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TMD2671
Digital Proximity Detector
General Description
The TMD2671 family of devices provides a complete proximity
detection system and digital interface logic in a single 8-pin
package. The proximity detector includes a digital proximity
sensor with integrated LED driver, and IR LED. The proximity
function is calibrated to 100mm (without cover glass), thus
eliminating the need for end-equipment or sub-assembly
factory calibration. The proximity detection feature operates
from sunlight to dark rooms. The wide dynamic range also
allows for operation in short distance detection behind dark
glass such as with a cell phone. An internal state machine
provides the ability to put the device into a low-power mode
providing very low average power consumption. The addition
of the micro-optics lenses within the module provide highly
efficient transmission and reception of infrared energy, which
lowers overall power dissipation for the detection function.
The proximity function specifically targets near-field proximity
applications. In cell phones, the proximity detection can detect
when the user positions the phone close to their ear. The device
is fast enough to provide proximity information at a high
repetition rate needed when answering a phone call. This
provides both improved green power saving capability and the
added security to lock the screen when the user may
accidentally deploy a touch.
Communication with the device is accomplished with a simple
2-wire I 2C interface with data rates up to 400kHz. An interrupt
output pin is provided for connection to the host processor. This
interrupt pin can be used to eliminate the need to poll the
device on a repetitive basis. There is also a digital filter that
compares the proximity ADC results to programmed values so
that an interrupt is only generated upon a proximity event.
The TMD2671 is packaged in a very small form factor 8-pin
optical package. The PCB board area required is only 9.36mm 2,
which is far smaller than discrete solutions. Also, the package
height is only 1.35mm, which makes the TMD2671 device
suitable for very thin mechanical applications.
Ordering Information and Content Guide appear at end of
datasheet.
ams Datasheet
[v1-00] 2016-May-16
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TMD2671 − General Description
Key Benefits & Features
The benefits and features of the TMD2671, Digital Proximity
Detector are listed below:
Figure 1:
Added Value of Using TMD2671
Benefits
Features
• Module reduces board space and design
effort
• Integrated proximity detection sensor and IR LED
• Enables operation in IR light environments
• Patented dual-diode architecture
• Pre-calibration eliminates need for customer
to end-product calibrate
• Proximity detection calibrated and trimmed to 100mm
detection
• Allows multiple power-level selection without
external passives
• Programmable LED drive current
• Digital Proximity Detector, LED Driver, and IR LED in a
Single Optical Module
• Proximity Detection
• Calibrated to 100mm Detection
• Integrated IR LED and Synchronous LED Driver
• Programmable Number of IR Pulses
• Programmable Current Sink for the IR LED - No
Limiting Resistor Needed
• Programmable Interrupt Function with Upper and
Lower Threshold
• Programmable Wait Timer
• Wait State - 65μA Typical Current
• Programmable from 2.72ms to > 8s
• I 2C Interface Compatible
• Up to 400kHz (I 2C Fast Mode)
• Sleep Mode - 2.5μA Typical
• Dedicated Interrupt Pin
• 3.94mm × 2.36mm × 1.35mm Package
Applications
The applications of this device include:
• Cell Phone Touch Screen Disable
• Automatic Speakerphone Enable
• Automatic Menu Popup
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − General Description
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TMD2671 Block Diagram
g
LDR
VDD
Interrupt
Prox Control
LEDA
Prox
Integration
Prox
ADC
Lower Limit
Channel 0
LEDK
SCL
SDA
Wait Control
Channel 1
ams Datasheet
[v1-00] 2016-May-16
Upper Limit
Prox
Data
INT
I2C Interface
IR LED Constant
Current Sink
GND
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TMD2671 − Detailed Description
Detailed Description
A fully integrated proximity detection solution is provided with
an 850nm IR LED, LED driver circuit, and proximity detection
engine. An internal LED driver (LDR) pin, is connected to the
LED cathode (LEDK) to provide a factory calibrated proximity of
100mm, ±20mm. This is accomplished with a proprietary
current calibration technique that accounts for all variances in
silicon, optics, package, and most important, IR LED output
power. This eliminates or greatly reduces the need for factory
calibration that is required for most discrete proximity sensor
solutions. While the device is factory calibrated at a given pulse
count, the number of proximity LED pulses can be programmed
from 1 to 255 pulses, which allows different proximity distances
to be achieved. Each pulse has a 16μs period, with a 7.2μs on
time.
The device provides a separate pin for level-style interrupts.
When interrupts are enabled and a pre-set value is exceeded,
the interrupt pin is asserted and remains asserted until cleared
by the controlling firmware. The interrupt feature simplifies and
improves system efficiency by eliminating the need to poll a
sensor for a proximity value. An interrupt is generated when the
value of a proximity conversion exceeds either an upper or
lower threshold. In addition, a programmable interrupt
persistence feature allows the user to determine how many
consecutive exceeded thresholds are necessary to trigger an
interrupt.
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Pin Assignment
The TMD2671 pin assignment is described below:
Pin Assignment
Figure 3:
Pin Diagram of Package Module-8 (Top View)
Note: Package drawing is not to scale
VDD 1
8 SDA
SCL 2
7 INT
GND 3
6 LDR
LEDA 4
5 LEDK
Figure 4:
Terminal Functions
Terminal
Type
Description
Name
No.
VDD
1
SCL
2
GND
3
LEDA
4
I
LED anode
LEDK
5
O
LED cathode. Connect to LDR pin when using internal LED driver circuit.
LDR
6
I
LED driver input for proximity IR LED, constant current source LED driver
INT
7
O
Interrupt - open drain
SDA
8
I/O
I2C serial data I/O terminal - serial data I/O for I2C
ams Datasheet
[v1-00] 2016-May-16
Supply voltage
I
I2C serial clock input terminal - clock signal for I2C serial data
Power supply ground. All voltages are referenced to GND.
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TMD2671 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These are
stress ratings only. Functional operation of the device at these
or any other conditions beyond those indicated under
Recommended Operating Conditions is not implied. Exposure
to absolute maximum rating conditions for extended periods
may affect device reliability.
Figure 5:
Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted)
Symbol
Parameter
Min
Max
Unit
3.8
V
-0.5
3.8
V
VDD
Supply voltage (1)
VO
Digital output voltage range
IO
Digital output current
-1
20
mA
LDR
Analog voltage range
-0.5
3.8
V
Tstrg
Storage temperature range
-40
85
°C
ESDHBM
ESD tolerance, human body model
±2000
V
Note(s):
1. All voltages are with respect to GND.
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or
SQC (Statistical Quality Control) methods.
Electrical Characteristics
Figure 6:
Recommended Operating Conditions
Symbol
VDD
TA
Parameter
Min
Nom
Max
Unit
Supply voltage
2.5
3
3.6
V
Supply voltage accuracy, VDD total error including
transients
-3
3
%
Operating free-air temperature range (1)
-30
85
°C
Note(s):
1. While the device is operational across the temperature range, functionality will vary with temperature. Specifications are stated
only at 25°C unless otherwise noted.
Figure 7:
Operating Characteristics, VDD = 3V, TA = 25°C (unless otherwise noted)
Symbol
IDD
VOL
Parameter
Supply current
INT, SDA output low
voltage
ILEAK
Leakage current, SDA,
SCL, INT pins
ILEAK
Leakage current, LDR
pin
VIH
SCL, SDA input high
voltage
VIL
SCL, SDA input low
voltage
ams Datasheet
[v1-00] 2016-May-16
Test Conditions
Min
Typ
Max
Active: proximity and wait
delay states
175
250
Wait state
65
Sleep state
2.5
Unit
μA
4
3mA sink current
0
0.4
6mA sink current
0
0.6
-5
5
μA
10
μA
V
TMD26711
0.7 VDD
TMD26713
1.25
V
TMD26711
0.3 VDD
TMD26713
0.54
V
Page 7
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TMD2671 − Electrical Characteristics
Figure 8:
Proximity Characteristics, V DD = VLEDA = 3V, TA = 25°C, PEN = 1 (unless otherwise noted)
Symbol
Parameter
Test Conditions
IDD
Supply current - LDR pulse on
ADC conversion time step size
PTIME = 0xFF
ADC number of integration
steps
ADC counts per step
Min
PTIME = 0xFF
Proximity IR LED pulse count
TLDR
Max
3
mA
2.72
ms
256
steps
0
1023
counts
0
255
pulses
16.3
LED current @ V 600mV LDR
pin sink (1)
Unit
1
Proximity pulse period
ILEDA
Typ
PDRIVE = 0 (100% current)
100
PDRIVE = 1 (50% current)
50
PDRIVE = 2 (25% current)
25
μs
mA
PDRIVE = 3 (12.5% current)
12.5
On time per pulse
PDRIVE = 1
7.2
μs
Proximity response, no target
(offset)
PDRIVE = 0, PPULSE = 8 (2)
100
counts
Prox count, 100mm target (3)
73mm × 83mm,
90% reflective Kodak Gray
Card, PPULSE = 8,
PDRIVE = 0, PTIME = 0xFF
414
520
624
counts
Note(s):
1. Value is factory-adjusted to meet the Prox count specification. Considerable variation (relative to the typical value) is possible after
adjustment.
2. No reflective surface above the module. Proximity offset varies with power supply characteristics and noise.
3. I LEDA is factory calibrated to achieve this specification. Offset and crosstalk directly sum with this value and is system dependent.
4. No glass or aperture above the module. Tested value is the average of 5 consecutive readings.
5. These parameters are ensured by design and characterization and are not 100% tested.
6. Proximity test was done using the following circuit. See Application Information: Hardware section for recommended application
circuit.
Figure 9:
Proximity Test Circuit
VDD
VDD
TMD2671
1 mF
GND
Page 8
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4
1
3
5
6
LEDA
LEDK
LDR
1 mF
22 mF
ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Electrical Characteristics
Figure 10:
IR LED Characteristics, VDD = 3V, TA = 25°C
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
1.4
1.5
V
VF
Forward voltage
IF = 20mA
VR
Reverse voltage
IR = 10μA
5
V
PO
Radiant power
IF = 20mA
4.5
mW
λp
Peak wavelength
IF = 20mA
850
nm
Δλ
Spectral radiation
bandwidth
IF = 20mA
40
nm
TR
Optical rise time
IF = 100mA, T W = 125ns,
duty cycle = 25%
20
40
ns
TF
Optical fall time
IF = 100mA, T W = 125ns,
duty cycle = 25%
20
40
ns
Typ
Max
Unit
2.72
2.9
ms
256
steps
Figure 11:
Wait Characteristics, VDD = 3V, TA = 25°C, WEN = 1 (unless otherwise noted)
Parameter
Wait step size
Wait number of integration steps
ams Datasheet
[v1-00] 2016-May-16
Test Conditions
Min
WTIME = 0xFF
1
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TMD2671 − Electrical Characteristics
Figure 12:
AC Electrical Characteristics, VDD = 3V, TA = 25°C (unless otherwise noted)
Parameter (1)
Symbol
Test Conditions
Min
Typ
Max
Unit
400
kHz
f(SCL)
Clock frequency (I2C only)
t(BUF)
Bus free time between start and
stop condition
1.3
μs
t(HDSTA)
Hold time after (repeated) start
condition. After this period, the first
clock is generated.
0.6
μs
t(SUSTA)
Repeated start condition setup time
0.6
μs
t(SUSTO)
Stop condition setup time
0.6
μs
t(HDDAT)
Data hold time
0
μs
t(SUDAT)
Data setup time
100
ns
t(LOW)
SCL clock low period
1.3
μs
t(HIGH)
SCL clock high period
0.6
μs
0
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
300
ns
Ci
Input pin capacitance
10
pF
Note(s):
1. Specified by design and characterization; not production tested.
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Parameter Measurement Information
Parameter Measurement
Information
Figure 13:
Timing Diagrams
t(LOW)
t(R)
t(F)
VIH
SCL
VIL
t(HDSTA)
t(BUF)
t(HDDAT)
t(HIGH)
t(SUSTA)
t(SUSTO)
t(SUDAT)
VIH
SDA
VIL
P
Stop
Condition
ams Datasheet
[v1-00] 2016-May-16
S
S
P
Start
Condition
Page 11
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TMD2671 − Typical Operating Characteristics
Typical Operating
Characteristics
Figure 14:
Spectral Responsivity
1
Ch 0
Normalized Responsivity
0.8
0.6
0.4
Ch 1
0.2
0
300
400
500
600
700
800
900 1000 1100
λ − Wavelength − nm
Figure 15:
LDR Output Compliance
112.5
100 mA
100
Load Current — mA
87.5
75
62.5
50 mA
50
37.5
25 mA
25
12.5 mA
12.5
0
0
0.3
0.6
0.9
1.2
VOL − Output Low Voltage − V
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Typical Operating Characteristics
Figure 16:
Normalized IDD vs. VDD and Temperature
110%
108%
IDD Normalized @ 3 V, 25C
75C
106%
104%
50C
25C
102%
100%
0C
98%
96%
94%
92%
2.7
2.8
2.9
3
3.1
3.2
3.3
VDD — V
ams Datasheet
[v1-00] 2016-May-16
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TMD2671 − Principles of Operation
Principles of Operation
System State Machine
The device provides control of proximity detection and power
management functionality through an internal state machine.
After a power-on-reset, the device is in the sleep mode. As soon
as the PON bit is set, the device will move to the start state. It
will then cycle through the Proximity and Wait states. If these
states are enabled, the device will execute each function. If the
PON bit is set to a 0, the state machine will continue until the
current conversion is complete and then go into a low-power
sleep mode.
Figure 17:
Simplified State Diagram
Sleep
PON = 1 (r 0:b0)
PON = 0 (r 0:b0)
Start
Prox
Wait
Note: In this document, the nomenclature uses the bit field
name in italics followed by the register number and bit number
to allow the user to easily identify the register and bit that
controls the function. For example, the power on (PON) is in
register 0, bit 0. This is represented as PON (r0:b0).
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Principles of Operation
Proximity Detection
Proximity detection is accomplished by measuring the amount
of IR energy, from the internal IR LED, reflected off an object to
determine its distance. The internal proximity IR LED is driven
by the integrated proximity LED current driver as shown in
Figure 18.
Figure 18:
Proximity Detection
LEDA
IR
LED
PPULSE(r0x0E)
PDRIVE(r0x0F, b7:6)
LEDK
LDR
PTIME(r0x02)
Prox LED
Current Driver
Prox Control
PDIODE(r0x0F, b5:4)
Object
Prox
Integration
Prox
ADC
Prox
Data
PDATAH(r0x019)
PDATAL(r0x018)
CH1
CH0
Background Energy
The LED current driver provides a regulated current sink on the
LDR terminal that eliminates the need for an external current
limiting resistor. The PDRIVE register setting sets the sink
current to 100%, 50%, 25%, or 12.5% of the factory trimmed full
scale current.
Referring to the Detailed State Machine figure, the LED current
driver pulses the IR LED as shown in Figure 19 during the Prox
Accum state. Figure 19 also illustrates that the LED On pulse has
a fixed width of 7.3μs and period of 16.0μs. So, in addition to
setting the proximity drive current, 1 to 255 proximity pulses
(PPULSE) can be programmed. When deciding on the number
of proximity pulses, keep in mind that the signal increases
proportionally to PPULSE, while noise increases by the square
root of PPULSE.
ams Datasheet
[v1-00] 2016-May-16
Page 15
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TMD2671 − Principles of Operation
Figure 19:
Proximity LED Current Driver Waveform
Reflected IR LED +
Background Energy
LED On
Background
Energy
LED Off
7.3 ms
16.0 ms
IR LED Pulses
Figure 18 illustrates light rays emitting from the internal IR LED,
reflecting off an object, and being absorbed by the CH0 and
CH1 photodiodes. The proximity diode selector (PDIODE)
determines which of the two photodiodes is used for a given
proximity measurement. Note that neither photodiode is
selected when the device first powers up, so PDIODE must be
set for proximity detection to work.
Referring again to Figure 19, the reflected IR LED and the
background energy is integrated during the LED On time, then
during the LED Off time, the integrated background energy is
subtracted from the LED On time energy, leaving the IR LED
energy to accumulate from pulse to pulse.
After the programmed number of proximity pulses have been
generated, the proximity ADC converts and scales the proximity
measurement to a 16-bit value, then stores the result in two
8-bit proximity data (PDATAx) registers. ADC scaling is
controlled by the proximity ADC conversion time (PTIME) which
is programmable from 1 to 256 2.73ms time units. However,
depending on the application, scaling the proximity data will
equally scale any accumulated noise. Therefore, in general, it is
recommended to leave PTIME at the default value of one 2.73ms
ADC conversion time (0xFF).
For additional information on using the proximity detection
function behind glass and for optical system design guidance,
please see available ams application notes.
Page 16
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Principles of Operation
Optical Design Considerations
The TMD2671 device simplifies the optical system design by
integrating an IR LED into the package, and also by providing
an effective barrier between the LED and proximity sensor. In
addition the package contains integrated lenses and apertures
over both the LED and the sensor, which significantly extends
the maximum proximity detection distance and helps to reduce
optical crosstalk.
Although the package integrates an optical barrier between the
IR LED and detector, placing the device behind a cover glass
potentially provides another significant path for IR light to
reach the detector, via reflection from the inside and outside
faces of the cover glass. Because it is cost prohibitive to use
anti-reflection coatings on the glass, the faces of the glass will
reflect significantly (typically on the order of 4% of the light),
and it is crucial that the system be designed so that this
reflected light cannot find an efficient path back to the optical
detector. See ams Application Note DN28: Proximity Detection
Behind Glass for a detailed discussion of optical design
considerations.
Interrupts
The interrupt feature simplifies and improves system efficiency
by eliminating the need to poll the sensor for a proximity value.
The interrupt mode is determined by the state of the PIEN field
in the ENABLE register.
Two 16-bit-wide interrupt threshold registers allow the user to
define upper and lower threshold limits. An interrupt can be
generated when the proximity data (PDATA) exceeds the upper
threshold value (PIHTx) or falls below the lower threshold
(PILTx).
To further control when an interrupt occurs, the device provides
an interrupt persistence feature. This feature allows the user to
specify a number of conversion cycles for which an event
exceeding the proximity interrupt threshold must persist
(PPERS) before actually generating an interrupt. See the register
descriptions for details on the length of the persistence.
Figure 20:
Programmable Interrupt
PIHTH(r 0x0B), PIHTL(r 0x0A)
Upper Limit
Prox
Integration
Prox
ADC
Prox Persistence
Prox
Data
Lower Limit
Channel 0
Channel 1
ams Datasheet
[v1-00] 2016-May-16
PPERS(r 0x0C, b7:4)
PILTH(r 0x09), PILTL(r 0x08)
Page 17
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TMD2671 − Principles of Operation
State Diagram
The following state diagram shows a more detailed flow for the
state machine. The device starts in the sleep mode. The PON bit
is written to enable the device. A 2.72ms Start Delay will occur
before entering the start state. If the PEN bit is set, the state
machine will step through the proximity accumulate, then
proximity ADC conversion states. As soon as the conversion is
complete, the state machine will move to the Wait Check state.
If the WEN bit is set, the state machine will then cycle through
the wait state. If the WLONG bit is set, the wait cycles are
extended by 12× over normal operation. When the wait counter
terminates, the state machine will move to the 2.72ms Wait
Delay state before returning to the Start state.
Figure 21:
Expanded State Diagram
PON = 1
Start
Delay
PON = 0
Start
2.72 ms
1 to 255 LED Pulses
Pulse Frequency: 62.5 kHz
Time: 16.3 ms − 4.2 ms
PEN = 1
Sleep
5.44 ms
Prox
Check
Wait
Delay
PEN = 0
WEN = 0
Prox
Accum
Wait
Check
WEN = 1
1 to 256 steps
Prox
Step: 2.72 ms
ADC
Time: 2.72 ms − 696 ms
Recommended − 2.72 ms 1023 Counts
Page 18
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Wait
WLONG = 0
1 to 256 steps
Step: 2.72 ms
Time: 2.72 ms − 696 ms
WLONG = 1
1 to 256 steps
Step: 32.6 ms
Time: 32.6 ms − 8.35 s
ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Principles of Operation
Power Management
Power consumption can be controlled through the use of the
wait state timing because the wait state consumes only 65μA
of power. Figure 22 shows an example of using the power
management feature to achieve an average power
consumption of 136μA current with four 100mA pulses of
proximity detection.
Figure 22:
Power Consumption Calculations
4 IR LED Pulses
Prox Accum
65 ms (29 ms LED On Time)
Prox ADC
2.72 ms
Example: ~49 ms Cycle TIme
Wait
Wait
Delay
43.52 ms
2.72 ms
State
Duration (ms)
Current (mA)
Prox Accum
LED On
Prox ADC
Wait
Wait Delay
0.065 (Note 1)
0.029 (Note 2)
2.72
43.52
2.72
100.0
0.175
0.065
0.175
Average Current = ((0.029 100) + (2.72 0.175) + (43.52 0.065) + (2.72 0.175)) / 49 = 136 mA
Note(s):
1. Prox Accum = 16.3μs per pulse x 4 pulses = 65μs = 0.065ms
2. LED On = 7.2μs per pulse x 4 pulses = 29μs = 0.029ms
ams Datasheet
[v1-00] 2016-May-16
Page 19
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TMD2671 − Principles of Operation
I 2 C Protocol
Interface and control are accomplished through an I 2C serial
compatible interface (standard or fast mode) to a set of registers
that provide access to device control functions and output data.
The devices support the 7-bit I 2C addressing protocol.
The I 2C standard provides for three types of bus transaction:
read, write, and a combined protocol (Figure 23). During a write
operation, the first byte written is a command byte followed by
data. In a combined protocol, the first byte written is the
command byte followed by reading a series of bytes. If a read
command is issued, the register address from the previous
command will be used for data access. Likewise, if the MSB of
the command is not set, the device will write a series of bytes
at the address stored in the last valid command with a register
address. The command byte contains either control information
or a 5-bit register address. The control commands can also be
used to clear interrupts.
The I 2C bus protocol was developed by Philips (now NXP). For
a complete description of the I2C protocol, please review the
NXP I 2C design specification at
http://www.i2c-bus.org/references.
Figure 23:
I2C Protocols
1
7
1
1
S
Slave Address
W
A
8
Command Code
1
8
1
A
Data Byte
A
1
8
1
A
Data
A
1
...
P
I2C Write Protocol
1
7
1
1
S
Slave Address
R
A
8
Data
1
...
P
I2C Read Protocol
1
7
1
1
8
1
1
7
1
1
S
Slave Address
W
A
Command Code
A
Sr
Slave Address
R
A
8
Data
A
N
P
R
S
Sr
W
...
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Repeated Start Condition
Write (0)
Continuation of protocol
Master-to-Slave
Slave-to-Master
Page 20
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1
8
1
A
Data
A
1
...
P
I2C Read Protocol — Combined Format
ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Register Set
The device is controlled and monitored by data registers and a
command register accessed through the serial interface. These
registers provide for a variety of control functions and can be
read to determine results of the ADC conversions. The Register
Set is summarized in Figure 24.
Register Set
Figure 24:
Register Address
Address
Register Name
R/W
----
COMMAND
W
0x00
ENABLE
0x01
Register Function
Reset Value
Specifies register address
0x00
R/W
Enables states and interrupts
0x00
ATIME
R/W
ALS ADC time
0x02
PTIME
R/W
Proximity ADC time
0xFF
0x03
WTIME
R/W
Wait time
0xFF
0x08
PILTL
R/W
Proximity interrupt low
threshold low byte
0x00
0x09
PILTH
R/W
Proximity interrupt low
threshold high byte
0x00
0x0A
PIHTL
R/W
Proximity interrupt high
threshold low byte
0x00
0x0B
PIHTH
R/W
Proximity interrupt high
threshold high byte
0x00
0x0C
PERS
R/W
Interrupt persistence filter
0x00
0x0D
CONFIG
R/W
Configuration
0x00
0x0E
PPULSE
R/W
Proximity pulse count
0x00
0x0F
CONTROL
R/W
Control register
0x00
0x12
ID
R
Device ID
0x13
STATUS
R
Device status
0x00
0x18
PDATAL
R
Proximity ADC low data register
0x00
0x19
PDATAH
R
Proximity ADC high data register
0x00
0x00 (1)
ID
Note(s):
1. Following power on, this register should be initialized to 0xFF.
The mechanics of accessing a specific register depends on the
specific protocol used. See the section on I2C protocols on the
previous pages. In general, the Command Register is written
first to specify the specific control/status register for following
read/write operations.
ams Datasheet
[v1-00] 2016-May-16
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TMD2671 − Register Set
Command Register
The Command Registers specifies the address of the target
register for future write and read operations.
Figure 25:
Command Register
7
6
COMMAND
5
4
TYPE
Field
Bits
COMMAND
7
3
2
1
0
ADD
Description
Select Command Register. Must write as 1 when addressing COMMAND register.
Selects type of transaction to follow in subsequent data transfers:
Field Value
TYPE
Description
00
Repeated byte protocol transaction
01
Auto-increment protocol transaction
10
Reserved - Do not use
11
Special function - See description below
6:5
Transaction type 00 will repeatedly read the same register with each data access.
Transaction type 01 will provide an auto-increment function to read successive
register bytes.
Address register/special function register. Depending on the transaction type, see
above, this field either specifies a special function command or selects the specific
control-status-register for following write and read transactions:
Field Value
ADD
4:0
Description
00000
Normal - no action
00101
Proximity interrupt clear
Proximity Interrupt Clear clears any pending proximity interrupt. This special
function is self clearing.
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Register Set
Enable Register (0x00)
The Enable Register is used to power the device on/off, enable
functions, and interrupts.
Figure 26:
Enable Register
7
6
Reserved
5
4
3
PIEN
Reserved
WEN
2
1
0
PEN
PON
Field
Bits
Description
Reserved
7:6
PIEN
5
Proximity Interrupt Mask. When asserted, permits proximity interrupts to be
generated.
Reserved
4
Reserved. Write as 0.
WEN
3
Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer.
Writing a 0 disables the wait timer.
PEN
2:1
Proximity Enable. These bits activate the proximity function. Writing a 11b enables
proximity. Writing a 00b disables proximity. The Wait Time Register should be
configured before asserting proximity enable.
PON (1), (2)
0
Reserved. Write as 0.
Power ON. This bit activates the internal oscillator to permit the timers and ADC
channel to operate. Writing a 1 activates the oscillator. Writing a 0 disables the
oscillator.
Note(s):
1. See Power Management section for more information.
2. A minimum interval of 2.72ms must pass after PON is asserted before proximity can be initiated. This required time is enforced by
the hardware in cases where the firmware does not provide it.
ALS Timing Register (0x01)
Although this part is proximity only, the ATIME period still
occurs. Note that the power-on default value is 0x00
(the longest duration). This register should be initialized by the
application code to 0xFF.
Figure 27:
ALS Timing Register
Field
ATIME
ams Datasheet
[v1-00] 2016-May-16
Bits
7:0
Description
Value
INTEG_CYCLES
Time
0xFF
1
2.72ms
0x00
256
696ms
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TMD2671 − Register Set
Proximity Time Control Register (0x02)
The Proximity Timing Register controls the integration time of
the proximity ADC in 2.72ms increments. It is recommended
that this register be programmed to a value of 0xFF
(1 integration cycle).
Figure 28:
Proximity Time Control Register
Field
Bits
PTIME
7:0
Description
Value
INTEG_CYCLES
Time
Max Count
0xFF
1
2.72ms
1023
Wait Time Register (0x03)
Wait time is set 2.72ms increments unless the WLONG bit is
asserted, in which case the wait times are 12× longer. WTIME is
programmed as a 2’s complement number.
Figure 29:
Wait Time Register
Field
WTIME
Bits
Description
REGISTER VALUE
WAIT TIME
TIME (WLONG = 0)
TIME (WLONG = 1)
0xFF
1
2.72ms
0.032 s
0xB6
74
200ms
2.4 s
0x00
256
700ms
8.3 s
7:0
Note(s):
1. The Wait Time Register should be configured before PEN is asserted.
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Register Set
Proximity Interrupt Threshold Register
(0x08 − 0x0B)
The Proximity Interrupt Threshold Registers provide the values
to be used as the high and low trigger points for the comparison
function for interrupt generation. If the value generated by
proximity channel crosses below the lower threshold specified,
or above the higher threshold, an interrupt is signaled to the
host processor.
Figure 30:
Proximity Interrupt Threshold Register
Register
Address
Bits
Description
PILTL
0x08
7:0
Proximity low threshold lower byte
PILTH
0x09
7:0
Proximity low threshold upper byte
PIHTL
0x0A
7:0
Proximity high threshold lower byte
PIHTL
0x0B
7:0
Proximity high threshold upper byte
Persistence Register (0x0C)
The Persistence Register controls the filtering interrupt
capabilities of the device. Configurable filtering is provided to
allow interrupts to be generated after each ADC integration
cycle or if the ADC integration has produced a result that is
outside of the values specified by threshold register for some
specified amount of time.
Figure 31:
Persistence Register
7
6
5
4
3
2
PPERS
Field
1
0
Reserved
Bits
Description
Proximity Interrupt Persistence. Controls rate of proximity interrupt to the host processor.
PPERS
Reserved
7:4
3:0
ams Datasheet
[v1-00] 2016-May-16
Field Value
Meaning
Interrupt Persistence Function
0000
…
Every proximity cycle generates an interrupt
0001
1
1 proximity value out of range
0010
2
2 consecutive proximity values out of range
…
…
…
1111
15
15 consecutive proximity values out of range
Default setting is 0x00.
Page 25
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TMD2671 − Register Set
Configuration Register (0x0D)
The Configuration Register sets the wait long time.
Figure 32:
Configuration Register
7
6
5
4
3
2
Reserved
1
0
WLONG
Reserved
Field
Bits
Description
Reserved
7:2
WLONG
1
Wait Long. When asserted, the wait cycles are increased by a factor 12× from that
programmed in the WTIME register.
Reserved
0
Reserved. Write as 0.
Reserved. Write as 0.
Proximity Pulse Count Register (0x0E)
The Proximity Pulse Count Register sets the number of
proximity pulses that will be transmitted. PPULSE defines the
number of pulses to be transmitted at a 62.5kHz rate.
While the value can be programmed up to 255 pulses, the
practical limit of the device is 32 pulses. It is recommended that
32 or fewer pulses be used to achieve maximum signal-to-noise
ratio.
Figure 33:
Proximity Pulse Count Register
7
6
5
4
3
2
1
0
PPULSE
Field
Bits
Description
PPULSE
7:0
Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Register Set
Control Register (0x0F)
The Control Register provides four bits of control to the analog
block. These bits control the diode drive current and diode
selection functions.
Figure 34:
Control Register
7
6
PDRIVE
Field
5
4
3
2
PDIODE
Bits
1
0
Reserved
Description
LED Drive Strength.
PDRIVE
Field Value
LED Strength
00
100%
01
50%
10
25%
11
12.5%
7:6
Proximity Diode Select.
Field Value
PDIODE
Reserved
Diode Selection
00
Reserved
01
Proximity uses the Channel 0 diode
10
Proximity uses the Channel 1 diode
11
Proximity uses both diodes
5:4
3:0
Reserved. Write bits as 0.
Note(s):
1. The PDRIVE values are relative to the factory-trimmed current necessary to meet the Prox Coun specification shown on page 8.
ams Datasheet
[v1-00] 2016-May-16
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TMD2671 − Register Set
ID Register (0x12)
The ID Register provides the value for the part number. The ID
Register is a read-only register.
Figure 35:
ID Register
7
6
5
4
3
2
1
0
ID
Field
Bits
ID
7:0
Description
0x20 = TMD26711
Part number identification
0x29 = TMD26713
Status Register (0x13)
The Status Register provides the internal status of the device.
This register is read only.
Figure 36:
Status Register
7
6
Reserved
PINT
Field
Bits
Reserved
7:6
PINT
5
Reserved
4:0
Page 28
Document Feedback
5
4
3
2
1
0
Reserved
Description
Reserved
Proximity Interrupt. Indicates that the device is asserting a proximity interrupt.
Reserved
ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Register Set
Proximity Data Register (0x18 - 0x19h)
Proximity data is stored as a 16-bit value. To ensure the data is
read correctly, a two-byte I 2C read transaction should be
utilized with auto increment protocol bits set in the Command
Register. With this operation, when the lower byte register is
read, the upper eight bits are stored into a shadow register,
which is read by a subsequent read to the upper byte. The upper
register will read the correct value even if the next ADC cycle
ends between the reading of the lower and upper registers.
Figure 37:
PDATA Registers
Register
Address
Bits
PDATAL
0x18
7:0
Proximity data low byte
PDATAH
0x19
7:0
Proximity data high byte
ams Datasheet
[v1-00] 2016-May-16
Description
Page 29
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TMD2671 − Application Information: Hardware
Application Information:
Hardware
LED Driver Pin with Proximity Detection
In a proximity sensing system, the included IR LED can be pulsed
with more than 100mA of rapidly switching current, therefore,
a few design considerations must be kept in mind to get the
best performance. The key goal is to reduce the power supply
noise coupled back into the device during the LED pulses.
Averaging of multiple proximity samples is recommended to
reduce the proximity noise.
The first recommendation is to use two power supplies; one for
the device V DD and the other for the IR LED. In many systems,
there is a quiet analog supply and a noisy digital supply. By
connecting the quiet supply to the V DD pin and the noisy supply
to the LEDA pin, the key goal can be met. Place a 1μF low-ESR
decoupling capacitor as close as possible to the V DD pin and
another at the LEDA pin, and a 22μF capacitor at the output of
the LED voltage regulator to supply the 100mA current surge.
Figure 38:
Proximity Sensing Using Separate Power Supplies
VBUS
Voltage
Regulator
LEDK
VDD
LDR
1 mF
C*
GND
TMD2671
RP
RP
RPI
INT
SCL
Voltage
Regulator
LEDA
22 mF
SDA
1 mF
* Cap Value Per Regulator Manufacturer Recommendation
If it is not possible to provide two separate power supplies, the
device can be operated from a single supply. A 22Ω resistor in
series with the V DD supply line and a 1μF low ESR capacitor
effectively filter any power supply noise. The previous capacitor
placement considerations apply.
Page 30
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Application Information: Hardware
Figure 39:
Proximity Sensing Using Single Power Supply
VBUS
22 W
Voltage
Regulator
LEDK
VDD
22 mF
LDR
1 mF
GND
TMD2671
RP
RP
RPI
INT
SCL
LEDA
SDA
1 mF
V BUS in the above figures refers to the I 2C bus voltage which is
either V DD or 1.8V. Be sure to apply the specified I 2C bus voltage
shown in the Ordering Information table for the specific device
being used.
The I 2C signals and the Interrupt are open-drain outputs and
require pull-up resistors. The pull-up resistor (RP) value is a
function of the I 2C bus speed, the I 2C bus voltage, and the
capacitive load. The ams EVM running at 400kbps, uses 1.5kΩ
resistors. A 10kΩ pull-up resistor (R PI) can be used for the
interrupt line.
ams Datasheet
[v1-00] 2016-May-16
Page 31
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TMD2671 − Application Information: Hardware
PCB Pad Layout
Suggested PCB pad layout guidelines for the surface mount
module are shown in Figure 40. Flash Gold is recommended
surface finish for the landing pads.
Figure 40:
Suggested Module PCB Layout
0.60 0.05
0.80 0.05
0.72 0.05
0.25 0.05
Note(s):
1. All linear dimensions are in mm.
2. This drawing is subject to change without notice.
Page 32
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Package Drawings & Markings
Package Drawings & Markings
Figure 41:
Module Packaging Configuration
TOP VIEW
SIDE VIEW
Detector
1.0
2.40
3.94
0.2
3.73
0.1
0.9
LED
1.18
0.58
END VIEW
2.36 0.2
1.35
0.2
2.10 0.1
RoHS
BOTTOM VIEW
0.60
0.80
Green
0.25
0.72
0.05
Note(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ±0.05mm unless otherwise noted.
2. Contacts are copper with NiPdAu plating.
3. This package contains no lead (Pb).
4. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2016-May-16
Page 33
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TMD2671 − Package Mechanical Data
Package Mechanical Data
Figure 42:
Module Carrier Tape
TOP VIEW
8.00
1.75
4.00
1.50
2.00 0.05
B
5.50 0.05
+ 0.30
12.00
− 0.10
B
1.00
0.05
Unit Orientation
A
DETAIL A
A
DETAIL B
6 Max
8 Max
2.70
0.29
0.02
Ao
1.70
Ko
4.30
Bo
Note(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ±0.10mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 330 millimeters in diameter and contains 2500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
Page 34
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Soldering & Storage Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate. The process,
equipment, and materials used in these test are detailed below.
Soldering & Storage
Information
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 43:
Solder Reflow Profile
Parameter
Reference
Device
Average temperature gradient in preheating
2.5°C/s
tsoak
2 to 3 minutes
Time above 217°C (T1)
t1
Max 60 s
Time above 230°C (T2)
t2
Max 50 s
Time above Tpeak - 10°C (T3)
t3
Max 10 s
Peak temperature in reflow
Tpeak
260°C
Soak time
Temperature gradient in cooling
Max -5°C/s
Figure 44:
Solder Reflow Profile Graph
Tpeak
T3
T2
Temperature (C)
T1
t3
Time (s)
t2
tsoak
t1
Note(s):
1. Not to scale - for reference only.
ams Datasheet
[v1-00] 2016-May-16
Page 35
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TMD2671 − Soldering & Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is dry-baked prior to
being packed for shipping. Devices are packed in a sealed
aluminized envelope called a moisture barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
The Moisture Barrier Bags should be stored under the following
conditions:
• Temperature Range: < 40°C
• Relative Humidity: < 90%
• Total Time: No longer than 12 months from the date code
on the aluminized envelope if unopened.
Rebaking of the reel will be required if the devices have been
stored unopened for more than 12 months and the Humidity
Indicator Card shows the parts to be out of the allowable
moisture region.
Opened reels should be used within 168 hours if exposed to the
following conditions:
• Temperature Range: < 30°C
• Relative Humidity: < 60%
If rebaking is required, it should be done at 50°C for 12 hours.
The Module has been assigned a moisture sensitivity level of
MSL 3.
Page 36
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Ordering & Contact Information
Ordering & Contact Information
Figure 45:
Ordering Information
Ordering Code
Device
Address
Leads
Interface Description
TMD26711
TMD26711
0x39
8
I2C Vbus = VDD Interface
TMD26713
TMD26713
0x39
8
I2C Vbus = 1.8 V Interface
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-00] 2016-May-16
Page 37
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TMD2671 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
Page 38
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ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-00] 2016-May-16
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TMD2671 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
Page 40
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Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-00] 2016-May-16
TMD2671 − Revision Information
Revision Information
Changes from TAOS144C (2013-Mar) to current revision 1-00 (2016-May-16)
Page
Content of TAOS datasheet was converted to the latest ams design
Added Figure 1
2
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision
2. Correction of typographical errors is not explicitly mentioned.
ams Datasheet
[v1-00] 2016-May-16
Page 41
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TMD2671 − Content Guide
Content Guide
Page 42
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1
2
2
3
General Description
Key Benefits & Features
Applications
Block Diagram
4
5
6
7
11
12
Detailed Description
Pin Assignment
Absolute Maximum Ratings
Electrical Characteristics
Parameter Measurement Information
Typical Operating Characteristics
14
14
15
17
17
18
19
20
Principles of Operation
System State Machine
Proximity Detection
Optical Design Considerations
Interrupts
State Diagram
Power Management
I2C Protocol
21
22
23
23
24
24
25
25
26
26
27
28
28
29
Register Set
Command Register
Enable Register (0x00)
ALS Timing Register (0x01)
Proximity Time Control Register (0x02)
Wait Time Register (0x03)
Proximity Interrupt Threshold Register
(0x08 − 0x0B)
Persistence Register (0x0C)
Configuration Register (0x0D)
Proximity Pulse Count Register (0x0E)
Control Register (0x0F)
ID Register (0x12)
Status Register (0x13)
Proximity Data Register (0x18 - 0x19h)
30
30
32
Application Information: Hardware
LED Driver Pin with Proximity Detection
PCB Pad Layout
33
34
Package Drawings & Markings
Package Mechanical Data
35
36
Soldering & Storage Information
Moisture Sensitivity
37
38
39
40
41
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
ams Datasheet
[v1-00] 2016-May-16