Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
MLA Varistor Series
RoHS
Description
The MLA Series family of transient voltage surge
suppression devices is based on the Littelfuse Multilayer
fabrication technology. These components are designed
to suppress a variety of transient events, including those
specified in IEC 61000-4-2 or other standards used for
Electromagnetic Compliance (EMC). The MLA Series is
typically applied to protect integrated circuits and other
components at the circuit board level.
The wide operating voltage and energy range make the
MLA Series suitable for numerous applications on power
supply, control and signal lines.
The MLA Series is manufactured from semiconducting
ceramics, and is supplied in a leadless, surface mount
package. The MLA Series is compatible with modern
reflow and wave soldering procedures.
Size Table
Metric
EIA
1005
0402
1608
0603
2012
0805
3216
1206
3225
1210
It can operate over a wider temperature range than Zener
diodes, and has a much smaller footprint than plastichoused components.
Absolute Maximum Ratings
• For ratings of individual members of a series, see device ratings and specifications table.
Continuous
Steady State Applied Voltage:
Littelfuse Inc. manufactures other multilayer series
products. See the MLE Series data sheet for ESD
applications, MHS Series data sheet for high-speed ESD
applications, the MLN Series for multiline protection and
the AUML Series for automotive applications.
ML Series
Units
DC Voltage Range (VM(DC))
3.5 to 120
V
AC Voltage Range (VM(AC)RMS)
2.5 to 107
V
Non-Repetitive Surge Current, 8/20µs
Waveform, (ITM)
4 to 500
A
Non-Repetitive Surge Energy,
10/1000µs Waveform, (WTM)
0.02 to
2.5
J
Operating Ambient Temperature Range (TA)
-55 to
+125
ºC
•
Storage Temperature Range (TSTG)
-55 to
+150
ºC
•
Temperature Coefficient (αV) of Clamping
Voltage (VC) at Specified Test Current
<0.01
%/º C
Transient:
Resources
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
•
•
•
Halogen-Free and
RoHS compliant
Leadless 0402,
0603, 0805, 1206
and 1210 chip sizes
Multilayer ceramic
construction
technology
-55°C to +125°C
operating temp. range
Operating voltage
range VM(DC) =
5.5V to 120V
Rated
for surge
current (8 x 20µs)
• Rated for energy
(10 x 1000µs)
•Inherent bi-directional
clamping
• Standard low
capacitance
types available
• ESD rated to IEC
61000-4-2, Level 4: Air
Discharge 15KV and
Contact Discharge 8KV
•
Applications
Additional Information
Datasheet
Features
•
Samples
•
Suppression of
inductive switching
or other transient
events such as EFT
and surge voltage at
the circuit board level
ESD protection for IEC
61000-4-2 (Level 4),
MIL-STD-883 method
3015.7, and other
industry specifications
(see also the MLE
or MLN Series)
•
•
•
Provides on-board
transient voltage
protection for ICS
and transistors
Used to help achieve
electromagnetic
compliance of
end products
Replace larger surface
mount TVS Zeners in
many applications
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Device Ratings and Specifications
Part Number
V3.5MLA0603N5
V3.5MLA0805N
V3.5MLA0805LN
V3.5MLA1206N
V5.5MLA0402N
V5.5MLA0402LN
V5.5MLA0603N5
V5.5MLA0603LN4
V5.5MLA0805N
V5.5MLA0805LN
V5.5MLA1206N
V9MLA0402N
V9MLA0402LN
V9MLA0603N5
V9MLA0603LN4
V9MLA0805LN
V12MLA0805LN
V14MLA0402N
V14MLA0603N
V14MLA0805N
V14MLA0805LN
V14MLA1206N
V18MLA0402N
V18MLA0603N
V18MLA0805N
V18MLA0805LN
V18MLA1206N
V18MLA1210N
V26MLA0603N
V26MLA0805N
V26MLA0805LN
V26MLA1206N
V26MLA1210N
V30MLA0603N
V30MLA0805LN
V30MLA1206N
V30MLA1210N
V30MLA1210LN
V33MLA1206N
V42MLA1206N
V48MLA1206N
V48MLA1210N
V48MLA1210LN
V56MLA1206N
V60MLA1210N
V68MLA1206N
V85MLA1210N
V120MLA1210N
Maximum
Continuous
Working Voltage
VM(AC)
VM(DC)
(V)
3.5
3.5
3.5
3.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
9.0
9.0
9.0
9.0
9.0
12.0
14.0
14.0
14.0
14.0
14.0
18.0
18.0
18.0
18.0
18.0
18.0
26.0
26.0
26.0
26.0
26.0
30.0
30.0
30.0
30.0
30.0
33.0
42.0
48.0
48.0
48.0
56.0
60.0
68.0
85.0
120.0
(V)
2.5
2.5
2.5
2.5
4.0
4.0
4.0
4.0
4.0
4.0
4.0
6.5
6.5
6.5
6.5
6.5
9.0
10.0
10.0
10.0
10.0
10.0
14.0
14.0
14.0
14.0
14.0
14.0
20.0
20.0
20.0
20.0
20.0
25.0
25.0
25.0
25.0
25.0
26.0
30.0
40.0
40.0
40.0
40.0
50.0
50.0
67.0
107.0
Maximum Ratings (125º C)
Specifications (25ºC)
Maximum NonMaximum NonMaximum Clamping Nominal Voltage
Typical
repetitive Surge
repetitive Surge
Voltage at 1A (or as
at 1mA DC Test
Capacitance
Current (8/20µs) Energy (10/1000µs)
Noted) (8/20µs)
Current
at f = 1MHz
ITM
WTM
VC
VN(DC) Min VN(DC) Max
C
(A)
30
120
40
100
20
20
30
30
120
40
150
20
4
30
30
40
40
20
30
120
40
150
20
30
120
40
150
500
30
100
40
150
300
30
30
180
280
220
180
180
180
250
220
180
250
180
250
125
(J)
0.100
0.300
0.100
0.300
0.050
0.050
0.100
0.100
0.300
0.100
0.400
0.050
0.020
0.100
0.100
0.100
0.100
0.050
0.100
0.300
0.100
0.400
0.050
0.100
0.300
0.100
0.400
2.500
0.100
0.300
0.100
0.600
1.200
0.100
0.100
1.000
1.200
0.900
0.800
0.800
0.900
1.200
0.900
1.000
1.500
1.000
2.500
2.000
(V)
13.0
13.0
13.0
13.0
21.0
39.0
17.5
17.5
17.5
17.5
17.5
30.0
35.0
25.5
25.5
25.5
29.0
39.0
34.5
32.0
32.0
32.0
50.0
50.0
44.0
44.0
44.0
44.0 at 2.5
60.0
60.0
60.0
60.0
60.0 at 2.5
74.0
72.0
67.0
68.0 at 2.5
68.0 at 2.5
75.0
92.0
100
105.0 at 2.5
105.0 at 2.5
120.0
130.0 at 2.5
140.0
180.0 at 2.5
260.0 at 2.5
(V)
3.7
3.7
3.7
3.7
7.1
15.9
7.1
7.1
7.1
7.1
7.1
11.0
11.0
11.0
11.0
11.0
14.0
15.9
15.9
15.9
15.9
15.9
22.0
22.0
22.0
22.0
22.0
22.0
31.0
29.5
29.5
29.5
29.5
37.0
37.0
35.0
35.0
35.0
38.0
46.0
54.5
54.5
54.5
61.0
67.0
76.0
95.0
135.0
(V)
7.0
7.0
7.0
7.0
10.8
21.5
9.3
9.3
9.3
9.3
9.3
16.0
16.0
16.0
16.0
16.0
18.5
21.5
21.5
20.3
20.3
20.3
28.0
28.0
28.0
28.0
28.0
28.0
38.0
38.5
38.5
38.5
38.5
46.0
46.0
43.0
43.0
43.0
49.0
60.0
66.5
66.5
66.5
77.0
83.0
90.0
115.0
165.0
(pF)
1270
1760
1380
7500
220
70
960
450
1840
660
3500
120
33
490
360
520
410
70
180
560
320
1200
40
120
520
290
1270
2930
110
220
190
720
1480
90
130
500
900
600
500
425
350
400
380
180
440
150
260
80
NOTES: 1 'L' suffix is a low capacitance and energy version; Contact your Littelfuse sales representative for custom capacitance requirements
2 Typical leakage at 25ºC<25µA, maximum leakage 100µA at VM(DC); for 0402 size, typical leakage <5µA, maximum leakage <20µA at VM(DC)
3 Average power dissipation of transients for 0402, 0603, 0805, 1206 and 1210 sizes not to exceed 0.03W, 0.05W, 0.1W, 0.1W and 0.15W respectively
4 Item is available as 'R' packing option only. All 0402 size items available as 'R' packaging option only. See Packaging section for additional information.
5 Item is available in 'H','T'and 'A' packing option only. All 0805, 1206 and 1210 parts come as 'H','T'and 'A' packing option only. See Packaging section for additional information.
6. The typical capacitance rating is the discrete component test result.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Peak Current and Energy Derating Curve
Peak Pulse Current Test Waveform for Clamping Voltage
100
PERCENT OF PEAK VALUE
When transients occur in rapid succession, the average
power dissipation is the energy (watt-seconds) per pulse
times the number of pulses per second. The power so
developed must be within the specifications shown
on the Device Ratings and Specifications Table for the
specific device. For applications exceeding 125°C ambient
temperature, the peak surge current and energy ratings
must be derated as shown below.
50
0
T
PERCENT OF RATED VALUE
O1
Figure 2
100
80
40
20
50
60
70
80
90
100
110
120
130 140 150
t2 = VIRTUAL TIME TO HALF VALUE
(IMPULSE DURATION)
AMBIENT TEMPERATURE ( oC)
Figure 1
T2
01 = Virtual Origin of Wave
T = Time from 10% to 90% of Peak
FIGURE
2. Time
PEAK =
PULSE
TEST WAVEFORM
T1 = Rise
1.25 xCURRENT
T
FOR CLAMPING VOLTAGE
T2 = Decay Time
Example - For an 8/20 µs Current Waveform:
O1 = VIRTUAL ORIGIN OF WAVE
8µsFROM
= T1 10%
= Rise
Time
t = TIME
TO 90%
OF PEAK
t1 = VIRTUAL
TIME = 1.25
xt
20µs =FRONT
T2 = Decay
Time
60
0
-55
TIME
T1
EXAMPLE:
FOR AN 8/20 s CURRENT WAVEFORM
Limit V-I8 sCharacteristic
forTIME
V9MLA0402L
= t1 = VIRTUAL FRONT
FIGURE 1. PEAK CURRENT AND ENERGY
DERATING CURVE
Limit V-I Characteristic for V5.5MLA0402 to V18MLA0402
MLA0402L Limit VI Curves
20 s = t2 = VIRTUAL TIME TO
HALF VALUE
MLA0402 Limit VI Curves
100
10
Varistor Voltage (V)
Varistor Voltage (V)
100
V18MLA0402
V14MLA0402
V9MLA0402
V5.5MLA0402
1
1µA
10µA
100µA
1mA
10mA
1A
10A
Figure 3
V9MLA0402L
V5.5MLA0402L
1
1µA
100A
Current (A)
10
10µA
100µA
Figure 4
Limit V-I Characteristic for V3.5MLA0603 to V30MLA0603
1mA
10mA
1A
10A
100A
Current (A)
Limit V-I Characteristic for V3.5MLA0805L to V30MLA0805L
1000
1000
V30MLA0805L
V26MLA0805L
V30MLA0603
V18MLA0805L
V26MLA0603
V18MLA0603
100
10
Varistor Voltage (V)
Varistor Voltage (V)
V14MLA0603
V9MLA0603, V9MLA0603L
100
V14MLA0805L
10
V12MLA0805L
V9MLA0805L
V5.5MLA0603, V5.5MLA0603L
V5.5MLA0805L
V3.5MLA0603
V3.5MLA0805L
1
10µA
Figure 5
100µA
1mA
10mA
Current (A)
100mA
1A
10A
FIGURE 5. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0603 TO V30MLA0603
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
100A
1
10µA
Figure 6
100µA
1mA
10mA
100mA
1A
10A
Current (A)
FIGURE 6. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805L TO V30MLA0805L
100A
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Limit V-I Characteristic for V3.5MLA0805 to V26MLA0805
Limit V-I Characteristic for V3.5MLA1206 to V68MLA1206
1000
100
100
Varistor Voltage (V)
Varistor Voltage (V)
1000
V26MLA0805
10
V18MLA0805
V14MLA0805
V68MLA1206
V56MLA1206
V42MLA1206
V33MLA1206
V26MLA1206
V18MLA1206
V14MLA1206
V5.5MLA1206
V3.5MLA1206
10
V5.5MLA0805
V3.5MLA0805
1
10µA
100µA
1mA
10mA
100mA
1A
10A
100A
1000A
Current (A)
Figure 7
1
10µA
FIGURE 7. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805 TO V26MLA0805
Limit V-I Characteristic for V18MLA1210 to V120MLA1210
Figure 8
100µA
1mA
10mA
100mA
Current (A)
1A
10A
100A
1000A
FIGURE 6. LIMIT V-1 CHARACTERISTIC FOR V3.5MLA1206 TO V68MLA1206
1000
MAXIMUM CLAMPING VOLTAGE
MAXIMUM LEAKAGE
Varistor Voltage (V)
100
V120MLA1210
10
V85MLA1210
V60MLA1210
V48MLA1210, V48MLA1210L
V30MLA1210, V30MLA1210L
V26MLA1210
1
10µA
Figure 9
V18MLA1210
100µA
1mA
10mA
100mA
1A
10A
100A
1000A
CURRENT (A)
FIGURE 9. LIMIT V-I CHARACTERISTIC FOR V18MLA1210 TO V120MLA1210
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Clamping Voltage Over Temperature (VC at 10A)
Device Characteristics
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance modex (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100µA, typically 25µA;
for 0402 size below 20µA, typically 5µA.
CLAMPING VOLTAGE (V)
100
V26MLA1206
V5.5MLA1206
Typical Temperature Dependance of the Haracteristic
Curve in the Leakage Region
10
-60
-40
-20
0
Figure 11
VNOM VALUE AT 25 oC (%)
SUPPRESSOR VOLTAGE IN PERCENT OF
100%
20
40
60
80
TEMPERATURE ( oC)
100
120
140
FIGURE 12. CLAMPING VOLTAGE OVER TEMPERATURE
(VC AT 10A)
Energy Absorption/Peak Current Capability
25
10%
1E -9
o
50o 75o
1E -8
100o 125 oC
1E -7
Figure 10
1E -6
1E -5
1E -4
1E -3
1E -2
SUPPRESSOR CURRENT (ADC)
FIGURE 10. TYPICAL TEMPERATURE DEPENDANCE OF THE CHARACTERISTIC
CURVE IN THE LEAKAGE REGION
Speed of Response
The Multilayer Suppressor is a leadless device. Its
response time is not limited by the parasitic lead
inductances found in other surface mount packages.
The response time of the ZNO dielectric material is less
than 1ns and the MLA can clamp very fast dV/dT events
such as ESD. Additionally, in "real world" applications,
the associated circuit wiring is often the greatest
factor effecting speed of response. Therefore, transient
suppressor placement within a circuit can be considered
important in certain instances.
Energy dissipated within the MLA Series is calculated
by multiplying the clamping voltage, transient current
and transient duration. An important advantage of the
multilayer is its interdigitated electrode construction within
the mass of dielectric material. This results in excellent
current distribution and the peak temperature per energy
absorbed is very low. The matrix of semiconducting grains
combine to absorb and distribute transient energy (heat)
(see Speed of Response). This dramatically reduces peak
temperature; thermal stresses and enhances device
reliability.
As a measure of the device capability in energy and peak
current handling, the V26MLA1206A part was tested with
multiple pulses at its peak current rating (3A, 8/20µs). At
the end of the test,10,000 pulses later, the device voltage
characteristics are still well within specification.
Repetitive Pulse Capability
Multilayer Internal Construction
100
PEAK CURRENT = 3A
8/20 s DURATION, 30s BETWEEN PULSES
FIRED CERAMIC
DIELECTRIC
VOLTAGE
V26MLA1206
METAL
ELECTRODES
METAL END
TERMINATION
10
DEPLETION
0
REGION
Figure 13
DEPLETION
REGION
Figure 12
GRAINS
FIGURE 11. MULTILAYER INTERNAL CONSTRUCTION
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
2000
4000
6000
8000
NUMBER OF PULSES
FIGURE 13.
REPETITIVE PULSE CAPABILITY
10000
12000
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Lead (Pb) Soldering Recommendations
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MLA chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50º C before cleaning.
250
250
MAXIMUM TEMPERATURE
MAXIMUM230°C
TEMPERATURE
230°C
250
200
200
TEMPERATURE
°C°C
TEMPERATURE
TEMPERATURE
°C
The recommended solder for the MLA suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
Reflow Solder Profile
40-80
MAXIMUM TEMPERATURE
40-80
SECONDS
230°C
SECONDS
ABOVE
183°C
ABOVE 183°C
RAMP RATE40-80
SECONDS
RAMP RATE
<2°C/s
<2°C/s ABOVE 183°C
200
150
150
150
100
100
PREHEAT DWELL
RAMP RATE
PREHEAT DWELL
<2°C/s
100
50
50
PREHEAT ZONE
PREHEAT
ZONE
PREHEAT
DWELL
50
0
00
0
0.5
0.5
Figure 14
0
0
2.5
2.5
3.0
3.0
3.5
3.5
4.0
4.0
3.5
4.0
MAXIMUM WAVE 260°C
MAXIMUM WAVE 260°C
250
300
250
MAXIMUM WAVE 260°C
200
250
200
150
200
150
SECOND PREHEAT
SECOND PREHEAT
100
150
100
SECOND PREHEAT
FIRST PREHEAT
FIRST PREHEAT
50
100
50
Lead–free (Pb-free) Soldering Recommendations
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
2.0
2.0
TIME (MINUTES)
TIME (MINUTES)
300
300
0
0.0
FIRST PREHEAT
0.5
0.5
1.0
1.0
1.5
1.5
2.0
2.5
3.0
2.0
2.5
3.0
TIME (MINUTES)
TIME (MINUTES)
3.5
3.5
4.0
4.0
4.5
4.5
0.5
1.0 15.1.5
2.5 PROFILE
3.0
3.5
FIGURE
WAVE2.0SOLDER
FIGURE 15. WAVE
TIME SOLDER
(MINUTES)PROFILE
4.0
4.5
FIGURE 15. WAVE SOLDER PROFILE
Lead–free Re-flow Solder Profile
300
300
MAXIMUM TEMPERATURE 260˚C,
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
20 SECONDS MAXIMUM
MAXIMUM TEMPERATURE
260˚C,
RAMP RATE
RAMP
RATE
TIME WITHIN 5˚C OF
PEAK
<3˚C/s
<3˚C/s
20 SECONDS MAXIMUM
250
300
250
TEMPERATURE
°C°C
TEMPERATURE
TEMPERATURE
°C
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.
1.5
1.5
FIGURE 14. REFLOW SOLDER PROFILE
Figure 15
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
1.0
1.0
0.5
1.0
1.5
2.0
2.5PROFILE
3.0
FIGURE
14. REFLOW
SOLDER
FIGURE 14. REFLOW
SOLDER PROFILE
TIME (MINUTES)
0
50
00.0
0.0
Littelfuse offers the Nickel Barrier Termination option (see
"N" suffix in Part Numbering System for ordering) for the
optimum Lead–free solder performance, consisting of a
Matte Tin outer surface plated on Nickel underlayer, plated
on Silver base metal.
PREHEAT ZONE
Wave Solder Profile
TEMPERATURE
°C°C
TEMPERATURE
TEMPERATURE
°C
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
200
250
200
RAMP RATE
<3˚C/s
150
200
150
100
150
100
60 - 150 SEC
> 217˚C
PREHEAT ZONE
PREHEAT ZONE
50
100
50
PREHEAT ZONE
0
50
00
0
0
60 - 150 SEC
60 - 150 SEC
> 217˚C
> 217˚C
1.0
1.0
2.0
2.0
3.0
3.0
4.0
4.0
TIME (MINUTES)
TIME (MINUTES)
5.0
5.0
6.0
6.0
7.0
7.0
0 FIGURE
1.0 16. LEAD-FREE
2.0
3.0 RE-FLOW
4.0
5.0
6.0
7.0
SOLDER
PROFILE
RE-FLOW SOLDER PROFILE
Figure 16 FIGURE 16. LEAD-FREE
TIME (MINUTES)
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Product Dimensions (mm)
PAD LAYOUT DIMENSIONS
CHIP LAYOUT DIMENSIONS
C
E
B
NOTE
D
L
W
A
NOTE : Avoid metal runs in this area, parts not recommended for use in applications using
Silver (Ag) epoxy
paste. Avoid metal runs in this area.
NOTE:
Parts not recommended for use in
1210
Size
1206 paste.
Size
applications
using silver epoxy
Dimension
IN
MM
IN
MM
A
0.160
B
0.100
4.06
0.160
2.54
0.065
0805 Size
0603 Size
IN
MM
4.06
0.120
1.65
0.050
0402 Size
IN
MM
IN
MM
3.05
0.100
2.54
0.067
1.70
1.27
0.030
0.76
0.020
0.51
C
0.040
1.02
0.040
1.02
0.040
1.02
0.035
0.89
0.024
0.61
D (max.)
0.113
2.87
0.071
1.80
0.043
1.10
0.040
1.00
0.024
0.60
E
0.020
-/+0.010
0.50
-/+0.25
0.020
-/+0.010
0.50
-/+0.25
0.020 -/+
0.010
0.50 -/+
0.25
0.015
-/+0.008
0.4
-/+0.20
0.010
-/+0.006
0.25
-/+0.15
L
0.125
-/+0.012
3.20
-/+0.30
0.125
-/+0.012
3.20
-/+0.30
0.079
-/+0.008
2.01
-/+0.20
0.063
-/+0.006
1.6
-/+0.15
0.039
-/+0.004
1.00
-/+0.10
W
0.100
-/+0.012
2.54
-/+0.30
0.060
-/+0.011
1.60
-/+0.28
0.049
-/+0.008
1.25
-/+0.20
0.032
-/+0.060
0.8
-/+0.15
0.020
-/+0.004
0.50
-/+0.10
Part Numbering System
V 18 MLA 1206 X X X
PACKING OPTIONS (see Packaging table for quantities)
T: 13in (330mm) Diameter Reel, Plastic Carrier Tape
H: 7in (178mm) Diameter Reel, Plastic Carrier Tape
R: 7in (178mm) Diameter Reel, Paper Carrier Tape
A: Bulk Pack
DEVICE FAMILY
Littelfuse TVSS Device
MAXIMUM DC
WORKING VOLTAGE
MULTILAYER SERIES
DESIGNATOR
DEVICE SIZE:
0201 = .024 inch x .012 inch (0.6 mm x 0.3 mm)
0402 = .04 inch x .02 inch (1.0 mm x 0.5 mm)
0603 = .063 inch x .031 inch (1.6 mm x 0.8 mm)
0805 = .08 inch x .08 inch (2.0 mm x 1.25 mm)
1206 = .126 inch x .063 inch (3.2 mm x 1.6 mm)
1210 = .126 inch x .1 inch (3.2 mm x 2.5 mm)
END TERMINATION OPTION
:
N or No Letter: Nickel Barrier Option
(Matte Tin outer surface, plated on Nickel underlayer
plated on silver base metal)
CAPACITANCE OPTION
No Letter: Standard
L: Low Capacitance Version
*NOTES:
1 V120MLA1210 standard shipping quantities are 1000 pieces per reel for the "H" option and 4000 pieces per reel for "T" option.
2 V3.5 MLA0603, V5.5MLA0603 and V9MLA0603 only available in "H," "T" and "A" packing options.
Packaging*
Quantity
Device Size
13” Inch Reel
("T" Option)
7” Inch Reel
("H" Option)
7” Inch Reel
("R" Option)
Bulk Pack
("A" Option)
1210
1206
0805
0603
0402
8,000
10,000
10,000
10,000
N/A
2,000
2,500
2,500
2,500
N/A
N/A
N/A
N/A
4,000
10,000
2,000
2,500
2,500
2,500
N/A
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Tape and Reel Specifications
D0
PRODUCT
IDENTIFYING
LABEL
P0
For T and H Pack Options: PLASTIC CARRIER TAPE
For R Pack Options: EMBOSSED PAPER CARRIER TAPE
P2
E
F
K0
W
B0
t1
D1
P1
Symbol
A0
Description
EMBOSSMENT
TOP TAPE
8mm
NOMINAL
178mm
OR 330mm
DIA. REEL
Dimensions in Millimeters
0402 Size
0603, 0805, 1206 & 1210 Sizes
A0
Width of Cavity
Dependent on Chip Size to Minimize Rotation.
B0
Length of Cavity
Dependent on Chip Size to Minimize Rotation.
K0
Depth of Cavity
Dependent on Chip Size to Minimize Rotation.
W
Width of Tape
8 -/+0.2
8 -/+0.3
F
Distance Between Drive Hole Centers and Cavity Centers
3.5 -/+0.05
3.5 -/+0.05
E
Distance Between Drive Hole Centers and Tape Edge
1.75 -/+0.1
1.75 -/+0.1
P1
Distance Between Cavity Centers
2-/+0.05
4 -/+0.1
P2
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
2 -/+0.1
2 -/+0.1
P0
Axial Drive Distance Between Drive Hole Centers
D0
Drive Hole Diameter
D1
Diameter of Cavity Piercing
T1
Top Tape Thickness
4 -/+0.1
4 -/+0.1
1.55 -/+0.05
1.55 -/+0.05
N/A
1.05 -/+0.05
0.1 Max
0.1 Max
NOTES:
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15