Issue Date:
2008-02-14
Page 1 of 8
Report Reference #
E135493-A3-UL
2010-10-21
UL TEST REPORT AND PROCEDURE
Standard:
Certification Type:
CCN:
Product:
Model:
UL 60950-1, 2nd Edition, 2007-03-27 (Information Technology
Equipment - Safety - Part 1: General Requirements)
CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Information
Technology Equipment - Safety - Part 1: General Requirements)
Power Supplies for Information Technology Equipment Including
Electrical Business Equipment
QQGQ2, QQGQ8
DC/DC Power Supply
Vi Chip Half VTM and BCM model: Vii01wwxHyz
VI Chip Half VTM2 and BCM2 model: AAAbbbcdddefffxzz
See Miscellaneous Enclosure for Family Tree.
Rated Input:
48 Vdc
Rating:
Rated Output:
12Vdc max.
50A max.
120W max.
See Miscellaneous Enclosure for model matrix
Applicant Name and Address:
VICOR CORP
25 FRONTAGE RD
ANDOVER MA 01810
UNITED STATES
This is to certify that representative samples of the products covered by this Test Report have been investigated in accordance with the
above referenced Standards. The products have been found to comply with the requirements covering the category and the products are
judged to be eligible for Follow-Up Service under the indicated Test Procedure. The manufacturer is authorized to use the UL Mark on
such products which comply with this Test Report and any other applicable requirements of Underwriters Laboratories Inc. ('UL') in
accordance with the Follow-Up Service Agreement. Only those products which properly bear the UL Mark are considered as being
covered by UL's Follow-Up Service under the indicated Test Procedure.
The applicant is authorized to reproduce the referenced Test Report provided it is reproduced in its entirety.
UL authorizes the applicant to reproduce the latest pages of the referenced Test Report consisting of the first page of the Specific
Technical Criteria through to the end of the Conditions of Acceptability.
Any information and documentation involving UL Mark services are provided on behalf of Underwriters Laboratories Inc. (UL) or any
authorized licensee of UL.
Prepared by:
Gerard Soprych
Underwriters Laboratories Inc.
Reviewed by:
David Keen
Underwriters Laboratories Inc.
Copyright © 2010
Issue Date:
2008-02-14
Page 2 of 8
Report Reference #
E135493-A3-UL
2010-10-21
Supporting Documentation
The following documents located at the beginning of this Procedure supplement the requirements of this Test
Report:
A. Authorization - The Authorization page may include additional Factory Identification Code markings.
B. Generic Inspection Instructions i. Part AC details important information which may be applicable to products covered by this Procedure.
Products described in this Test Report must comply with any applicable items listed unless otherwise
stated in the body of this Test Report.
ii. Part AE details any requirements which may be applicable to all products covered by this Procedure.
Products described in this Test Report must comply with any applicable items listed unless otherwise
stated in the body of each Test Report.
iii. Part AF details the requirements for the UL Certification Mark which is not controlled by the technical
standard used to investigate these products. Products are permitted to bear only the Certification
Mark(s) corresponding to the countries for which it is certified, as indicated in each Test Report.
Product Description
The half size VI Chip BCM / VTM series of DC-DC converters are designed for Building-in. Both the BCM
and VTM provide an isolated but non-regulated output that is determined by a fixed turns ratio. The VTM
output can be regulated when used with a VI Chip PRM (Pre-regulator Module). The BCM is a standalone
device. The input to the half size BCM / VTM series of DC-DC converters is intended to be supplied from a
TNV-2 or other secondary circuit. Basic Insulation is provided from input to output with a dielectric rating of
2250Vdc.
The VIB0101THJ / VIV0101THJ are the highest rated output power half size BCM / VTM modules and were
tested to represent the half size BCM / VTM family of converters.
The half size BCM's output is rated in terms of maximum power in Watts while the half size VTM's output is
rated in terms of maximum current in Amps.
Added Half VTM2 and BCM2 model numbers which have identical construction to the original products but
utilize a new controller IC. No additional testing was required.
Model Differences
See Model Matrix
Issue Date:
2008-02-14
Page 3 of 8
Report Reference #
E135493-A3-UL
2010-10-21
Technical Considerations
Equipment mobility : for building-in
Connection to the mains : N/A
Operating condition : continuous
Access location : building-in
Over voltage category (OVC) : OVC II
Mains supply tolerance (%) or absolute mains supply values : 38-55Vdc
Tested for IT power systems : No
IT testing, phase-phase voltage (V) : N/A
Class of equipment : Class III (supplied by SELV)
Considered current rating (A) : Pollution degree (PD) : PD 2
IP protection class : IP X0
Altitude of operation (m) : 2000
Altitude of test laboratory (m) : 150
Mass of equipment (kg) : 0.0125
The product was submitted and tested for use at the maximum case temperature permitted by the
manufacturer’s specification of 125°C.
Issue Date:
2008-02-14
Page 4 of 8
Report Reference #
E135493-A3-UL
2010-10-21
Engineering Conditions of Acceptability
For use only in or with complete equipment where the acceptability of the combination is determined by
Underwriters Laboratories Inc. When installed in an end-product, consideration must be given to the
following:
Input Voltage: Both a nominal input voltage and an input voltage range are specified. Operation over
the entire range was evaluated.
Max Temperature: Keep the maximum semiconductor junction temperature of the VI Chip at
125degC or less. There are two methods to demonstrate compliance. Method1 Keep Tcasemax <
100C under all conditions where Tcasemax is the maximum case temp of the VI Chip Method 2
Keep Tcasemax < 125C – (Pdissmax X 3.0) under all conditions where Pdissmax = Pinput_max –
Poutput_max. Pdissmax is the amount of power in Watts dissipated within the device. The thermal
resistance of the half size VI Chip from the internal semiconductor junction to the case is 3.0 degC /
Watt.
Fusing Requirements: The half size BCM / VTM modules were evaluated with a 3.15A Littelfuse
Nano²Fuse. If the VTM module is used with a VI Chip PRM then the VTM does not require individual
fusing since the PRM requires it’s own fuse and provides a current limited source to the VTM input. A
worst case scenario of a half size VTM powered by a PRM fused with a 10A Littelfuse Nano²Fuse
was evaluated. Refer to the PRM safety approvals for complete PRM model numbers and fusing
requirements.
The input to the half size VI Chip is intended to be supplied from a TNV-2 or other secondary circuit.
The output is considered to be SELV.
The half size BCM and VTM provide 2250 Vdc of isolation from input to output and from the input to
the molded case.
The output is separated from the input by Basic insulation.
The following Production-Line tests are conducted for this product: Electric Strength
The following secondary output circuits are SELV: All
The power supply terminals and/or connectors are: Not investigated for field wiring
The investigated Pollution Degree is: 2
The following end-product enclosures are required: Mechanical , Fire , Electrical
The end-product Electric Strength Test is to be based upon a maximum working voltage of: PrimarySELV: 55 Vpk
The following secondary output circuits are at non-hazardous energy levels: All
Issue Date:
2008-02-14
Page 5 of 8
Report Reference #
E135493-A3-UL
2010-10-21
VI Chip Half VIC Family Tree Model Vii01wwxHyz
V = Constant
ii =
IB
IV
MV
Product Type
BCM
VTM
Military VTM
01 = Constant
ww = 00-99, defines electrical ratings, Product Type (ii)
dependent
Model
Vin Nom
Vout (nom) Iout (VTM) Pout (BCM)
(range)
VIB0101
48 Vdc (38-55)
12.0 Vdc
120 W
VIB0102
48 Vdc (38-55)
1.2 Vdc
75 W
VIB0103
48 Vdc (38-55)
1.8 Vdc
80 W
VIB0104
48 Vdc (38-55)
3.3 Vdc
100 W
VIB0105
48 Vdc (38-55)
5.0 Vdc
100 W
VIB0106
48 Vdc (38-55)
6.0 Vdc
100 W
VIB0107
48 Vdc (38-55)
8.0 Vdc
100 W
VIB0108
48 Vdc (38-55)
9.6 Vdc
100 W
VIV0101
VIV0102
VIV0103
VIV0104
VIV0105
VIV0106
VIV0107
VIV0108
VMV0105
VMV0106
x =
C
T
M
48
40
40
40
40
40
48
48
36
36
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Product Grade
Commercial
Telecom
Military
(26-55)
(26-55)
(26-55)
(26-55)
(26-55)
(26-55)
(26-55)
(26-55)
(26-50)
(26-50)
12 Vdc
1.2 Vdc
1.8 Vdc
3.3 Vdc
5.0 Vdc
6.0 Vdc
8.0 Vdc
9.6 Vdc
4.5 Vdc
12.0 Vdc
10 A
50 A
40 A
25 A
20 A
17 A
12 A
10 A
15 A
6 A
Temp Range
0 - 100 C
-40 - 100 C
-55 - 100 C
H = Half VIC Package Size
y =
J
G
T
Lead Designator
J-Lead
Gull-Wing
Through-Hole
z =
Revision Designator, any alpha-numeric character (optional, nonsafety related)
Issue Date:
2008-02-14
Page 6 of 8
Report Reference #
2010-10-21
VI Chip Half BCM2 and VTM2 Family Tree Model: AAAbbbcdddefffxzz
Example: BCM48BH120T120A00
AAA = BCM
BCM Family (Buss Converter
Module)
Standard
BCM
version
Mil-COTS
MBCM
version
bbb = 48B
Input
Voltage
48B
48E
AAA = VTM
VTM Family (Voltage
Transformation Module)
Nominal (range)
48 Vdc (38-55)
48 Vdc (26-55)
c = H
Package Size / Lead Designator
H
Half VI Chip J-Lead
ddd = 120
Output Voltage Designator (range)
015
1.5 Vdc
060
6.0 Vdc
020
2.0 Vdc
080
8.0 Vdc
040
4.0 Vdc
120
12.0 Vdc
e = T
Product Grade
T
-40 to 125C
M
-55 to 125C
fff = 120
Output Power / Current Designator
BCM – (Watt)
VTM – (Amp)
075
75W
006
6A
080
80W
010
10A
100
100W
020
20A
120
120W
025
25A
040
40A
050
50A
x = A
Revision (non-safety related)
x
Any alphanumeric character
zz = 00
Customer reference (non-safety related)
zz
Any alphanumeric character
VTM
Standard version
MVTM
Mil-COTS version
E135493-A3-UL