TCS3771

TCS3771
Color Light-To-Digital Converter with
Proximity Sensing
General Description
The TCS3771 family of devices provides red, green, blue, and
clear (RGBC) light sensing and proximity detection (when
coupled with an external IR LED). They detect light intensity
under a variety of lighting conditions and through a variety of
attenuation materials. The proximity detection feature allows a
large dynamic range of operation for use in short distance
detection behind dark glass such as in a cell phone or for longer
distance measurements for applications such as presence
detection for monitors or laptops. The programmable proximity
detection enables continuous measurements across the entire
range. In addition, an internal state machine provides the ability
to put the device into a low power mode in between RGBC and
proximity measurements providing very low average power
consumption.
The TCS3771 is directly useful in lighting conditions containing
minimal IR content such as LED RGB backlight control, reflected
LED color sampler, or fluorescent light color temperature
detector. With the addition of an IR blocking filter, the device is
an excellent ambient light sensor, color temperature monitor,
and general purpose color sensor.
The proximity function is targeted specifically towards
battery-powered mobile devices, LCD monitor, laptop, and
flat-panel television applications. In cell phones, the proximity
detection can detect when the user positions the phone close
to their ear. The device is fast enough to provide proximity
information at a high repetition rate needed when answering
a phone call. It can also detect both close and far distances so
the application can implement more complex algorithms to
provide a more robust interface. In laptop or monitor
applications, the product is sensitive enough to determine
whether a user is in front of the laptop using the keyboard or
away from the desk. This provides both improved green power
saving capability and the added security to lock the computer
when the user is not present.
Ordering Information and Content Guide appear at end of
datasheet.
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − General Description
Key Benefits & Features
The benefits and features of the TCS3771 are listed below:
Figure 1:
Added Value of using TCS3771
Benefits
Features
Single Device reduces board space
RGB Color Sensing and Proximity Detection in a Single Device
Enables both Correlated Color
Temperature and Ambient Light Sensing
across wide range of lighting condition
applications
Color Light Sensing
• Programmable Analog Gain, Integration Time, and Interrupt
Function with Upper and Lower Thresholds
• Resolution Up to 16 bits
• Very High Sensitivity - Ideally Suited for Operation Behind
Dark Glass
• Up to 1,000,000:1 Dynamic Range
Enables versatile Infra-red proximity
based object detection
Proximity Detection
• Programmable Number of IR Pulses, Current Sink for the IR
LED - No Limiting Resistor Needed, and Interrupt Function
with Upper and Lower Thresholds
• Covers a 2000:1 Dynamic Range
Low power wait state programmability
reduces average power consumption
Low Power Wait State
• 65μA Typical Current
• Wait Timer is Programmable from 2.4ms to > 7 seconds
Digital interfaces are less susceptible to
noise
I2C Interface Compatible
• Up to 400kHz (I2C Fast Mode)
Reduces micro-processor Interrupt
Overhead with both up persist and
no-persist interrupt thresholds
Dedicated Interrupt Pin
Enables drop-in and foot-print
compatible solutions
Pin and Register Set Compatible with the TCS3x7x Family of
Devices
Reduces board space requirements
while simplifying designs
Small 2mm × 2.4mm Dual Flat No-Lead Package
Low power sleep state reduces average
power consumption
Sleep Mode - 2.5μA Typical Current
Applications
The applications of TCS3771 include:
• RGB LED Backlight Control
• Ambient Color Temperature Sensing
• Cell Phone Touch Screen Disable
• Notebook/Monitor Security
• Automatic Menu Popup
• Industrial Process Control
• Medical Diagnostics
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ams Datasheet
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TCS3771 − General Description
End Products and Market Segments
• HDTVs, Mobile Handsets, Tablets, Laptops, Monitors,
PMP (Portable Media Payers)
• Medical and Commercial Instrumentation
• Consumer Toys
• Industrial/Commercial Lighting
Block Diagram
The functional blocks of this device for reference are
shown below:
Figure 2:
TCS3771 Block Diagram
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Detailed Description
Detailed Description
The TCS3771 light-to-digital device contains a 4 × 4 photodiode
array, integrating amplifiers, ADCs, accumulators, clocks,
buffers, comparators, a state machine, and an I 2C interface. The
4 × 4 photodiode array is composed of red-filtered,
green-filtered, blue-filtered, and clear photodiodes - four of
each type. Four integrating ADCs simultaneously convert the
amplified photodiode currents to a digital value providing up
to 16 bits of resolution. Upon completion of the conversion
cycle, the conversion result is transferred to the data registers.
The transfers are double-buffered to ensure that the integrity
of the data is maintained. Communication to the device is
accomplished through a fast (up to 400kHz), two-wire I2C serial
bus for easy connection to a microcontroller or embedded
controller.
The TCS3771 provides a separate pin for level-style interrupts.
When interrupts are enabled and a preset value is exceeded,
the interrupt pin is asserted and remains asserted until cleared
by the controlling firmware. The interrupt feature simplifies and
improves system efficiency by eliminating the need to poll a
sensor for a light intensity or proximity value. An interrupt is
generated when the value of an RGBC or proximity conversion
exceeds either an upper or lower threshold. In addition, a
programmable interrupt persistence feature allows the user to
determine how many consecutive exceeded thresholds are
necessary to trigger an interrupt. Interrupt thresholds and
persistence settings are configured independently for both
RGBC and proximity.
Proximity detection requires only a single external IR LED. An
internal LED driver can be configured to provide a constant
current sink of 12.5mA, 25mA, 50mA or 100mA of current. No
external current limiting resistor is required. The number of
proximity LED pulses can be programmed from 1 to 255 pulses.
Each pulse has a 14μs period. This LED current coupled with the
programmable number of pulses provides a 2000:1 contiguous
dynamic range.
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TCS3771 − Pin Assignments
The TCS3771 pin assignments are described below:
Pin Assignments
Figure 3:
Pin Diagram of Package FN Dual Flat No-Lead (Top View)
Package drawing not to scale.
Figure 4:
Terminal Functions
Terminal
Type
Description
Name
No
VDD
1
SCL
2
GND
3
LDR
4
O
LED driver for proximity emitter - up to 100mA, open drain
INT
5
O
Interrupt - open drain (active low)
SDA
6
I/O
I2C serial data I/O terminal - serial data I/O for I2C
ams Datasheet
[v1-30] 2014-Sep-01
Supply voltage
I
I2C serial clock input terminal - clock signal for I2C serial data
Power supply ground. All voltages are referenced to GND.
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TCS3771 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These are
stress ratings only. Functional operation of the device at these
or any other conditions beyond those indicated under
“Recommended Operating Conditions” on page 7 is not
implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Figure 5:
Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted)
Symbol
Parameter
Min
Max
Unit
3.8
V
-0.5
3.8
V
VDD
Supply voltage (1)
VO
Digital output voltage range
IO
Digital output current
-1
20
mA
Storage temperature range
-40
85
°C
2000
V
Tstg
ESD tolerance, human body model
Note(s) and/or Footnote(s):
1. All voltages are with respect to GND.
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[v1-30] 2014-Sep-01
TCS3771 − Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or
SQC (Statistical Quality Control) methods.
Electrical Characteristics
Figure 6:
Recommended Operating Conditions
Symbol
VDD
TA
Parameter
Min
Nom
Max
Unit
Supply voltage
2.7
3
3.3
V
Operating free-air temperature
-30
70
°C
Typ
Max
Unit
Active - LDR pulses off
235
330
Wait mode
65
Sleep mode - no I2C activity
2.5
Figure 7:
Operating Characteristics, VDD = 3V, TA = 25°C (unless otherwise noted)
Symbol
IDD
VOL
Parameter
Supply current
INT, SDA output low
voltage
Test Conditions
Min
μA
10
3mA sink current
0
0.4
6mA sink current
0
0.6
V
ILEAK
Leakage current,
SDA, SCL, INT pins
-5
5
μA
ILEAK
Leakage current, LDR
pin
-10
+10
μA
VIH
SCL, SDA input high
voltage
VIL
SCL, SDA input low
voltage
ams Datasheet
[v1-30] 2014-Sep-01
TCS37711 & TCS37715
0.7 VDD
TCS37713 & TCS37717
1.25
V
TCS37711 & TCS37715
0.3 VDD
TCS37713 & TCS37717
0.54
V
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T C S 3 7 7 1 − Electrical Characteristics
Figure 8:
Optical Characteristics, VDD = 3V, TA = 25°C, Gain = 16, ATIME = 0xF6 (unless otherwise noted) (1)
Parameter
Re
Irradiance
responsivity
Test
Conditions
Red Channel
Green Channel
Blue Channel
Clear Channel
Unit
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
λD = 465nm, (2)
0%
15%
10%
42%
65%
88%
19.2
24
28.8
λD = 525nm, (3)
6%
25%
60%
85%
9%
35%
22.4
28
33.6
λD = 625nm, (4)
85%
110%
0%
15%
5%
25%
27.2
34
40.8
counts/
(μW/cm2)
Note(s) and/or Footnote(s):
1. The percentage shown represents the ratio of the respective red, green, or blue channel value to the clear channel value.
2. The 465nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics:
dominant wavelength λD = 465nm, spectral halfwidth Δλ½ = 22nm, and luminous efficacy = 75lm/W.
3. The 525nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics:
dominant wavelength λD = 525nm, spectral halfwidth Δλ½ = 35nm, and luminous efficacy = 520lm/W.
4. The 625nm input irradiance is supplied by a AlInGaP light-emitting diode with the following characteristics:
dominant wavelength λD = 625nm, spectral halfwidth Δλ½ = 9nm, and luminous efficacy = 155lm/W.
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ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Electrical Characteristics
Figure 9:
RGBC Characteristics, VDD = 3V, TA = 25°C, AGAIN = 16, AEN = 1 (unless otherwise noted)
Parameter
Test Conditions
Dark ADC count
value
Ee = 0, AGAIN = 60×, ATIME = 0xD6 (100ms)
ADC integration time
step size
ATIME = 0xFF
Min
Typ
Max
Unit
0
1
5
counts
2.27
2.4
2.56
ms
ADC number of
integration steps
1
256
steps
ADC counts per step
0
1024
counts
0
65535
counts
ADC count value
Gain scaling, relative
to 1× gain setting
ams Datasheet
[v1-30] 2014-Sep-01
ATIME = 0xC0 (153.6ms)
4×
3.8
4
4.2
16×
15
16
16.8
60×
58
60
63
%
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TCS3771 − Electrical Characteristics
Figure 10:
Proximity Characteristics, VDD = 3V, TA = 25°C, Gain = 16, PEN = 1 (unless otherwise noted)
Parameter
IDD
Test Conditions
Supply current
LDR pulse on
ADC conversion time
step size
PTIME = 0xFF
Condition
Min
Typ
Max
3
2.27
Unit
mA
2.4
2.56
ms
ADC number of
integration steps
1
256
steps
ADC counts per step
0
1023
counts
IR LED pulse count
0
255
pulses
LED pulse period
Two or more pulses
LED pulse width - LED
on time
PDRIVE = 0
LED drive current
ISINK sink current @
600mV, LDR pin
80
14
μs
6.3
μs
106
PDRIVE = 1
50
PDRIVE = 2
25
PDRIVE = 3
12.5
132
mA
Dark count value
Ee = 0, PTIME = 0xFB, PPULSE = 2
Red channel
λP = 850nm, Ee = 45.3μW/cm2,
Clear channel
λP = 850nm, Ee = 45.3μW/cm2,
PTIME = 0xFB, PPULSE = 2 (1)
PTIME = 0xFB, PPULSE = 2 (1)
900
counts
1000
3000
counts
1000
3000
counts
Operating distance (2)
30
inches
Note(s) and/or Footnote(s):
1. The specified light intensity is 100% modulated by the pulse output of the device so that during the pulse output low time, the light
intensity is at the specified level, and 0 otherwise.
2. Proximity Operating Distance is dependent upon emitter properties and the reflective properties of the proximity surface. The
nominal value shown uses an IR emitter with a peak wavelength of 850nm and a 20° half angle. The proximity surface used is a 90%
reflective (white surface) 16 × 20-inch Kodak Gray Card. 60mw/SR, 100mA, 64 pulses, open view (no glass). Greater distances are
achievable with appropriate system considerations.
Figure 11:
Wait Characteristics, VDD = 3V, TA = 25°C, Gain = 16, WEN = 1 (unless otherwise noted)
Parameter
Wait step size
Wait number of steps
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Test Conditions
WTIME = 0xFF
Channel
Min
Typ
Max
Unit
2.27
2.4
2.56
ms
256
steps
1
ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Electrical Characteristics
Figure 12:
AC Electrical Characteristics, VDD = 3V, TA = 25°C (unless otherwise noted)
Parameter (1)
Symbol
Test
Conditions
Min
Typ
Max
Unit
400
kHz
f(SCL)
Clock frequency (I2C only)
t(BUF)
Bus free time between start and stop
condition
1.3
μs
t(HDSTA)
Hold time after (repeated) start
condition. After this period, the first
clock is generated.
0.6
μs
t(SUSTA)
Repeated start condition setup time
0.6
μs
t(SUSTO)
Stop condition setup time
0.6
μs
t(HDDAT)
Data hold time
0
μs
t(SUDAT)
Data setup time
100
ns
t(LOW)
SCL clock low period
1.3
μs
t(HIGH)
SCL clock high period
0.6
μs
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
300
ns
Ci
Input pin capacitance
10
pF
0
Note(s) and/or Footnote(s):
1. Specified by design and characterization; not production tested.
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Parameter Measurement Information
Parameter Measurement
Information
Figure 13:
Timing Diagrams
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ams Datasheet
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TCS3771 − Typical Characteristics
Typical Characteristics
Relative Responsivity
Figure 14:
Photodiode Spectral Responsivity
λ - Wavelength - nm
LDR Current - mA
Figure 15:
Typical LDR Current vs. Voltage
LDR Voltage - V
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Typical Characteristics
IDD Normalized @ 3V, 25°C
Figure 16:
Normalized IDD vs. VDD and Temperature
VDD - V
Normalized Responsivity
Figure 17:
Normalized Responsivity vs. Angular Displacement
Θ - Angular Displacement - °
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ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Typical Characteristics
Temperature Coefficient - ppm/°C
Figure 18:
Responsivity Temperature Coefficient
λ - Wavelength - nm
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Principles of Operation
Principles of Operation
System State Machine
The TCS3771 provides control of RGBC, proximity detection,
and power management functionality through an internal state
machine (Figure 19). After a power-on-reset, the device is in the
sleep mode. As soon as the PON bit is set, the device will move
to the start state. It will then continue through the Prox, Wait,
and RGBC states. If these states are enabled, the device will
execute each function. If the PON bit is set to 0, the state
machine will continue until all conversions are completed and
then go into a low power sleep mode.
Figure 19:
Simplified State Diagram
Note(s): In this document, the nomenclature uses the bit field
name in italics followed by the register number and bit number
to allow the user to easily identify the register and bit that
controls the function. For example, the power on (PON) is in
register 0, bit 0. This is represented as PON (r0:b0).
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TCS3771 − Principles of Operation
RGBC Operation
The RGBC engine contains RGBC gain control (AGAIN) and four
integrating analog-to-digital converters (ADC) for the RGBC
photodiodes. The RGBC integration time (ATIME) impacts both
the resolution and the sensitivity of the RGBC reading.
Integration of all four channels occurs simultaneously and upon
completion of the conversion cycle, the results are transferred
to the color data registers. This data is also referred to as channel
count. The transfers are double-buffered to ensure that invalid
data is not read during the transfer. After the transfer, the device
automatically moves to the next state in accordance with the
configured state machine.
Figure 20:
RGBC Operation
The registers for programming the integration and wait times
are a 2’s compliment values. The actual time can be calculated
as follows:
ATIME = 256 - Integration Time / 2.4ms
Inversely, the time can be calculated from the register value as
follows:
Integration Time = 2.4ms × (256 - ATIME)
For example, if a 100-ms integration time is needed, the device
needs to be programmed to:
256 - (100 / 2.4) = 256 - 42 = 214 = 0xD6
Conversely, the programmed value of 0xC0 would correspond
to:
(256 - 0xC0) × 2.4 = 64 × 2.4 = 154ms
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Principles of Operation
Proximity Detection
Proximity sensing uses an external light source (generally an
infrared emitter) to emit light, which is then viewed by the
integrated light detector to measure the amount of reflected
light when an object is in the light path (Figure 21). The amount
of light detected from a reflected surface can then be used to
determine an object’s proximity to the sensor.
Figure 21:
Proximity Detection
The TCS3771 has controls for the number of IR pulses
(PPCOUNT), the integration time (PTIME), the LED drive current
(PDRIVE) and the photodiode configuration (PDIODE). The
photodiode configuration can be set to red diode
(recommended), clear diode, or a combination of both diodes.
At the end of the integration cycle, the results are latched into
the proximity data (PDATA) register.
Figure 22:
Proximity Detection Operation
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TCS3771 − Principles of Operation
The LED drive current is controlled by a regulated current sink
on the LDR pin. This feature eliminates the need to use a current
limiting resistor to control LED current. The LED drive current
can be configured for 12.5mA, 25mA, 50mA, or 100mA. For
higher LED drive requirements, an external P-FET transistor can
be used to control the LED current.
The number of LED pulses can be programmed to any value
between 1 and 255 pulses as needed. Increasing the number of
LED pulses at a given current will increase the sensor sensitivity.
Sensitivity grows by the square root of the number of pulses.
Each pulse has a 14μs period.
Figure 23:
Proximity IR LED Waveform
The proximity integration time (PTIME) is the period of time that
the internal ADC converts the analog signal to a digital count.
It is recommend that this be set to a minimum of PTIME = 0xFF
or 2.4ms.
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Principles of Operation
The combination of LED power and number of pulses can be
used to control the distance at which the sensor can detect
proximity. Figure 24 shows an example of the distances covered
with settings such that each curve covers 2× the distance.
Counts up to 64 pulses provide a 16× range.
Figure 24:
Proximity ADC Count vs. Relative Distance
Interrupts
The interrupt feature simplifies and improves system efficiency
by eliminating the need to poll the sensor for light intensity or
proximity values outside of a user-defined range. While the
interrupt function is always enabled and it’s status is available
in the status register (0x13), the output of the interrupt state
can be enabled using the proximity interrupt enable (PIEN) or
RGBC interrupt enable (AIEN) fields in the Enable Register
(0x00).
Four 16-bit interrupt threshold registers allow the user to set
limits below and above a desired light level and proximity
range. An interrupt can be generated when the RGBC Clear data
(CDATA) falls outside of the desired light level range, as
determined by the values in the RGBC interrupt low threshold
registers (AILTx) and RGBC interrupt high threshold registers
(AIHTx). Likewise, an out-of-range proximity interrupt can be
generated when the proximity data (PDATA) falls below the
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TCS3771 − Principles of Operation
proximity interrupt low threshold (PILTx) or exceeds the
proximity interrupt high threshold (PIHTx). It is important to
note that the low threshold value must be less than the high
threshold value for proper operation.
To further control when an interrupt occurs, the device provides
a persistence filter. The persistence filter allows the user to
specify the number of consecutive out-of-range RGBC or
proximity occurrences before an interrupt is generated. The
persistence register (0x0C) allows the user to set the RGBC
persistence (APERS) and the proximity persistence (PPERS)
values. See the persistence register for details on the
persistence filter values. Once the persistence filter generates
an interrupt, it will continue until a special function interrupt
clear command is received (see “Command Register” on
page 26).
Figure 25:
Programmable Interrupt
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[v1-30] 2014-Sep-01
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TCS3771 − Principles of Operation
State Diagram
Figure 26 shows a more detailed flow for the state machine. The
device starts in the sleep mode. The PON bit is written to enable
the device. A 2.4ms delay will occur before entering the start
state. If the PEN bit is set, the state machine will step through
the proximity states of proximity accumulate and then
proximity ADC conversion. As soon as the conversion is
complete, the state machine will move to the following state.
If the WEN bit is set, the state machine will then cycle through
the wait state. If the WLONG bit is set, the wait cycles are
extended by 12× over normal operation. When the wait counter
terminates, the state machine will step to the RGBC state.
The AEN should always be set, even in proximity-only operation.
In this case, a minimum of 1 integration time step should be
programmed. The RGBC state machine will continue until it
reaches the terminal count at which point the data will be
latched in the RGBC register and the interrupt set, if enabled.
Figure 26:
Expanded State Diagram
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ams Datasheet
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TCS3771 − Principles of Operation
I 2 C Protocol
Interface and control are accomplished through an I 2C serial
compatible interface (standard or fast mode) to a set of registers
that provide access to device control functions and output data.
The devices support the 7-bit I 2C addressing protocol.
The I 2C standard provides for three types of bus transaction:
read, write, and a combined protocol (Figure 27). During a write
operation, the first byte written is a command byte followed by
data. In a combined protocol, the first byte written is the
command byte followed by reading a series of bytes. If a read
command is issued, the register address from the previous
command will be used for data access. Likewise, if the MSB of
the command is not set, the device will write a series of bytes
at the address stored in the last valid command with a register
address. The command byte contains either control information
or a 5-bit register address. The control commands can also be
used to clear interrupts.
The I 2C bus protocol was developed by Philips (now NXP). For
a complete description of the I2C protocol, please review the
NXP I 2C design specification at
http://www.i2c-bus.org/references.
Figure 27:
I2C Protocols
A
Acknowledge (0)
N
Not Acknowledged (1)
P
Stop Condition
R
Read (1)
S
Start Condition
Sr
Repeated Start Condition
W
Write (0)
…
Continuation of protocol
Master-to-Slave
Slave-to-Master
1
7
S
Slave Address
1
1
W A
8
1
8
Command Code
A
Data Byte
1
1
A ... P
I2C Write Protocol
1
7
1
1
8
1
8
S
Slave Address
R
A
Data
A
Data
1
1
A ... P
I2C Read Protocol
1
7
S
Slave Address
1
1
W A
8
Command Code
1
1
A Sr
7
1
1
Slave Address
R
A
8
Data
A
Data
1
1
A ... P
I2C Read Protocol - Combined Format
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Principles of Operation
Register Set
The TCS3771 is controlled and monitored by data registers and
a command register accessed through the serial interface.
These registers provide for a variety of control functions and
can be read to determine results of the ADC conversions. The
Register Set is summarized in Figure 28.
Figure 28:
Register Address
Address
Register Name
R/W
--
COMMAND
W
0x00
ENABLE
0x01
Register Function
Reset Value
Specifies register address
0x00
R/W
Enables states and interrupts
0x00
ATIME
R/W
RGBC ADC time
0xFF
0x02
PTIME
R/W
Proximity ADC time
0xFF
0x03
WTIME
R/W
Wait time
0xFF
0x04
AILTL
R/W
RGBC interrupt low threshold low byte
0x00
0x05
AILTH
R/W
RGBC interrupt low threshold high byte
0x00
0x06
AIHTL
R/W
RGBC interrupt high threshold low byte
0x00
0x07
AIHTH
R/W
RGBC interrupt high threshold high byte
0x00
0x08
PILTL
R/W
Proximity interrupt low threshold low byte
0x00
0x09
PILTH
R/W
Proximity interrupt low threshold high byte
0x00
0x0A
PIHTL
R/W
Proximity interrupt high threshold low byte
0x00
0x0B
PIHTH
R/W
Proximity interrupt high threshold high byte
0x00
0x0C
PERS
R/W
Interrupt persistence filters
0x00
0x0D
CONFIG
R/W
Configuration
0x00
0x0E
PPCOUNT
R/W
Proximity pulse count
0x00
0x0F
CONTROL
R/W
Gain control register
0x00
0x12
ID
R
Device ID
0x13
STATUS
R
Device status
0x00
0x14
CDATA
R
Clear ADC low data register
0x00
0x15
CDATAH
R
Clear ADC high data register
0x00
0x16
RDATA
R
Red ADC low data register
0x00
0x17
RDATAH
R
Red ADC high data register
0x00
0x18
GDATA
R
Green ADC low data register
0x00
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ID
ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Principles of Operation
Address
Register Name
R/W
Register Function
Reset Value
0x19
GDATAH
R
Green ADC high data register
0x00
0x1A
BDATA
R
Blue ADC low data register
0x00
0x1B
BDATAH
R
Blue ADC high data register
0x00
0x1C
PDATA
R
Proximity ADC low data register
0x00
0x1D
PDATAH
R
Proximity ADC high data register
0x00
The mechanics of accessing a specific register depends on the
specific protocol used. See the section on I 2C protocols on the
previous pages. In general, the Command register is written first
to specify the specific control/status register for following
read/write operations.
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Principles of Operation
Command Register
The Command Registers specifies the address of the target
register for future write and read operations.
Figure 29:
Command Register
7
6
COMMAND
5
4
TYPE
Field
Bits
COMMAND
7
3
2
1
0
ADD
Description
Select Command Register. Must write as 1 when addressing Command Register.
Selects type of transaction to follow in subsequent data transfers:
TYPE
6:5
Field Value
Integration Time
00
Repeated byte protocol transaction
01
Auto-increment protocol transaction
10
Reserved - Do not use
11
Special function - See description below
Byte protocol will repeatedly read the same register with each data access. Block
protocol will provide auto-increment function to read successive bytes.
Address field/special function field. Depending on the transaction type, see above,
this field either specifies a special function command or selects the specific
control-status-register for following write and read transactions. The field values
listed below apply only to special function commands:
ADD
4:0
Field Value
Read Value
00000
Normal - no action
00101
Proximity interrupt clear
00110
RGBC interrupt clear
00111
Proximity and RGBC interrupt clear
other
Reserved — Do not write
RGBC/Proximity Interrupt Clear. Clears any pending RGBC/Proximity interrupt. This
special function is self clearing.
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ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Principles of Operation
Enable Register (0x00)
The Enable Register is used primarily to power the TCS3771
device on and off, and enable functions and interrupts as shown
in Figure 30.
Figure 30:
Enable Register
7
6
Reserved
5
4
3
2
1
0
PIEN
AIEN
WEN
PEN
AEN
PON
Field
Bits
Reserved
7:6
PIEN
5
Proximity interrupt enable. When asserted, permits proximity interrupts to be
generated.
AIEN
4
RGBC interrupt enable. When asserted, permits RGBC interrupts to be generated.
WEN
3
Wait enable. This bit activates the wait feature. Writing a 1 activates the wait timer.
Writing a 0 disables the wait timer.
PEN
2
Proximity enable. This bit activates the proximity function. Writing a 1 enables
proximity. Writing a 0 disables proximity.
AEN
1
RGBC enable. This bit actives the two-channel ADC. Writing a 1 activates the RGBC.
Writing a 0 disables the RGBC.
0
Power ON. This bit activates the internal oscillator to permit the timers and ADC
channels to operate. Writing a 1 activates the oscillator. Writing a 0 disables the
oscillator. During reads and writes over the I2C interface, this bit is temporarily
overridden and the oscillator is enabled, independent of the state of PON.
PON (1)
Description
Reserved. Write as 0.
Note(s) and/or Footnote(s):
1. A minimum interval of 2.4ms must pass after PON is asserted before either a proximity or an RGBC can be initiated. This required
time is enforced by the hardware in cases where the firmware does not provide it.
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Principles of Operation
RGBC Timing Register (0x01)
The RGBC Timing Register controls the internal integration time
of the RGBC clear and IR channel ADCs in 2.4ms increments.
Figure 31:
RGBC Timing Register
Field
ATIME
Bits
Description
Value
INTEG_CYCLES
Time
Max Count
0xFF
1
2.4ms
1024
0xF6
10
24ms
10240
0xD6
42
101ms
43008
0xAD
64
154ms
65535
0x00
256
614ms
65535
7:0
Proximity Time Control Register (0x02)
The Proximity Timing Register controls the integration time of
the proximity ADC in 2.4ms increments. It is recommended that
this register be programmed to a value of 0xFF
(1 cycle, 1023 bits).
Max Prox Count = ((256 - PTIME) × 1024)) - 1 up to a maximum
of 65535
Figure 32:
Proximity Time Control Register
Field
Bits
PTIME
7:0
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Document Feedback
Description
Value
INTEG_CYCLES
Time
Max Count
0xFF
1
2.4ms
1023
ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Principles of Operation
Wait Time Register (0x03)
Wait time is set 2.4ms increments unless the WLONG bit is
asserted in which case the wait times are 12× longer. WTIME is
programmed as a 2’s complement number.
Figure 33:
Wait Time Register
Field
WTIME
Bits
Description
Register Value
Wait Time
Time
(WLONG = 0)
Time
(WLONG = 1)
0xFF
1
2.4ms
0.029 sec
0xAB
85
204ms
2.45 sec
0x00
256
614ms
7.4 sec
7:0
RGBC Interrupt Threshold Registers
(0x04 − 0x07)
The RGBC Interrupt Threshold Registers provides the values to
be used as the high and low trigger points for the comparison
function for interrupt generation. If the value generated by the
clear channel crosses below the lower threshold specified, or
above the higher threshold, an interrupt is asserted on the
interrupt pin.
Figure 34:
RGBC Interrupt Threshold Registers
Register
Address
Bits
AILTL
0x04
7:0
RGBC clear channel low threshold lower byte
AILTH
0x05
7:0
RGBC clear channel low threshold upper byte
AIHTL
0x06
7:0
RGBC clear channel high threshold lower byte
AIHTH
0x07
7:0
RGBC clear channel high threshold upper byte
ams Datasheet
[v1-30] 2014-Sep-01
Description
Page 29
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TCS3771 − Principles of Operation
Proximity Interrupt Threshold Registers
(0x08 − 0x0B)
The Proximity Interrupt Threshold Registers provide the values
to be used as the high and low trigger points for the comparison
function for interrupt generation. If the value generated by
proximity channel crosses below the lower threshold specified,
or above the higher threshold, an interrupt is signaled to the
host processor.
Figure 35:
Proximity Interrupt Threshold Register
Register
Address
Bits
PILTL
0x08
7:0
Proximity ADC channel low threshold lower byte
PILTH
0x09
7:0
Proximity ADC channel low threshold upper byte
PIHTL
0x0A
7:0
Proximity ADC channel high threshold lower byte
PIHTH
0x0B
7:0
Proximity ADC channel high threshold upper byte
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Description
ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Principles of Operation
Persistence Register (0x0C)
The Persistence Register controls the filtering interrupt
capabilities of the device. Configurable filtering is provided to
allow interrupts to be generated after each integration cycle or
if the integration has produced a result that is outside of the
values specified by the threshold register for some specified
amount of time. Separate filtering is provided for proximity and
the RGBC clear channel.
Figure 36:
Persistence Register
7
6
5
4
3
2
PPERS
Field
1
0
APERS
Bits
Description
Proximity interrupt persistence. Controls rate of proximity interrupt to the host
processor.
PPERS
ams Datasheet
[v1-30] 2014-Sep-01
7:4
Field Value
Meaning
Interrupt Persistence Function
0000
----
0001
1
1 proximity value out of range
0010
2
2 consecutive proximity values out of range
....
....
....
1111
15
15 consecutive proximity values out of range
Every proximity cycle generates an interrupt
Page 31
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TCS3771 − Principles of Operation
Field
Bits
Description
Interrupt persistence. Controls rate of interrupt to the host processor.
APERS
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Field Value
Meaning
Interrupt Persistence Function
0000
Every
0001
1
1 clear channel value outside of threshold range
0010
2
2 clear channel consecutive values out of range
0011
3
3 clear channel consecutive values out of range
0100
5
5 clear channel consecutive values out of range
0101
10
10 clear channel consecutive values out of range
0110
15
15 clear channel consecutive values out of range
0111
20
20 clear channel consecutive values out of range
1000
25
25 clear channel consecutive values out of range
1001
30
30 clear channel consecutive values out of range
1010
35
35 clear channel consecutive values out of range
1011
40
40 clear channel consecutive values out of range
1100
45
45 clear channel consecutive values out of range
1101
50
50 clear channel consecutive values out of range
1110
55
55 clear channel consecutive values out of range
1111
60
60 clear channel consecutive values out of range
Every RGBC cycle generates an interrupt
3:0
ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Principles of Operation
Configuration Register (0x0D)
The Configuration Register sets the wait long time.
Figure 37:
Configuration Register
7
6
5
4
3
2
Reserved
1
0
WLONG
Reserved
Field
Bits
Description
Reserved
7:2
WLONG
1
Wait Long. When asserted, the wait cycles are increased by a factor 12× from that
programmed in the WTIME register.
Reserved
0
Reserved. Write as 0.
Reserved. Write as 0.
Proximity Pulse Count Register (0x0E)
The Proximity Pulse Count Register sets the number of
proximity pulses that will be transmitted. When proximity
detection is enabled, a proximity detect cycle occurs after each
RGBC cycle. PPULSE defines the number of pulses to be
transmitted.
Note(s): The ATIME register will be used to time the interval
between proximity detection events even if the RGBC function
is disabled.
Figure 38:
Proximity Pulse Count Register
7
6
5
4
3
2
1
0
PPULSE
Field
Bits
Description
PPULSE
7:0
Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Principles of Operation
Control Register (0x0F)
The Control Register provides eight bits of miscellaneous
control to the analog block. These bits typically control
functions such as gain settings and/or diode selection.
Figure 39:
Control Register
7
6
PDRIVE
Field
5
4
3
PDIODE
Bits
2
1
Reserved
0
AGAIN
Description
LED Drive Strength.
PDRIVE
Field Value
LED Strength
00
100mA
01
50mA
10
25mA
11
12.5mA
7:6
Proximity Diode Select.
Field Value
PDIODE
Reserved
Diode Selection
00
Reserved
01
Proximity uses the clear (broadband) diode
10
Proximity uses the IR diode
11
Proximity uses both the clear diode and the red diode
5:4
3:2
Reserved. Write bits as 0.
RGBC Gain Control.
AGAIN
Page 34
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Field Value
RGBC Gain Value
00
1× gain
01
4× gain
10
16× gain
11
60× gain
1:0
ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Principles of Operation
ID Register (0x12)
The ID Register provides the value for the part number. The ID
Register is a read-only register.
Figure 40:
ID Register
7
6
5
4
3
2
1
0
ID
Field
Bits
ID
7:0
Description
0x10 = TCS37711 & TCS37715
Part number identification
0x19 = TCS37713 & TCS37717
Status Register (0x13)
The Status Register provides the internal status of the device.
This register is read only.
Figure 41:
Status Register
7
6
Reserved
5
4
PINT
AINT
3
2
Reserved
1
0
PVALID
AVALID
Field
Bits
Reserved
7:6
PINT
5
Proximity Interrupt
AINT
4
RGBC clear channel Interrupt
Reserved
3:2
PVALID
1
Proximity Valid. Indicates that a RGBC cycle has completed since AEN was asserted.
AVALID
0
RGBC Valid. Indicates that the RGBC channels have completed an integration cycle.
ams Datasheet
[v1-30] 2014-Sep-01
Description
Reserved
Reserved
Page 35
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TCS3771 − Principles of Operation
RGBC Channel Data Registers (0x14 − 0x1B)
Clear, red, green, and blue data is stored as 16-bit values. To
ensure the data is read correctly, a two-byte read I2C transaction
should be used with a read word protocol bit set in the
Command Register. With this operation, when the lower byte
register is read, the upper eight bits are stored into a shadow
register, which is read by a subsequent read to the upper byte.
The upper register will read the correct value even if additional
ADC integration cycles end between the reading of the lower
and upper registers.
Figure 42:
ADC Channel Data Registers
Register
Address
Bits
Description
CDATA
0x14
7:0
Clear data low byte
CDATAH
0x15
7:0
Clear data high byte
RDATA
0x16
7:0
Red data low byte
RDATAH
0x17
7:0
Red data high byte
GDATA
0x18
7:0
Green data low byte
GDATAH
0x19
7:0
Green data high byte
BDATA
0x1A
7:0
Blue data low byte
BDATAH
0x1B
7:0
Blue data high byte
Proximity Data Registers (0x1C − 0x1D)
Proximity data is stored as a 16-bit value. To ensure the data is
read correctly, a two-byte read I2C transaction should be used
with a read word protocol bit set in the Command Register. With
this operation, when the lower byte register is read, the upper
eight bits are stored into a shadow register, which is read by a
subsequent read to the upper byte. The upper register will read
the correct value even if additional ADC integration cycles end
between the reading of the lower and upper registers.
Figure 43:
PDATA Registers
Register
Address
Bits
PDATA
0x1C
7:0
Proximity data low byte
PDATAH
0x1D
7:0
Proximity data high byte
Page 36
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Description
ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Application Information
Application Information
LED Driver Pin with Proximity Detection
In a proximity sensing system, the IR LED can be pulsed by the
TCS3771 with more than 100mA of rapidly switching current,
therefore, a few design considerations must be kept in mind to
get the best performance. The key goal is to reduce the power
supply noise coupled back into the device during the LED
pulses.
The first recommendation is to use two power supplies; one for
the device V DD and the other for the IR LED. In many systems,
there is a quiet analog supply and a noisy digital supply. By
connecting the quiet supply to the V DD pin and the noisy supply
to the LED, the key goal can be meet. Place a 1μF low-ESR
decoupling capacitor as close as possible to the V DD pin and
another at the LED anode, and a 22μF capacitor at the output
of the LED voltage regulator to supply the 100mA current surge.
Figure 44:
Proximity Sensing Using Separate Power Supplies
If it is not possible to provide two separate power supplies, the
device can be operated from a single supply. A 22Ω resistor in
series with the V DD supply line and a 1μF low ESR capacitor
effectively filter any power supply noise. The previous capacitor
placement considerations apply.
Figure 45:
Proximity Sensing Using Single Power Supply
ams Datasheet
[v1-30] 2014-Sep-01
Page 37
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TCS3771 − Application Information
V BUS in the above figures refers to the I 2C bus voltage which is
either V DD or 1.8V. Be sure to apply the specified I 2C bus voltage
shown in the Available Options table for the specific device
being used.
The I 2C signals and the Interrupt are open-drain outputs and
require pull−up resistors. The pull-up resistor (RP) value is a
function of the I 2C bus speed, the I 2C bus voltage, and the
capacitive load. The ams EVM running at 400kbps, uses 1.5kΩ
resistors. A 10kΩ pull-up resistor (RPI) can be used for the
interrupt line.
PCB Pad Layout
Suggested PCB pad layout guidelines for the Dual Flat
No-Lead (FN) surface mount package are shown in Figure 46.
Figure 46:
Suggested FN Package PCB Layout
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
3. Pads can be extended further if hand soldering is needed.
Page 38
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ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Packaging Mechanical Data
Packaging Mechanical Data
Figure 47:
Package FN - Dual Flat No-Lead Packaging Configuration
Green
RoHS
Note(s) and/or Footnote(s):
1. All linear dimensions are in micrometers.
2. The die is centered within the package within a tolerance of ±75μm.
3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Packaging Mechanical Data
Figure 48:
Package FN Carrier Tape
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ±0.10mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 3500 parts.
5. ams AG packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
Page 40
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ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Manufacturing Information
Manufacturing Information
The FN package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 49:
TCS310x Solder Reflow Profile
Parameter
Reference
Average temperature gradient in preheating
TCS310x
2.5°C/sec
tsoak
2 to 3 minutes
Time above 217°C (T1)
t1
Max 60 sec
Time above 230°C (T2)
t2
Max 50 sec
Time above Tpeak - 10°C (T3)
t3
Max 10 sec
Peak temperature in reflow
Tpeak
260° C
Soak time
Temperature gradient in cooling
Max -5°C/sec
Figure 50:
Solder Reflow Profile Graph
Note(s) and/or Footnote(s):
1. Not to scale - for reference only.
ams Datasheet
[v1-30] 2014-Sep-01
Page 41
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TCS3771 − Manufacturing Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is dry-baked prior to
being packed for shipping. Devices are packed in a sealed
aluminized envelope called a moisture barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
The FN package has been assigned a moisture sensitivity level
of MSL 3 and the devices should be stored under the following
conditions:
• Temperature Range: 5°C to 50°C
• Relative Humidity: 60% maximum
• Total Time: 12 months from the date code on the
aluminized envelope - if unopened
• Opened Time: 168 hours or fewer
Rebaking will be required if the devices have been stored
unopened for more than 12 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking
is required, it should be done at 50°C for 12 hours.
Page 42
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ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Ordering & Contact Information
Ordering & Contact Information
Figure 51:
Ordering Information
Device
Address
Package - Leads
Interface Description
Ordering Number
TCS37711 (1)
0x39
FN-6
I2C Vbus = VDD Interface
TCS37711FN
TCS37713 (1)
0x39
FN-6
I2C Vbus = 1.8V Interface
TCS37713FN
TCS37715
0x29
FN-6
I2C Vbus = VDD Interface
TCS37715FN
TCS37717
0x29
FN-6
I2C Vbus = 1.8V Interface
TCS37717FN
Note(s) and/or Footnote(s):
1. Contact ams AG for availability.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-30] 2014-Sep-01
Page 43
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TCS3771 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
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ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141
Unterpremstaetten, Austria-Europe. Trademarks Registered. All
rights reserved. The material herein may not be reproduced,
adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-30] 2014-Sep-01
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TCS3771 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
Page 46
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Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-30] 2014-Sep-01
TCS3771 − Revision Information
Revision Information
Changes from 1-20 (2014-Aug-06) to current revision 1-30 (2014-Sep-01)
The minimum Red Channel response to green light has been reduced from 8% to 6%
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Note(s) and/or Footnote(s):
1. Page numbers for the previous version may differ from page numbers in the current revision.
ams Datasheet
[v1-30] 2014-Sep-01
Page 47
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TCS3771 − Content Guide
Content Guide
Page 48
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General Description
Key Benefits & Features
Applications
End Products and Market Segments
Block Diagram
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Detailed Description
Pin Assignments
Absolute Maximum Ratings
Electrical Characteristics
Parameter Measurement Information
Typical Characteristics
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Principles of Operation
System State Machine
RGBC Operation
Proximity Detection
Interrupts
State Diagram
I2C Protocol
Register Set
Command Register
Enable Register (0x00)
RGBC Timing Register (0x01)
Proximity Time Control Register (0x02)
Wait Time Register (0x03)
RGBC Interrupt Threshold Registers (0x04 − 0x07)
Proximity Interrupt Threshold Registers (0x08 − 0x0B)
Persistence Register (0x0C)
Configuration Register (0x0D)
Proximity Pulse Count Register (0x0E)
Control Register (0x0F)
ID Register (0x12)
Status Register (0x13)
RGBC Channel Data Registers (0x14 − 0x1B)
Proximity Data Registers (0x1C − 0x1D)
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Application Information
LED Driver Pin with Proximity Detection
PCB Pad Layout
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Packaging Mechanical Data
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Manufacturing Information
Moisture Sensitivity
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Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
ams Datasheet
[v1-30] 2014-Sep-01