SSFT3904
30V N-Channel MOSFET
Main Product Characteristics
VDSS
30V
RDS(on)
2.6mΩ (typ.)
ID
110A
TO-220
Features and Benefits
Marking and Pin
Schematic Diagram
Assignment
Advanced MOSFET process technology
Special designed for PWM, load switching and
general purpose applications
Ultra low on-resistance with low gate charge
Fast switching and reverse body recovery
175℃ operating temperature
Lead free product
Description
It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with
high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable
device for use in power switching application and a wide variety of other applications.
Absolute Max Rating
Parameter
Max.
ID @ TC = 25°C
Symbol
Continuous Drain Current, VGS @ 10V①
110
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V①
80
IDM
Pulsed Drain Current②
440
Power Dissipation③
100
W
Linear Derating Factor
0.55
W/°C
VDS
Drain-Source Voltage
30
V
VGS
Gate-to-Source Voltage
± 20
V
EAS
Single Pulse Avalanche Energy @ L=0.1mH②
320
mJ
IAR
Avalanche Current @ L=0.1mH②
80
A
-55 to + 175
°C
PD @TC = 25°C
TJ
TSTG
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Operating Junction and Storage Temperature Range
Page 1 of 7
Units
A
Rev.2.5
SSFT3904
30V N-Channel MOSFET
Thermal Resistance
Symbol
Characteristics
RθJC
RθJA
Typ.
Max.
Units
Junction-to-case③
—
1.5
℃/W
Junction-to-ambient (t ≤ 10s) ④
—
62
℃/W
Junction-to-Ambient (PCB mounted, steady-state) ④
—
40
℃/W
Electrical Characteristics @TA=25℃
Symbol
Parameter
V(BR)DSS
Drain-to-Source breakdown voltage
RDS(on)
Static Drain-to-Source on-resistance
RDS(on)
Static Drain-to-Source on-resistance
VGS(th)
Gate threshold voltage
IDSS
Drain-to-Source leakage current
IGSS
Gate-to-Source forward leakage
Qg
unless otherwise specified
Min.
Typ.
Max.
Units
30
—
—
V
—
2.6
3.6
—
3.8
—
—
3.2
5
—
4.8
—
1
—
3
—
1.3
—
—
—
1
—
—
50
—
—
100
—
—
-100
Total gate charge
—
68
—
Qgs
Gate-to-Source charge
—
19
—
Qgd
Gate-to-Drain("Miller") charge
—
25
—
td(on)
Turn-on delay time
—
19
—
tr
Rise time
—
18
—
td(off)
Turn-Off delay time
—
145
—
tf
Fall time
—
63
—
Ciss
Input capacitance
—
9291
—
Coss
Output capacitance
—
748
—
Crss
Reverse transfer capacitance
—
702
—
mΩ
Conditions
VGS = 0V, ID = 250μA
VGS=10V,ID = 30A
TJ = 125℃
mΩ
VGS=4.5V,ID = 16A
TJ = 125℃
V
VDS = VGS, ID = 250μA
TJ = 125℃
μA
nA
VDS = 30V,VGS = 0V
TJ = 125°C
VGS =20V
VGS = -20V
VDS=15V,
nC
ID=16A,
VGS=5V
ns
VGS=10V, VDS=15V,
RGEN=6Ω, ID=1A
VGS = 0V
pF
VDS = 15V
ƒ = 1MHz
Source-Drain Ratings and Characteristics
Symbol
IS
ISM
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Min.
Typ.
Max.
Units
—
—
110
A
—
—
440
A
Conditions
MOSFET symbol
showing the
integral reverse
p-n junction diode.
VSD
Diode Forward Voltage
—
0.85
1.3
V
IS=50A, VGS=0V
trr
Reverse Recovery Time
—
20
—
ns
TJ = 25°C, IF =32A,
Qrr
Reverse Recovery Charge
—
7.8
—
nC
di/dt = 100A/μs
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Page 2 of 7
Rev.2.5
SSFT3904
30V N-Channel MOSFET
Test Circuits and Waveforms
Switch Waveforms:
Notes:
①The maximum current rating is limited by bond-wires.
②Repetitive rating; pulse width limited by max. junction temperature.
③The power dissipation PD is based on max. junction temperature, using junction-to-case thermal
resistance.
④The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a
still air environment with TA =25°C
⑤These curves are based on the junction-to-case thermal impedence which is measured with the
device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=175°C.
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Page 3 of 7
Rev.2.5
SSFT3904
30V N-Channel MOSFET
Typical Electrical Characteristics
Figure 1: Typical Output Characteristics
Figure 2: Typical Transfer Characteristics
IS,source to drain current(A)
1.E+02
ID=50A
1.E+01
125℃
1.E+00
1.E-01
1.E-02
25℃
1.E-03
1.E-04
1.E-05
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
1.1
VSD,source to drain voltage(V)
Figure 3: On-Resistance vs. Gate-Source
Figure 4: Body-Diode Characteristics
Voltage
Figure 5: Gate-Charge Characteristics
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Figure 6: Capacitance Characteristics
Page 4 of 7
Rev.2.5
SSFT3904
30V N-Channel MOSFET
Typical Thermal Characteristics
Figure 7: Normalized Thermal transient Impedance Curve
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Page 5 of 7
Rev.2.5
SSFT3904
30V N-Channel MOSFET
Mechanical Data
TO-220 PACKAGE OUTLINE DIMENSION_GN
E
ФP
A
ϴ1
D
D2
ФP1
ϴ
ϴ2
D1
b1
b
A1
ϴ4
L
c
e
Symbol
A
A1
b
b1
c
D
D1
D2
E
E1
ФP
ФP1
e
L
ϴ1
ϴ2
ϴ3
ϴ4
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Dimension In Millimeters
Min
Nom
Max
1.300
2.200
2.400
2.600
1.270
1.270
1.370
1.470
0.500
15.600
28.700
9.150
9.900
10.000
10.100
10.160
3.600
1.500
2.54BSC
12.900
13.100
13.300
0
7
0
7
30
0
3
Page 6 of 7
E
Dimension In Inches
Nom
Max
0.051
0.094
0.102
0.050
0.054
0.058
0.020
0.614
1.130
0.360
0.394
0.398
0.400
0.142
0.059
0.1BSC
0.508
0.516
0.524
0
7
0
7
Min
0.087
0.050
0.390
-
50
70
90
10
30
50
Rev.2.5
SSFT3904
30V N-Channel MOSFET
Ordering and Marking Information
Device Marking: SSFT3904
Package (Available)
TO-220
Operating Temperature Range
C : -55 to 175 ºC
Devices per Unit
Package
Type
Units/
Tube
Tubes/Inner
Box
Units/Inner Inner
Box
Boxes/Carton
Box
Units/Carton
Box
TO220
50
20
1000
6000
6
Reliability Test Program
Test Item
Conditions
Duration
Sample Size
High
Temperature
Reverse
Bias(HTRB)
High
Temperature
Gate
Bias(HTGB)
Tj=125℃ to 175℃ @
80% of Max
VDSS/VCES/VR
168 hours
500 hours
1000 hours
3 lots x 77 devices
TJ=125℃ to 175℃ @
100% of Max VGSS
168 hours
500 hours
1000 hours
3 lots x 77 devices
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Page 7 of 7
Rev.2.5