Datasheet

Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLN Series
MLN SurgeArrayTM Suppressor
RoHS
Description
The MLN SurgeArray™ Suppressor is designed to
help protect components from transient voltages that
exist at the circuit board level. This device provides four
independent suppressors in a single leadless chip in order
to reduce part count and placement time as well as save
space on printed circuit boards.
SurgeArray™ Suppressor are intended to suppress ESD,
EFT and other transients in order to protect integrated
circuits or other sensitive components operating at any
voltage up to 18VDC. SurgeArray™ Suppressor are rated
to the IEC 61000-4-2 human body model ESD to help
products attain EMC compliance. The array offers excellent
isolation and low crosstalk between sections.
Size Table
Metric
EIA
3216
1206
The inherent capacitance of the SurgeArray™ Suppressor
permits it to function as a filter/suppressor, thereby
replacing separate Zener/capacitor combinations.
Absolute Maximum Ratings
Continuous
MLN Series
Units
Steady State Applied Voltage:
DC Voltage Range (VM(DC))
5.5 - 18
V
Operating Ambient Temperature Range (TA)
-55 to +125
ºC
Storage Temperature Range (TSTG)
-55 to +150
ºC
For ratings of individual members of a series, see device ratings and
specifications table.
Additional Information
Datasheet
Resources
Samples
The MLN array is manufactured using the Littelfuse
Multilayer technology process and is similar to the
Littelfuse ML and MLE Series of discrete leadless chips.
Features
• RoHS Compliant
• Low leakage
• Four individual
devices in one chip
• Operating voltage
up to 18VM(DC)
• ESD rated to IEC
61000-4-2 (Level 4)
• -55ºC to 125ºC
operating temp range
• AC characterized
for impedance and
capacitance
• Low-profile, PCMCIA
compatible
• Low adjacent channel
crosstalk, -55dB
at 10MHz (Typ)
Applications
• Data, Diagnostic
I/O Ports
• Analog Signal/
Sensor Lines
•Computer/DSP
Products
•Portable/HandHeld Products
• Industrial Instruments
Including Medical
•Mobile
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
Communications/
Cellular Phones
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Device Ratings and Specifications Any Single Section
Maximum Ratings (125ºC)
Maximum
Maximum
Maximum
Maximum
NonNonClamping
Continuous
repetitive
repetitive
Voltage (at
Working
Surge Current Surge Energy Noted 8/20µs)
Voltage
(8/20µs)
(10/1000µs)
Current
Part Number
VM(DC)
I TM
WTM
VC
Specifications (25ºC)
Typical ESD
Supression Voltage
(Note1)
Nominal Voltage
at 1mA DC Test
Current
(Note 2)
(Note 3)
8kV Contact 15kV Air VN(DC)
Min
Peak Clamp Peak
Capacitance
at 1 MHz
(1V p-p)
(Note 4)
C
TYP
MAX
VN(DC)
Max
(V)
(A)
(J)
(V)
(V)
(V)
(V)
(V)
(V)
(pF)
V5.5MLN41206
5.5
30
0.10
15.5 at 2A
60
35
45
7.10
10.8
430
520
V9MLN41206
9.0
30
0.10
23.0 at 2A
95
50
75
11.0
16.0
250
300
V14MLN41206
14.0
30
0.10
30.0 at 2A
110
55
85
15.9
20.3
140
175
V18MLN41206
18.0
30
0.10
40.0 at 2A
165
63
100
22.0
28.0
100
125
V18MLN41206L
18.0
30
0.05
50.0 at 1A
200
95
130
25.0
35.0
45
75
NOTES: 1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit.
2. Direct discharge to device terminals (IEC preffered test method).
3. Corona discharge through air (represents actual ESD event)
Peak Current and Energy Derating Curve
4.Capacitance may be customized, contact Sales.
5. The typical capacitance rating is the discrete component test result.
Peak Pulse Current Test Waveform for Clamping Voltage
PERCENT OF PEAK VALUE
For applications exceeding 125ºC ambient temperature, the
peak surge current and energy ratings must be reduced.
PERCENT OF RATED VALUE
100
NORMALIZED VARISTOR VOLTAGE (%)
100
90
80
-40oC
70
25oC
10
0.1mA
60
85oC
50
125 oC
40
30
1mA
10 mA
100mA
O1 = Virtual origin of wave
t = Time from 10% to 90% of
t1 = Virtual front time = 1.25 x
t2 = Virtual time to half value
(Impulse duration)
50
10
t
t1
50
60
70
80
90
100
110
120
t2
FIGURE 2.
PEAK PULSE CURRENT TEST WAVEFORM FOR CL
Example:
01 = Virtual Origin of Wave
T = Time from 10% to 90% of Peak
T1 = Rise Time = 1.25 x T
T2 = Decay Time
(Impulse Duration)
130 140 150
AMBIENT TEMPERATURE ( oC)
Figure
1
70
TIME
1mA
CURRENT (A)
FIGURE 7. STANDBY CURRENT AT NORMALIZED VARISTOR VOLTAGE AND TEMPERATURE (ANY SINGLE SECTION)
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
65
CAPACITANCE (pF)
90
Figure 2
20
0
-55
100
O1
10
(pF)
For an 8/20 µs Current Waveform:
8µs = T1 = Rise Time
20µs = T2 = Virtual Time
to Half Value
60
Typical Performance Curves
55
50
Impedance vs Frequency, 1206 Size
Equivalent Series Resistance
45
40
1MHz
10MHz
1GHz
100MHz
FREQUENCY
10000
FIGURE 8. CAPACITANCE vs FREQUENCY
1000
1000
Impeance |Z| (Ω)
OHMS
100
10
1
100
V5.5
V9
10
V14
V18
V18L
0.1
1MHz
10MHz
100MHz
1GHz
10GHz
1
Frequency
FIGURE 11. CAPACITANCE VS FREQUENCY, 1206 SIZE
Figure 3
0.1
0.1
Figure 4
1
10
100
1000
Frequency (MHz)
FIGURE 12. IMPEDANCE vs FREQUENCY, 1206 SIZE
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Typical Performance Curves (continued)
Nominal Voltage Stability to IEC 1000-4-2 (8kV Contact
Method, One Section)
1206 Size Pulse Rating for Long Duration Surges
(Any Single Section)
100
25
V18
NUMBER OF SURGES
1
100
V14
15
2
Surge Current (A)
NOMINAL VOLTAGE
VNOM (V)
20
V9
10
V5.5
10
103
10
1
5
∞
104
105
106
0
0
10
Figure 5
100
1000
10000
NUMBER OF DISCHARGES
0.1
10
100
Figure 6
1000
10000
Square Wave Impulse Duration (µs)
FIGURE 6. 0805 SIZE PULSE RATING FOR LONG DURATION SURGES
(ANY SINGLE SECTION)
FIGURE 3. NOMINAL VOLTAGE STABILITYTO IEC 1000-4-2
(8kV CONTACT METHOD, ONE SECTION)
V-I Characteristic, 1206 size
Capacitance vs Frequency, 1206 Size
500
100
V18L
MAXIMUM CLAMP VOLTAGE
V5.5
V18
MAXIMUM STANDBY
400
V14
V5.5
Capacitance (pF)
Varistor Voltage (V)
V9
V18L
V18
10
V14
V9
V5.5
300
V9
200
V14
V18
100
V18L
1
10µA
100µA
1mA
10mA
100mA
1A
100A
10A
Current (A)
Figure 7
FIGURE 5. V-I CHARACTERISTIC, 1206 SIZE
0
Crosstalk (dB)
-20
-40
-60
V18L
V14
V18
V9
-80
V5.5
VIN = 1VRMS
Z = 50Ω
-100
-120
0.001
0.01
0.1
1
10
Frequency (MHz)
FIGURE 13. ADJACENT CHANNEL CROSSTALK
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
1
10
100
Frequency (MHz)
FIGURE 8. CAPACITANCE vs FREQUENCY
Adjacent Channel Crosstalk
Figure 9
0
0.1
Figure 8
100
1000
1000
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Lead (Pb) Soldering Recommendations
When using a reflow process, care should be taken to
ensure that the MLN chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
MAXIMUM TEMPERATURE
230°C
MAXIMUM TEMPERATURE
40-80
230°C
250
200
TEMPERATURE
TEMPERATURE
°C °C
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
250
SECONDS
ABOVE
183°C
40-80
SECONDS
RAMP RATE
ABOVE 183°C
<2°C/s
RAMP RATE
<2°C/s
PREHEAT DWELL
200
150
150
100
100
50
PREHEAT
DWELL
PREHEAT
ZONE
50
0
0
0
0
Figure 10
PREHEAT ZONE
0.5
1.0
1.5
0.5
1.0
1.5
2.0
2.5
TIME (MINUTES)
2.0
2.5
3.0
3.5
4.0
3.0
3.5
4.0
TIME (MINUTES)
FIGURE 14. REFLOW
SOLDER PROFILE
FIGURE 14.
Wave Solder Profile
REFLOW SOLDER PROFILE
300
MAXIMUM WAVE 260°C
300
250
MAXIMUM WAVE 260°C
250
200
TEMPERATURE
TEMPERATURE
°C °C
The recommended solder for the MLN suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
Reflow Solder Profile
200
150
SECOND PREHEAT
150
100
SECOND PREHEAT
FIRST PREHEAT
100
50
FIRST PREHEAT
Figure 11
50
0
0.0
0
0.0
0.5
1.0
1.5
4.0
4.5
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TIME (MINUTES)
2.0
2.5
3.0
3.5
TIMESOLDER
(MINUTES)PROFILE
FIGURE 15. WAVE
4.0
4.5
FIGURE 15. WAVE SOLDER PROFILE
300
MAXIMUM TEMPERATURE 250˚C,
TIME WITHIN 5˚C OF PEAK
20
SECONDS
MAXIMUM 250˚C,
MAXIMUM
TEMPERATURE
TIME WITHIN 5˚C RAMP
OF PEAK
RATE
20 SECONDS MAXIMUM
<3˚C/s
RAMP RATE
<3˚C/s
300
250
TEMPERATURE
TEMPERATURE
°C °C
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
250
200
200
150
150
100
PREHEAT ZONE
100
50
50
0
0
60 - 150 SEC
> 217˚C
60 - 150 SEC
> 217˚C
PREHEAT ZONE
0
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
TIME (MINUTES)
1.0
2.0
3.0
4.0
5.0
6.0
7.0
FIGURE 16. LEAD-FREE
RE-FLOW SOLDER PROFILE
TIME (MINUTES)
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Product Dimensions (mm)
PAD LAYOUT DEMENSIONS
CHIP LAYOUT DIMENSIONS
T
E
T
W
T
W
W
D
X
A
P
B
L
P
L
C
P
X
X
L
S
S
BW
S
BL
1206 Size
Dimension
IN
MM
A
0.035
0.890
B
0.065
1.650
C
0.100
2.540
D
0.018
0.460
E
0.030
0.790
L
3.200 -/+0.200
0.126 -/+0.008
W
1.600 -/+0.200
0.063 -/+0.008
T
1.350 Max
0.053 Max
BW
0.410 -/+0.100
0.016 -/+0.004
BL
0.180 +0.25/-0.050
0.007 +0.01/- 0.002
P
0.760 Ref
0.030 Ref
X
1.140 -/+0.100
0.045 -/+0.004
S
0.380 -/+0.100
0.015 -/+0.004
VXXMLN TYPES
Part Numbering System
V 18 ML N 4 1206 L W T
DEVICE FAMILY
TVSS Device
MAXIMUM DC
WORKING VOLTAGE
MULTILAYER DESIGNATOR
SERIES DESIGNATOR
N: Array
NUMBER OF SECTIONS
PACKING OPTIONS*
A: Bulk Pack, 2500 pieces
H: 7in (178mm) Diameter Reel, 2500 pieces
T: 13in (330mm) Diameter Reel, 10,000 pieces
END TERMINATION
W: Ag/Pd/Pt (Silver/Platinum/Palladium)
CAPACITANCE OPTION
(no letter): Standard
L: Low Capacitance Version
DEVICE SIZE: 1206: 120mil x 60mil
Packaging*
Quantity
Device Size
13” Inch Reel
("T" Option)
7” Inch Reel
("H" Option)
Bulk Pack
("A" Option)
1206
10,000
2,500
2,500
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
BL
BW
BL
B
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Tape and Reel Specifications
t1
D0
P0
PRODUCT
IDENTIFYING
LABEL
P2
PLASTIC CARRIER TAPE
E
F
K0
W
B0
t2
D1
P1
Symbol
A0
Description
EMBOSSMENT
TOP TAPE
8mm
NOMINAL
178mm
OR 330mm
DIA. REEL
Dimensions in Millimeters
A0
Width of Cavity
Dependent on Chip Size to Minimize Rotation.
B0
Length of Cavity
Dependent on Chip Size to Minimize Rotation.
K0
Depth of Cavity
Dependent on Chip Size to Minimize Rotation.
W
Width of Tape
F
Distance Between Drive Hole Centers and Cavity Centers
3.5 -/+0.5
1.75 -/+0.1
8 -/+0.2
E
Distance Between Drive Hole Centers and Tape Edge
P1
Distance Between Cavity Center
4 -/+0.1
P2
Axial Distance Between Drive Hole Centers and Cavity Centers
2 -/+0.1
P0
Axial Distance Between Drive Hole Centers
4 -/+0.1
D0
Drive Hole Diameter
1.55 -/+0.05
D1
Diameter of Cavity Piercing
1.05 -/+0.05
T1
Embossed Tape Thickness
0.3 Max
T2
Top Tape Thickness
0.1 Max
Notes :
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15