CLD-AP193 Rev 2B soldering & handling Cree® XLamp® MH Family LED Introduction Table of Contents This application note applies to XLamp® MH Family LEDs, which Handling XLamp® MH Family LEDs............................................. 2 have order codes in the following format: Circuit Board Preparation & Layouts............................................ 5 Case Temperature (Ts) Measurement Point................................ 6 MHxxxx-xxxx-xxxxxxxxxxx Notes on Soldering XLamp® MH Family LEDs............................ 7 Moisture Sensitivity...................................................................... 8 This application note explains how XLamp MH Family LEDs and Low Temperature Operation......................................................... 8 assemblies containing these LEDs should be handled during XLamp® MH Family LED Reflow Soldering Characteristics....... 9 manufacturing. Please read the entire document to understand Chemicals & Conformal Coatings.............................................. 10 how to properly handle XLamp MH Family LEDs. Assembly Storage & Handling.................................................... 11 Tape and Reel.............................................................................. 12 www.cree.com/Xlamp Packaging & Labels.................................................................... 14 Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 1 XLamp ® MH Family LED Soldering & Handling Handling XLamp® MH Family LEDs Manual Handling Use plastic, not metal, tweezers to grab XLamp MH Family LEDs at the sides of the substrate, i.e., at the base. Do not touch the optical surface with tweezers. Do not touch the optical surface with fingers. Do not push on the optical surface. P CORRECT X WRONG Cree recommends the following at all times when handling XLamp MH Family LEDs or assemblies containing these LEDs: • Avoid putting mechanical stress on the LED optical surface. • Never touch the optical surface with fingers or sharp objects. The LED optical surface could become soiled or damaged, which would affect the optical performance of the LED. • Cree recommends always handling MH Family LEDs with appropriate ESD grounding. • Cree recommends handling MH Family LEDs wearing clean, lint‑free gloves. Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp MH Family LEDs from the factory tape and reel packaging. Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. 2 XLamp ® MH Family LED Soldering & Handling Pick & Place Nozzle The following diagrams show examples of pick & place tools to remove MH Family LEDs from the factory tape and reel packaging. Cree 5 place nozzle with a spring constant 4 3 For pick and place nozzles recommends6 using a spring‑relieved pick and of 0.519 lb‑ft (0.704 N‑m). 2 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. coming into contact with silicone-covered LED components, Cree recommends nozzles be constructed of non-metallic materials. Cree REV DES and several of Cree’s customers have had good success using nozzles fabricated from 95a urethane. All dimensions in mm. D Measurement tolerance unless indicated otherwise:= ±0.2 mm MHB-A 3.300 3.300 50.0 50.0 .300 .300 .400 .400 C 5.000 5.000 +.05 +.05 -0.1 -0.1 .357 .357 1.071 1.071 7.000 7.000 B 5.000 5.000 +.05 +.05 -0.1 -0.1 2.857 2.857 Ø1.000 n1.000 1.071 1.071 2.857 2.857 7.000 7.000 DRAWN BY A THIRD ANGLE PROJECTION 6 5 4 3 UNLESS OTHERWISE SPECIFIED D. CRONIN DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH.CHECK TOLERANCE UNLESS SPECIFIED: APPROVED .XX ` .25 .XXX ` .125 X ` .5 MATERIAL FOR SHEET METAL PARTS ONLY .X ` 1.5 .XX ` .75 .XXX ` .25 X ` .5 SURFACE FINISH:1.6 w DATE 2/2/15 DATE DATE NBR FINAL PROTECTIVE FINISH Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. 3 2 XLamp ® MH Family LED Soldering & Handling 6 5 4 3 2 1 REVISONS NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. REV BY DESCRIPTION DATE APP'D Handling XLamp® MH Family LEDs - Continued MHD-E & MHD-G D 3.300 3.300 .300 .300 .400 .400 C 7.000 7.000 .500 .500 1.500 1.500 7.000 7.000 4.000 4.000 B Ø1.000 n1.000 .500 .500 DRAWN BY A THIRD ANGLE PROJECTION 6 5 4 3 UNLESS OTHERWISE SPECIFIED D. CRONIN DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH.CHECK TOLERANCE UNLESS SPECIFIED: APPROVED .XX ` .25 .XXX ` .125 X ` .5 MATERIAL FOR SHEET METAL PARTS ONLY .X ` 1.5 .XX ` .75 .XXX ` .25 X ` .5 SURFACE FINISH:1.6 w DATE 2/2/15 4600 Silicon Drive Durham, N.C 27703 Phone (919) 313-5300 Fax (919) 313-5558 DATE DATE NBR TITLE COLLET SIZE C SCALE 16.000 FINAL PROTECTIVE FINISH DRAWING NO. REV. 12003242 2 Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. 4 SHEET 1 A OF 1/1 0.8 ±.1 0.8 ±.1 3.70.50 .45 .71 .50 .45 .71 XLamp ® MH Family LED Soldering & Handling 4.70 5.00 5.00 4.70 Circuit Board Preparation & Layouts C C Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or 2.80 2.80 soldering XLamp MH Family LEDs onto the PCB. The diagrams below show the recommended PCB solder pad layouts for XLamp MH Family LEDs. The diagrams are not to scale. PRIMARY PRIMARY All dimensions in mm Tolerance: +0.13 mm MHB-A 9‑V, 18‑V & 36‑V Class 4.78 6 4.78 .50 .50 6 D .50 4 .80 5 4 4.78 REV .50 .70 .70 .71 4.30 .25 ALL DIMENSIONS ARE .97 2.78 2.78 6.70 Recommended PCB Solder RECOMMENDED PCB SOLDER PAD Pad 4.78 6.70 .80 .804.78 Recommended Stencil RECOMMENDED STENCIL PATTERNPattern (HATCHED AREA IS Area OPENING) RECOMMENDED STENCIL (Shaded is PATTERN Open) 2.95 RECOMMENDED PCB SOLDER PAD THIRD ANGLE PROJECTION THIRD ANGLE PROJECTION (HATCHED AREA 2.95IS OPENING) 6 5 MHD-E C9‑V/18‑V Class - 9‑V Configuration MHD-E 36‑V Class MHD-G 18‑V/36‑V Class - 18‑V Configuration 6 C 6.70 .70 4 .70 4 3.90 ± .13M UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS ANDOTHERWISE AFTER FINISH. UNLESS SPECIFIED DIMENSIONS ARE IN TOLERANCE UNLESS SPECIFIED: MILLIMETERS .XX ±AND AFTER .25 FINISH. TOLERANCE SPECIFIED: .XXX UNLESS ± .125 X° ±.XX .5± ° .25 .XXX ONLY ± .125 FOR SHEET METAL PARTS X° ± .5 ° .X ± 1.5 FOR.XX SHEET ± METAL.75 PARTS ONLY .XXX .X ± .25 ± 1.5 X° ±.XX .5± ° .75 .XXX 1.6 ± .25 SURFACE FINISH: X° ± .5 ° SURFACE FINISH: DRAWN D. C CHECK APPRO MATER FINAL PRO 1.6 3 PRIMARY PRIMARY 6.70 6.70 .70 3 5 .70 .70 ± .13MM U ALL DIMENSIONS ARE .97 A DE 6.70 .80 6.70 .50.80 4.30 .25 A 7.00 2 2 REV .71 .35 .35±0.2 mm ±0.2 mm 7.00 3 3 .25.50 .25 0.75 0.75 ±0.2 4.78 mm ±0.2 mm 4.78 7.00 7.00 4.78 D .80 5 NOTICE B CONFIDENTIAL. THIS PLOT AND THE INFORMATION CREE NOTICE .50 .50 CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION B CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOTOF BECREE COPIED, INC.REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. .70 .70 3.90 .25 .70 6.70 1.24 1.29 .70 1.24 .70 1.29 .25 B B 6.76 6.76 6.76 6.76 .25 1.29 Recommended PCB Solder Pad Recommended Stencil Pattern RECOMMENDED STENCIL PATTERN (Shaded Area Open) RECOMMENDED STENCIL (HATCHED AREA Is ISPATTERN OPEN) .25 1.29 ALL DIMENSIONS ARE ± ALL DIMENSIONS ARE ± .13mm DRAWN BY UNLESS OTHERWISE SPECIFIED D. CRONIN DATE DRAWN BY DIMENSIONS ARE IN UNLESS OTHERWISE SPECIFIED CHECK MILLIMETERS AND AFTER FINISH. D. CRONIN 11/12/1 A DIMENSIONS ARE IN CHECK DATE MILLIMETERSTOLERANCE AND AFTER UNLESS FINISH. SPECIFIED: .XX ± .25 APPROVED (HATCHED AREA IS OPEN) TOLERANCE UNLESS SPECIFIED: .XXX ± .125 .XX ± .25 DATE X° ± .5 ° APPROVED .XXX ± .125 RECOMMENDED PCB SOLDER PAD THIRD ANGLE PROJECTION MATERIAL FOR SHEET X° ± METAL .5 ° PARTS ONLY RECOMMENDED PCB SOLDER PAD THIRD ANGLE PROJECTION MATERIAL .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .75 .X ± 1.5 .XXX ± .25 FINAL PROTECTIVE FINISH ± .75 X° a trademark ± .5 ° Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree.XX logo is .XXX ± .25 FINAL PROTECTIVE FINISH 1.6 ± FINISH: .5 ° of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorshipX°SURFACE or association. This A 1.6 FINISH: document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see For warranty information, 6 5 4 the data sheets available at www.cree.com. 3 SURFACE 6 5 4 3 please contact Cree Sales at [email protected]. 5 2 2 D 7.00 7.00 D .80 .80 Circuit Board Preparation & Layouts - Continued This configuration should not be used for 36‑V class MHD-E LEDs. 0.75 ±0.2mm 6.70 6.70 .70 .71 .71 PRIMARY 0.75 ±0.2mm 6.70 6.70 .70 .70 .70 .70 1.24 .70 1.29 .25 B 6.76 6.76 .50 .50 .50 6.76 .70 PRIMARY .70 1.24 1.29 .25 .50 6.76 .25 .25 3.13 3.13 3.13 3.13 1.29 1.29 ALL DIMENSIONS ALL DIMENSIONS ARE .13mm UN .70 .70 A A .70 .70 RECOMMENDED PCB SOLDER PAD 6 5 UNLESS OTHERWISE SPECIFIED DRAWN BY UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN D. CRONIN DIMENSIONS AREMILLIMETERS IN AND AFTER FINISH. CHECK MILLIMETERS AND AFTER TOLERANCE FINISH. UNLESS SPECIFIED: TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XX ± .25 .XXX APPROVED ± .125 .XXX ± .125 X° ± .5 ° THIRD ANGLE PROJECTION X° ± .5 ° FOR SHEET METAL PARTS ONLY THIRD ANGLE PROJECTION MATERIAL FOR SHEET METAL PARTS ONLY .X ± 1.5 .X ± 1.5 .XX ± .75 .XX ± .75 .XXX ± .25 .XXX ± .25 X° FINAL ± PROTECTIVE .5 °FINISH X° ± .5 ° 1.6 SURFACE FINISH: 1.6 SURFACE FINISH: RECOMMENDED STENCIL PATTERN RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) (HATCHED AREA IS OPENING) Recommended Stencil Pattern (Shaded Area Is Open) RECOMMENDED PCB SOLDER PAD Recommended PCB Solder Pad 6 6.70 6.70 2.95 2.95 MHD-E 9‑V/18‑V Class - 18‑V Configuration C MHD-GC 18‑V/36‑V Class - 36‑V Configuration B 4.30 XLamp ® MH Family LED Soldering & Handling 7.00 7.00 .70 .70 4.30 .35 ±0.2mm .35 ±0.2mm .50 .50 5 Case Temperature (Ts) Measurement Point 4 4 3 3 XLamp MH Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This measurement point is shown in the picture below. It is not required to use a solder footprint for the thermal pad that is larger than the XLamp MH Family LED itself. In testing, Cree has found such a solder pad to have insignificant impact on the resulting Ts measurement. Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. 6 2 DRAW DATE D. 11/17/1 CHECK DATE APPRO DATE MATER FINAL PR XLamp ® MH Family LED Soldering & Handling Notes on Soldering XLamp® MH Family LEDs Notes on Soldering XLamp XP Family LEDs XLamp MH Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the XLamp XP Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or PCB on a hotplate and following the reflow soldering profile listed on page 9. by placing the PCB on a hotplate and following the reflow soldering profile listed on the previous page. Do solder not wave solder XLamp XP Family LEDs. Do not hand solder Do not wave XLamp MH Family LEDs. Do not hand solder XLamp MH FamilyXLamp LEDs. XP Family LEDs. PP CORRECT CORRECT XX WRONG WRONG PP CORRECT CORRECT Solder Paste Type Solder Paste Type Cree strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after Cree strongly recommends clean” solder MH solder Family LEDs that cleaning the PCB after reflow soldering is reflow soldering using is not“no required. Creepaste useswith theXLamp following pastesointernally: not required. Cree uses Kester® R276 solder paste internally. Indium Corporation of America® Part number 82676 • Sn62/Pb36/Ag2 composition Cree recommends following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver). • Flux:the NC-SMQ92J Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg. Solder Paste Thickness The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated Solder Thickness dispensing systemPaste or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil (102-μm) The bondchoice line, i.e., solder joint thickness aftermethod reflow soldering. ofthe solder and the application will dictate the specific amount of solder. For the most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 3-mil (75-μm) bond line. P P CORRECT X X WRONG CORRECT WRONG Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contactThis Creedocument Sales at [email protected]. 7 is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Copyright © 2008-2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo Cree, Inc. 4600 Silicon Drive Durham, NC 27703 XLamp ® MH Family LED Soldering & Handling Notes on Soldering XLamp® MH Family LEDs - Continued After Soldering After soldering, allow XLamp MH Family LEDs to return to room temperature before subsequent handling. Premature handling of the device, especially around the optical surface, could result in damage to the LED. Cree recommends verifying that soldered LEDs are not tilted, a situation called tombstoning. As a general guideline, an LED is tilted when the part has a low edge touching the PCB surface and a high edge above the PCB surface. Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB. Cleaning PCBs After Soldering Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA). Do not use ultrasonic cleaning. Moisture Sensitivity Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp MH Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs in the original MBP. Low Temperature Operation The minimum operating temperature of these XLamp LED components is -40 °C. To maximize lifetime, Cree recommends avoiding applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 °C. Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. 8 XLamp ® MH Family LED Soldering & Handling XLamp® MH Family LED Reflow Soldering Characteristics In testing, Cree has found XLamp MH Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 t 25˚C to Peak Time Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Lead-Free Solder 1.2 °C/second Preheat: Temperature Min (Tsmin) 120 °C Preheat: Temperature Max (Tsmax) 170 °C Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) 65-150 seconds 217 °C 45-90 seconds 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Note: While the high reflow temperatures (above) have been approved, Cree’s best practice guideline for reflow is to use as low a temperature as possible during the reflow soldering process for these LEDs. Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. 9 XLamp ® MH Family LED Soldering & Handling Chemicals & Conformal Coatings Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer. Recommended Cleaning Solutions Cree has found the following chemicals to be safe to use with XLamp MH Family LEDs. • Water • Isopropyl alcohol (IPA) Chemicals Tested as Harmful In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to XLamp MH Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp MH Family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs. • Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene) • Methyl acetate or ethyl acetate (i.e., nail polish remover) • Cyanoacrylates (i.e., “Superglue”) • Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether) • Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive) Hermetically Sealing Luminaires For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically sealing LEDs in an enclosed space is not recommended. Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. 10 XLamp ® MH Family LED Soldering & Handling Assembly Storage & Handling Do not stack PCBs or assemblies containing XLamp MH Family LEDs so that anything rests on the LED optical surface. PCBs or assemblies containing XLamp MH Family LEDs should be stacked in a way to allow at least 1-cm clearance above the LED optical surface. Do not use bubble wrap directly on top of XLamp MH Family LEDs. Force from the bubble wrap can potentially damage the LED. P CORRECT P CORRECT X WRONG Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. 11 XLamp ® MH Family LED Soldering & Handling Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. Except as noted, all dimensions in mm [in]. MHB-A CATHODE SIDE CATHODE SIDE ANODE SIDE ANODE SIDE 6 5 4 3 2 1 2400-00009 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTANED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. INDEX QTY ITEM 1 2 1 2 2400-00009-CORE 2400-00009-REEL COMMENTS D D 12.4 +.2 .0 MEASURED AT HUB C 330 +.25 -.75 C 16.4 +0.2 .0 MEASURED AT HUB 1.9±.4 21 ±.4 13.1 ±.2 B B 12.4 +1.0 -.5 MEASURED AT EDGE 60° 60° REVISONS REV A DESCRIPTION BY DATE APP'D Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree and XLamp are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specificUNLESS product and/or vendor endorsement, sponsorship or association. This OTHERWISE SPECIFIED 4600 Silicon Drive D. CRONIN 09/29/09 DIMENSIONS ARE IN INCHES Durham, N.C 27703 document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the dataFINISH. sheets available at www.cree.com. For warranty information, AND AFTER Phone (919) 313-5300 TOLERANCE UNLESS SPECIFIED: --Fax (919) 313-5558 please contact Cree Sales at [email protected]. 12 .XX ± .01 ® THIRD ANGLE PROJECTION ® .XXX ± X° ± .005 .5 ° FOR SHEET METAL PARTS ONLY DRAWN BY DATE CHECK DATE APPROVED -MATERIAL DATE -- TITLE REEL, 13" X 12MM, 3 PIECE SNAP A XLamp ® MH Family LED Soldering & Handling Tape and Reel - Continued MHD-E & MHD-G 2.00 [.079] P2 +.0039 1.50+.10 -.00 [ .0591-.0000 ] Do 4.00 [.157] Po 1.75 [.069] E1 CATHODE SIDE 3.0° 7.50 [.295]F 1.50 [.059] D1 MIN 12.00 [.472] P NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTANED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. 5 7.60 [.299] Bo 14.25 [.561] 16.30 [.642] MAX E2 W ANODE SIDE .30 [.012] T 3.0° 6 16.00 [.630] NOMINAL 4 1.70 [.067] Ko 3 2 1 2400-00009 1000 LEDs per reel 7.60 [.299] INDEX QTY ITEM 1 2 1 2 2400-00009-CORE 2400-00009-REEL COMMENTS D D 12.4 +.2 .0 MEASURED AT HUB C 330 +.25 -.75 C 16.4 +0.2 .0 MEASURED AT HUB 1.9±.4 21 ±.4 13.1 ±.2 B B 12.4 +1.0 -.5 MEASURED AT EDGE 60° 60° REVISONS REV A UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN INCHES AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: ® ® .XX ± .01 .XXX ± .005 X° ± .5 ° BY DESCRIPTION DATE APP'D DATE DRAWN BY D. CRONIN 4600 Silicon Drive Durham, N.C 27703 09/29/09 CHECK DATE -- Phone (919) 313-5300 -- Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree and XLamp are registered trademarks and the Cree logo is a trademark -of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor-- endorsement, sponsorship or association. This THIRD ANGLE PROJECTION REEL, 13" X 12MM, 3 PIECE SNAP FOR SHEET METAL PARTS ONLY available at www.cree.com. For warranty information, document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets .X ± .06 ANTI-STATIC HIPS please contact Cree Sales at [email protected]. .XX ± .03 13 APPROVED Fax (919) 313-5558 DATE TITLE MATERIAL SIZE .XXX ± X° ± SURFACE FINISH: .010 .5 ° 63 FINAL PROTECTIVE FINISH - SCALE C 0.500 REV. DRAWING NO. 2400-00009 SHEET A OF 1 /1 A XLamp ® MH Family LED Soldering & Handling Packaging & Labels Humidity Indicator The diagrams below show the packaging and labels Cree uses to ship XLamp MH Family LEDs. XLamp MH Family LEDs areDessicant shipped in Card (inside bag) (inside bag) tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Unpackaged Reel Label with Cree Bin Code, Quantity, Reel ID Packaged Reel Label with Cree Bin Code, Qty, Lot # Vacuum-Sealed Moisture Barrier Bag Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Label with Custom Code, Qty, Reel ID Boxed Reel Label with Cree Order Code, Quantity, Reel ID, PO # Patent Label Label with Cree Bin Code, Quantity, Reel ID Patent Label Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. CCree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. 14