Technical Note

VISHAY
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Resistive Products
Technical Note
RFCS - Silicon SMD RF Capacitor
GENERAL INFORMATION
The RFCS Component
All of the traditional performance characteristics of the
MNOS technology can be found in the RFCS product:
Thin film MNOS capacitors are a well-established
technology for applications with highly demanding
performance requirements, but MNOS technology is
typically limited to use in hybrid assemblies (chip and wire).
The RFCS product is a patented adaptation of Vishay's
mature MNOS process to accommodate surface mount
assembly (SMT) and thus go beyond these limitations.
Vishay offers RFCS capacitors in 0402 case size in values
ranging from 0.1 pF to 27 pF.
• The thin film electrodes provide superior RF conductivity
compared to thick film devices
• The robustness of the silicon oxide/silicon nitride
dielectric combination is well established and has been in
use for decades in the most demanding applications
• The silicon substrate provides excellent thermal
conductivity, allowing higher power ratings than
alternative technologies
The
RFCS
capacitor
is
characterized
by
its
bottom-termination (flip chip) configuration. This approach
minimizes the parasitics associated with the component
terminations, resulting in the surface-mount capacitor with
the industry's highest self-resonant frequency (SRF).
• The dielectric deposition process can be controlled to
obtain tight tolerances across wafers, among wafers in a
single batch, and between batches. This characteristic
allows RFCS components to be manufactured to spec
rather than being binned to spec as is the case with
alternative technologies.
RFCS Construction Details
The RFCS capacitor consists of two MNOS capacitors set in series. The highly conductive silicon substrate forms the common
electrode as described in figure 1.
Lead (Pb)-Free Solder
Silicon Nitride Passivation
Thin-Film Aluminum Conductor
Silicon Oxide/Nitride Dielectric
Highly Conducitve Silicon substrate
SI
The series configuration provides two significant advantages:
• Improved maximum working voltage characteristics
• A more controllable method of manufacturing small capacitance values
All values of the RFCS components include a stacked oxide/nitride dielectric layer. This combination of dielectric layers provides
for robust electrical and mechanical characteristics. The silicon nitride passivation layer further enhances the mechanical
integrity of the component.
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Document Number: 61093
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TECHNICAL NOTE
Fig. 1
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RFCS - Silicon SMD RF Capacitor
RFCS Performance Benefits
The patented structure of the RFCS component provides a number of benefits over alternative technologies. One such benefit
is its ultra-low parasitic series inductance. This characteristic causes these component to self-resonate at significantly higher
frequencies than alternative technologies. The following figure demonstrates this aspect:
Self Resonance Frequency (GHz)
25
RFCS < 2.2 pF
20
15
RF MLCC
RFCS ≥ 2.2 pF
10
5
Standard MLCC
0
0.1
1
10
Capacitance (pF)
Fig. 2 - SRF comparison between RFCS and multi-layered co-fired ceramic alternatives
Typical parasitic inductance values for RFCS are presented in figure 3.
Series Inductance (nH)
1.00
RFCS < 2.2 pF
0.10
RFCS ≥ 2.2 pF
0.01
0
1
10
100
TECHNICAL NOTE
Capacitance (pF)
Fig. 3 - Typical parasitic inductance of RFCS
Their high SRF allows RFCS components to maintain their performance to higher frequencies than other technologies. The
following plot displays measured impedance vs. frequency of a few select values. All of these measurements were performed
on identical test setups.
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RFCS - Silicon SMD RF Capacitor
50
45
Capacitance (pF)
40
35
30
RF MLCC
RF MLCC
Standard MLCC
25
20
15
10
5
0
0.1
1
10
Frequency (GHz)
Fig. 4
The mechanical structure of the RFCS components also provides for low losses. Their equivalent series resistance (ESR) is so
low, in fact, that measuring it is difficult. The very low values for absolute capacitance make this measurement even harder.
The technique used to measure ESR for the RFCS product was to use a network analyzer to measure the real part of the
impedance at self resonance. Because RFCS components are characterized by their high SRF, the measured values included
real losses caused by high-frequency phenomena such as skin effect.
Interestingly, the ESR at SRF values are almost completely value-independent. The higher value components have lower SRF,
so the contribution of skin effect related losses is lower. On the other hand, the higher values also have thicker dielectric layers
that introduce more loss. These two effects act in opposite directions, canceling each other.
2.50
ESR at SRF (Ω)
2.00
1.50
1.00
TECHNICAL NOTE
0.50
0.00
0.1
1
10
100
Capacitance (pF)
Fig. 5
Revision: 30-Jun-11
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RFCS - Silicon SMD RF Capacitor
The large tolerance presented in the figure above represents a single standard deviation of a sample of 10 components. The
large tolerance is a reflection of the difficulty measuring this parameter (1). This tolerance should not be interpreted as reflecting
large deviations between the components themselves. The RFCS product is manufactured using thin film techniques resulting
in high levels of uniformity among components. The lot-to-lot uniformity of the RFCs product is excellent compared to
alternative technologies that deposit both the electrodes and the dielectric material using thick-film paste deposition
techniques.
ESR at frequencies under SRF can be directly measured at frequencies under 3 GHz. The following plot of Q vs. frequency has
been created by interpolating between the measured values at lower frequencies and the ESR at SRF results presented above.
An ideal model of skin effect was assumed in this process.
Note
(1) Measured ESR values included a large amount of setup related noise. The fitting quality of the presenter linear approximations was R2 = 0.2.
100 000
10 000
Q Factor
0.2 pF
1000
100
10
2.7 pF
10 pF
27 pF
1
0.1
1
1 pF
10
Frequency (GHz)
Fig. 6
S Parameters
S parameter values up to 20 GHz are available upon request for all values of RFCS product. These measurements were
performed in series configuration using the following equipment set:
• Vector Network Analyzer: Anritsu 37247D
• Test Socket: Inter-Continental Microwave (ICM), universal socket for bottom electrode components.
Summary
TECHNICAL NOTE
The RFCS product is an excellent choice for applications operating in the high-GHz frequency range. The advantages of
Vishay's patented RFCS technology, compared with alternative technologies, are presented in the following table.
COMPARISON OF KEY RF CHARACTERISTICS BY TECHNOLOGY
RFCS
STANDARD MLCC
RF MLCC
Self resonance frequency
Very good
Poor
Good
Batch-to-batch capacitive variation
Very good
Good
Good
Good
Very good
Very good
Very good
Good
Very good
Maximum working voltage
Low loss, high Q
Revision: 30-Jun-11
Document Number: 61093
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000