高辉度LED 焊接和处理

Cree® 高亮度 LED
焊锡与处理
CLD-CTAP001 Rev 22
焊锡与处理
要点:
发布此文件目的是向客户及使用者提供我公司LED简明准确的使用方法
描述
一般而言,LED可以按照与普通用途的半导体器件相类似方法使用。当使用CREE灯时,必须采取下列措施来保护LED.
P2 与 P4 LEDs
1. 清洗
•
不可使用未指定的化学溶液清洗LED, 这些化学品可能损害LED. 当必需清洗时,请将LED在室温下用酒精擦拭并在室温下干燥15分
钟后方可使用.
•
超声波清洗对LED的影响跟超声波功率及LED装配方式有关,须预先检查超声波清洗过程不损害LED方可进行.
2. 成形
•
灯脚成形时,弯曲成形的位置最少距封装底部3mm
•
不可在上锡时或上锡后弯脚成形,如需成形必须在上锡前进行
•
灯脚成形时,须避免LED封装胶体受压破裂
•
LED上PCB时,LED灯脚必须对准PCB板上的孔径
3. 贮存
•
在温度25ºC 湿度<40% RH的条件下,存放于原包装袋中.
4. 焊锡
•
最小焊盘面积建议为(P2 LED 0.18X0.18平方英寸及P4 LED 0.18X0.18平方英寸)
•
焊接LED的位置建议在胶体下3mm以外的卡点之下.
•
LED焊锡规格如下(含铅锡及不含铅锡皆适用)
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo
are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
高亮度 LED 焊锡与处理
手工焊锡
浸锡
烙铁功率
最大 35 W
温度
最高 300 ºC
预热温度
最高110 ºC
预热时间
最长60 秒
锡槽温度
最高260 ºC
焊锡总时间
最长3 秒
浸锡时间
最长5 秒
位置
封装底部3 mm以外
位置
封装底部3 mm以外
•
因较难控制焊接时的条件,所以不建议手工焊锡
•
建议波峰焊曲线如下
300
laminar
wave
层流波峰
温度 °C ℃
Temperature
250
200
150
100
上助焊剂
Fluxing
50
30
0
预热
Prehead
10
20
30
40
50
60
70
Times(sec)
80
90
100
110
120
时间(秒)
* 不同的不含铅焊料需依其各自的焊锡条件处理,可联络我们以便提供详情
•
不可使LED封装受压,尤其不要在其受热时受压
•
LED一经插板,便不可重用
•
在焊接LED时,要保护LED封装,免受机械冲击及振动直至温度冷却到低于40 ºC
•
防止LED插脚受到底板扭曲,弯折,剪断造成之机械压力影响
•
当需要夹紧LED焊锡时,最重要需确保LED不要受到机械压力影响
•
须在室温下进行切脚操作,高溫下切腳有可能使LED失效
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
2
高亮度 LED 焊锡与处理
5. 静电释放及 冲击电流
•
静电释放(ESD)及冲击电流(EOS)皆有可能损坏LED.
•
注意处理LED时皆须做好静电防护措施
•
所有器件,设备及机械皆须正确接地
•
建议在最终检查时进行电性测试以检出不良件
•
在电路设计时,尽量消除冲击电流(EOS)隐患.
6. 热量管理
•
在设计使用LED时必须考虑热量管理
使用LED的环境温度不可温高,不然会造成失效。LED的使用环境温度需要参照规格书上相关图表。.
7. 其他
•
小心以避免反向电压超过绝对最高值
•
插脚已上锡,插脚接触硫化氢及其他化学气体质会失光泽,须在洁凈环境贮存以作预防
•
高亮LED亮度很高,须预防直视LED对双眼造成伤害.
•
传统3 mm LED不可进行自动插件操作.
SMD LEDs
1. 清洗
•
不可使用未指定的化学液体清洗SMD LED, 这些化学品可能损害SMD LED. 当必要清洗时, 请将LED在室温下用酒精擦拭并在室温下干
燥15分钟后方可使用.
•
超声波清洗对SMD LED的影响跟超声波功率及SMD LED装配方式有关,须预先检查以保证超声波清洗过程不损害SMD LED方可进行.
2. 防潮包装
•
为防SMD LED 在运输及贮存时吸湿,SMD LED须放于密封防潮袋中,内部放防潮剂以作保护,同时放置湿度卡可显示SMD包装袋内湿度
情况.
3. 贮存
•
使用前不要打开密封包装袋.
•
原密封袋包装可在条件为≤40 ºC 及 ≤90% RH存放12个月,超过存放期便须再烘烤.
•
打开包装袋前,请检查是否漏气.
•
在打开密封袋后,须将SMD LED 置于≤30 ºC及 ≤ 60% RH.条件下,在上述条件下,SMD LED 须在开包24小时内使用回流焊。如放置
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
3
高亮度 LED 焊锡与处理
超过24小时,便需再烘烤.
•
烘烤时,置SMD LED于80ºC±5ºC及相对湿度<=10%RH烤箱内24小时
•
取走包装袋方可再烘烤,烘烤时不可频繁打开烤箱门.
•
更具体的细节请参考对应产品规格书
4. 焊锡
. 以烙铁手工焊锡
•
由于手工焊锡的不确定性,应在实际中尽量避免使用
•
如必需进行,建议使用功率小于25 W烙铁,烙铁温度须保持于315 ºC以下,焊接时间须在2秒以内
•
烙铁焊咀不可以触及SMD LED 的胶体.
•
焊锡时,SMD LED胶体不可受到机械挤压.
•
必需在降温至40ºC以下后方可用手处理SMD LED,以防用手处理时造成机械热压力使LED不良
.回流焊
•
过炉温度曲线(1) 供CLV1A-FKB/CLV1L-FKB/CLV6B-FKB/CLV6D-FKB/CLX6B-FKC/CLX6C-FKB/CLX6D-FKB/CLX6E-FKC/CLX6F-FKC/
CLY6C‑FKC/CLY6D-FKC/CLYBA-FKA SMD LED使用
温度
熔点
回流焊接
预热区
冷却区
時間
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
4
高亮度 LED 焊锡与处理
焊料
•
平均渐升速度
每秒不超过4 ºC
预热温度
150 ºC ~200 ºC
预热时间
最长120秒
渐降速度
每秒不超过6 ºC
峰值温度
最高 250 ºC
峰值以下5 ºC之
时间不超过10秒
217 ºC以上之
时段不超过60秒
.
过炉温度曲线(2)供CLMVB-DKA/CLMVB-FKA/CLMVC-FKA/CLMUC-FKA/CLP6C-FKB/CLV1S-FKB/CLV6A-FKB/CLX6A-FKB/CLVBA-FKA SMD LED及
不在此文件中列出的产品使用
温度
熔点
预热区
浸泡
回流焊接
冷却区
時間
焊料
平均渐升速度
每秒不超过4 ºC
预热温度
150 ºC ~200 ºC
预热时间
最长120秒.
渐降速度
每秒不超过6 ºC.
峰值温度
最高 235 ºC.
峰值以下5 ºC之
时间不超过10秒
217 ºC以上之
时段不超过45秒
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
5
高亮度 LED 焊锡与处理
Theunit
unitisismillimeter
millimeter(mm)
(mm)ininthe
thegraphs
graphsbelow.
below.
The
LM1series
seriesrecommended
recommendedsolder
solderpad
paddesign
designfor
forheat
heatdissipation:
dissipation:
LM1
The unitThe
is millimeter
(mm) in(mm)
the graphs
unit is millimeter
in the below.
graphs below.
•LM1
以下图中焊盘面积之单位均为毫米(mm)
7.0 for
7.0
series
solder
design
for
heat
dissipation:
series
solder
pad below.
design
heat dissipation:
it isLM1
millimeter
(mm)
inrecommended
the graphs
below.
The
unitrecommended
is
millimeter
(mm)
in pad
the
graphs
eries recommended
solder pad design
forpad
heat
dissipation:
LM1 series recommended
solder
design
for heat dissipation:
• 建议焊盘尺寸供散热设计参考(LM1系列):
7.0
7.0
7.0
7.0
2.6
2.6
1.5 1.5
2.6
1.5 1.54.5
4.5
1.5 1.5
0.5
0.5
7.5
0.5
0.5
7.5
7.5
7.5
4.5
4.5
4.5
1.5 1.5
1.5 1.5
4.5 1.5
1.5
2.6
7.50.5
0.5
7.5
2.6
2.6
LM4& &LM2
LM2series
seriesrecommended
recommendedsolder
solderpad
paddesign
designfor
forheat
heatdissipation:
dissipation:
LM4
LM4 & LM2
solder pad
design for heat dissipation:
LM4series
& LM2recommended
series recommended
7.5 solder pad design for heat dissipation:
7.5
& LM2 series
solder pad design
for heat dissipation:
• recommended
LM4
&建议焊盘尺寸供散热设计参考(LM4与LM2系列)
LM2 series recommended
solder
0.5pad design for heat dissipation:
0.5
0.5
2.6
2.6
1.1
2.6
1.1
1.1
1.1
1.1
2.6
2.6
2.6
1.1
7.0
7.0
7.0
0.4
0.4
4.5
4.5
1.5
1.5
4.5
1.5
4.5 1.5
1.5 1.5
1.5 1.5
0.4
0.5
0.47.0
7.0
0.5
4.5
4.5
1.5 1.5
1.5
1.5
7.5
7.0
0.5
7.5
7.5
0.4
0.4
7.5
LV1& &LA1
LA1& &LVB
LVBseries
seriesrecommended
recommendedsolder
solderpad
paddesign
designfor
forheat
heatdissipation:
dissipation:
LV1
• 建议焊盘尺寸供散热设计参考(LV1,LA1,LVB系列)
2.6
1.1
2.6
1.1
1.1 2.6
1.1
1.1
2.6
2.6
1.1
2.6
7.0
0.4
1.65
3.3
7.0 1.65
3.3
1.65
3.3
0.5
0.4
0.5
0.4
3.3
0.51.65
0.4
7.0
7.0
1.65 7.0
0.5
0.4 3.3
0.5
0.4
7.0
0.5
1.65
3.3
LV1 & LA1
solder
design
heatfor
dissipation:
LV1&&LVB
LA1series
& LVBrecommended
series recommended
solder
pad for
design
heat dissipation:
9.5 pad
9.5
LA1 & LVB
solder pad design
forpad
heat
dissipation:
LV1series
& LA1 recommended
& LVB series recommended
solder
design
for heat dissipation:
2.5
0.5
2.5
1.5
2.5
0.5
2.5
1.5
9.5
9.5
4.5
4.5
9.5
2.5
0.5 9.5 0.5
2.5
1.5
2.5
2.5
1.5
1.5 1.5
1.5
1.5
2.5 0.5 2.5 2.5 1.5 2.5
0.5
1.5
4.5
4.5
1.5
1.5
4.5
4.5 1.5
1.5
1.5 1.5
1.5 1.5
LP6series
seriesrecommended
recommendedsolder
solderpad
paddesign
designfor
forheat
heatdissipation:
dissipation:
LP6
LP6 series
solder pad
design
heatfor
dissipation:
LP6recommended
series recommended
solder
pad for
design
heat dissipation:
eries recommended
solder pad design
forpad
heat
dissipation:
LP6 series recommended
solder
design
for heat dissipation:
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
6
高亮度 LED 焊锡与处理
3
3
3
3
5
3
4
A
A
4
5
4
4
A
A
5
4
2.0 1.6 2.0
2.0 1.6 2.0
2
5
2.0 1.6 2.0
2.0 1.6 2.0
2
5
6
8.4
8.4
3.0 2.4
3.0 2.4
2.0 1.6 2.0
2
6
6
1
6.6
6.6
0.5
0.5
2
1
1
0.5
2
1
8.4
8.4
8.4
3.0 2.4
6 3.0 2.4 3.0 2.4
6
0.5
6.6
6.60.5
1
建议焊盘尺寸供散热设计参考(LP6系列)
6.6
•
Note:
Note:
Note: 注意:
Note:
为有效not
Metal area 1,2,3为金属焊盘位置,
at 1,
2, 3 area
should
Metal
at not
1, 2, 3 should
Metal
1, 2,
should
Metal
area
at 1,not
2,23 should not
Metal area
at 1,area
2,散热面积不得少于40 mm2
3 at
should
2 3not
be less than 40mm
lesseach
than
40mm each
for
2 for
2bebe
be less
than
40mm
each40mm
for 2 each for
less
be less than
40mm
each
forthan
sufficient heatsufficient
dissipation.
heat dissipation.
heat
dissipation.
sufficient
heat dissipation.
sufficientsufficient
heat dissipation.
Note:
A
LU6 series recommended
solder pad design
forpad
heat
dissipation:
LU6 series recommended
solder
design
for heat dissipation:
•recommended
建议焊盘尺寸供散热设计参考(LU6系列)
LU6
series
recommended
solder
padfor
design
for
heat
dissipation:
LU6 series
solder
pad
design
for heat dissipation:
LU6 series
solderrecommended
pad
design
heat dissipation:
3
3
4
4
5
5
4
4
5
0.8
0.8
5
5
0.35
0.35
2
Note:
4.7
Note:
Note:
Note: Note:
1.65 1.44.7
Metal area at注意:
1,
2, 3area
should
not
Metal
at 1,
2, 3 should not
1.65 1.4
Metal
area
at
1, 2,
3not
should
Metal
area
at 1,not
2,23 should not
Metal area at 1, 2, 3 should
2
为有效
be less than 1,2,3为金属焊盘位置,
16mm
be lesseach
than
16mm each
for
2 for
2
be less
than
16mm
each16mm
for 2 each for
be
less
be less than
16mm
each
forthan
散热面积不得少于16 mm2
sufficient heatsufficient
dissipation.
heat dissipation.
heat
dissipation.
sufficient
heat dissipation.
sufficientsufficient
heat dissipation.
0.8
0.8
6
0.35
0.35
3
1.8
1.8
1.8
1.8
3
2
1
4.7
6
6 4.71.65 1.4 4.76
1.65 1.4 1.65 1.4
6
4.0
4.0
9.5
0.35 9.5 0.8
3
2
1
4.0
9.5 4.0
9.5
2
1
9.5
2
1.8
1
1
9.4
9.4
9.4
4.0
9.4
9.4
4
Small Top SMD
LM3Top
series
recommended
solder pad design
forpad
heat
dissipation:
Small
SMD
LM3 series recommended
solder
design
for heat dissipation:
•
(小型SMD
LM3系列)
Small
Top
LM3
series
solder
padfor
design
for
heat
dissipation:
Small
Top
SMDrecommended
LM3 series
recommended
solder
pad
design
for heat dissipation:
Small Top
SMD建议焊盘尺寸供散热设计参考
LM3SMD
series
recommended
solder
pad
design
heat dissipation:
9.3
9.3
4.4
4.4
9.3
9.3
9.3
4.4
4.4
4.4
1.55
1.55
1.3
1.3
1.3
1.3
1.3
1.3
1.55
1.55
1.3
1.3
2.2
2.2
2.2
2.2
2.2
4.0
4.0
4.0
4.0
4.0
1.55
1.3
1.3
1.4
1.4
0.9
0.9
1.4
1.4
0.9
1.4
0.9
0.9
Mini side 0.8mm
series
recommended
solder pad design
forpad
heat
dissipation:
MiniSMD
side LS8
0.8mm
SMD
LS8 series recommended
solder
design
for heat dissipation:
sideSMD
0.8mm
SMD
LS8
series
solder
padfor
design
for
heat
dissipation:
Mini
0.8mm
SMDrecommended
LS8 series
solder
pad
design
for heat dissipation:
Mini sideMini
0.8mm
LS8side
series
recommended
solderrecommended
pad
design
heat dissipation:
3.8
3.8
1.0
1.0
3.8
3.8
1.0
1.0 3.8
1.0
1.0
1.0
1.0
1.0
1.0
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
LA6 series recommended
solder pad design
forpad
heat
dissipation:
LA6 series recommended
solder
design
for heat dissipation:
LA6
series recommended
solder
padfor
design
for
heat
dissipation:
LA6 series
solder
pad
design
for heat dissipation:
LA6 series
recommended
solderrecommended
pad
design
heat dissipation:
7
1.3
1.3
1.3
Mini sideMini
0.8mm
sideSMD
0.8mm
LS8
SMD
series
LS8
recommended
series recommended
solder pad
solder
design
pad
fordesign
heat dissipation:
for heat dissipation:
建议焊盘尺寸供散热设计参考
(迷你边型0.8 mm
SMD LS8系列)
1.0
3.8
3.8
1.0
1.0
1.4
0.9
1.4
0.9
1.0
•
2.2
高亮度 LED 焊锡与处理
1.3
•
1.55
2.2
4.0
4.0
1.55
4.5
建议焊盘尺寸供散热设计参考(LA6系列)
1.5 1.5
LA6
series recommended
solder
pad
for 4.5
heat dissipation:
LA6 series
recommended
solder pad
design
fordesign
heat dissipation:
0.8
0.8
2.9
0.8
0.3
0.3
2.9
1.5
0.7 0.8
0.7
1.5
6/13
LB6 series recommended solder pad design for heat dissipation:
建议焊盘尺寸供散热设计参考(LB6系列)
LB6 series recommended solder pad design for heat dissipation:
7.4
1.8
3.8
1.5
0.4
0.4
1.8
3.8
7.4
1.4 1.5
1.5
5.2 1.4 1.5
5.2
•
6/13
LT6 series recommended solder pad design for heat dissipation:
series
recommended
solder
pad design
for heat
dissipation:
Copyright LT6
© 2011-2015
Cree,
Inc. All rights reserved.
The information
in this document
is subject
to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
2.7
1.0
2.7
0.85
8
高亮度 LED 焊锡与处理

建议焊盘尺寸供散热设计参考(LT6 系列)
•
建议焊盘尺寸供散热设计参考(LT6系列)

•
建议焊盘尺寸供散热设计参考(CLMV系列)
2.5
1
0.8
1.9
7/13
0.8
1
LMU series recommended solder pad design for heat dissipation:
2.5
1
0.8
1.9
0.8
1
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
9
高亮度 LED 焊锡与处理
LMU series recommended solder pad design for heat dissipation:
建议焊盘尺寸供散热设计参考(CLMU系列)
LMU series recommended solder pad design for heat
2.5 dissipation:
1
2.5 1
1
0.8
1.9
0.8
1.9
0.8
1
0.8
•
•
LV6 series recommended solder pad design for heat dissipation:
建议焊盘尺寸供散热设计参考(CLV6系列)
LV6 series recommended solder pad design for heat dissipation:
8.2
2.7
2.8
1.7
0.475
0.475 5.65
5.65
1.7 1.3 1.7
1.3 1.7
2.7
2.88.2
LX6 series recommended solder pad design for heat dissipation:
LX6 series recommended solder pad design for heat dissipation:
8/13
8/13
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
10
高亮度 LED 焊锡与处理
•
建议焊盘尺寸供散热设计参考(CLX6系列)
5.0
0.35
0.7
0.7
2.8
0.7
1.8
1.6
•

LY6 series recommended solder pad design for heat dissipation:
建议焊盘尺寸供散热设计参考(CLY6系列)
建议焊盘尺寸供散热设计参考(CLY6 系列)
4.0
0.40
0.5
0.5
0.5
2.3
1.6
1.2
Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications

不建议在焊接后对 SMD LED 进行修正,如修正不可避免,则需以合格人员修正 SMD LED

回流焊不可超过一次
Reflow soldering should not be done more than one time.

must be pre-qualified to avoid damaging SMD LED.
焊锡时封装件不可施加压力
No stress should be exerted on the package during soldering.
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.

焊接完成后的
The PCB shouldPCB
not be需要自然冷却到温度低于
wrapped after soldering to allow40ºC
natural以下方可进行下一步作业(如包装等)
cooling down to 40ºC.
11
高亮度 LED 焊锡与处理
•
不建议在焊接后对SMD LED进行修正,如修正不可避免,则需以合格人员修改SMD LED.
•
回流焊不可超过一次
•
焊锡时封装件不可施加压力
•
焊接完成后的PCB需要自然冷却到温度低于40ºC以下方可进行下一步作业(如包装等)
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
12
高亮度 LED 焊锡与处理
5. 重要事项(小型及迷你边型0.8mm SMD 产品)
•
此类SMD产品封装细少及胶体固化后仍比较柔软,使用者须倍加小心,不可触及SMD产品表面
•
避免损害产品表面及其内部,建议选用特定吸嘴在SMT生产时放置SMD,如需人手操作,提取产品时要倍加小心,可以下列两种方法进
行
图1a,小型SMD
图1b迷你边型0.8mm SMD
•
贴片吸咀
例:CLA1B
对硅胶封装LED组件吸取与放料,建议吸咀用非金属材料,很多成功案例是使用铁氟龙或90d氨基甲酸乙酯制作之吸咀
•
开包前注意事项
1. 拆包前需确认SMD真空包装是否已超过12个月(从FQC PASS印日期算起),如果已经超过,则需拆开重新烘烤。
2. 拆包前请尽量记录下标贴上LOT编号,以利追溯
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
13
高亮度 LED 焊锡与处理
•
真空包装袋从纸箱里面拆出来后,应尽量避免外力破坏真空包装袋,以防袋子漏气,例:如果SMD真空包装袋很多重迭存放在车间,
建议用泡泡袋再包装一下,防止外力破坏真空包装袋。
•
打开真空袋包装前必须确认袋子有无漏气
•
推荐的开包方法:剪刀沿着袋子封口印整齐剪开,以利在24小时内未有用完时便于重新包装好)
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
14
高亮度 LED 焊锡与处理
•
开包装后注意事项
1. 袋子开包装后,应立即确认湿度卡30%处是否变色,若30%处开始变成浅绿或浅蓝色,该包产品需重新烘烤
正常
变色
2. 产品开包装后请立即在轴上标示开包日期和时间等数据
3. 产品需要确保开包后24小时内用完
4. 未用完的产品重新抽真空包装,以防止产品吸湿,再次使用前必须烘烤
•
综合下列状况发生时需要重烤
1. SMD真空包装袋上FQC日期印已超12个月.
2. SMD真空包装袋漏气
3. SMD真空包装袋拆包后,立即确认时发现湿度卡30%点处变浅绿或浅蓝色
4. SMD产品开包后未有按 “开包装后注意事项” 4项执行
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
15
高亮度 LED 焊锡与处理
•
烘烤方法
1. 材料要从真空包装袋内拿出来烘烤,且烘烤条件为80度24小时,烘烤过程中,尽量避免打开烤箱。
2. 烘烤时用棍子串起来并挂着,材料上下两端避免接触到金属支架,以防卷轴变形。
小卷轴烘烤方式
大卷轴烘烤方式
3. 烘烤后的产品在烤箱内冷却到温度低于40 ºC再使用.
6. 静电释放及 冲击电流
•
静电释放(ESD)及冲击电流(EOS)皆有可能损坏LED
•
注意处理LED时皆须做好静电防护措施
•
所有器件,设备及机械皆须正确接地
•
建议在最终检查时进行电性测试以检出不良件
•
在电路设计时,尽量消除冲击电流(EOS)隐患
7. 热量管理
•
在设计使用LED时必须考虑热量管理
使用LED的环境温度不可温高,不然会造成失效。LED的使用环境温度需要参照规格书上相关图表。
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
16
高亮度 LED 焊锡与处理
8. SMD屏幕产品防潮等级
产品类别:
型号:
防潮等级:
CLMVB-DKA
CLMVB-FKA
CLMVC-FKA
CLMUC-FKA
CLP6C-FKB
CLV1A-FKB
CLV1L-FKB
CLV1S-FKB
CLV6A-FKB
CLV6B-FKB
SMD LEDs
CLV6D-FKB
5a
CLVBA-FKA
CLX6A-FKB
CLX6B-FKC
CLX6C-FKB
CLX6D-FKB
CLX6E-FKC
CLX6F-FKC
CLY6C-FKC
CLY6D-FKC
CLYBA-FKA
本内容发生改动将不会预先通知
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
17