS H5 VDDQR VSS I/O13L I/O14R I/O13R VDDQL K1 A5 J5 VSS K5 VSS L5 VDD M5 VDD N5 E6 VDD F6 VSS G6 VSS H6 VSS J6 VSS K6 VSS L6 VSS M6 VDD N6 E7 VSS F7 VSS G7 VSS H7 VSS J7 VSS K7 VSS L7 VSS M7 VSS N7 E8 E9 VSS VSS F9 F8 VSS VSS G8 G9 VSS H8 VSS H9 VSS J8 VSS J9 VSS K8 VSS K9 VSS L8 VSS L9 VSS M8 VSS M9 VSS N8 VSS N9 E10 VSS F10 VSS G10 VSS H10 VSS J10 VSS K10 VSS L10 VSS M10 VSS N10 E11 VDD F11 VSS G11 VSS H11 VSS J11 VSS K11 VSS L11 VSS M11 VDD N11 E12 F12 A13R R5 NC T5 A14R P6 A10R R6 A12R T6 A11R P7 A7R R7 A9R T7 A8R P9 P8 NC LB R R9 R8 UB R NC P11 CLKR ADS R R10 R11 CE 0R R/W R CNTRSTR T9 T8 P10 CE1R T10 T11 F13 A0L B14 VDD C14 OPTL D14 NC E14 NC F14 VDD VDDQR I/O6R G12 VSS H12 VSS J12 VSS K12 VSS L12 VDD M12 VDD N12 VDDQR VDDQR VDDQL VDDQL VDDQR VDDQR VDDQL VDDQL P5 E13 VDD VDDQR A14 P12 A6R R12 A4R T12 OE R CNTENR A5R G13 G14 VDDQL I/O5L H13 VDDQL J13 H14 NC J14 A15 A16 NC B16 B15 NC VDDQR L13 K14 NC L14 VDDQL I/O2L M13 M14 VDDQL I/O1R N13 VDD P13 A3R R13 A1R T13 A2R N14 NC P14 NC R14 OPTR T14 A0R NC C16 C15 NC D15 I/O8L D16 NC I/O8R E16 E15 I/O7L F15 I/O7R F16 NC G15 I/O6L G16 NC NC H16 H15 NC I/O5R J16 J15 VDDQR I/O4R I/O3R K13 NC I/O4L K16 K15 NC L15 I/O3L L16 NC I/O2R M16 M15 I/O1L NC N16 N15 I/O0R P15 NC P16 NC I/O0L R16 R15 NC T15 NC , T16 NC NC 4833 drw 02c NOTES: 1. All VDD pins must be connected to 3.3V power supply. 2. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VIH (3.3V), and 2.5V if OPT pin for that port is set to VIL (0V). 3. All VSS pins must be connected to ground supply. 4. Package body is approximately 17mm x 17mm x 1.4mm, with 1.0mm ball-pitch. 5. This package code is used to reference the package diagram. 6. This text does not indicate orientation of the actual part-marking. 6.42 3 , IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges VDDQL VSS IO10L IO10R VDDQR VSS IO11L IO11R IO12L IO12R VDD VDD VSS VSS IO13R IO13L IO14R IO14L IO15R IO15L VDDQL VSS IO16R IO16L VDDQR VSS IO17R IO17L NC NC NC A14R 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 70V3379PRF PK-128(5) 128-Pin TQFP Top View(6) 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 A14L NC VSS NC IO9L IO9R 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 A13L A12L A11L A10L A9L A8L A7L UB L LB L CE1L CE 0L VDD VDD VSS VSS CLKL OE L R/W L ADSL CNTEN L CNTRST L A6L A5L A4L A3L A2L Pin Configuration(1,2,3,4) (con't.) A1L A0L OPTL NC (VSS)(7) IO8L IO8R NC (VSS)(7) VSS VDDQL IO7L IO7R VSS VDDQR IO6L IO6R IO5L IO5R VDD VDD VSS VSS IO4R IO4L IO3R IO3L IO2R IO2L VSS VDDQL IO1R IO1L VSS VDDQR IO0R IO0L OPTR A0R A1R A13R A12R A11R A10R A9R A8R A7R UBR LBR CE1R CE0R VDD VDD VSS VSS CLKR OER R/W R ADSR CNTEN R CNTRSTR A6R A5R A4R A3R A2R . 4833 drw 02a NOTES: 1. All VDD pins must be connected to 3.3V power supply. 2. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VIH (3.3V), and 2.5V if OPT pin for that port is set to VIL (0V). 3. All VSS pins must be connected to ground supply. 4. Package body is approximately 14mm x 20mm x 1.4mm. 5. This package code is used to reference the package diagram. 6. This text does not indicate orientation of the actual part-marking. 7. In the 70V3379 (32K x 18) and 70V3389 (64K x 18), pins 96 and 99 are NC. The upgrade devices 70V3399 (128K x 18) and 70V3319 (256K x 18) assign these pins as Vss. Customers who plan to take advantage of the upgrade path should treat these pins as VSS on the 70V3379 and 70V3389. If no upgrade is needed, the pins can be treated as NC. 6.42 4 IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges Pin Names Left Port Right Port Names CE0L, CE1L CE0R , CE1R Chip Enables R/WL R/WR Read/Write Enable OEL OER Output Enable A0L - A14L A0R - A14R Address I/O0L - I/O17L I/O0R - I/O17R Data Input/Output CLKL CLKR Clock ADSL ADSR Address Strobe Enable CNTENL CNTENR Counter Enable CNTRSTL CNTRSTR Counter Reset UBL - LBL UBR - LBR Byte Enables (9-bit bytes) VDDQL VDDQR Power (I/O Bus) (3.3V or 2.5V)(1) OPTL OPTR Option for selecting VDDQX(1,2) VDD Power (3.3V)(1) VSS Ground (0V) NOTES: 1. VDD, OPTX, and VDDQX must be set to appropriate operating levels prior to applying inputs on the I/Os and controls for that port. 2. OPTX selects the operating voltage levels for the I/Os and controls on that port. If OPTX is set to VIH (3.3V), then that port's I/Os and controls will operate at 3.3V levels and VDDQX must be supplied at 3.3V. If OPTX is set to VIL (0V), then that port's I/Os and controls will operate at 2.5V levels and VDDQX must be supplied at 2.5V. The OPT pins are independent of one another—both ports can operate at 3.3V levels, both can operate at 2.5V levels, or either can operate at 3.3V with the other at 2.5V. 4833 tbl 01 Truth Table IRead/Write and Enable Control(1,2,3) OE CLK CE0 CE1 UB LB R/W Upper Byte I/O9-18 Lower Byte I/O0-8 X ↑ L H H H X High-Z High-Z X ↑ L H H L L High-Z DIN Write to Lower Byte Only X ↑ L H L H L DIN High-Z Write to Upper Byte Only X ↑ L H L L L DIN DIN L ↑ L H H L H High-Z DOUT Read Lower Byte Only L ↑ L H L H H DOUT High-Z Read Upper Byte Only L ↑ L H L L H DOUT DOUT Read Both Bytes H ↑ L H L L X High-Z High-Z Outputs Disabled MODE All Bytes Deselected Write to Both Bytes 4833 tbl 02 NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. ADS, CNTEN, CNTRST = VIH. 3. OE is an asynchronous input signal. 6.42 5 IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges Truth Table IIAddress Counter Control(1,2) Address X Previous Address X Addr Used CLK(6) 0 ↑ ADS CNTEN X CNTRST I/O(3) MODE X (4) L DI/O (0) Counter Reset to Address 0 An X An ↑ L X H DI/O (n) External Address Used An Ap Ap ↑ H H H DI/O (p) External Address Blocked—Counter disabled (Ap reused) X Ap Ap + 1 ↑ H L(5) H DI/O (p+1) (4) Counter Enabled—Internal Address generation 4833 tbl 03 NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. Read and write operations are controlled by the appropriate setting of R/W, CE0, CE1, BEn and OE. 3. Outputs are in Pipelined mode: the data out will be delayed by one cycle. 4. ADS and CNTRST are independent of all other memory control signals including CE0, CE 1 and BEn 5. The address counter advances if CNTEN = VIL on the rising edge of CLK, regardless of all other memory control signals including CE0, CE1, BEn. Recommended Operating Temperature and Supply Voltage(1,2) Symbol Parameter Min. Typ. Max. Unit Ambient Temperature GND VDD VDD Core Supply Voltage 3.15 3.3 3.45 V 0OC to +70OC 0V 3.3V + 150mV VDDQ I/O Supply Voltage (3) 2.375 2.5 2.625 V -40OC to +85OC 0V 3.3V + 150mV VSS Ground 0 0 0 Grade Commercial Industrial Recommended DC Operating Conditions with VDDQ at 2.5V 4833 tbl 04 NOTES: 1. Industrial temperature: for specific speeds, packages and powers contact your sales office. 2. This is the parameter TA. This is the "instant on" case tempereature. V (2) VIH Input High Voltage (3) (Address & Control Inputs) 1.7 ____ V DDQ + 125mV VIH Input High Voltage - I/O(3) 1.7 ____ V DDQ + 125mV (2) V VIL Input Low Voltage -0.3(1) ____ 0.7 V V 4833 tb l 05a NOTES: 1. VIL > -1.5V for pulse width less than 10 ns. 2. VTERM must not exceed VDDQ + 125mV. 3. To select operation at 2.5V levels on the I/Os and controls of a given port, the OPT pin for that port must be set to VIL (0V), and V DDQX for that port must be supplied as indicated above. Absolute Maximum Ratings(1) Symbol VTERM(2) TBIAS TSTG IOUT Rating Commercial & Industrial Unit Terminal Voltage with Respect to GND -0.5 to +4.6 V Temperature Under Bias -55 to +125 Storage Temperature -65 to +150 DC Output Current Recommended DC Operating Conditions with VDDQ at 3.3V o C Symbol 50 o C mA 4833 tbl 06 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VTERM must not exceed VDD + 150mV for more than 25% of the cycle time or 4ns maximum, and is limited to < 20mA for the period of VTERM > VDD + 150mV. 6.42 6 Parameter Min. Typ. Max. Unit VDD Core Supply Voltage 3.15 3.3 3.45 V VDDQ I/O Supply Voltage (3) 3.15 3.3 3.45 V VSS Ground 0 0 0 (2) VDDQ + 150mV V V VIH Input High Voltage (Address & Control Inputs)(3) 2.0 ____ VIH Input High Voltage - I/O(3) 2.0 ____ VDDQ + 150mV(2) V ____ 0.8 V VIL Input Low Voltage (1) -0.3 4833 tbl 05b NOTES: 1. VIL > -1.5V for pulse width less than 10 ns. 2. VTERM must not exceed VDDQ + 150mV. 3. To select operation at 3.3V levels on the I/Os and controls of a given port, the OPT pin for that port must be set to VIH (3.3V), and VDDQX for that port must be supplied as indicated above. IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges Capacitance(1) (TA = +25°C, F = 1.0MHZ) TQFP ONLY Symbol CIN Parameter Input Capacitance (3) COUT Output Capacitance Conditions(2) Max. Unit VIN = 3dV 8 pF VOUT = 3dV 10.5 pF 4833 tbl 07 NOTES: 1. These parameters are determined by device characterization, but are not production tested. 2. 3dV references the interpolated capacitance when the input and output switch from 0V to 3V or from 3V to 0V. 3. COUT also references CI/O. DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VDD = 3.3V ± 150mV) 70V3379S Symbol |ILI| Parameter Test Conditions Min. Max. Unit Input Leakage Current(1) VDDQ = Max., VIN = 0V to V DDQ ___ 10 µA Output Leakage Current CE0 = VIH or CE1 = VIL, VOUT = 0V to V DDQ ___ 10 µA (2) IOL = +4mA, VDDQ = Min. ___ 0.4 V VOH (3.3V) Output High Voltage (2) IOH = -4mA, VDDQ = Min. 2.4 ___ V VOL (2.5V) Output Low Voltage (2) IOL = +2mA, VDDQ = Min. ___ 0.4 V VOH (2.5V) (2) 2.0 ___ |ILO| VOL (3.3V) Output Low Voltage Output High Voltage IOH = -2mA, VDDQ = Min. V 4833 tbl 08 NOTE: 1. At VDD < - 2.0V input leakages are undefined. 2. VDDQ is selectable (3.3V/2.5V) via OPT pins. Refer to p.4 for details. 6.42 7 IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(3) (VDD = 3.3V ± 150mV) 70V3379S4 Com 'l Only Sym bol IDD ISB1 ISB2 ISB3 ISB4 Param eter Test Condition Version 70V3379S5 Com 'l & Ind 70V3379S6 Com 'l & Ind Typ. (4) Max. Typ. (4) Max. Typ. (4) Max. Unit mA Dynam ic Ope rating Current (Bo th P orts A ctive ) +-L and +-R= V IL , Outputs Disab led , f = fMAX (1) COM 'L S 375 460 285 360 245 310 IND S ____ ____ 285 415 245 360 S tand by Current (Bo th P orts - TTL Le ve l Inp uts ) +-L = +-R = V IH COM 'L S 145 190 105 145 95 125 IND S ____ ____ 105 175 95 150 S tand by Current (One Po rt - TTL Le ve l Inp uts ) +-"A" = V IL and +-"B" = V IH (5) COM 'L S 265 325 190 260 175 225 A ctiv e P ort Outp uts Dis ab le d, f= fMAX(1) IND S ____ ____ 190 300 175 260 Full S tandb y Current (B oth P orts - CM OS Le ve l Inp uts ) B oth P orts +-L and +-R > V DD - 0.2V, V IN > V DD - 0.2V o r V IN < 0.2V , f = 0 (2) COM 'L S 6 15 6 15 6 15 IND S ____ ____ 6 30 6 30 Full S tandb y Current (One Po rt - CM OS Le ve l Inp uts ) +-"A" < 0.2V and +-"B" > V DD - 0.2V (5) COM 'L S 265 325 180 260 170 225 V IN > V DD - 0.2V or V IN < 0.2V, Ac tive IND P ort, Outp uts Disable d , f = f MAX(1) S ____ ____ 180 300 170 260 mA f = fMAX (1) mA mA mA 4833 tbl 09 NOTES: 1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC , using "AC TEST CONDITIONS" at input levels of GND to 3V. 2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby. 3. Port "A" may be either left or right port. Port "B" is the opposite from port "A". 4. VDD = 3.3V, TA = 25°C for Typ, and are not production tested. IDD DC (f=0) = 120mA (Typ). 5. CEX = V IL means CE 0X = V IL and CE1X = VIH CEX = VIH means CE0X = VIH or CE1X = VIL CEX < 0.2V means CE0X < 0.2V and CE1X > VCC - 0.2V CEX > VCC - 0.2V means CE0X > VCC - 0.2V or CE1X - 0.2V "X" represents "L" for left port or "R" for right port. 6.42 8 IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges AC Test Conditions 2.5V Input Pulse Levels (Address & Controls) GND to 3.0V/GND to 2.35V Input Pulse Levels (I/Os) GND to 3.0V/GND to 2.35V Input Rise/Fall Times 833Ω 3ns Input Timing Reference Levels 1.5V/1.25V Output Reference Levels DATAOUT 1.5V/1.25V Output Load 5pF* 770Ω Figures 1, 2, and 3 4833 tbl 10 , 3.3V 50Ω 50Ω DATAOUT 1.5V/1.25 10pF (Tester) 590Ω , DATAOUT 4833 drw 03 435Ω 5pF* Figure 1. AC Output Test load. 4833 drw 04 Figure 2. Output Test Load (For tCKLZ , tCKHZ, tOLZ, and tOHZ). *Including scope and jig. 10.5pF is the I/O capacitance of this device, and 10pF is the AC Test Load Capacitance. 7 6 5 4 ∆tCD (Typical, ns) 3 2 1 • 20.5 • 30 • • 50 80 100 200 -1 Capacitance (pF) 4833 drw 05 · Figure 3. Typical Output Derating (Lumped Capacitive Load). 6.42 9 , IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges AC Electrical Characteristics Over the Operating Temperature Range (Read and Write Cycle Timing)(1,2) (VDD = 3.3V ± 150mV, TA = 0°C to +70°C) 70V3379S4 Com'l Only Symbol tCYC2 tCH2 tCL2 Parameter Clock Cycle Time (Pipelined) Clock High Time (Pipelined) Clock Low Time (Pipelined) Min. Max. 7.5 ____ 3 ____ 3 ____ 70V3379S5 Com'l & Ind 70V3379S6 Com'l & Ind Min. Max. 10 ____ Min. Max. Unit 12 ____ 4 ____ ns 5 ____ 4 ____ ns 5 ____ 3 ____ ns 3 ____ 3 ns tR Clock Rise Time ____ tF Clock Fall Time ____ 3 ____ 3 ____ 3 ns tSA Address Setup Time 1.8 ____ 2.0 ____ 2.0 ____ ns tHA Address Hold Time 0.7 ____ 0.7 ____ 1.0 ____ ns tSC Chip Enable Setup Time 1.8 ____ 2.0 ____ 2.0 ____ ns 0.7 ____ 0.7 ____ 1.0 ____ ns 1.8 ____ 2.0 ____ 2.0 ____ ns 0.7 ____ 1.0 ____ ns tHC tSB Chip Enable Hold Time Byte Enable Setup Time tHB Byte Enable Hold Time 0.7 ____ tSW R/ W Setup Time 1.8 ____ 2.0 ____ 2.0 ____ ns tHW R/ W Hold Time 0.7 ____ 0.7 ____ 1.0 ____ ns tSD Input Data Setup Time 1.8 ____ 2.0 ____ 2.0 ____ ns tHD Input Data Hold Time 0.7 ____ 0.7 ____ 1.0 ____ ns tSAD ADS Setup Time 1.8 ____ 2.0 ____ 2.0 ____ ns tHAD ADS Hold Time 0.7 ____ 0.7 ____ 1.0 ____ ns tSCN CNTEN Setup Time 1.8 ____ 2.0 ____ 2.0 ____ ns tHCN CNTEN Hold Time 0.7 ____ 0.7 ____ 1.0 ____ ns tSRST CNTRST Setup Time 1.8 ____ 2.0 ____ 2.0 ____ ns tHRST CNTRST Hold Time 0.7 ____ 0.7 ____ 1.0 ____ ns Output Enable to Data Valid ____ 4 ____ 5 ____ 6 ns tOE (1) tOLZ Output Enable to Output Low-Z 0 ____ 0 ____ 0 ____ ns tOHZ Output Enable to Output High-Z 1 4 1 4.5 1 5 ns tCD2 Clock to Data Valid (Pipelined) ____ 4.2 ____ 5 ____ 6 ns ____ 1 ____ 1 ____ ns tDC Data Output Hold After Clock High 1 tCKHZ Clock High to Output High-Z 1 3 1 4.5 1.5 6 ns 1 ____ 1 ____ 1 ____ ns 6 ____ 8 ____ 10 ____ ns tCKLZ Clock High to Output Low-Z Port-to-Port Delay tCO Clock-to-Clock Offset NOTES: 1. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE). 2. These values are valid for either level of VDDQ (3.3V/2.5V). See page 4 for details on selecting the desired I/O voltage levels for each port. 6.42 10 4833 tbl 11 IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Read Cycle for Pipelined Operation(2) tCYC2 tCH2 tCL2 CLK CE0 tSC tSC tHC CE1 tSB tHB tSB UB , LB (0-3) tHB (5) R/W (4) ADDRESS tSW tHW tSA tHA An An + 1 (1 Latency) An + 2 An + 3 tDC tCD2 DATAOUT Qn tCKLZ OE tHC (3) Qn + 1 Qn + 2 (5) (1) tOHZ tOLZ (1) tOE NOTES: 4833 drw 06 1. OE is asynchronously controlled; all other inputs are synchronous to the rising clock edge. 2. ADS = VIL, CNTEN and CNTRST = VIH. 3. The output is disabled (High-Impedance state) by CE0 = VIH, CE1 = VIL, UB, LB = VIH following the next rising edge of the clock. Refer to Truth Table 1. 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. If UB or LB was HIGH, then the appropriate Byte of DATA OUT for Qn + 2 would be disabled (High-Impedance state). Timing Waveform of a Multi-Device Pipelined Read(1,2) tCH2 tCYC2 tCL2 CLK tSA ADDRESS(B1) CE 0(B1) tHA A0 tSC tHC tSC tHC tCD2 tCD2 Q0 DATAOUT(B1) tCKHZ A1 tSC tCKHZ A6 A5 A4 A3 A2 tSC CE 0(B2) Q3 tCKLZ tDC tHA A0 ADDRESS(B2) tCD2 Q1 tDC tSA A6 A5 A4 A3 A2 A1 tHC tHC tCD2 DATAOUT(B2) tCKHZ tCD2 Q4 Q2 tCKLZ NOTES: 1. B1 Represents Device #1; B2 Represents Device #2. Each Device consists of one IDT70V3379 for this waveform, and are setup for depth expansion in this example. ADDRESS(B1) = ADDRESS(B2) in this situation. 2. UB, LB, OE, and ADS = VIL; CE1(B1) , CE1(B2), R/W, CNTEN, and CNTRST = VIH. 6.42 11 tCKLZ 4833 drw 07 IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Left Port Write to Pipelined Right Port Read(1,2) CLKL tSW tHW tSA tHA R/W L ADDRESSL NO MATCH MATCH tSD DATAINL tHD VALID tCO(3) CLKR tCD2 R/WR ADDRESSR tSW tHW tSA tHA NO MATCH MATCH DATAOUTR VALID tDC 4833 drw 08 NOTES: 1. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = V IH. 2. OE = VIL for the Right Port, which is being read from. OE = V IH for the Left Port, which is being written to. 3. If tCO < minimum specified, then data from right port read is not valid until following right port clock cycle (ie, time from write to valid read on opposite port will be tCO + 2 tCYC2 + tCD2 ). If tCO > minimum, then data from right port read is available on first right port clock cycle (ie, time from write to valid read on opposite port will be tCO + tCYC + tCD2 ). Timing Waveform of Pipelined Read-to-Write-to-Read (OE = VIL)(2) tCYC2 tCH2 tCL2 CLK CE0 tSC tHC tSB tHB CE1 UB, LB tSW tHW R/W tSW tHW (3) ADDRESS An tSA tHA An +1 An + 2 An + 3 An + 2 An + 4 tSD tHD DATAIN Dn + 2 tCD2 (1) tCKHZ tCKLZ tCD2 Qn + 3 Qn DATAOUT READ NOP (4) WRITE READ 4833 drw 09 NOTES: 1. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 2. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. "NOP" is "No Operation". 3. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 4. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity. 6.42 12 IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Pipelined Read-to-Write-to-Read ( OE Controlled)(2) tCH2 tCYC2 tCL2 CLK CE 0 tSC tHC tSB tHB CE1 UB , LB tSW tHW R/W tSW tHW (3) ADDRESS An tSA tHA An +1 An + 2 tSD DATAIN Dn + 2 tCD2 (1) Qn DATAOUT An + 4 An + 3 An + 5 tHD Dn + 3 tCKLZ tCD2 Qn + 4 (4) tOHZ OE READ WRITE READ 4833 drw 10 NOTES: 1. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 2. CE 0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH . 3. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 4. This timing does not meet requirements for fastest speed grade. This waveform indicates how logically it could be done if timing so allows. Timing Waveform of Pipelined Read with Address Counter Advance(1) tCH2 tCYC2 tCL2 CLK tSA ADDRESS tHA An tSAD tHAD ADS tSAD tHAD CNTEN tSCN tHCN tCD2 DATAOUT Qx - 1(2) Qn + 2(2) Qn + 1 Qn Qx Qn + 3 tDC READ EXTERNAL ADDRESS READ WITH COUNTER COUNTER HOLD READ WITH COUNTER 4833 drw 11 NOTES: 1. CE0, OE, UB, LB = VIL; CE1, R/W, and CNTRST = VIH. 2. If there is no address change via ADS = V IL (loading a new address) or CNTEN = VIL (advancing the address), i.e. ADS = VIH and CNTEN = VIH, then the data output remains constant for subsequent clocks. 6.42 13 IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Write with Address Counter Advance(1) tCH2 tCYC2 tCL2 CLK tSA tHA An ADDRESS INTERNAL(3) ADDRESS An(7) An + 2 An + 1 An + 4 An + 3 tSAD tHAD ADS tSCN tHCN CNTEN tSD tHD Dn + 1 Dn DATAIN WRITE EXTERNAL ADDRESS Dn + 1 Dn + 4 Dn + 3 Dn + 2 WRITE WRITE WITH COUNTER COUNTER HOLD WRITE WITH COUNTER 4833 drw 12 Timing Waveform of Counter Reset(2) tCH2 tCYC2 tCL2 CLK tSA tHA (4) An ADDRESS INTERNAL(3) ADDRESS Ax 0 1 An + 2 An + 1 An An + 1 tSW tHW R/W ADS tSAD tHAD CNTEN tSCN tHCN tSRST tHRST CNTRST tSD tHD D0 DATAIN (5) Q1 Q0 DATAOUT (6) COUNTER RESET WRITE ADDRESS 0 READ ADDRESS 0 READ ADDRESS 1 READ ADDRESS n Qn READ ADDRESS n+1 NOTES: 4833 drw 13 1. CE0, UB, LB, and R/W = VIL; CE1 and CNTRST = VIH. 2. CE0, UB, LB = V IL; CE1 = VIH. 3. The "Internal Address" is equal to the "External Address" when ADS = VIL and equals the counter output when ADS = VIH. 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 6. No dead cycle exists during counter reset. A READ or WRITE cycle may be coincidental with the counter reset cycle: ADDR 0 will be accessed. Extra cycles are shown here simply for clarification. 7. CNTEN = VIL advances Internal Address from ‘An’ to ‘An +1’. The transition shown indicates the time required for the counter to advance. The ‘An +1’Address is written to during this cycle. 6.42 14 IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges Functional Description Depth and Width Expansion The IDT70V3379 provides a true synchronous Dual-Port Static RAM interface. Registered inputs provide minimal set-up and hold times on address, data, and all critical control inputs. All internal registers are clocked on the rising edge of the clock signal, however, the self-timed internal write pulse is independent of the LOW to HIGH transition of the clock signal. An asynchronous output enable is provided to ease asynchronous bus interfacing. Counter enable inputs are also provided to stall the operation of the address counters for fast interleaved memory applications. A HIGH on CE0 or a LOW on CE1 for one clock cycle will power down the internal circuitry to reduce static power consumption. Multiple chip enables allow easier banking of multiple IDT70V3379s for depth expansion configurations. Two cycles are required with CE0 LOW and CE1 HIGH to re-activate the outputs. The IDT70V3379 features dual chip enables (refer to Truth Table I) in order to facilitate rapid and simple depth expansion with no requirements for external logic. Figure 4 illustrates how to control the various chip enables in order to expand two devices in depth. The IDT70V3379 can also be used in applications requiring expanded width, as indicated in Figure 4. Through combining the control signals, the devices can be grouped as necessary to accommodate applications needing 36-bits or wider. A15 CE 0 IDT70V3379 CE1 CE1 CE1 VDD IDT70V3379 VDD CE1 CE0 CE 0 Control Inputs CE 0 Control Inputs Control Inputs IDT70V3379 IDT70V3379 Control Inputs 4833 drw 14 Figure 4. Depth and Width Expansion with IDT70V3379 6.42 15 UB , LB R/W, OE , CLK, ADS, CNTRST, CNTEN . IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges Ordering Information IDT XXXXX A 99 A A Device Type Power Speed Package Process/ Temperature Range Blank I Commercial (0°C to +70°C) Industrial (-40°C to +85°C) BF PRF BC 208-pin fpBGA (BF-208) 128-pin TQFP (PK-128) 256-pin BGA (BC-256) 4 5 6 Commercial Only Commercial & Industrial Commercial & Industrial S Standard Power Speed in nanoseconds 70V3379 576K (32K x 18-Bit) Synchronous Dual-Port RAM 4833 drw 15A 6.42 16 IDT70V3379S High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM Industrial and Commercial Temperature Ranges Datasheet Document History 1/18/98: 3/15/99: 4/28/99: 6/8/99: 6/11/99: 7/14/99: 8/4/99: 10/4/99: 11/12/99: 2/28/00: 5/1/00: 6/7/00: 1/10/01: 4/10/01: Initial Public Release Page 10 Additional Notes Added fpBGA package Page 2 Changed package body height from 1.5mm to 1.4mm Page 5 Deleted note 6 for Table II Page 2 Corrected pin to T3 to VDDQL Page 6 Improved power numbers Upgraded speed to 133MHz, added 2.5V I/O capability Replaced IDT logo Added new BGA package, added full 2.5V interface capability Page 2 Added ball pitch Page 3 Renamed pins Page 6 Made corrections to Truth Table Page 9 Changed Ω numbers in figure 2 Page 4 Added information to pin and pin notes Page 6 Increated storage temperature parameter Clarified TA Parameter Page 8 DC Electrical parameters–changed wording from "open" to "disabled" Removed note 7 on DC Electrical Characteristics table Page 1 Changed 64K to 32K in block drawing Removed Preliminary status Added Industrial Temperature Ranges and removed related notes CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054 for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 www.idt.com The IDT logo is a registered trademark of Integrated Device Technology, Inc. 6.42 17 for Tech Support: 831-754-4613 [email protected]