TSL230RD, TSL230ARD, TSL230BRD Programmable Light-to-Frequency Converters General Description The TSL230RD, TSL230ARD, and TSL230BRD Programmable Light-to-Frequency Converters combine a configurable silicon photodiode and a current-to-frequency converter on single monolithic CMOS integrated circuit. The output can be either a pulse train or a square wave (50% duty cycle) with frequency directly proportional to light intensity. Device sensitivity is selectable in three ranges, providing two decades of adjustment. The full-scale output frequency can be scaled by one of four preset values. All inputs and the output are TTL compatible, allowing direct two-way communication with a microcontroller for programming and output interface. The output enable (OE) places the output in the high-impedance state for multiple-unit sharing of a microcontroller input line. The devices are available with absolute output frequency tolerances of ±10% (TSL230BRD), ±15% (TSL230ARD), and ±20% (TSL230RD). They have been temperature compensated for the ultraviolet-to-visible light range of 320nm to 700nm and respond over the light range of 320nm to 1050nm. The devices are characterized over the temperature range of -25°C to 70°C. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of TSL230RD, TSL230ARD, and TSL230BRD Programmable Light-to-Frequency Converters, are listed below: Figure 1: Added Value of Using TSL230RD, TSL230ARD, and TSL230BRD Benefits Features • Detects light intensity at a high resolution • 2.5M:1 input dynamic range • Provides low light level operation • Low dark frequency of 0.4 Hz (typical) • Allows larger operating range • Programmable gain up to 100x • Enables low power-down state • Power-down mode (5μA typical) ams Datasheet [v1-00] 2016-Apr-13 Page 1 Document Feedback TSL230RD, TSL230ARD, TSL230BRD − General Description Benefits Features • Reduces board space requirements while simplifying designs • 5mm x 6.2mm SOIC (D) package • High-resolution conversion of light intensity to frequency with no external components • Programmable sensitivity and full-scale output frequency • Communicates directly with a microcontroller • High irradiance responsivity: 790Hz/(μW/cm 2) typical at 640nm • Single-supply operation: 2.7V to 5.5V • Nonlinearity error typically 0.2% at 100 kHz • Stable 200ppm/°C temperature coefficient Block Diagram The functional blocks of this device are shown below: Figure 2: TSL230RD, TSL230ARD, and TSL230BRD Block Diagram Output Light Photodiode Array Current-to-Frequency Converter OE S0 Page 2 Document Feedback S1 S2 S3 ams Datasheet [v1-00] 2016-Apr-13 TSL230RD, TSL230ARD, TSL230BRD − Pin Assignments The TSL230RD, TSL230ARD, and TSL230BRD pin assignments are described below: Pin Assignments Figure 3: Pin Diagram of Package D 8-LEAD SOIC (Top View) S0 1 8 S3 S1 2 7 S2 OE 3 6 OUT GND 4 5 VDD Figure 4: Terminal Functions Terminal Type Description Name No. S0, S1 1, 2 I Sensitivity-select inputs OE 3 I Enable for fO (active low) GND 4 Ground VDD 5 Supply voltage OUT 6 O Scaled-frequency (fO) output S2, S3 7, 8 I fO scaling-select inputs Figure 5: Selectable Options S1 S0 Sensitivity S3 S2 fO Scaling (divide-by) L L Power down L L 1 L H 1× L H 2 H L 10× H L 10 H H 100× H H 100 ams Datasheet [v1-00] 2016-Apr-13 Page 3 Document Feedback TSL230RD, TSL230ARD, TSL230BRD − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings Figure 6: Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted) Symbol VDD Parameter Min Supply voltage (1) Max Unit 6 V VI Input voltage range, all inputs -0.3 VDD + 0.3 V TA Operating free-air temperature range -40 85 °C Storage temperature range -40 85 °C 260 °C Tstrg Solder conditions in accordance with JEDEC J-STD-020A, maximum temperature (2) Note(s): 1. All voltages are with respect to GND. 2. The device may be hand soldered provided that heat is applied only to the solder pad and no contact is made between the tip of the solder iron and the device lead. The maximum time heat should be applied to the device is 5 seconds. Page 4 Document Feedback ams Datasheet [v1-00] 2016-Apr-13 TSL230RD, TSL230ARD, TSL230BRD − Electrical Characteristics All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. Electrical Characteristics Figure 7: Recommended Operating Conditions Symbol Parameter Min Nom Max Unit 2.7 5 5.5 V VDD Supply voltage VIH High-level input voltage VDD = 4.5V to 5.5V 2 VDD V VIL Low-level input voltage VDD = 4.5V to 5.5V 0 0.8 V TA Operating free-air temperature range -25 70 °C Max Unit Figure 8: Electrical Characteristics at TA = 25°C, VDD = 5V (unless otherwise noted) Symbol Parameter Test Conditions VOH High-level output voltage IOH = -4mA VOL Low-level output voltage IOL = 4mA IIH Min Typ 4 4.5 0.4 V High-level input current 5 μA IIL Low-level input current 5 μA IDD Supply current F.S. kSVS 0.25 V Power-on mode 2 3 mA Power-down mode 5 12 μA Full-scale frequency (1) S0 = S1 = H, S2 = S3 = L Temperature coefficient of output frequency λ ≤ 700nm (2) ±200 ppm/°C Supply voltage sensitivity VDD = 5V ±10% ±0.5 %/V 1.1 MHz Note(s): 1. Full-scale frequency is the maximum operating frequency of the device without saturation. 2. The temperature coefficient of output frequency is measured with constant irradiance as the temperature is varied between -25°C and 70°C. The constant irradiance is sufficiently high that the output frequency is much greater than the dark frequency over the entire temperature range ams Datasheet [v1-00] 2016-Apr-13 Page 5 Document Feedback Dark frequency Responsivity Output pulse duration fD Re tw Page 6 Document Feedback Output frequency Parameter fO Symbol S2 or S3 = H S2 = S3 = L 125 1/2fO 0.79 S0 = S1 = H, S2 = S3 = L 1 0.4 0.8 S0 = S1 = S2 = S3 =H 10 50 1 10 100 Typ TSL230RD Ee = 0, S0 = S1 = H, S2 = S3 = L 8 S0 = S1 = S3 = H, S2 = L 0.8 S0 = H, S1 = S2 = S3 = L 40 8 S1 = H, S0 = S2 = S3 = L S0 = S1 = S2 = H, S3 = L 80 Min S0 = S1 = H, S2 = S3 = L Test Conditions 600 10 1.2 12 60 1.2 12 120 Max 125 0.85 8.5 42.5 0.85 8.5 85 Min 1/2fO 0.79 0.4 1 10 50 1 10 100 Typ TSL230ARD 600 10 1.15 11.5 57.5 1.15 11.5 115 Max Figure 9: Operating Characteristics at VDD = 5V, TA = 25°C, Ee = 126μW/cm2, λp = 640nm (unless otherwise noted) 125 0.9 9 45 0.9 9 90 Min 1/2fO 0.79 0.4 1 10 50 1 10 100 Typ TSL230BRD s ns kHz/ (μW/cm2) Hz kHz Unit ams Datasheet [v1-00] 2016-Apr-13 600 10 1.1 11 55 1 11 110 Max T S L 2 3 0 R D , T S L 2 3 0 A R D , T S L 2 3 0 B R D − Electrical Characteristics ±0.5% fO = 0MHz to 1MHz ±0.5% ±0.2% ±0.1% Typ 100 Max 50 ams Datasheet [v1-00] 2016-Apr-13 3. Principal frequency is the internal oscillator frequency, equivalent to divide-by-1 output selection. 2. Nonlinearity test condition: S0 = S1 = H, S2 = S3 = L. 150 150 Min Response time to output enable (OE) 1 pulse of new frequency plus 1μs Min 2 periods of new principal frequency plus 1μs (3) 100 Max TSL230ARD Response time to programming change Step response to full-scale step input 50 ±0.2% fO = 0MHz to 100kHz Typ ±0.1% Min TSL230RD fO = 0MHz to 10kHz Test Conditions Recovery from power down Nonlinearity (1), (2) Parameter 1. Nonlinearity is defined as the deviation of f O from a straight line between zero and full scale, expressed as a percent of full scale. Note(s): Symbol T S L 2 3 0 R D, T S L 2 3 0 A R D, T S L 2 3 0 B R D − Electrical Characteristics 50 ±0.5% ±0.2% ±0.1% Typ TSL230BRD ns μs %F.S. Unit Page 7 Document Feedback 150 100 Max TSL230RD, TSL230ARD, TSL230BRD − Typical Operating Characteristics Typical Operating Characteristics Figure 10: Output Frequency vs. Irradiance Output Frequency (fO ï fD) kHz 1000 100 10 VDD = 5 V Op = 640 nm TA = 25qC S2 = S3 = L S0 = H, S1 = H 1 0.1 S0 = L, S1 = H 0.01 S0 = H, S1 = L 0.001 0.001 0.01 0.1 1 10 100 1k 10k 100k 1M Ee ï Irradiance ïPW/cm2 Figure 11: Photodiode Spectral Responsivity 1.2 Normalized Responsivity 1.0 0.8 0.6 0.4 0.2 0 300 400 500 600 700 800 900 1000 1100 O ï Wavelength ï nm Page 8 Document Feedback ams Datasheet [v1-00] 2016-Apr-13 TSL230RD, TSL230ARD, TSL230BRD − Typical Operating Characteristics Figure 12: Dark Frequency vs. Temperature 1.2 fD Dark Frequency Hz 1 VDD = 5 V Ee = 0 S0 = S1 = H S2 = S3 = L 0.8 0.6 0.4 0.2 0 ï25 0 25 50 75 TA ï Temperature ï qC Temperature Coefficient of Output Frequency ppm/C Figure 13: Temperature Coefficient of Output Frequency vs. Wavelength of Incident Light 7000 VDD = 5 V 6000 5000 4000 3000 2000 1000 0 300 400 500 600 700 800 900 1000 Oï Wavelength of Incident Light ï nm ams Datasheet [v1-00] 2016-Apr-13 Page 9 Document Feedback TSL230RD, TSL230ARD, TSL230BRD − Typical Operating Characteristics Figure 14: Output Frequency vs. Supply Voltage 1.010 TA = 25qC fO = 100 kHz Normalized Output Frequency 1.005 1.000 0.995 0.990 0.985 0.980 2.5 3 3.5 4 4.5 5 5.5 VDD ï Supply Voltage ï V Figure 15: Normalized Output Frequency vs. Angular Displacement 0.8 0.6 0.4 0.2 Angular Displacement is Equal for Both Aspects 0 ï90 Page 10 Document Feedback Optical Axis fO Output Frequency Normalized 1 ï60 ï30 0 30 60 ï Angular Displacement ï q 90 ams Datasheet [v1-00] 2016-Apr-13 TSL230RD, TSL230ARD, TSL230BRD − Application Information Application Information Power-Supply Considerations Power-supply lines must be decoupled by a 0.01μF to 0.1μF capacitor with short leads placed close to the TSL230RD device package. A low-noise power supply is required to minimize jitter on output pulses. Device Operational Details The frequency at the output pin (OUT) is given by: (EQ1) f O = fD + (R e) (Ee) where: • f O is the output frequency • f D is the output frequency for dark condition (Ee = 0) • R e is the device responsivity for a given wavelength of light given in kHz/(μW/cm 2) • E e is the incident irradiance in μW/cm2 f D is an output frequency resulting from leakage currents. As shown in the equation above, this frequency represents a light-independent term in the total output frequency fO. At very low light levels, this dark frequency can be a significant portion of f O. The dark frequency is temperature dependent. For optimum performance of any given device over the full output range, the value of f D should be measured (in the absence of light) and later subtracted from subsequent light measurement (see Figure 10). Input Interface A low-impedance electrical connection between the device OE pin and the device GND pin is required for improved noise immunity. Output Interface The output of the device is designed to drive a standard TTL or CMOS logic input over short distances. If lines greater than 12 inches are used on the output, a buffer or line driver is recommended. ams Datasheet [v1-00] 2016-Apr-13 Page 11 Document Feedback TSL230RD, TSL230ARD, TSL230BRD − Application Information Sensitivity Adjustment Sensitivity is controlled by two logic inputs, S0 and S1. Sensitivity is adjusted using an electronic iris technique effectively an aperture control - to change the response of the device to a given amount of light. The sensitivity can be set to one of three levels: 1×, 10×, or 100×, providing two decades of adjustment. This allows the responsivity of the device to be optimized to a given light level while preserving the full-scale output-frequency range. Changing of sensitivity also changes the effective photodiode area by the same factor. Output-Frequency Scaling Output-frequency scaling is controlled by two logic inputs, S2 and S3. Scaling is accomplished on chip by internally connecting the pulse-train output of the converter to a series of frequency dividers. Divided outputs available are divide-by 2, 10, 100, and 1 (no division). Divided outputs are 50 percent-duty-cycle square waves while the direct output (divide-by 1) is a fixed-pulse-width pulse train. Because division of the output frequency is accomplished by counting pulses of the principal (divide-by 1) frequency, the final-output period represents an average of n (where n is 2, 10, or 100) periods of the principal frequency. The output-scaling-counter registers are cleared upon the next pulse of the principal frequency after any transition of the S0, S1, S2, S3, or OE lines. The output goes high upon the next subsequent pulse of the principal frequency, beginning a new valid period. This minimizes the time delay between a change on the input lines and the resulting new output period in the divided output modes. In contrast with the sensitivity adjust, use of the divided outputs lowers both the full-scale frequency and the dark frequency by the selected scale factor. The frequency-scaling function allows the output range to be optimized for a variety of measurement techniques. The divide-by-1 or straight-through output can be used with a frequency counter, pulse accumulator, or high-speed timer (period measurement). The divided-down outputs may be used where only a slower frequency counter is available, such as a low-cost microcontroller, or where period measurement techniques are used. The divide-by-10 and divide-by-100 outputs provide lower frequency ranges for high resolution-period measurement. Page 12 Document Feedback ams Datasheet [v1-00] 2016-Apr-13 TSL230RD, TSL230ARD, TSL230BRD − Application Information Measuring the Frequency The choice of interface and measurement technique depends on the desired resolution and data acquisition rate. For maximum data-acquisition rate, period-measurement techniques are used. Using the divide-by-2 output, data can be collected at a rate of twice the output frequency or one data point every microsecond for full-scale output. Period measurement requires the use of a fast reference clock with available resolution directly related to reference-clock rate. Output scaling can be used to increase the resolution for a given clock rate or to maximize resolution as the light input changes. Period measurement is used to measure rapidly varying light levels or to make a very fast measurement of a constant light source. Maximum resolution and accuracy may be obtained using frequency-measurement, pulse-accumulation, or integration techniques. Frequency measurements provide the added benefit of averaging out random or high-frequency variations (jitter) resulting from noise in the light signal or from noise in the power supply. Resolution is limited mainly by available counter registers and allowable measurement time. Frequency measurement is well suited for slowly varying or constant light levels and for reading average light levels over short periods of time. Integration (the accumulation of pulses over a very long period of time) can be used to measure exposure, the amount of light present in an area over a given time period. ams Datasheet [v1-00] 2016-Apr-13 Page 13 Document Feedback TSL230RD, TSL230ARD, TSL230BRD − Application Information PCB Pad Layout Suggested PCB pad layout guidelines for the D package are shown in Figure 16. Figure 16: Suggested D Package PCB Layout 4.65 6.90 1.27 2.25 0.50 Note(s): 1. All linear dimensions are in millimeters. 2. This drawing is subject to change without notice. Page 14 Document Feedback ams Datasheet [v1-00] 2016-Apr-13 TSL230RD, TSL230ARD, TSL230BRD − Mechanical Information This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically nonconductive clear plastic compound. The TSL230RD has a 10 × 10 array of photodiodes with a total size of 0.96mm by 0.96mm. The photodiodes are 0.084mm × 0.084mm in size and are positioned on 0.096 mm centers. Mechanical Information Figure 17: Package D - Plastic Small Outline IC Packaging Configuration MECHANICAL DATA This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically nonconductive clear plastic compound. The TSL230RD has a 10 u 10 array of photodiodes with a total size of 0.96 mm by 0.96 mm. The photodiodes are 0.084 mm u 0.084 mm in size and are positioned on 0.096 mm centers. PACKAGE D PLASTIC SMALL-OUTLINE NOTE B 2 TOP VIEW 2.12 0.250 BOTTOM VIEW 3.00 0.250 PIN 1 PIN 1 8 0.510 0.330 6 1.27 SIDE VIEW 2.8 TYP CLEAR WINDOW 5.00 4.80 END VIEW 0.50 0.25 45 5.3 MAX 0.88 TYP TOP OF SENSOR DIE A 1.75 1.35 DETAIL A 4.00 3.80 6.20 5.80 0.25 0.19 Pb RoHS NOTES: A. B. C. D. 1.27 0.41 0.25 0.10 Green All linear dimensions are in millimeters. The center of the 0.96-mm by 0.96-mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1). Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55. This drawing is subject to change without notice. Figure 8. Package D Plastic Small Outline IC Packaging Configuration The LUMENOLOGY r Company Note(s): r Copyright E 2007, TAOS Inc. 1. All linear dimensions are in millimeters. 2. The center of the 0.96mm by 0.96mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1). 3. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55. 4. This drawing is subject to change without notice. ams Datasheet [v1-00] 2016-Apr-13 Page 15 Document Feedback TSL230RD, TSL230ARD, TSL230BRD − Mechanical Information Figure 18: Package D Carrier Tape SIDE VIEW Ko 2.11 0.10 [0.083 0.004] 0.292 0.013 [0.0115 0.0005] END VIEW TOP VIEW 1.50 8 0.1 [0.315 0.004] 4 0.1 [0.157 0.004] 2 0.05 [0.079 0.002] 1.75 0.10 [0.069 0.004] B 5.50 0.05 [0.217 0.002] 12 + 0.3 ï 0.1 [0.472 + 0.12 ï 0.004] A A B DETAIL A Ao DETAIL B 6.45 0.10 [0.254 0.004] Bo 5.13 0.10 [0.202 0.004] Note(s): 1. All linear dimensions are in millimeters [inches]. 2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. 3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481- B 2001. 4. Each reel is 178 millimeters in diameter and contains 1000 parts. 5. ams AG packaging tape and reel conform to the requirements of EIA Standard 481- B. 6. This drawing is subject to change without notice. Page 16 Document Feedback ams Datasheet [v1-00] 2016-Apr-13 TSL230RD, TSL230ARD, TSL230BRD − Manufacturing Information Manufacturing Information The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The component should be limited to a maximum of three passes through this solder reflow profile. Figure 19: TSL230RD Solder Reflow Profile Parameter Reference TSL230RD Average temperature gradient in preheating Soak time 2.5°C/s tsoak 2 to 3 minutes Time above 217°C t1 Max 60 s Time above 230°C t2 Max 50 s Time above Tpeak - 10°C t3 Max 10 s Tpeak 260°C (-0°C/+5°C) Peak temperature in reflow Temperature gradient in cooling Max -5°C/s Figure 20: TSL230RD Solder Reflow Profile Graph Tpeak Not to scale for reference only T3 T2 Temperature (C) T1 Time(sec) (s) Time t3 t2 tsoak ams Datasheet [v1-00] 2016-Apr-13 t1 Page 17 Document Feedback TSL230RD, TSL230ARD, TSL230BRD − Manufacturing Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package molding compound. To prevent these adverse conditions, all devices shipped in carrier tape have been pre-baked and shipped in a sealed moisture-barrier bag. No further action is necessary if these devices are processed through solder reflow within 24 hours of the seal being broken on the moisture-barrier bag. However, for all devices shipped in tubes or if the seal on the moisture barrier bag has been broken for 24 hours or longer, it is recommended that the following procedures be used to ensure the package molding compound contains the smallest amount of absorbed moisture possible. For devices shipped in tubes: 1. Remove devices from tubes 2. Bake devices for 4 hours, at 90°C 3. After cooling, load devices back into tubes 4. Perform solder reflow within 24 hours after bake Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be re-baked for 4 hours, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C). For devices shipped in carrier tape: 1. Bake devices for 4 hours, at 90°C in the tape 2. Perform solder reflow within 24 hours after bake Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be re−baked for 4 hours in tape, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C). Page 18 Document Feedback ams Datasheet [v1-00] 2016-Apr-13 TSL230RD, TSL230ARD, TSL230BRD − Ordering & Contact Information Ordering & Contact Information Figure 21: Ordering Information Ordering Code Device TA Package - Leads Package Designator TSL230RD-TR TSL230RD -25°C to 70°C SOIC-8 D TSL230ARD-TR TSL230ARD -25°C to 70°C SOIC-8 D TSL230BRD-TR TSL230BRD -25°C to 70°C SOIC-8 D Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: [email protected] For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbaderstrasse 30 8141 Premstaetten Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com ams Datasheet [v1-00] 2016-Apr-13 Page 19 Document Feedback TSL230RD, TSL230ARD, TSL230BRD − RoHS Compliant & ams Green Statement RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Page 20 Document Feedback ams Datasheet [v1-00] 2016-Apr-13 TSL230RD, TSL230ARD, TSL230BRD − Copyrights & Disclaimer Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. ams Datasheet [v1-00] 2016-Apr-13 Page 21 Document Feedback TSL230RD, TSL230ARD, TSL230BRD − Document Status Document Status Document Status Product Preview Preliminary Datasheet Datasheet Datasheet (discontinued) Page 22 Document Feedback Product Status Definition Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs ams Datasheet [v1-00] 2016-Apr-13 TSL230RD, TSL230ARD, TSL230BRD − Revision Information Revision Information Changes from 054P (2007-Oct) to current revision 1-00 (2016-Apr-13) Page Content of TAOS datasheet was converted to the latest ams design Added Figure 1 1 Note(s): 1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision. 2. Correction of typographical errors is not explicitly mentioned. ams Datasheet [v1-00] 2016-Apr-13 Page 23 Document Feedback TSL230RD, TSL230ARD, TSL230BRD − Content Guide Content Guide Page 24 Document Feedback 1 1 2 General Description Key Benefits & Features Block Diagram 3 4 5 8 Pin Assignments Absolute Maximum Ratings Electrical Characteristics Typical Operating Characteristics 11 11 11 11 11 12 12 13 14 Application Information Power-Supply Considerations Device Operational Details Input Interface Output Interface Sensitivity Adjustment Output-Frequency Scaling Measuring the Frequency PCB Pad Layout 15 Mechanical Information 17 18 18 18 Manufacturing Information Moisture Sensitivity For devices shipped in tubes: For devices shipped in carrier tape: 19 20 21 22 23 Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer Document Status Revision Information ams Datasheet [v1-00] 2016-Apr-13