Cree® 高亮度 LED 焊锡与处理 CLD-CTAP001 Rev 22 焊锡与处理 要点: 发布此文件目的是向客户及使用者提供我公司LED简明准确的使用方法 描述 一般而言,LED可以按照与普通用途的半导体器件相类似方法使用。当使用CREE灯时,必须采取下列措施来保护LED. P2 与 P4 LEDs 1. 清洗 • 不可使用未指定的化学溶液清洗LED, 这些化学品可能损害LED. 当必需清洗时,请将LED在室温下用酒精擦拭并在室温下干燥15分 钟后方可使用. • 超声波清洗对LED的影响跟超声波功率及LED装配方式有关,须预先检查超声波清洗过程不损害LED方可进行. 2. 成形 • 灯脚成形时,弯曲成形的位置最少距封装底部3mm • 不可在上锡时或上锡后弯脚成形,如需成形必须在上锡前进行 • 灯脚成形时,须避免LED封装胶体受压破裂 • LED上PCB时,LED灯脚必须对准PCB板上的孔径 3. 贮存 • 在温度25ºC 湿度<40% RH的条件下,存放于原包装袋中. 4. 焊锡 • 最小焊盘面积建议为(P2 LED 0.18X0.18平方英寸及P4 LED 0.18X0.18平方英寸) • 焊接LED的位置建议在胶体下3mm以外的卡点之下. • LED焊锡规格如下(含铅锡及不含铅锡皆适用) Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 高亮度 LED 焊锡与处理 手工焊锡 浸锡 烙铁功率 最大 35 W 温度 最高 300 ºC 预热温度 最高110 ºC 预热时间 最长60 秒 锡槽温度 最高260 ºC 焊锡总时间 最长3 秒 浸锡时间 最长5 秒 位置 封装底部3 mm以外 位置 封装底部3 mm以外 • 因较难控制焊接时的条件,所以不建议手工焊锡 • 建议波峰焊曲线如下 300 laminar wave 层流波峰 温度 °C ℃ Temperature 250 200 150 100 上助焊剂 Fluxing 50 30 0 预热 Prehead 10 20 30 40 50 60 70 Times(sec) 80 90 100 110 120 时间(秒) * 不同的不含铅焊料需依其各自的焊锡条件处理,可联络我们以便提供详情 • 不可使LED封装受压,尤其不要在其受热时受压 • LED一经插板,便不可重用 • 在焊接LED时,要保护LED封装,免受机械冲击及振动直至温度冷却到低于40 ºC • 防止LED插脚受到底板扭曲,弯折,剪断造成之机械压力影响 • 当需要夹紧LED焊锡时,最重要需确保LED不要受到机械压力影响 • 须在室温下进行切脚操作,高溫下切腳有可能使LED失效 Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 2 高亮度 LED 焊锡与处理 5. 静电释放及 冲击电流 • 静电释放(ESD)及冲击电流(EOS)皆有可能损坏LED. • 注意处理LED时皆须做好静电防护措施 • 所有器件,设备及机械皆须正确接地 • 建议在最终检查时进行电性测试以检出不良件 • 在电路设计时,尽量消除冲击电流(EOS)隐患. 6. 热量管理 • 在设计使用LED时必须考虑热量管理 使用LED的环境温度不可温高,不然会造成失效。LED的使用环境温度需要参照规格书上相关图表。. 7. 其他 • 小心以避免反向电压超过绝对最高值 • 插脚已上锡,插脚接触硫化氢及其他化学气体质会失光泽,须在洁凈环境贮存以作预防 • 高亮LED亮度很高,须预防直视LED对双眼造成伤害. • 传统3 mm LED不可进行自动插件操作. SMD LEDs 1. 清洗 • 不可使用未指定的化学液体清洗SMD LED, 这些化学品可能损害SMD LED. 当必要清洗时, 请将LED在室温下用酒精擦拭并在室温下干 燥15分钟后方可使用. • 超声波清洗对SMD LED的影响跟超声波功率及SMD LED装配方式有关,须预先检查以保证超声波清洗过程不损害SMD LED方可进行. 2. 防潮包装 • 为防SMD LED 在运输及贮存时吸湿,SMD LED须放于密封防潮袋中,内部放防潮剂以作保护,同时放置湿度卡可显示SMD包装袋内湿度 情况. 3. 贮存 • 使用前不要打开密封包装袋. • 原密封袋包装可在条件为≤40 ºC 及 ≤90% RH存放12个月,超过存放期便须再烘烤. • 打开包装袋前,请检查是否漏气. • 在打开密封袋后,须将SMD LED 置于≤30 ºC及 ≤ 60% RH.条件下,在上述条件下,SMD LED 须在开包24小时内使用回流焊。如放置 Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 3 高亮度 LED 焊锡与处理 超过24小时,便需再烘烤. • 烘烤时,置SMD LED于80ºC±5ºC及相对湿度<=10%RH烤箱内24小时 • 取走包装袋方可再烘烤,烘烤时不可频繁打开烤箱门. • 更具体的细节请参考对应产品规格书 4. 焊锡 . 以烙铁手工焊锡 • 由于手工焊锡的不确定性,应在实际中尽量避免使用 • 如必需进行,建议使用功率小于25 W烙铁,烙铁温度须保持于315 ºC以下,焊接时间须在2秒以内 • 烙铁焊咀不可以触及SMD LED 的胶体. • 焊锡时,SMD LED胶体不可受到机械挤压. • 必需在降温至40ºC以下后方可用手处理SMD LED,以防用手处理时造成机械热压力使LED不良 .回流焊 • 过炉温度曲线(1) 供CLV1A-FKB/CLV1L-FKB/CLV6B-FKB/CLV6D-FKB/CLX6B-FKC/CLX6C-FKB/CLX6D-FKB/CLX6E-FKC/CLX6F-FKC/ CLY6C‑FKC/CLY6D-FKC/CLYBA-FKA SMD LED使用 温度 熔点 回流焊接 预热区 冷却区 時間 Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 4 高亮度 LED 焊锡与处理 焊料 • 平均渐升速度 每秒不超过4 ºC 预热温度 150 ºC ~200 ºC 预热时间 最长120秒 渐降速度 每秒不超过6 ºC 峰值温度 最高 250 ºC 峰值以下5 ºC之 时间不超过10秒 217 ºC以上之 时段不超过60秒 . 过炉温度曲线(2)供CLMVB-DKA/CLMVB-FKA/CLMVC-FKA/CLMUC-FKA/CLP6C-FKB/CLV1S-FKB/CLV6A-FKB/CLX6A-FKB/CLVBA-FKA SMD LED及 不在此文件中列出的产品使用 温度 熔点 预热区 浸泡 回流焊接 冷却区 時間 焊料 平均渐升速度 每秒不超过4 ºC 预热温度 150 ºC ~200 ºC 预热时间 最长120秒. 渐降速度 每秒不超过6 ºC. 峰值温度 最高 235 ºC. 峰值以下5 ºC之 时间不超过10秒 217 ºC以上之 时段不超过45秒 Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 5 高亮度 LED 焊锡与处理 Theunit unitisismillimeter millimeter(mm) (mm)ininthe thegraphs graphsbelow. below. The LM1series seriesrecommended recommendedsolder solderpad paddesign designfor forheat heatdissipation: dissipation: LM1 The unitThe is millimeter (mm) in(mm) the graphs unit is millimeter in the below. graphs below. •LM1 以下图中焊盘面积之单位均为毫米(mm) 7.0 for 7.0 series solder design for heat dissipation: series solder pad below. design heat dissipation: it isLM1 millimeter (mm) inrecommended the graphs below. The unitrecommended is millimeter (mm) in pad the graphs eries recommended solder pad design forpad heat dissipation: LM1 series recommended solder design for heat dissipation: • 建议焊盘尺寸供散热设计参考(LM1系列): 7.0 7.0 7.0 7.0 2.6 2.6 1.5 1.5 2.6 1.5 1.54.5 4.5 1.5 1.5 0.5 0.5 7.5 0.5 0.5 7.5 7.5 7.5 4.5 4.5 4.5 1.5 1.5 1.5 1.5 4.5 1.5 1.5 2.6 7.50.5 0.5 7.5 2.6 2.6 LM4& &LM2 LM2series seriesrecommended recommendedsolder solderpad paddesign designfor forheat heatdissipation: dissipation: LM4 LM4 & LM2 solder pad design for heat dissipation: LM4series & LM2recommended series recommended 7.5 solder pad design for heat dissipation: 7.5 & LM2 series solder pad design for heat dissipation: • recommended LM4 &建议焊盘尺寸供散热设计参考(LM4与LM2系列) LM2 series recommended solder 0.5pad design for heat dissipation: 0.5 0.5 2.6 2.6 1.1 2.6 1.1 1.1 1.1 1.1 2.6 2.6 2.6 1.1 7.0 7.0 7.0 0.4 0.4 4.5 4.5 1.5 1.5 4.5 1.5 4.5 1.5 1.5 1.5 1.5 1.5 0.4 0.5 0.47.0 7.0 0.5 4.5 4.5 1.5 1.5 1.5 1.5 7.5 7.0 0.5 7.5 7.5 0.4 0.4 7.5 LV1& &LA1 LA1& &LVB LVBseries seriesrecommended recommendedsolder solderpad paddesign designfor forheat heatdissipation: dissipation: LV1 • 建议焊盘尺寸供散热设计参考(LV1,LA1,LVB系列) 2.6 1.1 2.6 1.1 1.1 2.6 1.1 1.1 2.6 2.6 1.1 2.6 7.0 0.4 1.65 3.3 7.0 1.65 3.3 1.65 3.3 0.5 0.4 0.5 0.4 3.3 0.51.65 0.4 7.0 7.0 1.65 7.0 0.5 0.4 3.3 0.5 0.4 7.0 0.5 1.65 3.3 LV1 & LA1 solder design heatfor dissipation: LV1&&LVB LA1series & LVBrecommended series recommended solder pad for design heat dissipation: 9.5 pad 9.5 LA1 & LVB solder pad design forpad heat dissipation: LV1series & LA1 recommended & LVB series recommended solder design for heat dissipation: 2.5 0.5 2.5 1.5 2.5 0.5 2.5 1.5 9.5 9.5 4.5 4.5 9.5 2.5 0.5 9.5 0.5 2.5 1.5 2.5 2.5 1.5 1.5 1.5 1.5 1.5 2.5 0.5 2.5 2.5 1.5 2.5 0.5 1.5 4.5 4.5 1.5 1.5 4.5 4.5 1.5 1.5 1.5 1.5 1.5 1.5 LP6series seriesrecommended recommendedsolder solderpad paddesign designfor forheat heatdissipation: dissipation: LP6 LP6 series solder pad design heatfor dissipation: LP6recommended series recommended solder pad for design heat dissipation: eries recommended solder pad design forpad heat dissipation: LP6 series recommended solder design for heat dissipation: Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 6 高亮度 LED 焊锡与处理 3 3 3 3 5 3 4 A A 4 5 4 4 A A 5 4 2.0 1.6 2.0 2.0 1.6 2.0 2 5 2.0 1.6 2.0 2.0 1.6 2.0 2 5 6 8.4 8.4 3.0 2.4 3.0 2.4 2.0 1.6 2.0 2 6 6 1 6.6 6.6 0.5 0.5 2 1 1 0.5 2 1 8.4 8.4 8.4 3.0 2.4 6 3.0 2.4 3.0 2.4 6 0.5 6.6 6.60.5 1 建议焊盘尺寸供散热设计参考(LP6系列) 6.6 • Note: Note: Note: 注意: Note: 为有效not Metal area 1,2,3为金属焊盘位置, at 1, 2, 3 area should Metal at not 1, 2, 3 should Metal 1, 2, should Metal area at 1,not 2,23 should not Metal area at 1,area 2,散热面积不得少于40 mm2 3 at should 2 3not be less than 40mm lesseach than 40mm each for 2 for 2bebe be less than 40mm each40mm for 2 each for less be less than 40mm each forthan sufficient heatsufficient dissipation. heat dissipation. heat dissipation. sufficient heat dissipation. sufficientsufficient heat dissipation. Note: A LU6 series recommended solder pad design forpad heat dissipation: LU6 series recommended solder design for heat dissipation: •recommended 建议焊盘尺寸供散热设计参考(LU6系列) LU6 series recommended solder padfor design for heat dissipation: LU6 series solder pad design for heat dissipation: LU6 series solderrecommended pad design heat dissipation: 3 3 4 4 5 5 4 4 5 0.8 0.8 5 5 0.35 0.35 2 Note: 4.7 Note: Note: Note: Note: 1.65 1.44.7 Metal area at注意: 1, 2, 3area should not Metal at 1, 2, 3 should not 1.65 1.4 Metal area at 1, 2, 3not should Metal area at 1,not 2,23 should not Metal area at 1, 2, 3 should 2 为有效 be less than 1,2,3为金属焊盘位置, 16mm be lesseach than 16mm each for 2 for 2 be less than 16mm each16mm for 2 each for be less be less than 16mm each forthan 散热面积不得少于16 mm2 sufficient heatsufficient dissipation. heat dissipation. heat dissipation. sufficient heat dissipation. sufficientsufficient heat dissipation. 0.8 0.8 6 0.35 0.35 3 1.8 1.8 1.8 1.8 3 2 1 4.7 6 6 4.71.65 1.4 4.76 1.65 1.4 1.65 1.4 6 4.0 4.0 9.5 0.35 9.5 0.8 3 2 1 4.0 9.5 4.0 9.5 2 1 9.5 2 1.8 1 1 9.4 9.4 9.4 4.0 9.4 9.4 4 Small Top SMD LM3Top series recommended solder pad design forpad heat dissipation: Small SMD LM3 series recommended solder design for heat dissipation: • (小型SMD LM3系列) Small Top LM3 series solder padfor design for heat dissipation: Small Top SMDrecommended LM3 series recommended solder pad design for heat dissipation: Small Top SMD建议焊盘尺寸供散热设计参考 LM3SMD series recommended solder pad design heat dissipation: 9.3 9.3 4.4 4.4 9.3 9.3 9.3 4.4 4.4 4.4 1.55 1.55 1.3 1.3 1.3 1.3 1.3 1.3 1.55 1.55 1.3 1.3 2.2 2.2 2.2 2.2 2.2 4.0 4.0 4.0 4.0 4.0 1.55 1.3 1.3 1.4 1.4 0.9 0.9 1.4 1.4 0.9 1.4 0.9 0.9 Mini side 0.8mm series recommended solder pad design forpad heat dissipation: MiniSMD side LS8 0.8mm SMD LS8 series recommended solder design for heat dissipation: sideSMD 0.8mm SMD LS8 series solder padfor design for heat dissipation: Mini 0.8mm SMDrecommended LS8 series solder pad design for heat dissipation: Mini sideMini 0.8mm LS8side series recommended solderrecommended pad design heat dissipation: 3.8 3.8 1.0 1.0 3.8 3.8 1.0 1.0 3.8 1.0 1.0 1.0 1.0 1.0 1.0 Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. LA6 series recommended solder pad design forpad heat dissipation: LA6 series recommended solder design for heat dissipation: LA6 series recommended solder padfor design for heat dissipation: LA6 series solder pad design for heat dissipation: LA6 series recommended solderrecommended pad design heat dissipation: 7 1.3 1.3 1.3 Mini sideMini 0.8mm sideSMD 0.8mm LS8 SMD series LS8 recommended series recommended solder pad solder design pad fordesign heat dissipation: for heat dissipation: 建议焊盘尺寸供散热设计参考 (迷你边型0.8 mm SMD LS8系列) 1.0 3.8 3.8 1.0 1.0 1.4 0.9 1.4 0.9 1.0 • 2.2 高亮度 LED 焊锡与处理 1.3 • 1.55 2.2 4.0 4.0 1.55 4.5 建议焊盘尺寸供散热设计参考(LA6系列) 1.5 1.5 LA6 series recommended solder pad for 4.5 heat dissipation: LA6 series recommended solder pad design fordesign heat dissipation: 0.8 0.8 2.9 0.8 0.3 0.3 2.9 1.5 0.7 0.8 0.7 1.5 6/13 LB6 series recommended solder pad design for heat dissipation: 建议焊盘尺寸供散热设计参考(LB6系列) LB6 series recommended solder pad design for heat dissipation: 7.4 1.8 3.8 1.5 0.4 0.4 1.8 3.8 7.4 1.4 1.5 1.5 5.2 1.4 1.5 5.2 • 6/13 LT6 series recommended solder pad design for heat dissipation: series recommended solder pad design for heat dissipation: Copyright LT6 © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 2.7 1.0 2.7 0.85 8 高亮度 LED 焊锡与处理 建议焊盘尺寸供散热设计参考(LT6 系列) • 建议焊盘尺寸供散热设计参考(LT6系列) • 建议焊盘尺寸供散热设计参考(CLMV系列) 2.5 1 0.8 1.9 7/13 0.8 1 LMU series recommended solder pad design for heat dissipation: 2.5 1 0.8 1.9 0.8 1 Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 9 高亮度 LED 焊锡与处理 LMU series recommended solder pad design for heat dissipation: 建议焊盘尺寸供散热设计参考(CLMU系列) LMU series recommended solder pad design for heat 2.5 dissipation: 1 2.5 1 1 0.8 1.9 0.8 1.9 0.8 1 0.8 • • LV6 series recommended solder pad design for heat dissipation: 建议焊盘尺寸供散热设计参考(CLV6系列) LV6 series recommended solder pad design for heat dissipation: 8.2 2.7 2.8 1.7 0.475 0.475 5.65 5.65 1.7 1.3 1.7 1.3 1.7 2.7 2.88.2 LX6 series recommended solder pad design for heat dissipation: LX6 series recommended solder pad design for heat dissipation: 8/13 8/13 Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 10 高亮度 LED 焊锡与处理 • 建议焊盘尺寸供散热设计参考(CLX6系列) 5.0 0.35 0.7 0.7 2.8 0.7 1.8 1.6 • LY6 series recommended solder pad design for heat dissipation: 建议焊盘尺寸供散热设计参考(CLY6系列) 建议焊盘尺寸供散热设计参考(CLY6 系列) 4.0 0.40 0.5 0.5 0.5 2.3 1.6 1.2 Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications 不建议在焊接后对 SMD LED 进行修正,如修正不可避免,则需以合格人员修正 SMD LED 回流焊不可超过一次 Reflow soldering should not be done more than one time. must be pre-qualified to avoid damaging SMD LED. 焊锡时封装件不可施加压力 No stress should be exerted on the package during soldering. Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 焊接完成后的 The PCB shouldPCB not be需要自然冷却到温度低于 wrapped after soldering to allow40ºC natural以下方可进行下一步作业(如包装等) cooling down to 40ºC. 11 高亮度 LED 焊锡与处理 • 不建议在焊接后对SMD LED进行修正,如修正不可避免,则需以合格人员修改SMD LED. • 回流焊不可超过一次 • 焊锡时封装件不可施加压力 • 焊接完成后的PCB需要自然冷却到温度低于40ºC以下方可进行下一步作业(如包装等) Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 12 高亮度 LED 焊锡与处理 5. 重要事项(小型及迷你边型0.8mm SMD 产品) • 此类SMD产品封装细少及胶体固化后仍比较柔软,使用者须倍加小心,不可触及SMD产品表面 • 避免损害产品表面及其内部,建议选用特定吸嘴在SMT生产时放置SMD,如需人手操作,提取产品时要倍加小心,可以下列两种方法进 行 图1a,小型SMD 图1b迷你边型0.8mm SMD • 贴片吸咀 例:CLA1B 对硅胶封装LED组件吸取与放料,建议吸咀用非金属材料,很多成功案例是使用铁氟龙或90d氨基甲酸乙酯制作之吸咀 • 开包前注意事项 1. 拆包前需确认SMD真空包装是否已超过12个月(从FQC PASS印日期算起),如果已经超过,则需拆开重新烘烤。 2. 拆包前请尽量记录下标贴上LOT编号,以利追溯 Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 13 高亮度 LED 焊锡与处理 • 真空包装袋从纸箱里面拆出来后,应尽量避免外力破坏真空包装袋,以防袋子漏气,例:如果SMD真空包装袋很多重迭存放在车间, 建议用泡泡袋再包装一下,防止外力破坏真空包装袋。 • 打开真空袋包装前必须确认袋子有无漏气 • 推荐的开包方法:剪刀沿着袋子封口印整齐剪开,以利在24小时内未有用完时便于重新包装好) Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 14 高亮度 LED 焊锡与处理 • 开包装后注意事项 1. 袋子开包装后,应立即确认湿度卡30%处是否变色,若30%处开始变成浅绿或浅蓝色,该包产品需重新烘烤 正常 变色 2. 产品开包装后请立即在轴上标示开包日期和时间等数据 3. 产品需要确保开包后24小时内用完 4. 未用完的产品重新抽真空包装,以防止产品吸湿,再次使用前必须烘烤 • 综合下列状况发生时需要重烤 1. SMD真空包装袋上FQC日期印已超12个月. 2. SMD真空包装袋漏气 3. SMD真空包装袋拆包后,立即确认时发现湿度卡30%点处变浅绿或浅蓝色 4. SMD产品开包后未有按 “开包装后注意事项” 4项执行 Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 15 高亮度 LED 焊锡与处理 • 烘烤方法 1. 材料要从真空包装袋内拿出来烘烤,且烘烤条件为80度24小时,烘烤过程中,尽量避免打开烤箱。 2. 烘烤时用棍子串起来并挂着,材料上下两端避免接触到金属支架,以防卷轴变形。 小卷轴烘烤方式 大卷轴烘烤方式 3. 烘烤后的产品在烤箱内冷却到温度低于40 ºC再使用. 6. 静电释放及 冲击电流 • 静电释放(ESD)及冲击电流(EOS)皆有可能损坏LED • 注意处理LED时皆须做好静电防护措施 • 所有器件,设备及机械皆须正确接地 • 建议在最终检查时进行电性测试以检出不良件 • 在电路设计时,尽量消除冲击电流(EOS)隐患 7. 热量管理 • 在设计使用LED时必须考虑热量管理 使用LED的环境温度不可温高,不然会造成失效。LED的使用环境温度需要参照规格书上相关图表。 Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 16 高亮度 LED 焊锡与处理 8. SMD屏幕产品防潮等级 产品类别: 型号: 防潮等级: CLMVB-DKA CLMVB-FKA CLMVC-FKA CLMUC-FKA CLP6C-FKB CLV1A-FKB CLV1L-FKB CLV1S-FKB CLV6A-FKB CLV6B-FKB SMD LEDs CLV6D-FKB 5a CLVBA-FKA CLX6A-FKB CLX6B-FKC CLX6C-FKB CLX6D-FKB CLX6E-FKC CLX6F-FKC CLY6C-FKC CLY6D-FKC CLYBA-FKA 本内容发生改动将不会预先通知 Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc. 17