MC-E Soldering & Handling

CLD-AP21 Rev 5F
soldering & handling
Cree® XLamp® MC-E LEDs
Introduction
Table of Contents
This application note applies to XLamp® MC-E LEDs, which
Handling XLamp® MC-E LEDs...................................................2
have order codes in the following fomat:
Circuit Board Preparation & Layouts.........................................3
Case Temperature (Ts) Measurement Point.............................4
MCxxxx-xx-xxxx-xxxxxx
This application note explains how XLamp MC-E LEDs and
assemblies containing XLamp MC-E LEDs should be handled
during manufacturing. Please read the entire document to
understand how to properly handle XLamp MC-E LEDs.
Notes on Soldering XLamp® MC-E LEDs..................................4
Low Temperature Operation......................................................5
XLamp® MC-E LED Reflow Soldering Characteristics..............6
Moisture Sensitivity...................................................................7
Chemicals & Conformal Coatings.............................................8
Assembly Storage & Handling...................................................9
Tape and Reel.......................................................................... 10
www.cree.com/Xlamp
Packaging & Labels................................................................ 11
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective
owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty
information, please contact Cree Sales at [email protected].
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1
XLamp ® MC-E LED Soldering & Handling
Handling XLamp® MC-E LEDs
Cree recommends the following at all times when handling XLamp MC-E LEDs or assemblies containing XLamp MC-E LEDs:
•
Avoid putting mechanical stress on the LED lens.
•
Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect
the optical performance of the LED.
•
Cree recommends always handling MC-E LEDs with appropriate ESD grounding.
•
Cree recommends handling MC-E LEDs wearing clean, lint‑free gloves.
Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp MC-E LEDs from the factory tape & reel packaging.
Pick & Place Nozzle
For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles be constructed of
non-metallic materials. Cree and several of Cree’s customers have had good success using nozzles fabricated from Teflon or from 90d
urethane.
Cree recommends the pickup tool shown below for XLamp MC-E LEDs.
All dimensions in mm
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
2
XLamp ® MC-E LED Soldering & Handling
Handling XLamp® MC-E LEDs - Continued
6
5
4
3
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE INC.
Manual Handling
Use tweezers to grab XLamp MC-E LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do not
push on the lens.
4.48±.20
D
1.45
P
.80
TYP.
+.13
.75 -.03
.05±.05
X
1
HEATSINK
2
3
4
WRONG
CORRECT
2.60
A
+.2
9.0
.0
D2 D3
7.50
D1 D4
R3.18
C
8
7
6
.25
5.40
Circuit Board Preparation
& Layouts
5
1.50 BSC
PITCH
7.00
.10
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or
soldering XLamp MC-E LEDs onto the PCB.
The diagrams below show the recommended PCB solder pad layout and stencil pattern for XLamp MC-E LEDs.
All dimensions in mm.
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
5.60
1.16
1.00 TYP.
1.16
1
8
NEGATIVE (-) 1
B
D1
1
D2
2
POSITIVE (+) 1
D5
2.00
3.85
7
NEGATIVE (-) 2
4
3.85
POSITIVE (+) 2
D6
2.84
7.70 10.02
6
NEGATIVE (-) 3
D3
1.24
3
7.7
10.02
POSITIVE (+) 3
D7
2.75
1.30
5
NEGATIVE (-) 4
2.75
D4
4
POSITIVE (+) 4
D8
A
1.50 BSC
PITCH
1.5
RECOMMENDED
PCBPCB
SOLDER
PADPad
Recommended
Solder
1.
2.
Tolerances: .10
Solder mask windows must be .05 mm bigger
than PCB Solder Pad.
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
.X ± 0.3
.XX ± .13
Recommended Stencil Pattern
(Shaded Area is Open)
THIRD ANGLE PROJECTION
X°
X°
6
± 1°
FOR SHEET METAL PARTS ONLY
.X ± .25
.XX ± .10
5
4
3
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
3
± 2°
XLamp ® MC-E LED Soldering & Handling
Case Temperature (Ts) Measurement Point
XLamp MC-E LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This
measurement point is shown in the picture below.
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp MC-E LED itself. In testing, Cree has found such
a solder pad to have insignificant impact on the resulting Ts measurement.
Notes on Soldering XLamp® MC-E LEDs
XLamp MC-E LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the PCB on
a hotplate and following the reflow soldering profile listed on the previous page.
Do not wave solder XLamp MC-E LEDs. Do not hand solder XLamp MC-E LEDs.
P
CORRECT
X
WRONG
P
CORRECT
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
4
XLamp ® MC-E LED Soldering & Handling
Notes on Soldering XLamp® MC-E LEDs (continued)
Solder Paste Type
Cree strongly recommends using “no clean” solder paste with XLamp MC-E LEDs so that cleaning the PCB after reflow soldering is not
required. Cree uses Kester® R276 solder paste internally.
Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
Solder Paste Thickness
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated
dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil
(102-μm) bond line, i.e., the solder joint thickness after reflow soldering.
P
CORRECT
X
WRONG
After Soldering
After soldering, allow XLamp MC-E LEDs to return to room temperature before subsequent handling. Premature handling of the device,
especially around the lens, could result in damage to the LED.
Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After
shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder
areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning PCBs After Soldering
Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary,
Cree recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
Low Temperature Operation
The minimum operating temperature of these XLamp LED components is -40 °C. To maximize lifetime, Cree recommends avoiding
applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 °C.
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
5
XLamp ® MC-E LED Soldering & Handling
XLamp® MC-E LED Reflow Soldering Characteristics
In testing, Cree has found XLamp MC-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
IPC/JEDEC J-STD-020C
Time
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Free Solder
1.2 °C/second
Preheat: Temperature Min (Tsmin)
120 °C
Preheat: Temperature Max (Tsmax)
170 °C
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
1 - 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
6
XLamp ® MC-E LED Soldering & Handling
Moisture Sensitivity
Cree recommends keeping XLamp MC-E LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp MC-E LEDs should be handled and stored as MSL 4 per JEDEC J-STD-033, meaning they have limited
exposure time before damage to the LED may occur during the soldering operation. The table on the right specifies the maximum exposure
time in days depending on temperature and humidity conditions. LEDs with exposure time longer than the specified maximums must be
baked according to the baking conditions listed below.
Baking Conditions
It is not necessary to bake all XLamp MC-E LEDs. Only the LEDs that meet all of the following criteria must be baked:
1. LEDs that have been removed from the original MBP.
2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
3. LEDs that have not been soldered.
Baking Procedure
Baking the LEDs will remove moisture from the package and reset the exposure time, as defined in the Moisture Sensitivity section above.
Cree recommends baking any LEDs that may have been exposed to excessive moisture.
1. Remove LEDs or reel of LEDs from MBP.
2. LEDs may be baked on the original reels.
3. Bake LEDs or reel of LEDs at 80ºC for 24 hours.
4. Reflow solder the parts within one hour of baking or immediately store the parts in a container with < 10% RH.
IMPORTANT: Do not bake reels of LEDs at temperatures higher than 80 ºC.
Storage Conditions
XLamp MC-E LEDs that have been removed from the original MBP but not soldered should be stored in one of the following ways:
•
Store the parts in a rigid metal container with a tight-fitting lid. Place fresh dessicant and an RH (relative humidity) indicator in the
container to verify the temperature is 25 ± 5 °C and the RH is no greater than 10%.
•
Store the parts in a dry, nitrogen-purged cabinet or container that actively maintains the temperature at 25 ± 5 °C and the RH at no
greater than 10%.
•
For short-term storage only: LEDs can be resealed in the original MBP soon after opening. Fresh dessicant may be needed. Use the
included humidity indicator card to verify < 20% RH.
If an environment of < 10% RH is not available for storage, XLamp MC-E LEDs should be baked (described above) one hour before reflow
soldering.
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
7
XLamp ® MC-E LED Soldering & Handling
Chemicals & Conformal Coatings
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and
current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application
Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of
chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer.
Recommended Cleaning Solutions
Cree has found the following chemicals to be safe to use with XLamp MC-E LEDs.
•
Water
•
Isopropyl alcohol (IPA)
Chemicals Tested as Harmful
In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to
XLamp MC-E LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp MC-E LEDs. The fumes
from even small amounts of the chemicals may damage the LEDs.
•
Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
•
Methyl acetate or ethyl acetate (i.e., nail polish remover)
•
Cyanoacrylates (i.e., “Superglue”)
•
Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether)
•
Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive)
Hermetically Sealing Luminaires
For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment
that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically
sealing LEDs in an enclosed space is not recommended.
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
8
XLamp ® MC-E LED Soldering & Handling
Assembly Storage & Handling
Do not stack PCBs or assemblies containing XLamp MC-E LEDs so that anything rests on the LED lens. Force applied to the LED lens may
result in the lens being knocked off. PCBs or assemblies containing XLamp MC-E LEDs should be stacked in a way to allow at least 1-cm
clearance above the LED lens.
Do not use bubble wrap directly on top of XLamp MC-E LEDs. Force from the bubble wrap can potentially damage the LED.
P
P
CORRECT
CORRECT
X
X
WRONG
WRONG
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
9
XLamp ® MC-E LED Soldering & Handling
Tape and Reel
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm.
4.0±.1
1.5±.1
12.0±.1
1.75±.10
5.5±.1
Cathode Side
+.3
16.0
.0
Anode Side
(denoted by chamfer)
User Feed Direction
END
START
Loaded Pockets
(200 Lamps)
Trailer
160mm (min) of
empty pockets
sealed with tape
(13 pockets min.)
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(34 empty pockets min.)
User Feed Direction
Cover Tape
Pocket Tape
13mm
7"
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
10
XLamp ® MC-E LED Soldering & Handling
Packaging & Labels
The diagrams below show the packaging and labels Cree uses to ship XLamp MC-E LEDs. XLamp MC-E LEDs are shipped in tape loaded
on a reel. Each box contains only one reel in a moisture barrier bag.
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin Code,
Quantity, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Dessicant
(inside bag)
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Quantity, Reel ID, PO #
Humidity Indicator Card
(inside bag)
Label with Cree Bin
Code, Quantity, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
(on bottom of box)
Copyright © 2008-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
11