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TSL230RD,
TSL230ARD,
TSL230BRD
Programmable
Light-to-Frequency Converters
General Description
The TSL230RD, TSL230ARD, and TSL230BRD Programmable
Light-to-Frequency Converters combine a configurable silicon
photodiode and a current-to-frequency converter on single
monolithic CMOS integrated circuit. The output can be either a
pulse train or a square wave (50% duty cycle) with frequency
directly proportional to light intensity. Device sensitivity is
selectable in three ranges, providing two decades of
adjustment. The full-scale output frequency can be scaled by
one of four preset values. All inputs and the output are TTL
compatible, allowing direct two-way communication with a
microcontroller for programming and output interface. The
output enable (OE) places the output in the high-impedance
state for multiple-unit sharing of a microcontroller input line.
The devices are available with absolute output frequency
tolerances of ±10% (TSL230BRD), ±15% (TSL230ARD), and
±20% (TSL230RD). They have been temperature compensated
for the ultraviolet-to-visible light range of 320nm to 700nm and
respond over the light range of 320nm to 1050nm. The devices
are characterized over the temperature range of -25°C to 70°C.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of TSL230RD, TSL230ARD, and
TSL230BRD Programmable Light-to-Frequency Converters, are
listed below:
Figure 1:
Added Value of Using TSL230RD, TSL230ARD, and TSL230BRD
Benefits
Features
• Detects light intensity at a high resolution
• 2.5M:1 input dynamic range
• Provides low light level operation
• Low dark frequency of 0.4 Hz (typical)
• Allows larger operating range
• Programmable gain up to 100x
• Enables low power-down state
• Power-down mode (5μA typical)
ams Datasheet
[v1-00] 2016-Apr-13
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TSL230RD, TSL230ARD, TSL230BRD − General Description
Benefits
Features
• Reduces board space requirements while
simplifying designs
• 5mm x 6.2mm SOIC (D) package
• High-resolution conversion of light intensity to frequency
with no external components
• Programmable sensitivity and full-scale output frequency
• Communicates directly with a microcontroller
• High irradiance responsivity: 790Hz/(μW/cm 2) typical at
640nm
• Single-supply operation: 2.7V to 5.5V
• Nonlinearity error typically 0.2% at 100 kHz
• Stable 200ppm/°C temperature coefficient
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TSL230RD, TSL230ARD, and TSL230BRD Block Diagram
Output
Light
Photodiode Array
Current-to-Frequency
Converter
OE
S0
Page 2
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S1
S2
S3
ams Datasheet
[v1-00] 2016-Apr-13
TSL230RD, TSL230ARD, TSL230BRD − Pin Assignments
The TSL230RD, TSL230ARD, and TSL230BRD pin assignments
are described below:
Pin Assignments
Figure 3:
Pin Diagram of Package D 8-LEAD SOIC (Top View)
S0 1
8 S3
S1 2
7 S2
OE 3
6 OUT
GND 4
5 VDD
Figure 4:
Terminal Functions
Terminal
Type
Description
Name
No.
S0, S1
1, 2
I
Sensitivity-select inputs
OE
3
I
Enable for fO (active low)
GND
4
Ground
VDD
5
Supply voltage
OUT
6
O
Scaled-frequency (fO) output
S2, S3
7, 8
I
fO scaling-select inputs
Figure 5:
Selectable Options
S1
S0
Sensitivity
S3
S2
fO Scaling
(divide-by)
L
L
Power down
L
L
1
L
H
1×
L
H
2
H
L
10×
H
L
10
H
H
100×
H
H
100
ams Datasheet
[v1-00] 2016-Apr-13
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TSL230RD, TSL230ARD, TSL230BRD − Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute Maximum Ratings
Figure 6:
Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted)
Symbol
VDD
Parameter
Min
Supply voltage (1)
Max
Unit
6
V
VI
Input voltage range, all inputs
-0.3
VDD + 0.3
V
TA
Operating free-air temperature range
-40
85
°C
Storage temperature range
-40
85
°C
260
°C
Tstrg
Solder conditions in accordance with JEDEC J-STD-020A,
maximum temperature (2)
Note(s):
1. All voltages are with respect to GND.
2. The device may be hand soldered provided that heat is applied only to the solder pad and no contact is made between the tip of
the solder iron and the device lead. The maximum time heat should be applied to the device is 5 seconds.
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ams Datasheet
[v1-00] 2016-Apr-13
TSL230RD, TSL230ARD, TSL230BRD − Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or
SQC (Statistical Quality Control) methods.
Electrical Characteristics
Figure 7:
Recommended Operating Conditions
Symbol
Parameter
Min
Nom
Max
Unit
2.7
5
5.5
V
VDD
Supply voltage
VIH
High-level input voltage
VDD = 4.5V to 5.5V
2
VDD
V
VIL
Low-level input voltage
VDD = 4.5V to 5.5V
0
0.8
V
TA
Operating free-air temperature range
-25
70
°C
Max
Unit
Figure 8:
Electrical Characteristics at TA = 25°C, VDD = 5V (unless otherwise noted)
Symbol
Parameter
Test Conditions
VOH
High-level output voltage
IOH = -4mA
VOL
Low-level output voltage
IOL = 4mA
IIH
Min
Typ
4
4.5
0.4
V
High-level input current
5
μA
IIL
Low-level input current
5
μA
IDD
Supply current
F.S.
kSVS
0.25
V
Power-on mode
2
3
mA
Power-down mode
5
12
μA
Full-scale frequency (1)
S0 = S1 = H, S2 = S3 = L
Temperature coefficient of
output frequency
λ ≤ 700nm (2)
±200
ppm/°C
Supply voltage sensitivity
VDD = 5V ±10%
±0.5
%/V
1.1
MHz
Note(s):
1. Full-scale frequency is the maximum operating frequency of the device without saturation.
2. The temperature coefficient of output frequency is measured with constant irradiance as the temperature is varied between -25°C
and 70°C. The constant irradiance is sufficiently high that the output frequency is much greater than the dark frequency over the
entire temperature range
ams Datasheet
[v1-00] 2016-Apr-13
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Dark frequency
Responsivity
Output pulse
duration
fD
Re
tw
Page 6
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Output frequency
Parameter
fO
Symbol
S2 or S3 = H
S2 = S3 = L
125
1/2fO
0.79
S0 = S1 = H,
S2 = S3 = L
1
0.4
0.8
S0 = S1 = S2 = S3
=H
10
50
1
10
100
Typ
TSL230RD
Ee = 0,
S0 = S1 = H,
S2 = S3 = L
8
S0 = S1 = S3 = H,
S2 = L
0.8
S0 = H,
S1 = S2 = S3 = L
40
8
S1 = H,
S0 = S2 = S3 = L
S0 = S1 = S2 = H,
S3 = L
80
Min
S0 = S1 = H,
S2 = S3 = L
Test
Conditions
600
10
1.2
12
60
1.2
12
120
Max
125
0.85
8.5
42.5
0.85
8.5
85
Min
1/2fO
0.79
0.4
1
10
50
1
10
100
Typ
TSL230ARD
600
10
1.15
11.5
57.5
1.15
11.5
115
Max
Figure 9:
Operating Characteristics at VDD = 5V, TA = 25°C, Ee = 126μW/cm2, λp = 640nm (unless otherwise noted)
125
0.9
9
45
0.9
9
90
Min
1/2fO
0.79
0.4
1
10
50
1
10
100
Typ
TSL230BRD
s
ns
kHz/
(μW/cm2)
Hz
kHz
Unit
ams Datasheet
[v1-00] 2016-Apr-13
600
10
1.1
11
55
1
11
110
Max
T S L 2 3 0 R D , T S L 2 3 0 A R D , T S L 2 3 0 B R D − Electrical Characteristics
±0.5%
fO = 0MHz to
1MHz
±0.5%
±0.2%
±0.1%
Typ
100
Max
50
ams Datasheet
[v1-00] 2016-Apr-13
3. Principal frequency is the internal oscillator frequency, equivalent to divide-by-1 output selection.
2. Nonlinearity test condition: S0 = S1 = H, S2 = S3 = L.
150
150
Min
Response time to output enable (OE)
1 pulse of new frequency plus 1μs
Min
2 periods of new principal frequency plus 1μs (3)
100
Max
TSL230ARD
Response time to programming change
Step response to full-scale step input
50
±0.2%
fO = 0MHz to
100kHz
Typ
±0.1%
Min
TSL230RD
fO = 0MHz to
10kHz
Test
Conditions
Recovery from power down
Nonlinearity (1), (2)
Parameter
1. Nonlinearity is defined as the deviation of f O from a straight line between zero and full scale, expressed as a percent of full scale.
Note(s):
Symbol
T S L 2 3 0 R D, T S L 2 3 0 A R D, T S L 2 3 0 B R D − Electrical Characteristics
50
±0.5%
±0.2%
±0.1%
Typ
TSL230BRD
ns
μs
%F.S.
Unit
Page 7
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150
100
Max
TSL230RD, TSL230ARD, TSL230BRD − Typical Operating Characteristics
Typical Operating
Characteristics
Figure 10:
Output Frequency vs. Irradiance
Output Frequency (fO ï fD) — kHz
1000
100
10
VDD = 5 V
Op = 640 nm
TA = 25qC
S2 = S3 = L
S0 = H, S1 = H
1
0.1
S0 = L, S1 = H
0.01
S0 = H, S1 = L
0.001
0.001 0.01 0.1
1
10
100
1k
10k 100k
1M
Ee ï Irradiance ïPW/cm2
Figure 11:
Photodiode Spectral Responsivity
1.2
Normalized Responsivity
1.0
0.8
0.6
0.4
0.2
0
300
400
500
600
700
800
900
1000 1100
O ï Wavelength ï nm
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ams Datasheet
[v1-00] 2016-Apr-13
TSL230RD, TSL230ARD, TSL230BRD − Typical Operating Characteristics
Figure 12:
Dark Frequency vs. Temperature
1.2
fD — Dark Frequency — Hz
1
VDD = 5 V
Ee = 0
S0 = S1 = H
S2 = S3 = L
0.8
0.6
0.4
0.2
0
ï25
0
25
50
75
TA ï Temperature ï qC
Temperature Coefficient of Output Frequency — ppm/C
Figure 13:
Temperature Coefficient of Output Frequency vs.
Wavelength of Incident Light
7000
VDD = 5 V
6000
5000
4000
3000
2000
1000
0
300
400
500
600
700
800
900
1000
Oï Wavelength of Incident Light ï nm
ams Datasheet
[v1-00] 2016-Apr-13
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TSL230RD, TSL230ARD, TSL230BRD − Typical Operating Characteristics
Figure 14:
Output Frequency vs. Supply Voltage
1.010
TA = 25qC
fO = 100 kHz
Normalized Output Frequency
1.005
1.000
0.995
0.990
0.985
0.980
2.5
3
3.5
4
4.5
5
5.5
VDD ï Supply Voltage ï V
Figure 15:
Normalized Output Frequency vs. Angular Displacement
0.8
0.6
0.4
0.2
Angular Displacement is
Equal for Both Aspects
0
ï90
Page 10
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Optical Axis
fO — Output Frequency — Normalized
1
ï60
ï30
0
30
60
ï Angular Displacement ï q
90
ams Datasheet
[v1-00] 2016-Apr-13
TSL230RD, TSL230ARD, TSL230BRD − Application Information
Application Information
Power-Supply Considerations
Power-supply lines must be decoupled by a 0.01μF to 0.1μF
capacitor with short leads placed close to the TSL230RD device
package. A low-noise power supply is required to minimize
jitter on output pulses.
Device Operational Details
The frequency at the output pin (OUT) is given by:
(EQ1)
f O = fD + (R e) (Ee)
where:
• f O is the output frequency
• f D is the output frequency for dark condition (Ee = 0)
• R e is the device responsivity for a given wavelength of
light given in kHz/(μW/cm 2)
• E e is the incident irradiance in μW/cm2
f D is an output frequency resulting from leakage currents. As
shown in the equation above, this frequency represents a
light-independent term in the total output frequency fO. At very
low light levels, this dark frequency can be a significant portion
of f O. The dark frequency is temperature dependent.
For optimum performance of any given device over the full
output range, the value of f D should be measured (in the
absence of light) and later subtracted from subsequent light
measurement (see Figure 10).
Input Interface
A low-impedance electrical connection between the device OE
pin and the device GND pin is required for improved noise
immunity.
Output Interface
The output of the device is designed to drive a standard TTL or
CMOS logic input over short distances. If lines greater than
12 inches are used on the output, a buffer or line driver is
recommended.
ams Datasheet
[v1-00] 2016-Apr-13
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TSL230RD, TSL230ARD, TSL230BRD − Application Information
Sensitivity Adjustment
Sensitivity is controlled by two logic inputs, S0 and S1.
Sensitivity is adjusted using an electronic iris technique effectively an aperture control - to change the response of the
device to a given amount of light. The sensitivity can be set to
one of three levels: 1×, 10×, or 100×, providing two decades of
adjustment. This allows the responsivity of the device to be
optimized to a given light level while preserving the full-scale
output-frequency range. Changing of sensitivity also changes
the effective photodiode area by the same factor.
Output-Frequency Scaling
Output-frequency scaling is controlled by two logic inputs, S2
and S3. Scaling is accomplished on chip by internally
connecting the pulse-train output of the converter to a series
of frequency dividers. Divided outputs available are divide-by
2, 10, 100, and 1 (no division). Divided outputs are 50
percent-duty-cycle square waves while the direct output
(divide-by 1) is a fixed-pulse-width pulse train. Because division
of the output frequency is accomplished by counting pulses of
the principal (divide-by 1) frequency, the final-output period
represents an average of n (where n is 2, 10, or 100) periods of
the principal frequency. The output-scaling-counter registers
are cleared upon the next pulse of the principal frequency after
any transition of the S0, S1, S2, S3, or OE lines. The output goes
high upon the next subsequent pulse of the principal
frequency, beginning a new valid period. This minimizes the
time delay between a change on the input lines and the
resulting new output period in the divided output modes. In
contrast with the sensitivity adjust, use of the divided outputs
lowers both the full-scale frequency and the dark frequency by
the selected scale factor.
The frequency-scaling function allows the output range to be
optimized for a variety of measurement techniques. The
divide-by-1 or straight-through output can be used with a
frequency counter, pulse accumulator, or high-speed timer
(period measurement). The divided-down outputs may be used
where only a slower frequency counter is available, such as a
low-cost microcontroller, or where period measurement
techniques are used. The divide-by-10 and divide-by-100
outputs provide lower frequency ranges for high
resolution-period measurement.
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ams Datasheet
[v1-00] 2016-Apr-13
TSL230RD, TSL230ARD, TSL230BRD − Application Information
Measuring the Frequency
The choice of interface and measurement technique depends
on the desired resolution and data acquisition rate. For
maximum data-acquisition rate, period-measurement
techniques are used.
Using the divide-by-2 output, data can be collected at a rate of
twice the output frequency or one data point every
microsecond for full-scale output. Period measurement
requires the use of a fast reference clock with available
resolution directly related to reference-clock rate. Output
scaling can be used to increase the resolution for a given clock
rate or to maximize resolution as the light input changes. Period
measurement is used to measure rapidly varying light levels or
to make a very fast measurement of a constant light source.
Maximum resolution and accuracy may be obtained using
frequency-measurement, pulse-accumulation, or integration
techniques. Frequency measurements provide the added
benefit of averaging out random or high-frequency variations
(jitter) resulting from noise in the light signal or from noise in
the power supply. Resolution is limited mainly by available
counter registers and allowable measurement time. Frequency
measurement is well suited for slowly varying or constant light
levels and for reading average light levels over short periods of
time. Integration (the accumulation of pulses over a very long
period of time) can be used to measure exposure, the amount
of light present in an area over a given time period.
ams Datasheet
[v1-00] 2016-Apr-13
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TSL230RD, TSL230ARD, TSL230BRD − Application Information
PCB Pad Layout
Suggested PCB pad layout guidelines for the D package are
shown in Figure 16.
Figure 16:
Suggested D Package PCB Layout
4.65
6.90
1.27
2.25
0.50
Note(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
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ams Datasheet
[v1-00] 2016-Apr-13
TSL230RD, TSL230ARD, TSL230BRD − Mechanical Information
This SOIC package consists of an integrated circuit mounted on
a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The TSL230RD has a
10 × 10 array of photodiodes with a total size of 0.96mm by
0.96mm. The photodiodes are 0.084mm × 0.084mm in size and
are positioned on 0.096 mm centers.
Mechanical Information
Figure 17:
Package D - Plastic Small Outline IC Packaging Configuration
MECHANICAL DATA
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The TSL230RD has a 10 u 10 array of photodiodes with a total size of
0.96 mm by 0.96 mm. The photodiodes are 0.084 mm u 0.084 mm in size and are positioned on 0.096 mm centers.
PACKAGE D
PLASTIC SMALL-OUTLINE
NOTE B
2
TOP VIEW
2.12
0.250
BOTTOM VIEW
3.00 0.250
PIN 1
PIN 1
8 0.510
0.330
6 1.27
SIDE VIEW
2.8 TYP
CLEAR WINDOW
5.00
4.80
END VIEW
0.50
0.25
45
5.3
MAX
0.88 TYP TOP OF
SENSOR DIE
A
1.75
1.35
DETAIL A
4.00
3.80
6.20
5.80
0.25
0.19
Pb
RoHS
NOTES: A.
B.
C.
D.
1.27
0.41
0.25
0.10
Green
All linear dimensions are in millimeters.
The center of the 0.96-mm by 0.96-mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
This drawing is subject to change without notice.
Figure 8. Package D — Plastic Small Outline IC Packaging Configuration
The LUMENOLOGY r Company
Note(s):
r
Copyright E 2007, TAOS Inc.
1. All linear dimensions are in millimeters.
2. The center of the 0.96mm by 0.96mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
3. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2016-Apr-13
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TSL230RD, TSL230ARD, TSL230BRD − Mechanical Information
Figure 18:
Package D Carrier Tape
SIDE VIEW
Ko
2.11 0.10 [0.083 0.004]
0.292 0.013
[0.0115 0.0005]
END VIEW
TOP VIEW
1.50
8 0.1
[0.315 0.004]
4 0.1
[0.157 0.004]
2 0.05
[0.079 0.002]
1.75 0.10
[0.069 0.004]
B
5.50 0.05
[0.217 0.002]
12 + 0.3 ï 0.1
[0.472 + 0.12 ï 0.004]
A
A
B
DETAIL A
Ao
DETAIL B
6.45 0.10
[0.254 0.004]
Bo
5.13 0.10
[0.202 0.004]
Note(s):
1. All linear dimensions are in millimeters [inches].
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481- B 2001.
4. Each reel is 178 millimeters in diameter and contains 1000 parts.
5. ams AG packaging tape and reel conform to the requirements of EIA Standard 481- B.
6. This drawing is subject to change without notice.
Page 16
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ams Datasheet
[v1-00] 2016-Apr-13
TSL230RD, TSL230ARD, TSL230BRD − Manufacturing Information
Manufacturing Information
The Plastic Small Outline IC package (D) has been tested and
has demonstrated an ability to be reflow soldered to a PCB
substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The component should be limited to a maximum
of three passes through this solder reflow profile.
Figure 19:
TSL230RD Solder Reflow Profile
Parameter
Reference
TSL230RD
Average temperature gradient in preheating
Soak time
2.5°C/s
tsoak
2 to 3 minutes
Time above 217°C
t1
Max 60 s
Time above 230°C
t2
Max 50 s
Time above Tpeak - 10°C
t3
Max 10 s
Tpeak
260°C (-0°C/+5°C)
Peak temperature in reflow
Temperature gradient in cooling
Max -5°C/s
Figure 20:
TSL230RD Solder Reflow Profile Graph
Tpeak
Not to scale — for reference only
T3
T2
Temperature (C)
T1
Time(sec)
(s)
Time
t3
t2
tsoak
ams Datasheet
[v1-00] 2016-Apr-13
t1
Page 17
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TSL230RD, TSL230ARD, TSL230BRD − Manufacturing Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package
molding compound. To prevent these adverse conditions, all
devices shipped in carrier tape have been pre-baked and
shipped in a sealed moisture-barrier bag. No further action is
necessary if these devices are processed through solder reflow
within 24 hours of the seal being broken on the
moisture-barrier bag.
However, for all devices shipped in tubes or if the seal on the
moisture barrier bag has been broken for 24 hours or longer, it
is recommended that the following procedures be used to
ensure the package molding compound contains the smallest
amount of absorbed moisture possible.
For devices shipped in tubes:
1. Remove devices from tubes
2. Bake devices for 4 hours, at 90°C
3. After cooling, load devices back into tubes
4. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through
solder reflow in 24 hours. Devices can be re-baked for 4 hours,
at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours
at 90°C).
For devices shipped in carrier tape:
1. Bake devices for 4 hours, at 90°C in the tape
2. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through
solder reflow in 24 hours. Devices can be re−baked for 4 hours
in tape, at 90°C for a cumulative total of 12 hours (3 bakes for 4
hours at 90°C).
Page 18
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ams Datasheet
[v1-00] 2016-Apr-13
TSL230RD, TSL230ARD, TSL230BRD − Ordering & Contact Information
Ordering & Contact Information
Figure 21:
Ordering Information
Ordering Code
Device
TA
Package - Leads
Package Designator
TSL230RD-TR
TSL230RD
-25°C to 70°C
SOIC-8
D
TSL230ARD-TR
TSL230ARD
-25°C to 70°C
SOIC-8
D
TSL230BRD-TR
TSL230BRD
-25°C to 70°C
SOIC-8
D
Buy our products or get free samples online at:
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www.ams.com/Technical-Support
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ams AG
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8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-00] 2016-Apr-13
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TSL230RD, TSL230ARD, TSL230BRD − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
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TSL230RD, TSL230ARD, TSL230BRD − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-00] 2016-Apr-13
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TSL230RD, TSL230ARD, TSL230BRD − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
Page 22
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Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-00] 2016-Apr-13
TSL230RD, TSL230ARD, TSL230BRD − Revision Information
Revision Information
Changes from 054P (2007-Oct) to current revision 1-00 (2016-Apr-13)
Page
Content of TAOS datasheet was converted to the latest ams design
Added Figure 1
1
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
ams Datasheet
[v1-00] 2016-Apr-13
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TSL230RD, TSL230ARD, TSL230BRD − Content Guide
Content Guide
Page 24
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1
1
2
General Description
Key Benefits & Features
Block Diagram
3
4
5
8
Pin Assignments
Absolute Maximum Ratings
Electrical Characteristics
Typical Operating Characteristics
11
11
11
11
11
12
12
13
14
Application Information
Power-Supply Considerations
Device Operational Details
Input Interface
Output Interface
Sensitivity Adjustment
Output-Frequency Scaling
Measuring the Frequency
PCB Pad Layout
15
Mechanical Information
17
18
18
18
Manufacturing Information
Moisture Sensitivity
For devices shipped in tubes:
For devices shipped in carrier tape:
19
20
21
22
23
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
ams Datasheet
[v1-00] 2016-Apr-13