SSF6072G5 60V N-Channel MOSFET Main Product Characteristics VDSS 60V RDS(on) 67mΩ (typ.) ID 4A 6072 SSF6072G5 SOT-223 Features and Benefits Marking and Pin Schematic Diagram Assignment Advanced MOSFET process technology Special designed for DC-DC and DC-AC converters, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery 175℃ operating temperature Lead free product Description It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in DC-DC and DC-AC converters and a wide variety of other applications. Absolute Max Rating Symbol Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V① 4 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V① 3 IDM Pulsed Drain Current② 16 PD @TC = 25°C Power Dissipation③ 3.3 W VDS Drain-Source Voltage 60 V VGS Gate-to-Source Voltage ± 20 V EAS Single Pulse Avalanche Energy @ L=0.3mH 15 mJ IAS Avalanche Current @ L=0.3mH 10 A -55 to +175 °C TJ TSTG Operating Junction and Storage Temperature Range A Thermal Resistance Symbol RθJA www.goodark.com Characteristics Typ. Max. Units Junction-to-ambient (t ≤ 10s) ④ — 38 ℃/W Junction-to-Ambient (PCB mounted, steady-state) ④ — 35 ℃/W Page 1 of 7 Rev.1.1 SSF6072G5 60V N-Channel MOSFET Electrical Characteristics @TA=25℃ Symbol Parameter V(BR)DSS Drain-to-Source breakdown voltage RDS(on) Static Drain-to-Source on-resistance VGS(th) Gate threshold voltage IDSS Drain-to-Source leakage current IGSS Gate-to-Source forward leakage gfs unless otherwise specified Min. Typ. Max. Units 60 — — V — 67 100 — 76 115 1 — 2.5 — — 1 — — 10 — — 100 — — -100 Forward Transconductance 1 — — Qg Total gate charge — 12 — Qgs Gate-to-Source charge — 3.5 — Qgd Gate-to-Drain("Miller") charge — 3.7 — td(on) Turn-on delay time — 9.2 — tr Rise time — 16.7 — td(off) Turn-Off delay time — 35.4 — tf Fall time — 8.6 — Ciss Input capacitance — 582 — Coss Output capacitance — 49 — Crss Reverse transfer capacitance — 36 — mΩ V μA nA S Conditions VGS = 0V, ID = 250μA VGS=10V,ID = 1.5A VGS=5V,ID = 1.5A VDS = VGS, ID = 250μA VDS = 60V,VGS = 0V TJ = 125°C VGS =20V VGS = -20V VDS = 15 V ID = 1.5A ID = 4A, nC VDS=40V, VGS =10V ns VGS=10V, VDS=25V, RGEN=50Ω,ID = 1.2A, VGS = 0V pF VDS = 30V ƒ = 1MHz Source-Drain Ratings and Characteristics Symbol IS ISM VSD Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage www.goodark.com Min. Typ. Max. Units — — 4 A — — 16 A — — 1.5 V Page 2 of 7 Conditions MOSFET symbol showing the integral reverse p-n junction diode. IS=4A, VGS=0V Rev.1.1 SSF6072G5 60V N-Channel MOSFET Test Circuits and Waveforms Switch Waveforms: Notes: ①The maximum current rating is limited by bond-wires. ②Repetitive rating; pulse width limited by max. junction temperature. ③The power dissipation PD is based on max. junction temperature, using junction-to- ambient thermal resistance. ④The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C www.goodark.com Page 3 of 7 Rev.1.1 SSF6072G5 60V N-Channel MOSFET Typical Electrical and Thermal Characteristics Figure 1: Typical Capacitance Vs. Drain-to-Source Voltage Figure 2. Gate to source cut-off voltage Figure 3. Drain-to-Source Breakdown Voltage Vs. Figure 4: Normalized On-Resistance Vs. Case Case Temperature www.goodark.com Temperature Page 4 of 7 Rev.1.1 SSF6072G5 60V N-Channel MOSFET Typical Electrical and Thermal Characteristics Figure 5. Maximum Drain Current Vs. Case Figure 6. Maximum Effective Transient Thermal Temperature www.goodark.com Impedance, Junction-to-Case Page 5 of 7 Rev.1.1 SSF6072G5 60V N-Channel MOSFET Mechanical Data SOT-223 Dimensions in Millimeters (UNIT: mm) Notes: ① Dimensions are inclusive of plating ② Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils. ③ Dimension L is measured in gauge plane. ④ Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. www.goodark.com Page 6 of 7 Rev.1.1 SSF6072G5 60V N-Channel MOSFET Ordering and Marking Information Device Marking: SSF6072G5 Package (Available) SOT-223 Operating Temperature Range C : -55 to 175ºC Devices per Unit Package Type Units/ Tube Tubes/ Inner Box Units/ Inner Box Inner Boxes/ Carton Box Units/ Carton Box SOT-223 2500pcs 2pcs 5000pcs 8pcs 40000pcs Reliability Test Program Test Item Conditions Duration Sample Size High Temperature Reverse Bias(HTRB) High Temperature Gate Bias(HTGB) Tj=125℃ or 150℃ @ 80% of Max VDSS/VCES/VR 168 hours 500 hours 1000 hours 3 lots x 77 devices Tj=125℃ or 150℃ @ 100% of Max VGSS 168 hours 500 hours 1000 hours 3 lots x 77 devices www.goodark.com Page 7 of 7 Rev.1.1