TECHNICAL NOTE Power Management LSI Series for Automotive Body Control Regulators with Voltage Detector and Watchdog Timer BD3004HFP,BD3005HFP zDescription The BD3004HFP,BD3005HFP low bias current regulator and watchdog timer features a high 50 V breakdown voltage and is compatible with on-board vehicle microcontrollers. It offers an output current of 500 mA while limiting bias current to 80 µA (Typ.). The series supports the use of ceramic capacitors as output phase compensation capacitors.The reset detection voltage can be changed by connecting a resistor to the Vs pin.（BD3004HFP）The watchdog timer can be switched on and off using the INH pin input logic.（BD3005HFP） zFeatures 1) 5 V/500 mA regulators for microcontrollers BD3004HFP: Adjustable detection voltage (Vs pin) BD3005HFP:Built-in watchdog timer reset circuit (INH pin: watchdog timer on/off) 2) Super-low bias current: 80 µA (Typ.) 3) Low-saturation voltage type P-channel DMOS output transistors 4) High precision output voltage: 5 V ±2% 5) Low-ESR ceramic capacitors can be used as output capacitors 6) Vcc Maximum applied voltage: 50 V 7) Built-in overcurrent protection circuit and thermal shutdown circuit 8) Built-in reverse connection breakdown prevention circuit 9) Back current flow protection during sudden battery failures, making it a highly reliable 5 V regulator. 10) HRP7 package zApplications Onboard devices (Vehicle equipment, Car stereos, Satellite navigation systems, etc.) zAbsolute maximum ratings (Ta = 25°C) Parameter Symbol Limit Unit +50*1 V Vcc applied voltage Vcc −15 to Vs pin voltage(BD3004HFP) Vs −0.3 to +15 V INH pin voltage(BD3005HFP) VINH −0.3 to +15 V Regulator output pin voltage VOUT −0.3 to +15 V Reset output pin voltage VRO −0.3 to +15 V Watchdog input pin voltage VCLK −0.3 to +15 V Reset delay setting pin voltage VCT −0.3 to +15 V Output current IOUT 500 mA Pd 1.6*2 W Topr −40 to +125 °C Tstg −55 to +150 °C Tjmax 150 °C Power dissipation Operating temperature range Storage temperature range Maximum junction temperature *1 Must not exceed Pd. *2 Reduced by 12.8 mW/°C over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm). Ver.B July 2006 zOperating power supply voltage range (Ta = 25°C) Parameter Operating power supply voltage range Output current Min. Max. Unit 5.5* 36** V － 500 mA * For the output voltage, consider the voltage drop (min. I/O voltage differential) due to the output current. ** Must not exceed Pd. zElectrical Characteristics (Unless otherwise specified, Ta = −40°C to 125°C, Vcc = 13.5 V) Parameter Symbol Limit Min. Typ. Max. Unit Conditions [Overall] Total supply current 1 Icc1 — 80 130 µA Io=0mA Total supply current 2 Icc2 — 80 130 µA Io=200mA Total supply current 3(BD3005HFP) Icc3 — 80 130 µA VINH=0V VOUT 4.90 5.00 5.10 V Input stability Line.Reg — 10 20 mV Vcc=6.2～25 V Load stability Io=5～200mA [Regulator] Output voltage Load.Reg — 15 30 mV Min. I/O voltage differential ∆Vd — 0.78 1.1 V Output current IOUT 500 — — mA VOUT=4.9V Ripple rejection R.R. 45 55 — dB f=120Hz, ein=1Vrms, Io=200mA Vcc=4.75 V, Io=200mA [Reset] Detection voltage(BD3004HFP) Vdet 4.02 4.10 4.18 V Detection voltage(BD3005HFP) Vdet 4.40 4.50 4.60 V Hysteresis width VHS 50 100 150 mV Output delay time Low → High TdLH 12 21 40 mS CT=0.1µF*1 Low output voltage VRST — 0.2 0.5 V IRST=2mA Min. operating voltage VOPL 1.0 — — V High-side switching threshold voltage VthH 1.16 1.26 1.36 V Low-side switching threshold voltage VthL 0.20 0.24 0.28 V Discharge current Ictc 1 2 3 µA [Watchdog timer] Charge current Icto 3 6 10 µA Watchdog monitor time TWH 32 51 90 mS CT=0.1µF*2 Watchdog reset time TWL 10 17 30 mS CT=0.1µF*3 TWCLK 500 — — nS WDT off voltage(BD3005HFP) VUINH 3.2 — 8.0 V WDT on voltage(BD3005HFP) VLINH 0 — 1.8 V Clock input pulse width [INH] *1 TdLH can be varied by changing the CT capacitance value. TdLH (s) ≈ (1.26 × CT (µF)) / Icto (µA) (Calculation uses Typ. values) *2 TWH can be varied by changing the CT capacitance value. TWH (s) ≈ (1.02 × CT (µF)) / Ictc (µA) (Calculation uses Typ. values) *3 TWL can be varied by changing the CT capacitance value. TWL (s) ≈ (1.02 × CT (µF)) / Icto (µA) (Calculation uses Typ. values) Note: This IC is not designed to be radiation-resistant. 2/8 zReference data (Unless otherwise specified, Ta = 25°C) 6 Ta=125℃ 100 80 Ta=25℃ 60 Ta=-40℃ 40 20 0 6 5 4 Ta=-40℃ 3 Ta=25℃ 2 Ta=125℃ 1 0 0 5 10 15 20 0 25 5 Fig. 1 Circuit Current 15 20 Ta=125℃ 2 Ta=25℃ 1.5 Ta=-40℃ 0.5 0 1 0 200 300 400 60 40 20 500 10 100 1000 6 2000 BD3005HFP 4 2 BD3004HFP 0 10000 100000 1E+06 0 1 2 3 4 Fig. 6 Reset Detection Voltage Fig. 5 Ripple Rejection 0 4.6 Falling Edge Detection Voltage 4.4 Rising Edge Detection Voltage BD3004HFP 4.2 4.0 Falling Edge Detection Voltage CIRCIT CURRENT: Icc [µA] CIRCUIT CURRENT: Icc [mA] Rising Edge Detection Voltage BD3005HFP 0.4 0.3 0.2 0.1 40 0 80 0 120 -10 -20 -30 -40 -50 0 3.8 100 200 300 400 -15 500 -12 -9 -6 -3 AMBIENT TEMPERATURE:Ta[℃] OUTPUT CURRENT: IOUT [mA] SUPPLY VOLTAGE: Vcc [V] Fig. 7 Reset Detection Voltage Temperature Fig. 8 Total Supply Current Classified by Load Fig. 9 Back Current 5.5 0 -2 -4 -6 -8 -10 0.5 1 1.5 2 2.5 CT PIN VOLTAGE: VCT [V] Fig. 10 CT Pin Charge vs Discharge Current 3 0 6 OUTPUT VOLTAGE: VOUT [V] OUTPUT VOLTAGE: VOUT [V] 2 0 5 OUTPUT VOLTAGE: VOUT [V] 0.5 -40 1500 8 FREQUENCY: f [Hz] Fig. 4 I/O Voltage Difference 4.8 1000 Fig. 3 Output Voltage vs Load 0 100 500 OUTPUT CURRENT: IOUT [mA] 10 OUTPUT CURRENT: IOUT [mA] CT PIN CURRENT: ICT [µA] 2 RESET VOLTAGE: VRESET[V] RIPPLE REJECTON: R.R. [dB] 2.5 0 Ta=125℃ 3 0 25 80 1 Ta=25℃ 4 Fig. 2 Output Voltage vs Supply Voltage 3 DROPOUT VOLTAGE: ∆Vd [V] 10 Ta=-40℃ 5 SUPPLY VOLTAGE: Vcc [V] SUPPLY VOLTAGE: Vcc [V] DETECTION VOLTAGE: [V] OUTPUT VOLTAGE: VOUT [V] OUTPUT VOLTAGE: VOUT [V] CIRCUIT CURRENT: Icc [µA] 120 5.25 5 4.75 4.5 -40 0 40 80 120 AMBIENT TEMPERATURE: Ta [ ℃] Fig. 11 Output Voltage vs Temperature 3/8 5 4 3 2 1 0 100 120 140 160 180 200 AMBIENT TEMPERATURE: Ta [ ℃] Fig. 12 Thermal Shutdown Circuit zBlock diagram HRP7 Vcc Reverse Polarity Protection 3 Cin FIN Pre Reg Vref OUT TSD 5 Co OUT OCP Vs （BD3004HFP） OUT 2 INH （BD3005HFP） 2 OUT 6 RESET Signal from 1 2 3 4 5 6 7 WDT CLK 1 microcontroller Cin: 0.33 µF to 1000 µF 7 GND CT Co: 0.1 µF to 1000 µF CT 4 CT: 0.001 µF to 22 µF FIN Fig.13 zPin descriptions Pin name Pin. No Function CLK 1 2 Clock input from microcontroller Vs(BD3004HFP) Reset detection voltage adjustment function pin INH(BD3005HFP) WDT on/off function pin (WDT off when INH = high; WDT on when INH = low) 3 Vcc Power supply pin 4 GND GND pin 5 OUT Voltage output pin 6 RESET 7 CT FIN GND Reset output pin Reset output delay time, WDT monitor time setting external capacitance connection pin GND pin zI/O Circuit diagram CLK (1 pin) Vs(2 pin) Vcc PREREG INH (2 pin) Vcc PREREG Vcc PREREG 3.56MΩ 100KΩ CLK Vs 100KΩ 100KΩ INH 1.56MΩ OUT (5 pin) CT (7 pin) RESET (6 pin) Vcc OUT OUT OUT OUT 470KΩ OUT CT RESET Rb Ra Fig.14 4/8 * All resistance values are typical ones. ● Detection voltage adjustment OUT For a basic detection voltage of 4.1 V, R4 Vdet = Vs × (R1 + R2 / R1) R2=3.56MΩ Vs Detection voltage 1,25V(Typ.) To change the detection voltage, insert pull-down resistor R3 (with a resistance value lower than R1) R3 R1=1.56MΩ between the Vs and GND pins, and pull-up resistor R4 (with a resistance value lower than R2) between the Vs and Vo pins. Vdet = Vs × (R3 + R4 / R3) [R3<<R1, R4<<R2] (All resistance values are typical ones.) Fig.15 zTiming chart Vcc 0 VOUT VdetH Vdet 0 VHS VdetH = Vdet + VHS When VINH = high WDT current off VINH 0 CLK 0 TWCLK TWCLK VthH VCT VthL 0 TWL TdLH TWH RESET 0 (1)(2)(3) (4)(5) (6) (7) (4)(5)(8)(9) (4)(5) (10)(2)(3)(10)(2)(3)(4)(5)(10)(11) Fig.16 zExplanation (1) When the output voltage (VOUT) reaches 1.0 V, the reset pin voltage (RESET) will switch to low level. (2) When VOUT reaches or exceeds the reset clear voltage (VdetH), the external capacitor connected to the CT pin will begin to charge. When the CT pin voltage (VCT) reaches the upper switching threshold voltage (VthH), RESET will maintain a low-level signal. When VCT reaches the VthH voltage, RESET will switch from low to high level. The time from VCT reaching or exceeding the VdetH voltage until RESET reverses (the RESET transmission delay time: TdLH) is given by the following equation: TdLH (s) ≈ (1.26 × CT (µF)) / Icto (µA) [1] (3) The watchdog timer operates when RESET rises. (4) When VCT reaches the lower switching threshold voltage (VthL), the CT pin switches from discharging to charging, and RESET switches from high level to low level. The watchdog timer reset time TWL is given by the following equation: TWL(s) ≈ (1.02 × CT (µF)) / Icto (µA) [2] (5) The CT pin state switches from charge to discharge when VCT reaches VthH, and RESET switches from low to high. The watchdog timer monitor time TWH is given by the following equation: TWH(s) ≈ (1.02 × CT (µF)) / Ictc (µA) [3] (6) The CT pin state may not switche from charge to discharge when the CLK input pulse width (TWCLK) is short. Use a TWCLK input pulse width of at least 500 ns. (7) When a pulse (positive edge trigger) of at least 500 ns is input to the CLK pin while the CT pin is discharging, VCT switches from discharging to charging and then switches back to discharging once it charges to VthH. (8) Watchdog timer operation is forced off when the INH pin switches to high. At that time, only the watchdog timer will be turned off, and reset detection will operate normally. (9) The watchdog timer function turns on when the INH pin switches to low. At that time, the external capacitor on the CT pin will be discharged. (10) RESET switches from high to low when OUT falls to the RESET detection voltage (VDET) or lower. (11) When VOUT falls to 0 V, the RESET signal stays low until VOUT reaches 1.0 V 5/8 zSetting of heat POWER DISSIPATON: Pd [W] 2.0 ROHM standard board Board size: 70 mm × 70 mm × 1.6 mm θja = 78.1 (°C /W) 1.6 1.2 0.8 0.4 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [℃] Fig.17 Refer to the dissipation reduction illustrated in Fig.17 when using the IC in an environment where Ta ≥ 25°C. The characteristics of the IC are greatly influenced by the operating temperature. If the temperature exceeds the maximum junction temperature Tjmax, the elements of the IC may be damaged. It is necessary to give sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage and the maintenance of the reliability of the IC in long-time operation. In order to protect the IC from thermal destruction, the operating temperature of the IC must not exceed the maximum junction temperature Tjmax. Fig.17 illustrates the power dissipation/heat mitigation characteristics for the HRP-7 package. Always operate the IC within the power dissipation (Pd). The following method is used to calculate the power consumption Pc (W). Pc = (Vcc − VOUT) × IOUT + Vcc × Icc Vcc : Input voltage Power dissipation Pd ≤ Pc VOUT : Output voltage IOUT : Load current The load current Io is obtained to operate the IC within the power dissipation. Icc : Total supply current Pd – Vcc × Icc IOUT ≤ Vcc − VOUT For Icc, see Fig. 1. From the above, the maximum load current IOUTmax for the applied voltage Vcc can be calculated during the thermal design process. Calculation example Example: at Ta = 85°C, Vcc = 12 V, VOUT = 5 V 0.832 − 12 × Icc IOUT≤ 12 − 5 IOUT ≤ 118 mA (Icc = 80 µA) θja = 78.1°C/W → −12.8 mW/°C 25°C = 1.6 W → 85°C = 0.832 mW Make a thermal calculation in consideration of the above equations so that the whole operating temperature range will be within the power dissipation. The power consumption Pc of the IC, in the event of shorting (i.e., if the Vo and GND pins are shorted), will be obtained from the following equation: Pc = Vcc × (Icc + Ishort) Ishort = Short current zExternal settings for pins and precautions 1) Vcc pin Insert capacitors with a capacitance of 0.33 µF to 1,000 µF between the Vcc and GND pins. The capacitance varies with the application. Be sure to design the capacitance with a sufficient margin. 2) Output pin Capacitors for stopping oscillation must be placed between each output pin and the GND pin. Capacitor capacitance values can be used in a range between 0.1 µF and 1,000 µF. Since oscillation does not occur even for ESR values from 0.001 Ω to 100 Ω, a ceramic capacitor can be used. Abrupt input voltage and load fluctuations can affect output voltages. Output capacitor capacitance values should be determined after sufficient testing of the actual application 3) CT pin Be sure to connect a capacitor to the CT pin. The reset output delay time is given by equation (1) on P. 5. The WDT time is given by equations (2) and (3) on P.5. The setting times are proportional to the capacitance value of CT pin from the equations, so the maximum and minimum setting times can be calculated from the electrical characteristics according to the capacitance. Note however that the electrical characteristics do not include the external capacitor's temperature characteristics. The recommended connection capacity for the CT pin is 0.001 µF to 22 µF. 6/8 zOperation Notes 1. Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. GND voltage 3. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. The potential of GND pin must be minimum potential in all operating conditions. 4. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 5. Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 7. Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Transistor (NPN) B Resistor (Pin A) (Pin B) C (Pin B) E B C E P P+ P+ P P+ N P N GND P+ N N N Parasitic element Parasitic element or transistor N P substrate (Pin A) GND Parasitic element or transistor GND Parasitic element Fig. 18 Example of IC structure 8. Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 9. Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed.. (See Fig. 12) 10. Overcurrent protection circuit (OCP) The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to temperatures. (See Fig. 3) 11. Negative surge application to Vcc pin The IC incorporates a built-in reverse connection breakdown prevention circuit that prevents IC damage even if Vcc carries a lower voltage than the GND pin. However, note that the absolute maximum rating for the negative power supply voltage is -15 V. 12. Back current flow when the Vcc power supply is suddenly interrupted These ICs limit generation of back current flow when the Vcc power supply is suddenly interrupted to protect the IC from damage. Sinking current is also limited, making the series compatible with designs where high-capacitance capacitors are used to lengthen the amount of time over which the output voltage can be maintained. 7/8 zSelecting a model name when ordering 3 0 0 4 B D H F P Part number ROHM model name T R Taping TR: Reel-wound embossed taping Package type HFP: HRP7 3004：Adjustable detection voltage 3005：Stable detection voltage HRP7 <Tape and Reel information> 9.395 ± 0.125 (MAX 9.745 include BURR) 8.82 – 0.1 (5.59) 0.835 ± 0.2 3 4 5 6 1.523 ± 0.15 10.54 ± 0.13 (7.49) 1 2 Tape Embossed carrier tape Quantity 2000pcs Direction of feed TR 1.905 ± 0.1 8.0 ± 0.13 1.017 ± 0.2 <Dimension> (The direction is the 1pin of product is at the upper light when you hold reel on the left hand and you pull out the tape on the right hand) 7 0.8875 4.5 0.27 +5.5 -4.5 +0.1 -0.05 x x x x x x x x x x x x x x x x x x x x x x x x 0.08 ± 0.05 S 1.27 0.73 ± 0.1 1pin 0.08 S Reel (Unit:mm) Direction of feed ※When you order , please order in times the amount of package quantity. 8/8 Catalog No.06T148A '06.7 ROHM C 1000 TSU Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the NOTES specified in this catalog. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2008 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster@ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix1-Rev2.0