CLD-AP90 Rev 7E soldering & handling Cree® XLamp® XB Family LEDs Introduction Table of Contents This application note applies to XLamp® XB Family LEDs which Handling XLamp® XB Family LEDs..............................................2 have order codes in the following format. Circuit Board Preparation & Layouts............................................4 Case Temperature (Ts) Measurement Point................................5 XBxxxx-xx-xxxx-xxxxxxxxx Notes on Soldering XLamp® XB Family LEDs.............................5 Moisture Sensitivity......................................................................6 This application note explains how XLamp XB Family LEDs and XLamp® XB Family LED Reflow Soldering Characteristics.........7 assemblies containing these LEDs should be handled during Chemicals & Conformal Coatings................................................8 manufacturing. Please read the entire document to understand Assembly Storage & Handling......................................................9 how to properly handle XLamp XB Family LEDs. Tape and Reel - XB Family LEDs............................................... 10 www.cree.com/Xlamp Packaging & Labels................................................................... 11 Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 1 XLamp ® XB Family LED Soldering & Handling Handling XLamp® XB Family LEDs Manual Handling Use tweezers to grab XLamp XB Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do not push on the lens. Do not apply more than 1000 g of shear force onto the lens. Excessive force on the lens could damage the LED. P CORRECT X WRONG Cree recommends the following at all times when handling XLamp XB Family LEDs or assemblies containing these LEDs: • Avoid putting excessive mechanical stress on the LED lens. • Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect the optical performance of the LED. • Cree recommends always handling XB family LEDs with appropriate ESD grounding. • Cree recommends handling XB family LEDs wearing clean, lint‑free gloves. Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp XB Family LEDs from the factory tape & reel packaging. Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 2 XLamp ® XB Family LED Soldering & Handling Handling XLamp® XB5 Family LEDs - Continued 6 4 3 2 1 REVISONS Pick & Place Nozzle NOTICE CONFIDENTIAL. THIS PLOT AND THE INFORMATION AINED WITHIN ARE THE PROPRIETARY AND IDENTIAL INFORMATION OF CREE, INC. THIS PLOT NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY THORIZED PERSON WITHOUTTHE WRITTEN CONSENT REE INC. REV A DESCRIPTION BY DATE APP'D Initial Release DDS 1/5/12 D. H. For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles be constructed of non-metallic materials. Cree and several of Cree’s customers have had good success using nozzles fabricated from 90d urethane. The following pick & place tools are specific to the XB Family LEDs. All dimensions in mm. D XB-D 2.500 +.100/-.000 4.500 1.125 5.500 C Add features as required to interface with customer's tool 4x 15.0° 2.500 +.100/-.000 4x R.200 2.300 ± .050 thru x 90° 2.400 +.050/-.000 B XB-E HVW and XB-G HVW 1.50 ± 0.0508 THIRD ANGLE PROJECTION 60° 6 5 4 3 1.750 ± 0.0508 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XXX ± .125 X° ± .5 ° FOR SHEET METAL PARTS ONLY .X ± 1.5 .XX ± .75 .XXX ± .25 X° ± .5 ° DATE DRAWN BY D. Seibel 4600 Silicon Drive Durham, N.C 27703 1/5/12 CHECK DATE APPROVED DATE Phone (919) 313-5300 Fax (919) 313-5558 Don Hirsh 1/5/12 Tool, Pickup-XB-D MATERIAL Delrin SIZE FINAL PROTECTIVE FINISH SCALE SURFACE FINISH: 1.6 2 A TITLE C 13.000 REV. DRAWING NO. 12002494 A SHEET 1 2.75 ± 0.0508 Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 3 OF 1 /1 1.016 0.040 2.600 0.102 A XLamp ® XB Family LED Soldering & Handling A C 8 8 7 7 6 6 5 2.286 0.090 5 C 4 4 THE INFORMATION THE INFORMATION CONTAINED INCONTAINED THIS DRAWING IN THIS IS THE DRAWING SOLE PROPERTY IS THE SOLE OF PROPERTY OF COUNT ON TOOLS, COUNT INC.ONANY TOOLS, REPRODUCTION INC. ANY REPRODUCTION IN PART OR WHOLE IN PARTWITHOUT OR WHOLE WITHOUT THE WRITTEN THE PERMISSION WRITTENOF PERMISSION COUNT ONOF TOOLS, COUNT INC.ONISTOOLS, PROHIBITED. INC. IS PROHIBITED. Handling XLamp® XB Family LEDs - Continued XB-H 6 A 4 CREE CONFIDENTIAL. NOTICE THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE PROPRIETARY AND CREE CONFIDENTIAL. THISTHE PLOT AND THE INFORMATION CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND MAY NOT BE COPIED, REPRODUCED ORINC. DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, THIS PLOT UNAUTHORIZED PERSON THE WITHOUT WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY OF CREE INC. UNAUTHORIZED PERSON THE WITHOUT WRITTEN CONSENT 2.6002.600 OF CREE INC. REV All dimensions in mm. REV 1.0161.016 0.0400.040 0.1020.102 A A D D C 2.45 2.45 C 2.28 2.28 A A ITEM NO. 0.65 0.65 PART OR IDENTIFYING NO. UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN INCHES TOLERANCES ARE: DECIMALS XX = .002 XXX = .001 XXXX = .0002 2.45 2.45 ANGLES 1/2 MATERIAL 32 DO NOT SCALE DRAWING 8 6 7 C C Printed B NOMENCLATURE OR DESCRIPTION 5 DATE APPROVALS 135° 135° A 5/15/2014 CHECKED SECTION SECTION A-A A-A 2.29 2.29 XBH Assembly MFG ENG SIZE A QUAL ENG QTY REQD MATERIAL SPECIFICATION DRAWN REV. DWG. NO. SCALE 3 4 B 2.2862.286 0.0900.090 CAD GENERATED DRAWING, DO NOT MANUALLY UPDATE RESP ENG FINISH Circuit Board Preparation & Layouts 2.29 2.29 0.33 0.33 0.36 0.36 PARTS LIST A 2 3 3 6 & place tool, designed in conjunction 5 4 NOTICE The following pick with Count On Tools, is specific to the XB-H LED. D D B 3 REVISIONS REVISIO Rev. DESCRIPTION DESCRIPTION A RELEASE PRINT PRINT RELEASE Rev. 135° SECTION A-A 5 3 SHEET CAD FILE: 2 OF 1 Thursday, May 15, 2014 11:47:10 AM B circuit boards (PCBs) should be preparedR1.53 and/or cleaned according to the manufacturer’s specifications before placing or 0.92 0.92 R1.53 soldering XLamp XB Family LEDs onto the PCB. The diagram below shows the recommended PCB solder pad layout for XLamp XB Family LEDs. PRIMARY PRIMARY ITEM NO. ITEM PART OR PART OR NO. IDENTIFYING NO. IDENTIFYING NO. NOMENCLATURE NOMENCLATURE OR DESCRIPTION OR DESCRIPTION PARTS LIST PARTS LIST UNLESS OTHERWISE UNLESS SPECIFIED OTHERWISE SPECIFIED CAD GENERATED CAD DRAWING, GENERATED DRAWING, DIMENSIONS DIMENSIONS ARE IN INCHES ARE IN DO INCHES NOT MANUALLY DO NOT UPDATE MANUALLY UPDATE TOLERANCESTOLERANCES ARE: ARE: All dimensions in mm. A DECIMALS A 2.29 2.29 0.92 0.92 MATERIAL MATERIAL FINISH FINISH 0.39 32 0.39 32 DATE APPROVALS APPROVALS ANGLES DRAWN DRAWN 1/2 8 7 7 6 6 5 5 4 4 DATE 5/15/2014 5/15/2014 CHECKED CHECKED RESP ENG RESP ENG MFG ENG MFG ENG QUAL ENG DO NOT SCALE DO NOT DRAWING SCALE DRAWING 8 B B XX = .002 XX = .002 1/2 XXX = .001 XXX = .001 XXXX = .0002 XXXX = .0002 2.29 2.29 0.85 0.85 0.36 0.36 DECIMALS ANGLES XBH As SIZE A QUAL ENG 3 DWG. NO. SIZE SCALE 3 A 2 CAD SCA Thursday, Thursday, May 15, May 2014 15 0.85 0.85 2.29 2.29 2.29 2.29 0.25 0.17 0.25 0.17 1.95 1.95 ALL DIMENSI ALL DIMENSIO A A Recommended PCB Solder Pad RECOMMENDED PCB SOLDER PAD RECOMMENDED PCB SOLDER PAD 6 5 Recommended Stencil Pattern (Hatched Area is Opening) RECOMMENDED STENCIL PATTERN UNLESS OTHERWISE SD D DIMENSIONS ARESP IN UNLESS OTHERWISE MILLIMETERS DIMENSIONSAND AREAFT INDC TOLERANCEAND UNLESS S C MILLIMETERS AFTER RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) .XX ±UNLESS .25 SPA TOLERANCE (HATCHED AREA IS OPENING) .XXX ± .25 .125 A .XX ± X° ±± .125 .5° .XXX THIRD ANGLE PROJECTION FOR SHEET PAM X° ± METAL .5° THIRD ANGLE PROJECTION M .X ±METAL 1.5 PART FOR SHEET .75 .X.XX ± ±± 1.5 .XXX .25 F .XX ± .75 X° ±± .25 .5° .XXX FI 1.6 X° ± FINISH: .5° SURFACE 1.6 SURFACE FINISH: 4 3 6 Inc. All rights reserved. The information in this5document is subject to change without notice. Cree 4 ® and XLamp® are registered trademarks and the 3 Cree logo is a trademark Copyright © 2012-2016 Cree, of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 4 XLamp ® XB Family LED Soldering & Handling Case Temperature (Ts) Measurement Point XLamp XB Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This measurement point is shown in the picture below. Thermocouple site if no separate pad Pad for thermocouple It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XB Family LED itself. In testing, Cree has found such a solder pad to have insignificant impact on the resulting Ts measurement. Notes on Soldering XLamp® XB Family LEDs XLamp XB Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the PCB on a hotplate and following the reflow soldering profile listed on page 7. Do not wave solder XLamp XB Family LEDs. Do not hand solder XLamp XB Family LEDs. P CORRECT X WRONG P CORRECT Solder Paste Type Cree strongly recommends using “no clean” solder paste with XLamp MPL-EZW LEDs so that cleaning the PCB after reflow soldering is not required. Cree uses the following 5 solder paste internally: Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. XLamp ® XB Family LED Soldering & Handling Notes on Soldering XLamp® XB Family LEDs - Continued Solder Paste Type Cree strongly recommends using “no clean” solder paste with XLamp XB Family LEDs so that cleaning the PCB after reflow soldering is not required. Cree uses Kester® R276 solder paste internally. Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver). Solder Paste Thickness The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil (102-μm) bond line, i.e., the solder joint thickness after reflow soldering. P CORRECT X WRONG After Soldering After soldering, allow XLamp XB Family LEDs to return to room temperature before subsequent handling. Handling of the device, especially around the lens, before cooling could result in damage to the LED. Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. This can be done by X-ray or by shearing selected devices from the circuit board. The solder should appear completely re-flowed (no solder grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB. Cleaning PCBs After Soldering Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA). Do not use ultrasonic cleaning. Moisture Sensitivity Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp XB-H LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the original MBP. Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 6 XLamp ® XB Family LED Soldering & Handling XLamp® XB Family LED Reflow Soldering Characteristics In testing, Cree has found XLamp XB Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 t 25˚C to Peak IPC/JEDEC J-STD-020C Time Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Lead-Free Solder 1.2 °C/second Preheat: Temperature Min (Tsmin) 120 °C Preheat: Temperature Max (Tsmax) 170 °C Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) 65-150 seconds 217 °C 45-90 seconds 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 7 XLamp ® XB Family LED Soldering & Handling Chemicals & Conformal Coatings Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer. Recommended Cleaning Solutions Cree has found the following chemicals to be safe to use with XLamp XB Family LEDs. • Water • Isopropyl alcohol (IPA) Chemicals Tested as Harmful In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to XLamp XB Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XB Family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs. • Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene) • Methyl acetate or ethyl acetate (i.e., nail polish remover) • Cyanoacrylates (i.e., “Superglue”) • Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether) • Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive) Hermetically Sealing Luminaires For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically sealing LEDs in an enclosed space is not recommended. Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 8 XLamp ® XB Family LED Soldering & Handling Assembly Storage & Handling Do not stack PCBs or assemblies containing XLamp XB Family LEDs so that anything rests on the LED lens. Force applied to the LED lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XB Family LEDs should be stacked in a way to allow at least 1 cm clearance above the LED lens. Do not use bubble wrap directly on top of XLamp XB Family LEDs. Force from the bubble wrap can potentially damage the LED. P CORRECT P CORRECT X WRONG Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 9 XLamp ® XB Family LED Soldering & Handling Tape and Reel - XB Family LEDs 4.0±.1 1.5±.1 All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. 8.0±.1 1.75±.10 Cathode Side Except as noted, all2.5±.1 dimensions in mm. +.3 12.0 .0 Anode Side (denoted by + and circle) User Feed Direction END START Trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) Loaded Pockets (1,000 Lamps) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) User Feed Direction Cover Tape Pocket Tape 13mm 7" Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 10 XLamp ® XB Family LED Soldering & Handling Packaging & Labels The diagrams below show the packaging and labels Cree uses to ship XLamp XB Family LEDs. XLamp XB Family LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Quantity, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Boxed Reel Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Patent Label (on bottom of box) Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 11