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TSL2550
Ambient Light Sensor with SMBus
Interface
General Description
The TSL2550 is a digital-output light sensor with a two-wire,
SMBus serial interface. It combines two photodiodes and a
companding analog-to-digital converter (ADC) on a single
CMOS integrated circuit to provide light measurements over an
effective 12-bit dynamic range with a response similar to that
of the human eye.
The TSL2550 is designed for use with broad wavelength light
sources. One of the photodiodes (channel 0) is sensitive to
visible and infrared light, while the second photodiode
(channel 1) is sensitive primarily to infrared light. An integrating
ADC converts the photodiode currents to channel 0 and
channel 1 digital outputs. Channel 1 digital output is used to
compensate for the effect of the infrared component of
ambient light on channel 0 digital output. The ADC digital
outputs of the two channels are used to obtain a value that
approximates the human eye response in the commonly used
unit of Lux.
This device is intended primarily for use in applications in which
measurement of ambient light is used to control display
backlighting such as laptop computers, PDAs, camcorders, and
GPS systems. Other applications include contrast control in LED
signs and displays, camera exposure control, lighting controls,
etc. The integrating conversion technique used by the TSL2550
effectively eliminates the effect of flicker from AC-powered
lamps, increasing the stability of the measurement.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of TSL2550, Ambient Light Sensor
with SMBus Interface are listed below:
Figure 1:
Added Value of Using TSL2550
Benefits
Features
• Enables Operation in IR Light Environments
• Patented Dual-Diode Architecture
• Digital Interface Is Less Susceptible to Noise
• Two-Wire SMBus Digital Interface
• Enabling Low Active and Power-Down Modes
Reduces Average Power Consumption
• 1mW (typ) Active Power Mode
• Reduces Board Space Requirements while
Simplifying Designs
• Available in 2.6mm x 3.8mm TMB or 5mm x 6.2mm
SOIC (D) Packages
ams Datasheet
[v1-00] 2016-May-20
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TSL2550 − General Description
• Converts Light Intensity to Digital Signal
• Infrared Compensation to Approximate Human Eye
Response
• Companding A/D for Wide Dynamic Range
• Rejects 50 Hz/60 Hz Lighting Ripple
• Single Supply Operation (2.7 V to 5.5 V)
• Power Down Mode
• Low-Profile Surface-Mount Packages
Functional Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TSL2550 Block Diagram
Integrating
A/D Converter
Channel 0
Photodiode
Channel 1
Photodiode
V DD = 2.7 V to 5.5 V
Control Logic
Output Registers
SMBCLK
Two-Wire Serial Interface
SMBData
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Pin Assignments
Pin Assignments
Figure 3:
Package D 8-Lead SOIC (Top View)
8 SMBData
VDD 1
NC 2
7 NC
NC 3
6 NC
5 SMBCLK
GND 4
Figure 4:
Package T 4-Lead SMD (Top View)
VDD 1
4 SMBData
GND 2
3 SMBCLK
Figure 5:
Terminal Functions
Terminal
Type
Description
Name
D Pkg
No.
T Pkg
No.
GND
4
2
SMBCLK
5
3
I
SMBus serial clock input terminal — clock signal for SMBus
serial data.
SMBData
8
4
I/O
SMBus serial data I/O terminal — serial data I/O for SMBus.
VDD
1
1
ams Datasheet
[v1-00] 2016-May-20
Power supply ground. All voltages are referenced to GND.
Supply voltage.
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TSL2550 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or
any other conditions beyond those indicated under
Recommended Operating Conditions is not implied. Exposure
to absolute-maximum-rated conditions for extended periods
may affect device reliability.
Figure 6:
Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted)
Symbol
Parameter
VDD
Supply voltage (1)
VO
Digital output voltage range
IO
Digital output current
I(SMBIN)
TA
TSTRG
ESDHBM
Min
-0.3
Max
Units
6
V
+6
V
± 10
mA
SMBus input/output current
-1
20
mA
Operating free-air temperature range
-40
85
°C
Storage temperature range
-40
85
°C
ESD tolerance, human body model
Solder conditions in accordance with JEDEC
J-STD-020A, maximum temperature (2)
±2000
V
260
°C
Note(s):
1. All voltages are with respect to GND.
2. Package D only: The device may be hand soldered provided that heat is applied only to the solder pad and no contact is made
between the tip of the solder iron and the device lead. The maximum time heat should be applied to the device is 5 seconds.
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Electrical Characteristics
Electrical Characteristics
Figure 7:
Recommended Operating Conditions
Symbol
Parameter
VDD
Supply voltage
Min
Max
Units
2.7
5.5
V
0
70
°C
0.8
V
TA
Operating free-air temperature
VIL
SMBus input low voltage @ VDD = 3.3 V ± 5%
VIH
SMBus input high voltage @ VDD = 3.3 V ± 5%
2.1
SMBus operating frequency
10
f(SMBCLK)
V
100
kHz
Figure 8:
Electrical Characteristics over Recommended Operating Free-Air Temperature Range (unless
otherwise noted)
Symbol
Parameter
Test Conditions
IO = 50 μA
VOL
SMBus output low voltage
Typ
Max
Unit
0.01
V
IO = 4 μA
Active, VSMBCLK and
VSMDATA = VDD ,
VDD = 3.3 V ± 5%
IDD
Min
0.4
0.35
0.6
mA
Power down, VSMBCLK
and VSMDATA = VDD ,
VDD = 3.3 V ±5%
10
μA
Supply current
IIH
High level input current
VI = VDD
5
μA
IIL
Low level input current
VI = 0
-5
μA
ams Datasheet
[v1-00] 2016-May-20
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TSL2550 − Electrical Characteristics
Figure 9:
Operating Characteristics at VDD = 3.3 V, TA = 25°C (unless otherwise noted) (see Notes (1), (2), (3))
Parameter
Test Conditions
Channel
Min
Typ
Max
Ch0
1
Ch1
1
Unit
Ee = 0
ADC count value
standard mode
λp= 640 nm
Ee
Ch0
639
799
959
counts
= 72 μW/cm2
Ch1
λp = 940 nm
Ch0
2
Ee = 140 μW/cm
85
511
Ch1
799
1039
703
Ch0
1
Ch1
1
Ee = 0
ADC count value
extended mode
λp = 640 nm
Ee
Ch0
155
Ch1
16
Ch0
155
Ch1
139
counts
= 72 μW/cm2
λp = 940 nm
2
Ee = 140 μW/cm
λp = 640 nm,
ADC count value ratio:
Ch1/Ch0, standard mode
Ee = 72 μW/cm2
λp = 940 nm,
Ee = 140 μW/cm2
Re
Irradiance responsivity
standard mode
Rv
Illuminance responsivity
standard mode
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0.070
0.106
0.175
0.70
0.88
1.20
λp = 640 nm
Ch0
11.1
Ee = 72 μW/cm2
Ch1
1.2
λp = 940 nm
Ch0
5.7
Ee = 140 μW/cm2
Ch1
5
Ch0
2.8
Ch1
0.23
Ch0
19
Ch1
13
Fluorescent light
source: 300 Lux
counts/
(μW/ cm2)
counts/lux
Incandescent light
source: 50 Lux
ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Electrical Characteristics
Parameter
(Sensor Lux) / (actual
Lux), standard mode (4)
Test Conditions
Channel
Min
Typ
Max
Fluorescent light
source: 300 Lux
0.65
1
1.35
Incandescent light
source: 50 Lux
0.5
1
1.5
Unit
Note(s):
1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible 640 nm LEDs
and infrared 940 nm LEDs are used for final product testing for compatibility with high volume production.
2. The 640 nm irradiance E e is supplied by an AlInGaP light-emitting diode with the following characteristics: peak wavelength λp =
640 nm and spectral halfwidth Δλ½ = 17 nm.
3. The 940 nm irradiance E e is supplied by a GaAs light-emitting diode with the following characteristics: peak wavelength λp = 940
nm and spectral halfwidth Δλ½ = 40 nm.
4. The sensor Lux is calculated using the empirical formula shown on p. 11 of this data sheet based on measured Ch0 and Ch1 ADC
count values for the light source specified. Actual Lux is obtained with a commercial luxmeter. The range of the (sensor Lux) / (actual
Lux) ratio is estimated based on the variation of the 640 nm and 940 nm optical parameters. Devices are not 100% tested with
fluorescent or incandescent light sources.
ams Datasheet
[v1-00] 2016-May-20
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TSL2550 − Electrical Characteristics
Figure 10:
AC Electrical Characteristics, VDD = 3.3 V, TA = 25°C (unless otherwise noted)
Symbol
Parameter
t(CONV)
Conversion time, per channel,
standard mode
400
ms
t(CONV)
Conversion time, per channel,
extended mode
80
ms
f(SMBCLK)
t(BUF)
Test Conditions
Min
Clock frequency
Bus free time between start
and stop condition
Typ
Max
100
Unit
kHz
4.7
μs
4
μs
4.7
μs
4
μs
t(HDSTA)
Hold time after (repeated)
start condition. After this
period, the first clock is
generated.
t(SUSTA)
Repeated start condition setup
time
t(SUSTO)
Stop condition setup time
t(HDDAT)
Data hold time
300
ns
t(SUDAT)
Data setup time
250
ns
t(LOW)
SMBCLK clock low period
4.7
μs
t(HIGH)
SMBCLK clock high period
4
μs
Detect clock/data low timeout
25
t(TIMEOUT)
35
ms
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
1000
ns
Ci
Input pin capacitance
10
pF
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[v1-00] 2016-May-20
TSL2550 − Parameter Measurement Information
Parameter Measurement
Information
Figure 11:
SMBus Timing Diagrams
t(LOW)
t(R)
t(F)
VIH
SMBCLK
VIL
t(HDSTA)
t(BUF)
t(HIGH)
t(SUSTA)
t(HDDAT)
t(SUSTO)
t(SUDAT)
VIH
SMBDATA
VIL
P
Stop
Condition
S
S
Start
Condition
Start
P
Stop
t(LOWSEXT)
SMBCLKACK
SMBCLKACK
t(LOWMEXT)
t(LOWMEXT)
t(LOWMEXT)
SMBCLK
SMBDATA
Figure 12:
SMBus Timing Diagram for Send Byte Format
1
9
1
9
SMBCLK
SMBDATA
A6
A5
A4
A3
A2
A1
A0
R/W
Start by
Master
D6
D5
D4
D3
D2
D1
D0
ACK by
TSL2550
Frame 1 SMBus Slave Address Byte
ams Datasheet
[v1-00] 2016-May-20
D7
ACK by Stop by
TSL2550 Master
Frame 2 Command Byte
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TSL2550 − Parameter Measurement Information
Figure 13:
SMBus Timing Diagram for Receive Byte Format
1
9
1
9
SMBCLK
SMBDATA
A6
A5
A4
A3
A2
A1
A0
R/W
Start by
Master
ACK by
TSL2550
Frame 1 SMBus Slave Address Byte
Page 10
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D7
D6
D5
D4
D3
D2
D1
D0
NACK by Stop by
Master Master
Frame 2 Data Byte From TSL2550
ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Typical Operating Characteristics
Typical Operating
Characteristics
Figure 14:
Spectral Responsivity
1
Relative Responsivity
0.8
Channel 0
Photodiode
0.6
0.4
Channel 1
Photodiode
0.2
0
400
500
600
700
800
900
1000
1100
5.5
6
O Wavelength nm
Figure 15:
Normalized ADC Output vs. Supply Voltage
1.8
Normalized ADC Output
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
2.5
3
3.5
4
4.5
5
VDD Supply Voltage V
ams Datasheet
[v1-00] 2016-May-20
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TSL2550 − Principles Of Operation
Principles Of Operation
Analog-to-Digital Converter
The TSL2550 contains an integrating analog-to-digital
converter (ADC) that integrates a photodiode current. First it
integrates channel 0 photodiode current and then it integrates
channel 1 photodiode current. At the end of the conversion
cycle for each channel, the conversion result is transferred to
the appropriate channel 0 or channel 1 ADC register. The
transfer is double-buffered to ensure that invalid data is not
read during the transfer. After the data is transferred, the
TSL2550 automatically begins the next conversion cycle. A
VALID bit is used to indicate that data has been written to the
ADC register after ADC is enabled.
Interface to the ADC and control of other device functions is
accomplished using the standard 2-wire System Management
Bus (SMBus) interface. Both versions 1.1 and 2.0 of the SMBus
are supported.
The ADC has two operating modes: standard and extended. In
standard mode, the integration time is 400 mS for each channel
or 800 mS for both channel 0 and channel 1. Extended mode
shortens the integration time by a factor of five with a
corresponding decrease in responsivity of 5×. The extended
range allows the device to operate at higher light levels,
extending the overall dynamic range by a factor of five.
Digital Interface
The TSL2550 contains an 8-bit command register that can be
written and read via the SMBus. The command register controls
the overall operation of the device. There are two read-only
registers that contain the latest converted value of each of the
two ADC channels. The SMBus slave address is hardwired
internally as 0111001 (MSB to LSB, A6 to A0).
Both the send byte protocol and the receive byte protocol are
implemented in the TSL2550. The send byte protocol allows
single bytes of data to be written to the device (see Figure 16).
The written byte is called the COMMAND byte. The receive byte
protocol allows single bytes of data to be read from the device
(see Figure 17). The receive data can be either the previously
written COMMAND byte or the data from one of the ADC
channels. In Figure 16 and Figure 17, the clear area represents
data sent by the host and the shaded area represents data
returned by the ambient light sensor or slave device.
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Principles Of Operation
Figure 16:
Send Byte Protocol
1
7
1
1
8
1
1
S
Slave Address
WR
A
Data Byte
A
P
S = Start Condition
P = Stop Condition
Shaded = Slave Transmission
Figure 17:
Receive Byte Protocol
1
7
1
1
8
1
1
S
Slave Address
RD
A
Data Byte
A
P
S = Start Condition
ams Datasheet
[v1-00] 2016-May-20
P = Stop Condition
Shaded = Slave Transmission
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TSL2550 − Principles Of Operation
Command Register
The command register is used primarily to:
• Select which ADC register will be read during a read cycle
• Switch the dynamic range of the device between standard
and extended range modes
• Power the device up for operation or power it down for
minimum power consumption
Figure 18 shows the six primary commands used to control the
TSL2550.
Figure 18:
Command Summary
Command
Function
0x00h
Power-down state
0x03h
Power-up state/Read command register
0x1Dh
Write command to assert extended range mode
0x18h
Write command to reset or return to standard range mode
0x43h
Read ADC channel 0
0x83h
Read ADC channel 1
The content of the command register defaults to 0x00h when
power is applied to the device, placing the device into the
power-down mode.
Once the TSL2550 is set to the standard range mode (0x18h) or
the extended range mode (0x1Dh), the device remains in that
mode until it is powered down or the mode is changed via the
command register.
The 0x03h command has two purposes: It is used to power up
the device and can also be used to check that the device is
communicating properly. The value returned during a read
cycle should be 0x03h.
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Principles Of Operation
ADC Register
The TSL2550 contains two ADC registers (channel 0 and channel
1). Each ADC register contains two component fields that are
used to determine the logarithmic ADC count value: CHORD
bits and STEP bits. The CHORD bits correspond to the most
significant portion of the ADC value and specifies a segment of
the piece-wise linear approximation. The STEP bits correspond
to the least significant portion of the ADC count value and
specifies a linear value within a segment. CHORD and STEP bits
all equal to 0 corresponds to a condition in which the light level
is below the detection limit of the sensor. CHORD and STEP bits
all equal to 1 corresponds to an overflow condition.
Each of the two ADC value registers contain seven data bits and
a valid bit as described in Figure 19.
Figure 19:
ADC Register Data Format
Valid
Chord Bits
Step Bits
B7
B6
B5
B4
B3
B2
B1
B0
VALID
C2
C1
C0
S3
S2
S1
S0
Field
Bits
VALID
7
CHORD
6 to 4
CHORD number.
STEP
3 to 0
STEP number.
Description
ADC channel data is valid. One indicates that the ADC has written data into the
channel data register, since ADCEN was asserted in the COMMAND register.
The specific ADC value register read depends on the last read
command written to the command register, as described above
and in the Operation section, below.
The MSB of the ADC register (VALID bit B7) is used to indicate
that data has been written to the ADC register after the device
is powered up as described in Command Register section.
Bits 6 through 0 contain the 7-bit code representing the ADC
count value, which is proportional to a photodetector current.
In this code, the ADC count value is represented by a piece-wise
linear approximation to a log function. The transfer function is
broken into 8 chords of 16 steps each. (This code is very similar
to μ-law code used in audio compression — it differs in that it
does not have a sign bit and it is not inverted.) Figure 20 shows
the relationship between the CHORD and STEP bits and the
CHORD and STEP numbers and values. These are used to
calculate the ADC count value.
ams Datasheet
[v1-00] 2016-May-20
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Figure 20:
CHORD and STEP Numbers and Values vs Register Bits
Chord Bits B6, B5, B4
C, Chord Number
Chord Value (Note 1)
Step Value (Note 2)
000
0
0
1
001
1
16
2
010
2
49
4
011
3
115
8
100
4
247
16
101
5
511
32
110
6
1039
64
111
7
2095
128
Step Bits B3, B2, B1, B0
S, Step Number
0000
0
0001
1
0010
2
0011
3
0100
4
0101
5
0110
6
0111
7
1000
8
1001
9
1010
10
1011
11
1100
12
1101
13
1110
14
1111
15
Note(s):
1. CHORD VALUE = INT (16.5 × ((2C) - 1))
2. STEP VALUE = 2C
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Principles Of Operation
The ADC count value is obtained by adding the CHORD VALUE
and the product of the STEP NUMBER and STEP VALUE (which
depends on CHORD NUMBER).
ADC Count Value = ( ( Chord Value ) + ( Step Value ) × ( Step Number ) )
(EQ1)
The ADC count value can also be expressed as a formula:
(EQ2)
c
c
ADC Coun t Value = ( INT ( 16.25 × ( 2 – 1 ) ) ) + ( S × ( 2 ) )
where:
C
is the CHORD NUMBER (0 to 7)
S
is the STEP NUMBER (0 to 15)
as defined in Figure 20.
Operation
After applying VDD, the device will initially be in the power
down state. To operate the device, issue an SMBus Send Byte
protocol with the device address and the appropriate command
byte to read ADC channel 0 or ADC channel 1 (see Figure 18).
To obtain the conversion result, issue an SMBus Receive Byte
protocol with the device address. The data byte received will
correspond to the value in the ADC register (0 or 1) specified by
the previous command. If a conversion has not been completed
since power up (either through V DD or power up command), the
valid bit will be 0, and the data will not be valid. If there is a valid
conversion result available, the valid bit will be set (1), and the
remaining 7 bits will represent valid data from the previously
selected ADC register. Data may be read repeatedly from the
currently selected ADC register, and although it will remain
valid, the ADC register will not be updated until a new
conversion completes for that channel (800 ms total since there
are two serial 400 ms per channel conversion times in standard
mode). Note also that the command register itself may be read,
as a check to be sure that the device is communicating properly.
To power down the device for reduced power consumption,
issue an SMBus Send Byte protocol with the device address
followed by 0 as indicated in Figure 18.
ams Datasheet
[v1-00] 2016-May-20
Page 17
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TSL2550 − Application Information
The TSL2550 is intended for use in ambient light detection
applications, such as display backlight control, where
adjustments are made to display brightness or contrast based
on the brightness of the ambient light, as perceived by the
human eye. Conventional silicon detectors respond strongly to
infrared light, which the human eye does not see. This can lead
to significant error when the infrared content of the ambient
light is high, such as with incandescent lighting, due to the
difference between the silicon detector response and the
brightness perceived by the human eye.
Application Information
This problem is overcome in the TSL2550 through the use of
two photodiodes. One of the photodiodes (channel 0) is
sensitive to both visible and infrared light, while the second
photodiode (channel 1) is sensitive primarily to infrared light.
An integrating ADC converts the photodiode currents to
channel 0 and channel 1 digital outputs. Channel 1 digital
output is used to compensate for the effect of the infrared
component of light on the channel 0 digital output. The ADC
digital outputs from the two channels are used in a formula to
obtain a value that approximates the human eye response in
the commonly used Illuminance unit of Lux. For standard mode:
(EQ3)
Light Level ( lux ) ) = ( Ch0 – Ch1 ) × 0.39 × e
2
( – 0.181R )
where:
R = Ch1 Counts / (Ch0 Counts - Ch1 Counts)
The formula above was obtained by optical testing with
fluorescent and incandescent light sources. The light level
calculated from the formula will be slightly higher than the
actual light level for sunlight and will be slightly lower than the
actual light level for composite fluorescent and incandescent
light sources.
Note(s): Please see ams application notes for additional
information, including implementing a display brightness
control system with the TSL2550, and for a simple
implementation of the equation shown above suitable for use
in embedded microcontrollers.
Figure 21 contains a summary of the typical sensor outputs for
several common light sources.
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Application Information
Figure 21:
Sensor Output Summary (Standard Mode)
Light
Source
Illuminance
(LUX)
Channel 0
(Counts)
Channel 1
(Counts)
Ratio:
CH1/CH0
LUX Per
CH0 Count
Fluorescent
297
831
68
0.082
0.36
Daylight
(shade)
201
895
343
0.383
0.22
Incandescent
42
959
671
0.7
0.04
Light from 50 or 60 Hz sources, and especially fluorescent
lighting, has a high harmonic content. Since the TSL2550
integrates the ambient light over an approximately 400
millisecond interval (per channel), this light ripple is typically
reduced to less than 1/4 LSB.
Power Supply Decoupling
The power supply lines must be decoupled with a 0.1 μF
capacitor placed as close to the device package as possible. The
bypass capacitor should have low effective series resistance
(ESR) and effective series inductance (ESI), such as the common
ceramic types, which provide a low impedance path to ground
at high frequencies to handle transient currents caused by
internal logic switching.
ams Datasheet
[v1-00] 2016-May-20
Page 19
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TSL2550 − Application Information
PCB Pad Layout
Suggested PCB pad layout guidelines for the D package and T
package are shown in Figure 22 and Figure 23.
Figure 22:
Suggested D Package PCB Layout
4.65
6.90
1.27
2.25
0.50
Note(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
Figure 23:
Suggested T Package PCB Layout
2.90
1.50
1.00
0.90
Note(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
Page 20
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Mechanical Data
Mechanical Data
Figure 24:
Package D — Plastic Small Outline IC Packaging Configuration
PACKAGE D
Plastic Small-Outline
BOTTOM VIEW
TOP VIEW
PIN 1
PIN 1
6 1.27
SIDE VIEW
2.8 TYP
CLEAR WINDOW
NOTE B
8 0.510
0.330
END VIEW
0.50
0.25
5.00
4.80
45
5.3
MAX
0.88 TYP TOP OF
SENSOR DIE
A
1.75
1.35
DETAIL A
4.00
3.80
6.20
5.80
RoHS
0.25
0.19
Pb
Green
1.27
0.41
0.25
0.10
Note(s):
1. All linear dimensions are in millimeters.
2. The center of the 1234 μm by 282 μm photo-active area is typically located in the center of the package in the long dimension and
269 μm off center in the short dimension.
3. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2016-May-20
Page 21
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TSL2550 − Mechanical Data
Figure 25:
Package T — Four-Lead Surface Mount Device Packaging Configuration
PACKAGE T
Four-Lead Surface Mount Device
TOP VIEW
PHOTODIODE ACTIVE AREA LOCATION
1.46
0.28
PIN 1
PIN 4
0.67
1.50
1.23
0.55
SIDE VIEW
0.50
1.35
DETAIL A: TYPICAL PACKAGE TERMINAL
0.35
3.10
2
7
0.10
0.90
0.78
BOTTOM VIEW
0.78
A
R 0.25
2.60
PIN 4
PIN 1
3.80
Pb
RoHS
Green
Note(s):
1. All linear dimensions are in millimeters.
2. Terminal finish is gold.
3. Dimension tolerance is ± 0.15 mm.
4. This drawing is subject to change without notice.
Page 22
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Mechanical Data
Figure 26:
Package D Carrier Tape
SIDE VIEW
Ko
2.11 0.10 [0.083 0.004]
0.292 0.013
[0.0115 0.0005]
END VIEW
TOP VIEW
1.50
8 0.1
[0.315 0.004]
4 0.1
[0.157 0.004]
2 0.05
[0.079 0.002]
1.75 0.10
[0.069 0.004]
B
5.50 0.05
[0.217 0.002]
12 + 0.3 ï 0.1
[0.472 + 0.12 ï 0.004]
A
A
B
DETAIL A
Ao
DETAIL B
6.45 0.10
[0.254 0.004]
Bo
5.13 0.10
[0.202 0.004]
Note(s):
1. All linear dimensions are in millimeters [inches].
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, B o, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 1000 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2016-May-20
Page 23
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TSL2550 − Mechanical Data
Figure 27:
Package T Carrier Tape
0.30 0.050
2.10
SIDE VIEW
1.75 0.100
B
1.50
4 0.100
END VIEW
2 0.100
8 Typ
TOP VIEW
12 0.100
5.50
0.100
1.50
R 0.20 TYP
B
A
A
DETAIL B
DETAIL A
2.90 0.100 Ao
3.09 MAX
R 0.20 TYP
R 0.20 TYP
4.29 MAX
4.10 0.100 Bo
1.80 Ko
Note(s):
1. All linear dimensions are in millimeters.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, B o, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 1000 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
Page 24
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Manufacturing Information
Manufacturing Information
The D and T packages have been tested and have demonstrated
an ability to be reflow soldered to a PCB substrate. The process,
equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 28:
TSL2550 Solder Reflow Profile
Parameter
Reference
TSL2550D/TSL2550T
Average temperature gradient in preheating
2.5°C/s
tsoak
2 to 3 minutes
Time above 217°C
t1
Max 60 s
Time above 230°C
t2
Max 50 s
Time above Tpeak −10°C
t3
Max 10 s
Tpeak
260°C (−0°C/5°C)
Soak time
Peak temperature in reflow
Temperature gradient in cooling
Max −5°C/s
Figure 29:
TSL2550D/TSL2550T Solder Reflow Profile Graph
Tpeak
Not to scale — for reference only
T3
T2
Temperature (5C)
T1
Time (s)
t3
t2
tsoak
ams Datasheet
[v1-00] 2016-May-20
t1
Page 25
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TSL2550 − Manufacturing Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package
molding compound.
Package D
To ensure the package molding compound contains the
smallest amount of absorbed moisture possible, all devices
shipped in carrier tape have been pre-baked and shipped in a
sealed moisture-barrier bag. No further action is necessary if
these devices are processed through solder reflow within 24
hours of the seal being broken on the moisture-barrier bag.
However, for all devices shipped in tubes or if the seal on the
moisture barrier bag has been broken for 24 hours or longer, it
is recommended that the following procedures be used to
ensure the package molding compound contains the smallest
amount of absorbed moisture possible.
For devices shipped in tubes:
1. Remove devices from tubes
2. Bake devices for 4 hours, at 90°C
3. After cooling, load devices back into tubes
4. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through
solder reflow in 24 hours. Devices can be re-baked for 4 hours,
at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours
at 90°C).
For devices shipped in carrier tape:
1. Bake devices for 4 hours, at 90°C in the tape
2. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through
solder reflow in 24 hours. Devices can be re-baked for 4 hours
in tape, at 90°C for a cumulative total of 12 hours (3 bakes for 4
hours at 90°C).
Page 26
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Manufacturing Information
Package T
To ensure the package molding compound contains the
smallest amount of absorbed moisture possible, each device is
dry-baked prior to being packed for shipping. Devices are
packed in a sealed aluminized envelope with silica gel to
protect them from ambient moisture during shipping,
handling, and storage before use.
The T package has been assigned a moisture sensitivity level of
MSL 3 and the devices should be stored under the following
conditions:
• Temperature Range: 5°C to 50°C
• Relative Humidity: 60% maximum
• Total Time: 6 months from the date code on the
aluminized envelope—if unopened
• Opened Time: 168 hours or fewer
Rebaking will be required if the devices have been stored
unopened for more than 6 months or if the aluminized envelope
has been open for more than 168 hours. If rebaking is required,
it should be done at 90°C for 4 hours.
ams Datasheet
[v1-00] 2016-May-20
Page 27
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TSL2550 − Ordering & Contact Information
Ordering & Contact Information
Figure 30:
Ordering Information
Ordering
Code
Package
− Leads
Device
TA
Package
Designator
Delivery
Type
Delivery
Quantity
TSL2550D
SOIC-8
TSL2550
-40°C to 85°C
D
Tape & Reel
1000 pcs/reel
TSL2550T
T-4
TSL2550
-40°C to 85°C
T
Tape & Reel
1000 pcs/reel
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Page 28
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet
[v1-00] 2016-May-20
Page 29
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TSL2550 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Page 30
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
ams Datasheet
[v1-00] 2016-May-20
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Page 31
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TSL2550 − Revision Information
Revision Information
Changes from 029L (2007-Oct) to current revision 1-00 (2016-May-20)
Page
Content of TAOS datasheet was updated to latest ams design
Updated Key Benefits & Features
1
Updated Ordering Information
28
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Page 32
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ams Datasheet
[v1-00] 2016-May-20
TSL2550 − Content Guide
Content Guide
ams Datasheet
[v1-00] 2016-May-20
1
1
2
General Description
Key Benefits & Features
Functional Block Diagram
3
4
5
9
11
Pin Assignments
Absolute Maximum Ratings
Electrical Characteristics
Parameter Measurement Information
Typical Operation Characteristics
12
12
12
14
15
17
Principles Of Operation
Analog-to-Digital Converter
Digital Interface
Command Register
ADC Register
Operation
18
19
20
Application Information
Power Supply Decoupling
PCB Pad Layout
21
Mechanical Data
25
26
26
27
Manufacturing Information
Moisture Sensitivity
Package D
Package T
28
29
30
31
32
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
Page 33
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