Cree® XLamp® XQ-B LED PRODUCT DESCRIPTION FEATURES Table of Contents Cree XLamp® XQ-B LEDs revolutionize • Cree’s smallest lighting class LED: Characteristics........................................ 2 mid-power LEDs by delivering lighting- Flux Characteristics................................ 2 class reliability and a wider spread of • Available in white, 80-minimum CRI light than typical plastic packages. The white and 70-minimum CRI cool Relative Flux vs. Junction XQ-B’s innovative wide light emission white Temperature............................................ 3 Relative Spectral Power Distribution..... 3 enables a smooth look in replacement • 300 mA maximum drive current Electrical Characteristics........................ 4 tubes and panel lights while reducing • Low thermal resistance: 17 °C/W Relative Flux vs. Current......................... 4 system cost by using fewer LEDs. • Wide viewing angle: 140° Typical Spatial Distribution..................... 5 • Reflow solderable - JEDEC Thermal Design....................................... 5 J‑STD‑020C compatible Reflow Soldering Characteristics........... 6 Using Cree’s newest generation of silicon carbide-based LED chips, XQ-B is • Unlimited floor life at ≤ 30 °C/85% RH Notes....................................................... 7 optimized to dramatically lower system • RoHS- and REACh‑compliant Mechanical Dimensions......................... 9 cost in non-directional and outdoor area • UL recognized component Tape and Reel........................................ 10 lighting applications. www.cree.com/Xlamp 1.6 X 1.6 X 1.6 mm ® (E349212) Packaging.............................................. 11 Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 1 CLD-DS57 Rev 3E Product family data sheet XLamp ® XQ-B LED Characteristics Characteristics Unit Thermal resistance, junction to solder point °C/W 17 degrees. 140 mV/°C -2.0 Viewing angle (FWHM) Temperature coefficient of voltage Minimum ESD classification (HBM per Mil-Std-883D) Typical Maximum Class 1 DC forward current mA Reverse voltage V Forward voltage (@ 80 mA, 25 °C) V LED junction temperature °C 80 300 -5 3.0 3.4 150 Flux Characteristics (TJ = 25 °C) The following table provides several base order codes for XLamp XQ-B LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the ordercode nomenclature, please consult the XLamp XQ LED Family Binning and Labeling document. Color CCT Range Minimum Luminous Flux @ 80 mA Calculated Minimum Luminous Flux (lm)* Order Code Min. Max. Group Flux (lm) 150 mA Cool White 5000 K 8300 K K2 30.6 52.5 XQBAWT-00-0000-00000L051 Neutral White 3700 K 5000 K K2 30.6 52.5 XQBAWT-00-0000-00000H0E5 J3 26.8 46 XQBAWT-00-0000-00000HXE5 Warm White 2600 K 3700 K J3 26.8 46 XQBAWT-00-0000-00000HXE7 Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. See the Measurements section (page 7). • Typical CRI for Neutral White, 3700 K - 5000 K CCT is 75. • Typical CRI for Warm White, 2600 K - 3700 K CCT is 80. • Minimum CRI for 70 CRI Minimum Cool White is 70. • Minimum CRI for 80 CRI Minimum White is 80. * Calculated flux values at 150 mA are for reference only. Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 2 XLamp ® XQ-B LED Relative Spectral Power Relative Spectral Power Distribution Relative Radiant Power (%) 100 80 60 Cool White Neutral White Warm White 40 20 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) Relative Flux Output vs. Junction Temperature Relative Flux vs. Junction Temperature (IF = 80 mA) 100 Relative Luminous Flux (%) 90 80 70 60 50 40 30 20 10 0 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 3 XLamp ® XQ-B LED Electrical Characteristics (Tj = 25°C) Electrical Characteristics (TJ = 25 °C) parallel 300 Forward Current (mA) 250 200 150 100 50 0 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 Forward Voltage (V) Relative Intensity vs. Current (Tj = 25°C) parallel Relative Flux vs. Current (TJ = 25 °C) Relative Luminous Flux (%) 300 250 200 150 100 50 0 0 50 100 150 200 250 300 Forward Current (mA) Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 4 XLamp ® XQ-B LED Typical Spatial Radiation Pattern Typical Spatial Distribution 110 Relative Luminous Intensity (%) 100 90 80 70 60 50 40 30 20 10 -90 -70 -50 -30 -10 0 10 30 50 70 90 Angle (º) Thermal Design Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product parallelto be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 350 Maximum Current (mA) 300 250 200 150 Rj-a = 20°C/W 100 Rj-a = 25°C/W Rj-a = 30°C/W 50 Rj-a = 35°C/W 0 0 20 40 60 80 100 120 140 160 Ambient Temperature (ºC) Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 5 XLamp ® XQ-B LED Reflow Soldering Characteristics In testing, Cree has found XLamp XQ-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 t 25˚C to Peak IPC/JEDEC J-STD-020C Time Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Lead-Free Solder 1.2 °C/second Preheat: Temperature Min (Tsmin) 120 °C Preheat: Temperature Max (Tsmax) 170 °C Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) 65-150 seconds 217 °C 45-90 seconds 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 6 XLamp ® XQ-B LED Notes Measurements The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are provided for informational purposes only and are not intended as specifications. Pre‑Release Qualification Testing Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs. Lumen Maintenance Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document. Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting. Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp XQ-B LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the original MBP. RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of www.cree.com. REACh Compliance REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request. Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 7 XLamp ® XQ-B LED Notes - Continued UL® Recognized Component Level 1 enclosure consideration. The LED package or a portion thereof has not been investigated as a fire enclosure or a fire and electrical enclosure per ANSI/UL 8750. Vision Advisory WARNING: Do not look at exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please refer to the LED Eye Safety application note. Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 8 XLamp ® XQ-B LED 66 6 55 5 4 Mechanical Dimensions 44 33 3 22 2 11 1 REVISONS REVISONSREVISONS NOTICE NOTICE NOTICE CREECONFIDENTIAL. CONFIDENTIAL. THIS PLOT AND THEINFORMATION INFORMATION CONFIDENTIAL. THIS PLOT AND THEAND INFORMATION CREE THIS PLOT THE CONTAINED WITHIN ARETHE THEPROPRIETARY PROPRIETARY AND AINED WITHIN ARE THEARE PROPRIETARY AND CONTAINED WITHIN AND CONFIDENTIAL INFORMATION OF CREE, INC. THISPLOT PLOT DENTIAL INFORMATION OF CREE, INC. THIS PLOT CONFIDENTIAL INFORMATION OF CREE, INC. THIS MAY NOTBE BECOPIED, COPIED,REPRODUCED REPRODUCED ORDISCLOSED DISCLOSED TOANY ANY OT BE COPIED, REPRODUCED OR DISCLOSED TO ANY TO MAY NOT OR UNAUTHORIZED PERSON WITHOUT THEWRITTEN WRITTEN CONSENT THORIZED PERSONPERSON WITHOUT THE WRITTEN CONSENT UNAUTHORIZED WITHOUT THE CONSENT OF CREEINC. INC. EEOF INC. CREE REV REV REV BY DATE BY BY DESCRIPTION DESCRIPTION DESCRIPTION DATE APP'D DATE A AP All dimensions in mm. 1.60 Measurement tolerances unless indicated otherwise: ±13 mm 1.60 DD .375 1.60 1.60 1.60 R.936 1.60 1.60 .375 1.60 1.60 .600 .600 .600 .600 R.936 .600 .600 D NOTCH ISON ON NOTCHNOTCH IS ON IS CATHODE (-)SIDE SIDE CATHODE (-) SIDE(-) CATHODE 1.60 1.41 1.5 1.500 1.500 1.500 1.41 1.41 C CC 1.60± .05 .05 1.60± .05 1.60± 1.58 .300 ±.08 1.500 1.500 1.500 1.500 .300 .65 .300 .65 .65 .30 .30 .30 .65 .300 B SOLDER PAD SOLDER PAD REFERENCEREFERENCE .30 3.300 3.300 3.300 1.60 1.60 1.60 1.60 3.300 1.60 1.60 1.60 3.300 3.300 3.300 A DRAWN BY RECOMMENDED TRACELAYOUT LAYOUT TRACETRACE LAYOUT Recommended RECOMMENDED PCB RECOMMENDED solder pad RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED PC BOARD SOLDER PAD 66 3.300 1.60 1.60 RECOMMENDED PCBOARD BOARD SOLDER PAD RECOMMENDED PC BOARD SOLDER PAD PAD RECOMMENDED PC SOLDER 6 ±.08 1.500 SOLDER PAD SOLDER PAD PAD SOLDER REFERENCE REFERENCE REFERENCE .65 .30 B 1.60 .300 .300 .300 .300 1.58 5 55 4 44 DATE DATE DRAWN BY DATE DRAWN BY UNLESSOTHERWISE OTHERWISE SPECIFIED UNLESS OTHERWISE SPECIFIED SPECIFIED UNLESS CRONIN 5/23/12 5/23/12 5/23/12 DIMENSIONS AREININD. CRONIND.D.CRONIN DIMENSIONS ARE IN DIMENSIONS ARE CHECK DATE CHECK DATE DATE MILLIMETERS ANDAFTER AFTER FINISH. CHECK MILLIMETERS AND AFTERAND FINISH. MILLIMETERS FINISH. TOLERANCE UNLESS SPECIFIED: -TOLERANCE UNLESS SPECIFIED: ---- ----TOLERANCE UNLESS SPECIFIED: .XX ± ± .25 .25 .XX ± .25 .XX APPROVED DATE DATE APPROVED DATE APPROVED .XXX ± ± .125 .125 TITLE .XXX ± .XXX .125 -------X° ± .5X°° ± ± X° .5.5° ° THIRD ANGLEPROJECTION PROJECTION THIRD ANGLE PROJECTION THIRD ANGLE MATERIAL MATERIAL FORSHEET SHEET METAL PARTS ONLY MATERIAL FOR SHEETFOR METAL PARTS ONLY METAL PARTS ONLY .X ± ± 1.5 .X ± 1.5 .X 1.5 SIZE .XX ± ± .75 .75 .XX ± .75 .XX .XXX ± ± .25 .25 .XXX ± .XXX .25 FINAL PROTECTIVE FINISH FINAL PROTECTIVE FINISH FINAL PROTECTIVE FINISH X° ± .5X°° ± ± X° .5.5° ° 3.300 3.300 -- ---- 1.6 1.6 FINISH: 1.6 SURFACE SURFACE FINISH: SURFACE FINISH: -- ---- RECOMMENDED TRACE LAYOUT TRACE 3 2LAYOUT 33 RECOMMENDED 22 Recommended trace layout C SCALE 4600 Silicon Drive 4600 Silicon Drive 4600 Silicon Drive Durham, N.C 27703 Durham, N.C 27703 Durham, N.C 27703 Phone (919) 313-530 Phone (919) 313-5300 Phone (919) 313-5300 Fax (919) 313-5558 Fax (919) 313-5558 Fax (919) 313-5558 A TITLE TITLE XQxOUTLINE OUTLINE XQx OUTLINE XQx REV. DRAWING NO. SIZE DRAWING NO.DRAWING NO. SIZE C C SCALE SCALE 45.000 45.000 45.000 R 2610-00026 A 2610-00026 2610-00026 SHEET SHEET OF SHEET 11 1 Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 9 OF OF 1 /1 INFORMATION RY AND C. THIS PLOT ISCLOSED TO ANY RITTEN CONSENT REV BY DESCRIPTION DATE APP'D XLamp ® XQ-B LED D Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. Unless otherwise indicated, all dimensions in mm. Measurement tolerances unless indicated otherwise: .xx = ±.25 mm, .xxx = . ± 125 mm 1.500 4.0 ±.1 +.10 -.00 4.000 C 1.5 ±.1 1.75 ±.10 CATHODE SIDE 8.0 ±.1 A 2.5 ±.1 1.750 Cathode Side 1.65 8.000 NOMINAL 8.30 MAX +.3 12.0 .0 1.85 1.000 2.000 ANODE SIDE A 3.50 ±.10 .30 ± .10 Anode Side (denoted by + and circle) B User Feed Direction END START THIRD ANGLE PROJECTION mulative tolerance ± REFERENCE VENDOR PART NUMBER 021142 Loaded Pockets (2,000 Lamps) Trailer 160 mm (min) of empty pockets sealed with tape (20 pockets min.) 0.2mm UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XXX ± .125 X° ± .5 ° FOR SHEET METAL PARTS ONLY .X ± 1.5 .XX ± .75 .XXX ± .25 X° ± .5 ° Leader 400 mm (min) of D. CRONIN 5/31/12 empty pockets with at least 100 mm sealed by tape Carrier Tape, 1.7X1.7 XPQ (50 empty pockets min.) DRAWN BY DATE CHECK DATE APPROVED DATE Fax (919) 313-5558 3 A MATERIAL SIZE FINAL PROTECTIVE FINISH SCALE 1.6 4 Phone (919) 313-5300 TITLE User Feed Direction SURFACE FINISH: 5 4600 Silicon Drive Durham, N.C 27703 2 C 4.000 REV. DRAWING NO. 2402-00023 SHEET A OF 1 Cover Tape Pocket Tape 13mm 7" Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 10 1 /1 XLamp ® XQ-B LED Packaging The diagrams below show the packaging and labels Cree uses to ship XLamp XQ-B LEDs. XLamp XQ-B LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Quantity, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Boxed Reel Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Patent Label (on bottom of box) Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 11