MH Soldering & Handling

CLD-AP193 Rev 2B
soldering & handling
Cree® XLamp® MH Family LED
Introduction
Table of Contents
This application note applies to XLamp® MH Family LEDs, which
Handling XLamp® MH Family LEDs............................................. 2
have order codes in the following format:
Circuit Board Preparation & Layouts............................................ 5
Case Temperature (Ts) Measurement Point................................ 6
MHxxxx-xxxx-xxxxxxxxxxx
Notes on Soldering XLamp® MH Family LEDs............................ 7
Moisture Sensitivity...................................................................... 8
This application note explains how XLamp MH Family LEDs and
Low Temperature Operation......................................................... 8
assemblies containing these LEDs should be handled during
XLamp® MH Family LED Reflow Soldering Characteristics....... 9
manufacturing. Please read the entire document to understand
Chemicals & Conformal Coatings.............................................. 10
how to properly handle XLamp MH Family LEDs.
Assembly Storage & Handling.................................................... 11
Tape and Reel.............................................................................. 12
www.cree.com/Xlamp
Packaging & Labels.................................................................... 14
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective
owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational
purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty
information, please contact Cree Sales at [email protected].
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1
XLamp ® MH Family LED Soldering & Handling
Handling XLamp® MH Family LEDs
Manual Handling
Use plastic, not metal, tweezers to grab XLamp MH Family LEDs at the sides of the substrate, i.e., at the base. Do not touch the optical
surface with tweezers. Do not touch the optical surface with fingers. Do not push on the optical surface.
P
CORRECT
X
WRONG
Cree recommends the following at all times when handling XLamp MH Family LEDs or assemblies containing these LEDs:
•
Avoid putting mechanical stress on the LED optical surface.
•
Never touch the optical surface with fingers or sharp objects. The LED optical surface could become soiled or damaged, which would
affect the optical performance of the LED.
•
Cree recommends always handling MH Family LEDs with appropriate ESD grounding.
•
Cree recommends handling MH Family LEDs wearing clean, lint‑free gloves.
Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp MH Family LEDs from the factory tape and reel
packaging.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
2
XLamp ® MH Family LED Soldering & Handling
Pick & Place Nozzle
The following diagrams show examples of pick & place tools to remove MH Family LEDs from the factory tape and reel packaging. Cree
5 place nozzle with a spring constant
4
3 For pick and place nozzles
recommends6 using a spring‑relieved pick and
of 0.519 lb‑ft (0.704 N‑m).
2
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE INC.
coming into contact with silicone-covered LED components, Cree recommends nozzles be constructed of non-metallic materials.
Cree
REV
DES
and several of Cree’s customers have had good success using nozzles fabricated from 95a urethane.
All dimensions in mm.
D
Measurement tolerance unless indicated otherwise:= ±0.2 mm
MHB-A
3.300
3.300
50.0
50.0
.300
.300
.400
.400
C
5.000
5.000
+.05
+.05
-0.1
-0.1
.357
.357
1.071
1.071
7.000
7.000
B
5.000
5.000
+.05
+.05
-0.1
-0.1
2.857
2.857
Ø1.000
n1.000
1.071
1.071
2.857
2.857
7.000
7.000
DRAWN BY
A
THIRD ANGLE PROJECTION
6
5
4
3
UNLESS OTHERWISE SPECIFIED
D. CRONIN
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.CHECK
TOLERANCE UNLESS SPECIFIED:
APPROVED
.XX ` .25
.XXX ` .125
X
` .5
MATERIAL
FOR SHEET METAL PARTS ONLY
.X
` 1.5
.XX ` .75
.XXX ` .25
X
` .5
SURFACE FINISH:1.6
w
DATE
2/2/15
DATE
DATE
NBR
FINAL PROTECTIVE FINISH
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
3
2
XLamp ® MH Family LED Soldering & Handling
6
5
4
3
2
1
REVISONS
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE INC.
REV
BY
DESCRIPTION
DATE
APP'D
Handling XLamp® MH Family LEDs - Continued
MHD-E & MHD-G
D
3.300
3.300
.300
.300
.400
.400
C
7.000
7.000
.500
.500
1.500
1.500
7.000
7.000
4.000
4.000
B
Ø1.000
n1.000
.500
.500
DRAWN BY
A
THIRD ANGLE PROJECTION
6
5
4
3
UNLESS OTHERWISE SPECIFIED
D. CRONIN
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.CHECK
TOLERANCE UNLESS SPECIFIED:
APPROVED
.XX ` .25
.XXX ` .125
X
` .5
MATERIAL
FOR SHEET METAL PARTS ONLY
.X
` 1.5
.XX ` .75
.XXX ` .25
X
` .5
SURFACE FINISH:1.6
w
DATE
2/2/15
4600 Silicon Drive
Durham, N.C 27703
Phone (919) 313-5300
Fax (919) 313-5558
DATE
DATE
NBR
TITLE
COLLET
SIZE
C
SCALE
16.000
FINAL PROTECTIVE FINISH
DRAWING NO.
REV.
12003242
2
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
4
SHEET
1
A
OF
1/1
0.8
±.1
0.8
±.1
3.70.50
.45
.71
.50
.45
.71
XLamp ® MH Family LED Soldering & Handling
4.70
5.00
5.00
4.70
Circuit Board
Preparation & Layouts
C
C
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications
before placing or
2.80
2.80
soldering XLamp MH Family LEDs onto the PCB. The diagrams below show the recommended PCB solder pad layouts
for XLamp MH
Family LEDs. The diagrams are not to scale.
PRIMARY
PRIMARY
All dimensions in mm
Tolerance: +0.13 mm
MHB-A 9‑V, 18‑V & 36‑V Class
4.78
6
4.78
.50
.50
6
D
.50
4
.80
5
4
4.78
REV
.50
.70
.70
.71
4.30
.25
ALL DIMENSIONS ARE
.97
2.78
2.78
6.70
Recommended
PCB
Solder
RECOMMENDED PCB
SOLDER
PAD Pad
4.78
6.70
.80
.804.78
Recommended
Stencil
RECOMMENDED STENCIL
PATTERNPattern
(HATCHED
AREA IS Area
OPENING)
RECOMMENDED
STENCIL
(Shaded
is PATTERN
Open)
2.95
RECOMMENDED PCB SOLDER PAD
THIRD ANGLE PROJECTION
THIRD ANGLE PROJECTION
(HATCHED AREA
2.95IS OPENING)
6
5
MHD-E C9‑V/18‑V Class - 9‑V Configuration
MHD-E 36‑V Class
MHD-G 18‑V/36‑V Class - 18‑V Configuration
6
C
6.70
.70
4
.70
4
3.90
± .13M
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS
ANDOTHERWISE
AFTER FINISH.
UNLESS
SPECIFIED
DIMENSIONS
ARE IN
TOLERANCE UNLESS
SPECIFIED:
MILLIMETERS
.XX
±AND AFTER
.25 FINISH.
TOLERANCE
SPECIFIED:
.XXX UNLESS
±
.125
X°
±.XX .5± ° .25
.XXX ONLY
±
.125
FOR SHEET METAL PARTS
X°
±
.5 °
.X
±
1.5
FOR.XX
SHEET ±
METAL.75
PARTS ONLY
.XXX .X
±
.25
±
1.5
X°
±.XX .5± ° .75
.XXX 1.6 ±
.25
SURFACE FINISH:
X°
±
.5 °
SURFACE FINISH:
DRAWN
D. C
CHECK
APPRO
MATER
FINAL PRO
1.6
3
PRIMARY
PRIMARY
6.70
6.70
.70
3
5
.70
.70
± .13MM U
ALL DIMENSIONS ARE
.97
A
DE
6.70
.80
6.70
.50.80
4.30
.25
A
7.00
2
2
REV
.71
.35
.35±0.2 mm
±0.2 mm
7.00
3
3
.25.50
.25
0.75
0.75
±0.2 4.78
mm
±0.2 mm
4.78
7.00
7.00
4.78
D
.80
5
NOTICE
B CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CREE
NOTICE
.50
.50
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL.
THIS
PLOT
AND
THE INFORMATION
B
CONFIDENTIAL
INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
UNAUTHORIZED PERSON WITHOUT
THE WRITTEN CONSENT
MAY NOTOF
BECREE
COPIED,
INC.REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT
THE WRITTEN CONSENT
OF CREE INC.
.70
.70
3.90
.25
.70
6.70
1.24
1.29
.70
1.24
.70
1.29
.25
B
B
6.76
6.76
6.76
6.76
.25
1.29
Recommended PCB Solder Pad
Recommended Stencil Pattern
RECOMMENDED STENCIL PATTERN
(Shaded
Area
Open)
RECOMMENDED
STENCIL
(HATCHED
AREA Is
ISPATTERN
OPEN)
.25
1.29
ALL DIMENSIONS ARE
±
ALL DIMENSIONS ARE
± .13mm
DRAWN BY
UNLESS OTHERWISE SPECIFIED
D. CRONIN
DATE
DRAWN BY
DIMENSIONS ARE IN
UNLESS OTHERWISE SPECIFIED
CHECK
MILLIMETERS AND AFTER FINISH. D. CRONIN
11/12/1
A
DIMENSIONS ARE IN
CHECK
DATE
MILLIMETERSTOLERANCE
AND AFTER UNLESS
FINISH. SPECIFIED:
.XX
±
.25
APPROVED
(HATCHED AREA IS OPEN)
TOLERANCE UNLESS SPECIFIED:
.XXX ±
.125
.XX
±
.25
DATE
X°
±
.5 ° APPROVED
.XXX ±
.125
RECOMMENDED PCB SOLDER PAD
THIRD ANGLE PROJECTION
MATERIAL
FOR SHEET
X°
± METAL
.5 ° PARTS ONLY
RECOMMENDED PCB SOLDER PAD
THIRD ANGLE PROJECTION
MATERIAL
.X
±
1.5
FOR SHEET METAL PARTS ONLY
.XX
±
.75
.X
±
1.5
.XXX ±
.25
FINAL PROTECTIVE FINISH
±
.75
X° a trademark
±
.5 °
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree.XX
logo
is
.XXX ±
.25
FINAL PROTECTIVE FINISH
1.6
± FINISH:
.5 °
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorshipX°SURFACE
or association.
This
A
1.6
FINISH:
document is provided for informational purposes
only and is not a warranty or a specification.
For product specifications, please see
For warranty
information,
6
5
4 the data sheets available at www.cree.com.
3 SURFACE
6
5
4
3
please contact Cree Sales at [email protected].
5
2
2
D
7.00
7.00
D
.80
.80
Circuit Board Preparation & Layouts - Continued
This configuration should not be used for 36‑V class MHD-E LEDs.
0.75
±0.2mm
6.70
6.70
.70
.71
.71
PRIMARY
0.75
±0.2mm
6.70
6.70
.70
.70
.70
.70
1.24
.70
1.29
.25
B
6.76
6.76
.50
.50
.50
6.76
.70
PRIMARY
.70
1.24
1.29
.25
.50
6.76
.25
.25
3.13
3.13
3.13
3.13
1.29
1.29
ALL DIMENSIONS
ALL DIMENSIONS ARE .13mm UN
.70
.70
A
A
.70
.70
RECOMMENDED PCB SOLDER PAD
6
5
UNLESS OTHERWISE
SPECIFIED
DRAWN
BY
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN
D. CRONIN
DIMENSIONS AREMILLIMETERS
IN
AND AFTER FINISH.
CHECK
MILLIMETERS AND AFTER TOLERANCE
FINISH.
UNLESS SPECIFIED:
TOLERANCE UNLESS SPECIFIED:
.XX
±
.25
.XX
±
.25
.XXX APPROVED
±
.125
.XXX ±
.125
X°
±
.5 °
THIRD ANGLE PROJECTION X°
±
.5 °
FOR SHEET METAL
PARTS ONLY
THIRD ANGLE PROJECTION
MATERIAL
FOR SHEET METAL PARTS ONLY
.X
±
1.5
.X
±
1.5
.XX
±
.75
.XX
±
.75
.XXX ±
.25
.XXX ±
.25
X° FINAL
± PROTECTIVE
.5 °FINISH
X°
±
.5 °
1.6
SURFACE FINISH:
1.6
SURFACE FINISH:
RECOMMENDED STENCIL PATTERN
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPENING)
(HATCHED AREA IS OPENING)
Recommended Stencil Pattern
(Shaded Area Is Open)
RECOMMENDED PCB SOLDER PAD
Recommended
PCB Solder Pad
6
6.70
6.70
2.95
2.95
MHD-E 9‑V/18‑V Class - 18‑V Configuration
C
MHD-GC 18‑V/36‑V Class - 36‑V Configuration
B
4.30
XLamp ® MH Family LED Soldering & Handling
7.00
7.00
.70
.70
4.30
.35
±0.2mm
.35
±0.2mm
.50
.50
5
Case Temperature (Ts) Measurement Point
4
4
3
3
XLamp MH Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible.
This measurement point is shown in the picture below.
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp MH Family LED itself. In testing, Cree has found
such a solder pad to have insignificant impact on the resulting Ts measurement.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
6
2
DRAW
DATE
D.
11/17/1
CHECK
DATE
APPRO
DATE
MATER
FINAL PR
XLamp ® MH Family LED Soldering & Handling
Notes on Soldering XLamp® MH Family LEDs
Notes on Soldering XLamp XP Family LEDs
XLamp MH Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the
XLamp XP Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or
PCB on a hotplate and following the reflow soldering profile listed on page 9.
by placing the PCB on a hotplate and following the reflow soldering profile listed on the previous page.
Do solder
not wave
solder
XLamp
XP Family
LEDs.
Do not
hand
solder
Do not wave
XLamp
MH Family
LEDs.
Do not hand
solder
XLamp
MH
FamilyXLamp
LEDs. XP Family LEDs.
PP
CORRECT
CORRECT
XX
WRONG
WRONG
PP
CORRECT
CORRECT
Solder Paste Type
Solder Paste Type
Cree strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after
Cree strongly
recommends
clean” solder
MH solder
Family LEDs
that cleaning the PCB after reflow soldering is
reflow
soldering using
is not“no
required.
Creepaste
useswith
theXLamp
following
pastesointernally:
not required. Cree uses Kester® R276 solder paste internally.
Indium Corporation of America® Part number 82676
• Sn62/Pb36/Ag2 composition
Cree recommends
following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
• Flux:the
NC-SMQ92J
Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg.
Solder Paste Thickness
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated
Solder
Thickness
dispensing
systemPaste
or a solder
stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil
(102-μm) The
bondchoice
line, i.e.,
solder
joint
thickness
aftermethod
reflow soldering.
ofthe
solder
and
the
application
will dictate the specific amount of solder. For the most consistent results,
an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder
thickness that results in a 3-mil (75-μm) bond line.
P
P
CORRECT
X
X
WRONG
CORRECT
WRONG
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contactThis
Creedocument
Sales at [email protected].
7
is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the
data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected].
Copyright © 2008-2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
XLamp ® MH Family LED Soldering & Handling
Notes on Soldering XLamp® MH Family LEDs - Continued
After Soldering
After soldering, allow XLamp MH Family LEDs to return to room temperature before subsequent handling. Premature handling of the
device, especially around the optical surface, could result in damage to the LED.
Cree recommends verifying that soldered LEDs are not tilted, a situation called tombstoning. As a general guideline, an LED is tilted when
the part has a low edge touching the PCB surface and a high edge above the PCB surface.
Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After
shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder
areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning PCBs After Soldering
Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary,
Cree recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
Moisture Sensitivity
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp MH Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life
in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs
in the original MBP.
Low Temperature Operation
The minimum operating temperature of these XLamp LED components is -40 °C. To maximize lifetime, Cree recommends avoiding
applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 °C.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
8
XLamp ® MH Family LED Soldering & Handling
XLamp® MH Family LED Reflow Soldering Characteristics
In testing, Cree has found XLamp MH Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a
general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder
paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
Time
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Free Solder
1.2 °C/second
Preheat: Temperature Min (Tsmin)
120 °C
Preheat: Temperature Max (Tsmax)
170 °C
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
1 - 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Note: While the high reflow temperatures (above) have been approved, Cree’s best practice guideline for reflow is to use as low a
temperature as possible during the reflow soldering process for these LEDs.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
9
XLamp ® MH Family LED Soldering & Handling
Chemicals & Conformal Coatings
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and
current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application
Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of
chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer.
Recommended Cleaning Solutions
Cree has found the following chemicals to be safe to use with XLamp MH Family LEDs.
•
Water
•
Isopropyl alcohol (IPA)
Chemicals Tested as Harmful
In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to
XLamp MH Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp MH Family LEDs.
The fumes from even small amounts of the chemicals may damage the LEDs.
•
Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
•
Methyl acetate or ethyl acetate (i.e., nail polish remover)
•
Cyanoacrylates (i.e., “Superglue”)
•
Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether)
•
Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive)
Hermetically Sealing Luminaires
For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment
that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically
sealing LEDs in an enclosed space is not recommended.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
10
XLamp ® MH Family LED Soldering & Handling
Assembly Storage & Handling
Do not stack PCBs or assemblies containing XLamp MH Family LEDs so that anything rests on the LED optical surface. PCBs or assemblies
containing XLamp MH Family LEDs should be stacked in a way to allow at least 1-cm clearance above the LED optical surface.
Do not use bubble wrap directly on top of XLamp MH Family LEDs. Force from the bubble wrap can potentially damage the LED.
P
CORRECT
P
CORRECT
X
WRONG
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
11
XLamp ® MH Family LED Soldering & Handling
Tape and Reel
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm [in].
MHB-A
CATHODE SIDE
CATHODE SIDE
ANODE SIDE
ANODE SIDE
6
5
4
3
2
1
2400-00009
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTANED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE INC.
INDEX
QTY
ITEM
1
2
1
2
2400-00009-CORE
2400-00009-REEL
COMMENTS
D
D
12.4
+.2
.0
MEASURED AT HUB
C
330
+.25
-.75
C
16.4
+0.2
.0
MEASURED AT HUB
1.9±.4
21 ±.4
13.1 ±.2
B
B
12.4
+1.0
-.5
MEASURED AT EDGE
60°
60°
REVISONS
REV
A
DESCRIPTION
BY
DATE
APP'D
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree and XLamp are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specificUNLESS
product
and/or
vendor endorsement, sponsorship or association.
This
OTHERWISE
SPECIFIED
4600 Silicon Drive
D. CRONIN
09/29/09
DIMENSIONS ARE IN INCHES
Durham, N.C 27703
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see
the
dataFINISH.
sheets available at www.cree.com. For warranty information,
AND AFTER
Phone (919) 313-5300
TOLERANCE UNLESS SPECIFIED:
--Fax (919) 313-5558
please contact Cree Sales at [email protected].
12
.XX ±
.01
®
THIRD ANGLE PROJECTION
®
.XXX ±
X°
±
.005
.5 °
FOR SHEET METAL PARTS ONLY
DRAWN BY
DATE
CHECK
DATE
APPROVED
-MATERIAL
DATE
--
TITLE
REEL, 13" X 12MM, 3 PIECE SNAP
A
XLamp ® MH Family LED Soldering & Handling
Tape and Reel - Continued
MHD-E & MHD-G
2.00 [.079]
P2
+.0039
1.50+.10
-.00 [ .0591-.0000 ]
Do
4.00 [.157]
Po
1.75 [.069]
E1
CATHODE SIDE
3.0°
7.50 [.295]F
1.50 [.059]
D1
MIN
12.00 [.472]
P
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTANED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE INC.
5
7.60
[.299]
Bo
14.25
[.561] 16.30 [.642]
MAX
E2
W
ANODE SIDE
.30 [.012]
T
3.0°
6
16.00 [.630]
NOMINAL
4
1.70 [.067]
Ko
3
2
1
2400-00009
1000 LEDs per reel
7.60 [.299]
INDEX
QTY
ITEM
1
2
1
2
2400-00009-CORE
2400-00009-REEL
COMMENTS
D
D
12.4
+.2
.0
MEASURED AT HUB
C
330
+.25
-.75
C
16.4
+0.2
.0
MEASURED AT HUB
1.9±.4
21 ±.4
13.1 ±.2
B
B
12.4
+1.0
-.5
MEASURED AT EDGE
60°
60°
REVISONS
REV
A
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
®
®
.XX ±
.01
.XXX ±
.005
X°
±
.5 °
BY
DESCRIPTION
DATE
APP'D
DATE
DRAWN BY
D. CRONIN
4600 Silicon Drive
Durham, N.C 27703
09/29/09
CHECK
DATE
--
Phone (919) 313-5300
--
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree and XLamp are registered trademarks and the Cree logo is a trademark
-of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor-- endorsement,
sponsorship or association. This
THIRD ANGLE PROJECTION
REEL, 13" X 12MM, 3 PIECE SNAP
FOR SHEET
METAL PARTS
ONLY available at www.cree.com. For warranty information,
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see
the data
sheets
.X
±
.06
ANTI-STATIC HIPS
please contact Cree Sales at [email protected].
.XX ±
.03
13
APPROVED
Fax (919) 313-5558
DATE
TITLE
MATERIAL
SIZE
.XXX ±
X°
±
SURFACE FINISH:
.010
.5 °
63
FINAL PROTECTIVE FINISH
-
SCALE
C
0.500
REV.
DRAWING NO.
2400-00009
SHEET
A
OF
1 /1
A
XLamp ® MH Family LED Soldering & Handling
Packaging & Labels
Humidity
Indicator
The diagrams below show the packaging and labels Cree uses to ship XLamp MH Family LEDs.
XLamp MH
Family LEDs areDessicant
shipped in
Card
(inside
bag)
(inside
bag)
tape loaded on a reel. Each box contains only one reel in a moisture barrier bag.
Unpackaged Reel
Label with Cree Bin Code,
Quantity, Reel ID
Packaged Reel
Label with Cree Bin
Code, Qty, Lot #
Vacuum-Sealed
Moisture Barrier Bag
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Label with Custom
Code, Qty, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Patent Label
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected].
14