ds XQB

Cree® XLamp® XQ-B LED
PRODUCT DESCRIPTION
FEATURES
Table of Contents
Cree XLamp® XQ-B LEDs revolutionize
• Cree’s smallest lighting class LED:
Characteristics........................................ 2
mid-power LEDs by delivering lighting-
Flux Characteristics................................ 2
class reliability and a wider spread of
• Available in white, 80-minimum CRI
light than typical plastic packages. The
white and 70-minimum CRI cool
Relative Flux vs. Junction
XQ-B’s innovative wide light emission
white
Temperature............................................ 3
Relative Spectral Power Distribution..... 3
enables a smooth look in replacement
• 300 mA maximum drive current
Electrical Characteristics........................ 4
tubes and panel lights while reducing
• Low thermal resistance: 17 °C/W
Relative Flux vs. Current......................... 4
system cost by using fewer LEDs.
• Wide viewing angle: 140°
Typical Spatial Distribution..................... 5
• Reflow solderable - JEDEC
Thermal Design....................................... 5
J‑STD‑020C compatible
Reflow Soldering Characteristics........... 6
Using Cree’s newest generation of
silicon carbide-based LED chips, XQ-B is
• Unlimited floor life at ≤ 30 °C/85% RH
Notes....................................................... 7
optimized to dramatically lower system
• RoHS- and REACh‑compliant
Mechanical Dimensions......................... 9
cost in non-directional and outdoor area
• UL recognized component
Tape and Reel........................................ 10
lighting applications.
www.cree.com/Xlamp
1.6 X 1.6 X 1.6 mm
®
(E349212)
Packaging.............................................. 11
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1
CLD-DS57 Rev 3E
Product family data sheet
XLamp ® XQ-B LED
Characteristics
Characteristics
Unit
Thermal resistance, junction to solder point
°C/W
17
degrees.
140
mV/°C
-2.0
Viewing angle (FWHM)
Temperature coefficient of voltage
Minimum
ESD classification (HBM per Mil-Std-883D)
Typical
Maximum
Class 1
DC forward current
mA
Reverse voltage
V
Forward voltage (@ 80 mA, 25 °C)
V
LED junction temperature
°C
80
300
-5
3.0
3.4
150
Flux Characteristics (TJ = 25 °C)
The following table provides several base order codes for XLamp XQ-B LEDs. It is important to note that the base order codes listed here
are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the ordercode nomenclature, please consult the XLamp XQ LED Family Binning and Labeling document.
Color
CCT Range
Minimum Luminous Flux
@ 80 mA
Calculated
Minimum
Luminous Flux
(lm)*
Order Code
Min.
Max.
Group
Flux (lm)
150 mA
Cool White
5000 K
8300 K
K2
30.6
52.5
XQBAWT-00-0000-00000L051
Neutral White
3700 K
5000 K
K2
30.6
52.5
XQBAWT-00-0000-00000H0E5
J3
26.8
46
XQBAWT-00-0000-00000HXE5
Warm White
2600 K
3700 K
J3
26.8
46
XQBAWT-00-0000-00000HXE7
Notes:
• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI
measurements. See the Measurements section (page 7).
• Typical CRI for Neutral White, 3700 K - 5000 K CCT is 75.
• Typical CRI for Warm White, 2600 K - 3700 K CCT is 80.
• Minimum CRI for 70 CRI Minimum Cool White is 70.
• Minimum CRI for 80 CRI Minimum White is 80.
* Calculated flux values at 150 mA are for reference only.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
2
XLamp ® XQ-B LED
Relative Spectral Power
Relative Spectral Power Distribution
Relative Radiant Power (%)
100
80
60
Cool White
Neutral White
Warm White
40
20
0
380
430
480
530
580
630
680
730
780
Wavelength (nm)
Relative Flux Output vs. Junction Temperature
Relative Flux vs. Junction Temperature (IF = 80 mA)
100
Relative Luminous Flux (%)
90
80
70
60
50
40
30
20
10
0
25
50
75
100
125
150
Junction Temperature (ºC)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
3
XLamp ® XQ-B LED
Electrical Characteristics (Tj = 25°C)
Electrical
Characteristics (TJ = 25 °C)
parallel
300
Forward Current (mA)
250
200
150
100
50
0
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
Forward Voltage (V)
Relative Intensity vs. Current (Tj = 25°C)
parallel
Relative Flux vs. Current (TJ = 25 °C)
Relative Luminous Flux (%)
300
250
200
150
100
50
0
0
50
100
150
200
250
300
Forward Current (mA)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
4
XLamp ® XQ-B LED
Typical Spatial Radiation Pattern
Typical Spatial Distribution
110
Relative Luminous Intensity (%)
100
90
80
70
60
50
40
30
20
10
-90
-70
-50
-30
-10
0
10
30
50
70
90
Angle (º)
Thermal Design
Thermal Design
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end
product
parallelto be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life
and optical characteristics.
350
Maximum Current (mA)
300
250
200
150
Rj-a = 20°C/W
100
Rj-a = 25°C/W
Rj-a = 30°C/W
50
Rj-a = 35°C/W
0
0
20
40
60
80
100
120
140
160
Ambient Temperature (ºC)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
5
XLamp ® XQ-B LED
Reflow Soldering Characteristics
In testing, Cree has found XLamp XQ-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
IPC/JEDEC J-STD-020C
Time
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Free Solder
1.2 °C/second
Preheat: Temperature Min (Tsmin)
120 °C
Preheat: Temperature Max (Tsmax)
170 °C
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
1 - 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
6
XLamp ® XQ-B LED
Notes
Measurements
The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely
represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors
that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are
provided for informational purposes only and are not intended as specifications.
Pre‑Release Qualification Testing
Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.
For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document.
Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting.
Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect
the LED junction temperature.
Moisture Sensitivity
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp XQ-B LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in
conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the
original MBP.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product
Documentation sections of www.cree.com.
REACh Compliance
REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA)
has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to
insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available
upon request.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
7
XLamp ® XQ-B LED
Notes - Continued
UL® Recognized Component
Level 1 enclosure consideration. The LED package or a portion thereof has not been investigated as a fire enclosure or a fire and electrical
enclosure per ANSI/UL 8750.
Vision Advisory
WARNING: Do not look at exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please refer
to the LED Eye Safety application note.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
8
XLamp ® XQ-B LED
66
6
55
5
4
Mechanical Dimensions
44
33
3
22
2
11
1
REVISONS
REVISONSREVISONS
NOTICE
NOTICE NOTICE
CREECONFIDENTIAL.
CONFIDENTIAL.
THIS
PLOT
AND
THEINFORMATION
INFORMATION
CONFIDENTIAL.
THIS PLOT
AND
THEAND
INFORMATION
CREE
THIS
PLOT
THE
CONTAINED
WITHIN
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THEPROPRIETARY
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AND
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WITHIN ARE
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AND
CONTAINED
WITHIN
AND
CONFIDENTIAL
INFORMATION
OF
CREE,
INC.
THISPLOT
PLOT
DENTIAL
INFORMATION
OF CREE,
INC.
THIS
PLOT
CONFIDENTIAL
INFORMATION
OF
CREE,
INC.
THIS
MAY
NOTBE
BECOPIED,
COPIED,REPRODUCED
REPRODUCED
ORDISCLOSED
DISCLOSED
TOANY
ANY
OT
BE COPIED,
REPRODUCED
OR DISCLOSED
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EEOF
INC.
CREE
REV
REV
REV
BY
DATE
BY
BY
DESCRIPTION
DESCRIPTION
DESCRIPTION
DATE
APP'D
DATE
A
AP
All dimensions in mm.
1.60
Measurement tolerances unless indicated otherwise: ±13 mm
1.60
DD
.375
1.60
1.60
1.60
R.936
1.60
1.60
.375
1.60
1.60
.600
.600
.600
.600
R.936
.600
.600
D
NOTCH
ISON
ON
NOTCHNOTCH
IS ON IS
CATHODE
(-)SIDE
SIDE
CATHODE
(-) SIDE(-)
CATHODE
1.60
1.41
1.5
1.500
1.500 1.500
1.41
1.41
C
CC
1.60± .05
.05
1.60± .05
1.60±
1.58 .300
±.08
1.500
1.500
1.500 1.500
.300
.65
.300
.65
.65
.30
.30
.30
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.300
B
SOLDER PAD
SOLDER PAD
REFERENCEREFERENCE
.30
3.300
3.300 3.300
1.60
1.60
1.60
1.60
3.300
1.60
1.60
1.60
3.300
3.300 3.300
A
DRAWN BY
RECOMMENDED
TRACELAYOUT
LAYOUT
TRACETRACE
LAYOUT
Recommended RECOMMENDED
PCB RECOMMENDED
solder
pad
RECOMMENDED
PC BOARD SOLDER
PAD
RECOMMENDED
PC BOARD
SOLDER PAD
66
3.300
1.60
1.60
RECOMMENDED
PCBOARD
BOARD
SOLDER
PAD
RECOMMENDED
PC BOARD
SOLDER
PAD PAD
RECOMMENDED
PC
SOLDER
6
±.08
1.500
SOLDER
PAD
SOLDER
PAD PAD
SOLDER
REFERENCE
REFERENCE
REFERENCE
.65
.30
B
1.60
.300
.300
.300
.300
1.58
5
55
4
44
DATE
DATE
DRAWN
BY
DATE
DRAWN
BY
UNLESSOTHERWISE
OTHERWISE
SPECIFIED
UNLESS OTHERWISE
SPECIFIED SPECIFIED
UNLESS
CRONIN
5/23/12
5/23/12
5/23/12
DIMENSIONS
AREININD. CRONIND.D.CRONIN
DIMENSIONS
ARE IN
DIMENSIONS
ARE
CHECK
DATE
CHECK
DATE
DATE
MILLIMETERS
ANDAFTER
AFTER
FINISH. CHECK
MILLIMETERS
AND AFTERAND
FINISH.
MILLIMETERS
FINISH.
TOLERANCE
UNLESS
SPECIFIED:
-TOLERANCE
UNLESS
SPECIFIED:
---- ----TOLERANCE UNLESS SPECIFIED:
.XX ± ± .25
.25
.XX ±
.25
.XX
APPROVED
DATE
DATE
APPROVED
DATE
APPROVED
.XXX ± ± .125
.125
TITLE
.XXX ± .XXX
.125
-------X°
±
.5X°° ± ±
X°
.5.5° °
THIRD
ANGLEPROJECTION
PROJECTION
THIRD ANGLE
PROJECTION
THIRD
ANGLE
MATERIAL
MATERIAL
FORSHEET
SHEET
METAL
PARTS
ONLY MATERIAL
FOR SHEETFOR
METAL
PARTS
ONLY
METAL
PARTS
ONLY
.X ± ±
1.5
.X
±
1.5
.X
1.5
SIZE
.XX ± ± .75
.75
.XX ±
.75
.XX
.XXX ± ± .25
.25
.XXX ± .XXX
.25
FINAL
PROTECTIVE
FINISH
FINAL PROTECTIVE
FINISH
FINAL
PROTECTIVE
FINISH
X°
±
.5X°° ± ±
X°
.5.5° °
3.300
3.300
--
----
1.6
1.6 FINISH: 1.6
SURFACE
SURFACE FINISH:
SURFACE
FINISH:
--
----
RECOMMENDED
TRACE LAYOUT
TRACE
3
2LAYOUT
33 RECOMMENDED
22
Recommended
trace
layout
C
SCALE
4600
Silicon
Drive
4600 Silicon Drive
4600
Silicon
Drive
Durham,
N.C
27703
Durham, N.C 27703
Durham,
N.C
27703
Phone
(919)
313-530
Phone (919) 313-5300
Phone
(919)
313-5300
Fax
(919)
313-5558
Fax (919) 313-5558
Fax
(919)
313-5558
A
TITLE
TITLE
XQxOUTLINE
OUTLINE
XQx OUTLINE
XQx
REV.
DRAWING
NO.
SIZE DRAWING NO.DRAWING
NO.
SIZE
C
C
SCALE
SCALE
45.000
45.000
45.000
R
2610-00026 A
2610-00026
2610-00026
SHEET
SHEET
OF
SHEET
11
1
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
9
OF
OF
1 /1
INFORMATION
RY AND
C. THIS PLOT
ISCLOSED TO ANY
RITTEN CONSENT
REV
BY
DESCRIPTION
DATE
APP'D
XLamp ® XQ-B LED
D
Tape and Reel
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Unless otherwise indicated, all dimensions in mm.
Measurement tolerances unless indicated otherwise: .xx = ±.25 mm, .xxx = . ± 125 mm
1.500
4.0 ±.1
+.10
-.00
4.000
C
1.5 ±.1
1.75 ±.10
CATHODE SIDE
8.0 ±.1
A
2.5 ±.1
1.750
Cathode Side
1.65
8.000
NOMINAL
8.30
MAX
+.3
12.0
.0
1.85
1.000
2.000
ANODE SIDE
A
3.50 ±.10
.30 ± .10
Anode Side
(denoted by + and circle)
B
User Feed Direction
END
START
THIRD ANGLE PROJECTION
mulative tolerance ±
REFERENCE VENDOR PART NUMBER 021142
Loaded Pockets
(2,000 Lamps)
Trailer
160 mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
0.2mm
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
.XX ±
.25
.XXX ±
.125
X°
±
.5 °
FOR SHEET METAL PARTS ONLY
.X
±
1.5
.XX ±
.75
.XXX ±
.25
X°
±
.5 °
Leader
400 mm (min) of
D. CRONIN
5/31/12
empty
pockets with
at least 100 mm
sealed by tape
Carrier
Tape, 1.7X1.7 XPQ
(50 empty pockets
min.)
DRAWN BY
DATE
CHECK
DATE
APPROVED
DATE
Fax (919) 313-5558
3
A
MATERIAL
SIZE
FINAL PROTECTIVE FINISH
SCALE
1.6
4
Phone (919) 313-5300
TITLE
User
Feed Direction
SURFACE FINISH:
5
4600 Silicon Drive
Durham, N.C 27703
2
C
4.000
REV.
DRAWING NO.
2402-00023
SHEET
A
OF
1
Cover Tape
Pocket Tape
13mm
7"
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
10
1 /1
XLamp ® XQ-B LED
Packaging
The diagrams below show the packaging and labels Cree uses to ship XLamp XQ-B LEDs. XLamp XQ-B LEDs are shipped in tape loaded
on a reel. Each box contains only one reel in a moisture barrier bag.
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin Code,
Quantity, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
(on bottom of box)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
11