TMD2671 Digital Proximity Detector General Description The TMD2671 family of devices provides a complete proximity detection system and digital interface logic in a single 8-pin package. The proximity detector includes a digital proximity sensor with integrated LED driver, and IR LED. The proximity function is calibrated to 100mm (without cover glass), thus eliminating the need for end-equipment or sub-assembly factory calibration. The proximity detection feature operates from sunlight to dark rooms. The wide dynamic range also allows for operation in short distance detection behind dark glass such as with a cell phone. An internal state machine provides the ability to put the device into a low-power mode providing very low average power consumption. The addition of the micro-optics lenses within the module provide highly efficient transmission and reception of infrared energy, which lowers overall power dissipation for the detection function. The proximity function specifically targets near-field proximity applications. In cell phones, the proximity detection can detect when the user positions the phone close to their ear. The device is fast enough to provide proximity information at a high repetition rate needed when answering a phone call. This provides both improved green power saving capability and the added security to lock the screen when the user may accidentally deploy a touch. Communication with the device is accomplished with a simple 2-wire I 2C interface with data rates up to 400kHz. An interrupt output pin is provided for connection to the host processor. This interrupt pin can be used to eliminate the need to poll the device on a repetitive basis. There is also a digital filter that compares the proximity ADC results to programmed values so that an interrupt is only generated upon a proximity event. The TMD2671 is packaged in a very small form factor 8-pin optical package. The PCB board area required is only 9.36mm 2, which is far smaller than discrete solutions. Also, the package height is only 1.35mm, which makes the TMD2671 device suitable for very thin mechanical applications. Ordering Information and Content Guide appear at end of datasheet. ams Datasheet [v1-00] 2016-May-16 Page 1 Document Feedback TMD2671 − General Description Key Benefits & Features The benefits and features of the TMD2671, Digital Proximity Detector are listed below: Figure 1: Added Value of Using TMD2671 Benefits Features • Module reduces board space and design effort • Integrated proximity detection sensor and IR LED • Enables operation in IR light environments • Patented dual-diode architecture • Pre-calibration eliminates need for customer to end-product calibrate • Proximity detection calibrated and trimmed to 100mm detection • Allows multiple power-level selection without external passives • Programmable LED drive current • Digital Proximity Detector, LED Driver, and IR LED in a Single Optical Module • Proximity Detection • Calibrated to 100mm Detection • Integrated IR LED and Synchronous LED Driver • Programmable Number of IR Pulses • Programmable Current Sink for the IR LED - No Limiting Resistor Needed • Programmable Interrupt Function with Upper and Lower Threshold • Programmable Wait Timer • Wait State - 65μA Typical Current • Programmable from 2.72ms to > 8s • I 2C Interface Compatible • Up to 400kHz (I 2C Fast Mode) • Sleep Mode - 2.5μA Typical • Dedicated Interrupt Pin • 3.94mm × 2.36mm × 1.35mm Package Applications The applications of this device include: • Cell Phone Touch Screen Disable • Automatic Speakerphone Enable • Automatic Menu Popup Page 2 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − General Description Block Diagram The functional blocks of this device are shown below: Figure 2: TMD2671 Block Diagram g LDR VDD Interrupt Prox Control LEDA Prox Integration Prox ADC Lower Limit Channel 0 LEDK SCL SDA Wait Control Channel 1 ams Datasheet [v1-00] 2016-May-16 Upper Limit Prox Data INT I2C Interface IR LED Constant Current Sink GND Page 3 Document Feedback TMD2671 − Detailed Description Detailed Description A fully integrated proximity detection solution is provided with an 850nm IR LED, LED driver circuit, and proximity detection engine. An internal LED driver (LDR) pin, is connected to the LED cathode (LEDK) to provide a factory calibrated proximity of 100mm, ±20mm. This is accomplished with a proprietary current calibration technique that accounts for all variances in silicon, optics, package, and most important, IR LED output power. This eliminates or greatly reduces the need for factory calibration that is required for most discrete proximity sensor solutions. While the device is factory calibrated at a given pulse count, the number of proximity LED pulses can be programmed from 1 to 255 pulses, which allows different proximity distances to be achieved. Each pulse has a 16μs period, with a 7.2μs on time. The device provides a separate pin for level-style interrupts. When interrupts are enabled and a pre-set value is exceeded, the interrupt pin is asserted and remains asserted until cleared by the controlling firmware. The interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a proximity value. An interrupt is generated when the value of a proximity conversion exceeds either an upper or lower threshold. In addition, a programmable interrupt persistence feature allows the user to determine how many consecutive exceeded thresholds are necessary to trigger an interrupt. Page 4 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Pin Assignment The TMD2671 pin assignment is described below: Pin Assignment Figure 3: Pin Diagram of Package Module-8 (Top View) Note: Package drawing is not to scale VDD 1 8 SDA SCL 2 7 INT GND 3 6 LDR LEDA 4 5 LEDK Figure 4: Terminal Functions Terminal Type Description Name No. VDD 1 SCL 2 GND 3 LEDA 4 I LED anode LEDK 5 O LED cathode. Connect to LDR pin when using internal LED driver circuit. LDR 6 I LED driver input for proximity IR LED, constant current source LED driver INT 7 O Interrupt - open drain SDA 8 I/O I2C serial data I/O terminal - serial data I/O for I2C ams Datasheet [v1-00] 2016-May-16 Supply voltage I I2C serial clock input terminal - clock signal for I2C serial data Power supply ground. All voltages are referenced to GND. Page 5 Document Feedback TMD2671 − Absolute Maximum Ratings Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5: Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted) Symbol Parameter Min Max Unit 3.8 V -0.5 3.8 V VDD Supply voltage (1) VO Digital output voltage range IO Digital output current -1 20 mA LDR Analog voltage range -0.5 3.8 V Tstrg Storage temperature range -40 85 °C ESDHBM ESD tolerance, human body model ±2000 V Note(s): 1. All voltages are with respect to GND. Page 6 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Electrical Characteristics All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. Electrical Characteristics Figure 6: Recommended Operating Conditions Symbol VDD TA Parameter Min Nom Max Unit Supply voltage 2.5 3 3.6 V Supply voltage accuracy, VDD total error including transients -3 3 % Operating free-air temperature range (1) -30 85 °C Note(s): 1. While the device is operational across the temperature range, functionality will vary with temperature. Specifications are stated only at 25°C unless otherwise noted. Figure 7: Operating Characteristics, VDD = 3V, TA = 25°C (unless otherwise noted) Symbol IDD VOL Parameter Supply current INT, SDA output low voltage ILEAK Leakage current, SDA, SCL, INT pins ILEAK Leakage current, LDR pin VIH SCL, SDA input high voltage VIL SCL, SDA input low voltage ams Datasheet [v1-00] 2016-May-16 Test Conditions Min Typ Max Active: proximity and wait delay states 175 250 Wait state 65 Sleep state 2.5 Unit μA 4 3mA sink current 0 0.4 6mA sink current 0 0.6 -5 5 μA 10 μA V TMD26711 0.7 VDD TMD26713 1.25 V TMD26711 0.3 VDD TMD26713 0.54 V Page 7 Document Feedback TMD2671 − Electrical Characteristics Figure 8: Proximity Characteristics, V DD = VLEDA = 3V, TA = 25°C, PEN = 1 (unless otherwise noted) Symbol Parameter Test Conditions IDD Supply current - LDR pulse on ADC conversion time step size PTIME = 0xFF ADC number of integration steps ADC counts per step Min PTIME = 0xFF Proximity IR LED pulse count TLDR Max 3 mA 2.72 ms 256 steps 0 1023 counts 0 255 pulses 16.3 LED current @ V 600mV LDR pin sink (1) Unit 1 Proximity pulse period ILEDA Typ PDRIVE = 0 (100% current) 100 PDRIVE = 1 (50% current) 50 PDRIVE = 2 (25% current) 25 μs mA PDRIVE = 3 (12.5% current) 12.5 On time per pulse PDRIVE = 1 7.2 μs Proximity response, no target (offset) PDRIVE = 0, PPULSE = 8 (2) 100 counts Prox count, 100mm target (3) 73mm × 83mm, 90% reflective Kodak Gray Card, PPULSE = 8, PDRIVE = 0, PTIME = 0xFF 414 520 624 counts Note(s): 1. Value is factory-adjusted to meet the Prox count specification. Considerable variation (relative to the typical value) is possible after adjustment. 2. No reflective surface above the module. Proximity offset varies with power supply characteristics and noise. 3. I LEDA is factory calibrated to achieve this specification. Offset and crosstalk directly sum with this value and is system dependent. 4. No glass or aperture above the module. Tested value is the average of 5 consecutive readings. 5. These parameters are ensured by design and characterization and are not 100% tested. 6. Proximity test was done using the following circuit. See Application Information: Hardware section for recommended application circuit. Figure 9: Proximity Test Circuit VDD VDD TMD2671 1 mF GND Page 8 Document Feedback 4 1 3 5 6 LEDA LEDK LDR 1 mF 22 mF ams Datasheet [v1-00] 2016-May-16 TMD2671 − Electrical Characteristics Figure 10: IR LED Characteristics, VDD = 3V, TA = 25°C Symbol Parameter Test Conditions Min Typ Max Unit 1.4 1.5 V VF Forward voltage IF = 20mA VR Reverse voltage IR = 10μA 5 V PO Radiant power IF = 20mA 4.5 mW λp Peak wavelength IF = 20mA 850 nm Δλ Spectral radiation bandwidth IF = 20mA 40 nm TR Optical rise time IF = 100mA, T W = 125ns, duty cycle = 25% 20 40 ns TF Optical fall time IF = 100mA, T W = 125ns, duty cycle = 25% 20 40 ns Typ Max Unit 2.72 2.9 ms 256 steps Figure 11: Wait Characteristics, VDD = 3V, TA = 25°C, WEN = 1 (unless otherwise noted) Parameter Wait step size Wait number of integration steps ams Datasheet [v1-00] 2016-May-16 Test Conditions Min WTIME = 0xFF 1 Page 9 Document Feedback TMD2671 − Electrical Characteristics Figure 12: AC Electrical Characteristics, VDD = 3V, TA = 25°C (unless otherwise noted) Parameter (1) Symbol Test Conditions Min Typ Max Unit 400 kHz f(SCL) Clock frequency (I2C only) t(BUF) Bus free time between start and stop condition 1.3 μs t(HDSTA) Hold time after (repeated) start condition. After this period, the first clock is generated. 0.6 μs t(SUSTA) Repeated start condition setup time 0.6 μs t(SUSTO) Stop condition setup time 0.6 μs t(HDDAT) Data hold time 0 μs t(SUDAT) Data setup time 100 ns t(LOW) SCL clock low period 1.3 μs t(HIGH) SCL clock high period 0.6 μs 0 tF Clock/data fall time 300 ns tR Clock/data rise time 300 ns Ci Input pin capacitance 10 pF Note(s): 1. Specified by design and characterization; not production tested. Page 10 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Parameter Measurement Information Parameter Measurement Information Figure 13: Timing Diagrams t(LOW) t(R) t(F) VIH SCL VIL t(HDSTA) t(BUF) t(HDDAT) t(HIGH) t(SUSTA) t(SUSTO) t(SUDAT) VIH SDA VIL P Stop Condition ams Datasheet [v1-00] 2016-May-16 S S P Start Condition Page 11 Document Feedback TMD2671 − Typical Operating Characteristics Typical Operating Characteristics Figure 14: Spectral Responsivity 1 Ch 0 Normalized Responsivity 0.8 0.6 0.4 Ch 1 0.2 0 300 400 500 600 700 800 900 1000 1100 λ − Wavelength − nm Figure 15: LDR Output Compliance 112.5 100 mA 100 Load Current — mA 87.5 75 62.5 50 mA 50 37.5 25 mA 25 12.5 mA 12.5 0 0 0.3 0.6 0.9 1.2 VOL − Output Low Voltage − V Page 12 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Typical Operating Characteristics Figure 16: Normalized IDD vs. VDD and Temperature 110% 108% IDD Normalized @ 3 V, 25C 75C 106% 104% 50C 25C 102% 100% 0C 98% 96% 94% 92% 2.7 2.8 2.9 3 3.1 3.2 3.3 VDD — V ams Datasheet [v1-00] 2016-May-16 Page 13 Document Feedback TMD2671 − Principles of Operation Principles of Operation System State Machine The device provides control of proximity detection and power management functionality through an internal state machine. After a power-on-reset, the device is in the sleep mode. As soon as the PON bit is set, the device will move to the start state. It will then cycle through the Proximity and Wait states. If these states are enabled, the device will execute each function. If the PON bit is set to a 0, the state machine will continue until the current conversion is complete and then go into a low-power sleep mode. Figure 17: Simplified State Diagram Sleep PON = 1 (r 0:b0) PON = 0 (r 0:b0) Start Prox Wait Note: In this document, the nomenclature uses the bit field name in italics followed by the register number and bit number to allow the user to easily identify the register and bit that controls the function. For example, the power on (PON) is in register 0, bit 0. This is represented as PON (r0:b0). Page 14 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Principles of Operation Proximity Detection Proximity detection is accomplished by measuring the amount of IR energy, from the internal IR LED, reflected off an object to determine its distance. The internal proximity IR LED is driven by the integrated proximity LED current driver as shown in Figure 18. Figure 18: Proximity Detection LEDA IR LED PPULSE(r0x0E) PDRIVE(r0x0F, b7:6) LEDK LDR PTIME(r0x02) Prox LED Current Driver Prox Control PDIODE(r0x0F, b5:4) Object Prox Integration Prox ADC Prox Data PDATAH(r0x019) PDATAL(r0x018) CH1 CH0 Background Energy The LED current driver provides a regulated current sink on the LDR terminal that eliminates the need for an external current limiting resistor. The PDRIVE register setting sets the sink current to 100%, 50%, 25%, or 12.5% of the factory trimmed full scale current. Referring to the Detailed State Machine figure, the LED current driver pulses the IR LED as shown in Figure 19 during the Prox Accum state. Figure 19 also illustrates that the LED On pulse has a fixed width of 7.3μs and period of 16.0μs. So, in addition to setting the proximity drive current, 1 to 255 proximity pulses (PPULSE) can be programmed. When deciding on the number of proximity pulses, keep in mind that the signal increases proportionally to PPULSE, while noise increases by the square root of PPULSE. ams Datasheet [v1-00] 2016-May-16 Page 15 Document Feedback TMD2671 − Principles of Operation Figure 19: Proximity LED Current Driver Waveform Reflected IR LED + Background Energy LED On Background Energy LED Off 7.3 ms 16.0 ms IR LED Pulses Figure 18 illustrates light rays emitting from the internal IR LED, reflecting off an object, and being absorbed by the CH0 and CH1 photodiodes. The proximity diode selector (PDIODE) determines which of the two photodiodes is used for a given proximity measurement. Note that neither photodiode is selected when the device first powers up, so PDIODE must be set for proximity detection to work. Referring again to Figure 19, the reflected IR LED and the background energy is integrated during the LED On time, then during the LED Off time, the integrated background energy is subtracted from the LED On time energy, leaving the IR LED energy to accumulate from pulse to pulse. After the programmed number of proximity pulses have been generated, the proximity ADC converts and scales the proximity measurement to a 16-bit value, then stores the result in two 8-bit proximity data (PDATAx) registers. ADC scaling is controlled by the proximity ADC conversion time (PTIME) which is programmable from 1 to 256 2.73ms time units. However, depending on the application, scaling the proximity data will equally scale any accumulated noise. Therefore, in general, it is recommended to leave PTIME at the default value of one 2.73ms ADC conversion time (0xFF). For additional information on using the proximity detection function behind glass and for optical system design guidance, please see available ams application notes. Page 16 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Principles of Operation Optical Design Considerations The TMD2671 device simplifies the optical system design by integrating an IR LED into the package, and also by providing an effective barrier between the LED and proximity sensor. In addition the package contains integrated lenses and apertures over both the LED and the sensor, which significantly extends the maximum proximity detection distance and helps to reduce optical crosstalk. Although the package integrates an optical barrier between the IR LED and detector, placing the device behind a cover glass potentially provides another significant path for IR light to reach the detector, via reflection from the inside and outside faces of the cover glass. Because it is cost prohibitive to use anti-reflection coatings on the glass, the faces of the glass will reflect significantly (typically on the order of 4% of the light), and it is crucial that the system be designed so that this reflected light cannot find an efficient path back to the optical detector. See ams Application Note DN28: Proximity Detection Behind Glass for a detailed discussion of optical design considerations. Interrupts The interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for a proximity value. The interrupt mode is determined by the state of the PIEN field in the ENABLE register. Two 16-bit-wide interrupt threshold registers allow the user to define upper and lower threshold limits. An interrupt can be generated when the proximity data (PDATA) exceeds the upper threshold value (PIHTx) or falls below the lower threshold (PILTx). To further control when an interrupt occurs, the device provides an interrupt persistence feature. This feature allows the user to specify a number of conversion cycles for which an event exceeding the proximity interrupt threshold must persist (PPERS) before actually generating an interrupt. See the register descriptions for details on the length of the persistence. Figure 20: Programmable Interrupt PIHTH(r 0x0B), PIHTL(r 0x0A) Upper Limit Prox Integration Prox ADC Prox Persistence Prox Data Lower Limit Channel 0 Channel 1 ams Datasheet [v1-00] 2016-May-16 PPERS(r 0x0C, b7:4) PILTH(r 0x09), PILTL(r 0x08) Page 17 Document Feedback TMD2671 − Principles of Operation State Diagram The following state diagram shows a more detailed flow for the state machine. The device starts in the sleep mode. The PON bit is written to enable the device. A 2.72ms Start Delay will occur before entering the start state. If the PEN bit is set, the state machine will step through the proximity accumulate, then proximity ADC conversion states. As soon as the conversion is complete, the state machine will move to the Wait Check state. If the WEN bit is set, the state machine will then cycle through the wait state. If the WLONG bit is set, the wait cycles are extended by 12× over normal operation. When the wait counter terminates, the state machine will move to the 2.72ms Wait Delay state before returning to the Start state. Figure 21: Expanded State Diagram PON = 1 Start Delay PON = 0 Start 2.72 ms 1 to 255 LED Pulses Pulse Frequency: 62.5 kHz Time: 16.3 ms − 4.2 ms PEN = 1 Sleep 5.44 ms Prox Check Wait Delay PEN = 0 WEN = 0 Prox Accum Wait Check WEN = 1 1 to 256 steps Prox Step: 2.72 ms ADC Time: 2.72 ms − 696 ms Recommended − 2.72 ms 1023 Counts Page 18 Document Feedback Wait WLONG = 0 1 to 256 steps Step: 2.72 ms Time: 2.72 ms − 696 ms WLONG = 1 1 to 256 steps Step: 32.6 ms Time: 32.6 ms − 8.35 s ams Datasheet [v1-00] 2016-May-16 TMD2671 − Principles of Operation Power Management Power consumption can be controlled through the use of the wait state timing because the wait state consumes only 65μA of power. Figure 22 shows an example of using the power management feature to achieve an average power consumption of 136μA current with four 100mA pulses of proximity detection. Figure 22: Power Consumption Calculations 4 IR LED Pulses Prox Accum 65 ms (29 ms LED On Time) Prox ADC 2.72 ms Example: ~49 ms Cycle TIme Wait Wait Delay 43.52 ms 2.72 ms State Duration (ms) Current (mA) Prox Accum LED On Prox ADC Wait Wait Delay 0.065 (Note 1) 0.029 (Note 2) 2.72 43.52 2.72 100.0 0.175 0.065 0.175 Average Current = ((0.029 100) + (2.72 0.175) + (43.52 0.065) + (2.72 0.175)) / 49 = 136 mA Note(s): 1. Prox Accum = 16.3μs per pulse x 4 pulses = 65μs = 0.065ms 2. LED On = 7.2μs per pulse x 4 pulses = 29μs = 0.029ms ams Datasheet [v1-00] 2016-May-16 Page 19 Document Feedback TMD2671 − Principles of Operation I 2 C Protocol Interface and control are accomplished through an I 2C serial compatible interface (standard or fast mode) to a set of registers that provide access to device control functions and output data. The devices support the 7-bit I 2C addressing protocol. The I 2C standard provides for three types of bus transaction: read, write, and a combined protocol (Figure 23). During a write operation, the first byte written is a command byte followed by data. In a combined protocol, the first byte written is the command byte followed by reading a series of bytes. If a read command is issued, the register address from the previous command will be used for data access. Likewise, if the MSB of the command is not set, the device will write a series of bytes at the address stored in the last valid command with a register address. The command byte contains either control information or a 5-bit register address. The control commands can also be used to clear interrupts. The I 2C bus protocol was developed by Philips (now NXP). For a complete description of the I2C protocol, please review the NXP I 2C design specification at http://www.i2c-bus.org/references. Figure 23: I2C Protocols 1 7 1 1 S Slave Address W A 8 Command Code 1 8 1 A Data Byte A 1 8 1 A Data A 1 ... P I2C Write Protocol 1 7 1 1 S Slave Address R A 8 Data 1 ... P I2C Read Protocol 1 7 1 1 8 1 1 7 1 1 S Slave Address W A Command Code A Sr Slave Address R A 8 Data A N P R S Sr W ... Acknowledge (0) Not Acknowledged (1) Stop Condition Read (1) Start Condition Repeated Start Condition Write (0) Continuation of protocol Master-to-Slave Slave-to-Master Page 20 Document Feedback 1 8 1 A Data A 1 ... P I2C Read Protocol — Combined Format ams Datasheet [v1-00] 2016-May-16 TMD2671 − Register Set The device is controlled and monitored by data registers and a command register accessed through the serial interface. These registers provide for a variety of control functions and can be read to determine results of the ADC conversions. The Register Set is summarized in Figure 24. Register Set Figure 24: Register Address Address Register Name R/W ---- COMMAND W 0x00 ENABLE 0x01 Register Function Reset Value Specifies register address 0x00 R/W Enables states and interrupts 0x00 ATIME R/W ALS ADC time 0x02 PTIME R/W Proximity ADC time 0xFF 0x03 WTIME R/W Wait time 0xFF 0x08 PILTL R/W Proximity interrupt low threshold low byte 0x00 0x09 PILTH R/W Proximity interrupt low threshold high byte 0x00 0x0A PIHTL R/W Proximity interrupt high threshold low byte 0x00 0x0B PIHTH R/W Proximity interrupt high threshold high byte 0x00 0x0C PERS R/W Interrupt persistence filter 0x00 0x0D CONFIG R/W Configuration 0x00 0x0E PPULSE R/W Proximity pulse count 0x00 0x0F CONTROL R/W Control register 0x00 0x12 ID R Device ID 0x13 STATUS R Device status 0x00 0x18 PDATAL R Proximity ADC low data register 0x00 0x19 PDATAH R Proximity ADC high data register 0x00 0x00 (1) ID Note(s): 1. Following power on, this register should be initialized to 0xFF. The mechanics of accessing a specific register depends on the specific protocol used. See the section on I2C protocols on the previous pages. In general, the Command Register is written first to specify the specific control/status register for following read/write operations. ams Datasheet [v1-00] 2016-May-16 Page 21 Document Feedback TMD2671 − Register Set Command Register The Command Registers specifies the address of the target register for future write and read operations. Figure 25: Command Register 7 6 COMMAND 5 4 TYPE Field Bits COMMAND 7 3 2 1 0 ADD Description Select Command Register. Must write as 1 when addressing COMMAND register. Selects type of transaction to follow in subsequent data transfers: Field Value TYPE Description 00 Repeated byte protocol transaction 01 Auto-increment protocol transaction 10 Reserved - Do not use 11 Special function - See description below 6:5 Transaction type 00 will repeatedly read the same register with each data access. Transaction type 01 will provide an auto-increment function to read successive register bytes. Address register/special function register. Depending on the transaction type, see above, this field either specifies a special function command or selects the specific control-status-register for following write and read transactions: Field Value ADD 4:0 Description 00000 Normal - no action 00101 Proximity interrupt clear Proximity Interrupt Clear clears any pending proximity interrupt. This special function is self clearing. Page 22 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Register Set Enable Register (0x00) The Enable Register is used to power the device on/off, enable functions, and interrupts. Figure 26: Enable Register 7 6 Reserved 5 4 3 PIEN Reserved WEN 2 1 0 PEN PON Field Bits Description Reserved 7:6 PIEN 5 Proximity Interrupt Mask. When asserted, permits proximity interrupts to be generated. Reserved 4 Reserved. Write as 0. WEN 3 Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer. Writing a 0 disables the wait timer. PEN 2:1 Proximity Enable. These bits activate the proximity function. Writing a 11b enables proximity. Writing a 00b disables proximity. The Wait Time Register should be configured before asserting proximity enable. PON (1), (2) 0 Reserved. Write as 0. Power ON. This bit activates the internal oscillator to permit the timers and ADC channel to operate. Writing a 1 activates the oscillator. Writing a 0 disables the oscillator. Note(s): 1. See Power Management section for more information. 2. A minimum interval of 2.72ms must pass after PON is asserted before proximity can be initiated. This required time is enforced by the hardware in cases where the firmware does not provide it. ALS Timing Register (0x01) Although this part is proximity only, the ATIME period still occurs. Note that the power-on default value is 0x00 (the longest duration). This register should be initialized by the application code to 0xFF. Figure 27: ALS Timing Register Field ATIME ams Datasheet [v1-00] 2016-May-16 Bits 7:0 Description Value INTEG_CYCLES Time 0xFF 1 2.72ms 0x00 256 696ms Page 23 Document Feedback TMD2671 − Register Set Proximity Time Control Register (0x02) The Proximity Timing Register controls the integration time of the proximity ADC in 2.72ms increments. It is recommended that this register be programmed to a value of 0xFF (1 integration cycle). Figure 28: Proximity Time Control Register Field Bits PTIME 7:0 Description Value INTEG_CYCLES Time Max Count 0xFF 1 2.72ms 1023 Wait Time Register (0x03) Wait time is set 2.72ms increments unless the WLONG bit is asserted, in which case the wait times are 12× longer. WTIME is programmed as a 2’s complement number. Figure 29: Wait Time Register Field WTIME Bits Description REGISTER VALUE WAIT TIME TIME (WLONG = 0) TIME (WLONG = 1) 0xFF 1 2.72ms 0.032 s 0xB6 74 200ms 2.4 s 0x00 256 700ms 8.3 s 7:0 Note(s): 1. The Wait Time Register should be configured before PEN is asserted. Page 24 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Register Set Proximity Interrupt Threshold Register (0x08 − 0x0B) The Proximity Interrupt Threshold Registers provide the values to be used as the high and low trigger points for the comparison function for interrupt generation. If the value generated by proximity channel crosses below the lower threshold specified, or above the higher threshold, an interrupt is signaled to the host processor. Figure 30: Proximity Interrupt Threshold Register Register Address Bits Description PILTL 0x08 7:0 Proximity low threshold lower byte PILTH 0x09 7:0 Proximity low threshold upper byte PIHTL 0x0A 7:0 Proximity high threshold lower byte PIHTL 0x0B 7:0 Proximity high threshold upper byte Persistence Register (0x0C) The Persistence Register controls the filtering interrupt capabilities of the device. Configurable filtering is provided to allow interrupts to be generated after each ADC integration cycle or if the ADC integration has produced a result that is outside of the values specified by threshold register for some specified amount of time. Figure 31: Persistence Register 7 6 5 4 3 2 PPERS Field 1 0 Reserved Bits Description Proximity Interrupt Persistence. Controls rate of proximity interrupt to the host processor. PPERS Reserved 7:4 3:0 ams Datasheet [v1-00] 2016-May-16 Field Value Meaning Interrupt Persistence Function 0000 … Every proximity cycle generates an interrupt 0001 1 1 proximity value out of range 0010 2 2 consecutive proximity values out of range … … … 1111 15 15 consecutive proximity values out of range Default setting is 0x00. Page 25 Document Feedback TMD2671 − Register Set Configuration Register (0x0D) The Configuration Register sets the wait long time. Figure 32: Configuration Register 7 6 5 4 3 2 Reserved 1 0 WLONG Reserved Field Bits Description Reserved 7:2 WLONG 1 Wait Long. When asserted, the wait cycles are increased by a factor 12× from that programmed in the WTIME register. Reserved 0 Reserved. Write as 0. Reserved. Write as 0. Proximity Pulse Count Register (0x0E) The Proximity Pulse Count Register sets the number of proximity pulses that will be transmitted. PPULSE defines the number of pulses to be transmitted at a 62.5kHz rate. While the value can be programmed up to 255 pulses, the practical limit of the device is 32 pulses. It is recommended that 32 or fewer pulses be used to achieve maximum signal-to-noise ratio. Figure 33: Proximity Pulse Count Register 7 6 5 4 3 2 1 0 PPULSE Field Bits Description PPULSE 7:0 Proximity Pulse Count. Specifies the number of proximity pulses to be generated. Page 26 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Register Set Control Register (0x0F) The Control Register provides four bits of control to the analog block. These bits control the diode drive current and diode selection functions. Figure 34: Control Register 7 6 PDRIVE Field 5 4 3 2 PDIODE Bits 1 0 Reserved Description LED Drive Strength. PDRIVE Field Value LED Strength 00 100% 01 50% 10 25% 11 12.5% 7:6 Proximity Diode Select. Field Value PDIODE Reserved Diode Selection 00 Reserved 01 Proximity uses the Channel 0 diode 10 Proximity uses the Channel 1 diode 11 Proximity uses both diodes 5:4 3:0 Reserved. Write bits as 0. Note(s): 1. The PDRIVE values are relative to the factory-trimmed current necessary to meet the Prox Coun specification shown on page 8. ams Datasheet [v1-00] 2016-May-16 Page 27 Document Feedback TMD2671 − Register Set ID Register (0x12) The ID Register provides the value for the part number. The ID Register is a read-only register. Figure 35: ID Register 7 6 5 4 3 2 1 0 ID Field Bits ID 7:0 Description 0x20 = TMD26711 Part number identification 0x29 = TMD26713 Status Register (0x13) The Status Register provides the internal status of the device. This register is read only. Figure 36: Status Register 7 6 Reserved PINT Field Bits Reserved 7:6 PINT 5 Reserved 4:0 Page 28 Document Feedback 5 4 3 2 1 0 Reserved Description Reserved Proximity Interrupt. Indicates that the device is asserting a proximity interrupt. Reserved ams Datasheet [v1-00] 2016-May-16 TMD2671 − Register Set Proximity Data Register (0x18 - 0x19h) Proximity data is stored as a 16-bit value. To ensure the data is read correctly, a two-byte I 2C read transaction should be utilized with auto increment protocol bits set in the Command Register. With this operation, when the lower byte register is read, the upper eight bits are stored into a shadow register, which is read by a subsequent read to the upper byte. The upper register will read the correct value even if the next ADC cycle ends between the reading of the lower and upper registers. Figure 37: PDATA Registers Register Address Bits PDATAL 0x18 7:0 Proximity data low byte PDATAH 0x19 7:0 Proximity data high byte ams Datasheet [v1-00] 2016-May-16 Description Page 29 Document Feedback TMD2671 − Application Information: Hardware Application Information: Hardware LED Driver Pin with Proximity Detection In a proximity sensing system, the included IR LED can be pulsed with more than 100mA of rapidly switching current, therefore, a few design considerations must be kept in mind to get the best performance. The key goal is to reduce the power supply noise coupled back into the device during the LED pulses. Averaging of multiple proximity samples is recommended to reduce the proximity noise. The first recommendation is to use two power supplies; one for the device V DD and the other for the IR LED. In many systems, there is a quiet analog supply and a noisy digital supply. By connecting the quiet supply to the V DD pin and the noisy supply to the LEDA pin, the key goal can be met. Place a 1μF low-ESR decoupling capacitor as close as possible to the V DD pin and another at the LEDA pin, and a 22μF capacitor at the output of the LED voltage regulator to supply the 100mA current surge. Figure 38: Proximity Sensing Using Separate Power Supplies VBUS Voltage Regulator LEDK VDD LDR 1 mF C* GND TMD2671 RP RP RPI INT SCL Voltage Regulator LEDA 22 mF SDA 1 mF * Cap Value Per Regulator Manufacturer Recommendation If it is not possible to provide two separate power supplies, the device can be operated from a single supply. A 22Ω resistor in series with the V DD supply line and a 1μF low ESR capacitor effectively filter any power supply noise. The previous capacitor placement considerations apply. Page 30 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Application Information: Hardware Figure 39: Proximity Sensing Using Single Power Supply VBUS 22 W Voltage Regulator LEDK VDD 22 mF LDR 1 mF GND TMD2671 RP RP RPI INT SCL LEDA SDA 1 mF V BUS in the above figures refers to the I 2C bus voltage which is either V DD or 1.8V. Be sure to apply the specified I 2C bus voltage shown in the Ordering Information table for the specific device being used. The I 2C signals and the Interrupt are open-drain outputs and require pull-up resistors. The pull-up resistor (RP) value is a function of the I 2C bus speed, the I 2C bus voltage, and the capacitive load. The ams EVM running at 400kbps, uses 1.5kΩ resistors. A 10kΩ pull-up resistor (R PI) can be used for the interrupt line. ams Datasheet [v1-00] 2016-May-16 Page 31 Document Feedback TMD2671 − Application Information: Hardware PCB Pad Layout Suggested PCB pad layout guidelines for the surface mount module are shown in Figure 40. Flash Gold is recommended surface finish for the landing pads. Figure 40: Suggested Module PCB Layout 0.60 0.05 0.80 0.05 0.72 0.05 0.25 0.05 Note(s): 1. All linear dimensions are in mm. 2. This drawing is subject to change without notice. Page 32 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Package Drawings & Markings Package Drawings & Markings Figure 41: Module Packaging Configuration TOP VIEW SIDE VIEW Detector 1.0 2.40 3.94 0.2 3.73 0.1 0.9 LED 1.18 0.58 END VIEW 2.36 0.2 1.35 0.2 2.10 0.1 RoHS BOTTOM VIEW 0.60 0.80 Green 0.25 0.72 0.05 Note(s): 1. All linear dimensions are in millimeters. Dimension tolerance is ±0.05mm unless otherwise noted. 2. Contacts are copper with NiPdAu plating. 3. This package contains no lead (Pb). 4. This drawing is subject to change without notice. ams Datasheet [v1-00] 2016-May-16 Page 33 Document Feedback TMD2671 − Package Mechanical Data Package Mechanical Data Figure 42: Module Carrier Tape TOP VIEW 8.00 1.75 4.00 1.50 2.00 0.05 B 5.50 0.05 + 0.30 12.00 − 0.10 B 1.00 0.05 Unit Orientation A DETAIL A A DETAIL B 6 Max 8 Max 2.70 0.29 0.02 Ao 1.70 Ko 4.30 Bo Note(s): 1. All linear dimensions are in millimeters. Dimension tolerance is ±0.10mm unless otherwise noted. 2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. 3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001. 4. Each reel is 330 millimeters in diameter and contains 2500 parts. 5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B. 6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. 7. This drawing is subject to change without notice. Page 34 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Soldering & Storage Information The module has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The process, equipment, and materials used in these test are detailed below. Soldering & Storage Information The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 43: Solder Reflow Profile Parameter Reference Device Average temperature gradient in preheating 2.5°C/s tsoak 2 to 3 minutes Time above 217°C (T1) t1 Max 60 s Time above 230°C (T2) t2 Max 50 s Time above Tpeak - 10°C (T3) t3 Max 10 s Peak temperature in reflow Tpeak 260°C Soak time Temperature gradient in cooling Max -5°C/s Figure 44: Solder Reflow Profile Graph Tpeak T3 T2 Temperature (C) T1 t3 Time (s) t2 tsoak t1 Note(s): 1. Not to scale - for reference only. ams Datasheet [v1-00] 2016-May-16 Page 35 Document Feedback TMD2671 − Soldering & Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope called a moisture barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. The Moisture Barrier Bags should be stored under the following conditions: • Temperature Range: < 40°C • Relative Humidity: < 90% • Total Time: No longer than 12 months from the date code on the aluminized envelope if unopened. Rebaking of the reel will be required if the devices have been stored unopened for more than 12 months and the Humidity Indicator Card shows the parts to be out of the allowable moisture region. Opened reels should be used within 168 hours if exposed to the following conditions: • Temperature Range: < 30°C • Relative Humidity: < 60% If rebaking is required, it should be done at 50°C for 12 hours. The Module has been assigned a moisture sensitivity level of MSL 3. Page 36 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Ordering & Contact Information Ordering & Contact Information Figure 45: Ordering Information Ordering Code Device Address Leads Interface Description TMD26711 TMD26711 0x39 8 I2C Vbus = VDD Interface TMD26713 TMD26713 0x39 8 I2C Vbus = 1.8 V Interface Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: [email protected] For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbaderstrasse 30 8141 Premstaetten Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com ams Datasheet [v1-00] 2016-May-16 Page 37 Document Feedback TMD2671 − RoHS Compliant & ams Green Statement RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Page 38 Document Feedback ams Datasheet [v1-00] 2016-May-16 TMD2671 − Copyrights & Disclaimer Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. ams Datasheet [v1-00] 2016-May-16 Page 39 Document Feedback TMD2671 − Document Status Document Status Document Status Product Preview Preliminary Datasheet Datasheet Datasheet (discontinued) Page 40 Document Feedback Product Status Definition Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs ams Datasheet [v1-00] 2016-May-16 TMD2671 − Revision Information Revision Information Changes from TAOS144C (2013-Mar) to current revision 1-00 (2016-May-16) Page Content of TAOS datasheet was converted to the latest ams design Added Figure 1 2 Note(s): 1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision 2. Correction of typographical errors is not explicitly mentioned. ams Datasheet [v1-00] 2016-May-16 Page 41 Document Feedback TMD2671 − Content Guide Content Guide Page 42 Document Feedback 1 2 2 3 General Description Key Benefits & Features Applications Block Diagram 4 5 6 7 11 12 Detailed Description Pin Assignment Absolute Maximum Ratings Electrical Characteristics Parameter Measurement Information Typical Operating Characteristics 14 14 15 17 17 18 19 20 Principles of Operation System State Machine Proximity Detection Optical Design Considerations Interrupts State Diagram Power Management I2C Protocol 21 22 23 23 24 24 25 25 26 26 27 28 28 29 Register Set Command Register Enable Register (0x00) ALS Timing Register (0x01) Proximity Time Control Register (0x02) Wait Time Register (0x03) Proximity Interrupt Threshold Register (0x08 − 0x0B) Persistence Register (0x0C) Configuration Register (0x0D) Proximity Pulse Count Register (0x0E) Control Register (0x0F) ID Register (0x12) Status Register (0x13) Proximity Data Register (0x18 - 0x19h) 30 30 32 Application Information: Hardware LED Driver Pin with Proximity Detection PCB Pad Layout 33 34 Package Drawings & Markings Package Mechanical Data 35 36 Soldering & Storage Information Moisture Sensitivity 37 38 39 40 41 Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer Document Status Revision Information ams Datasheet [v1-00] 2016-May-16