Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
MLE Varistor Series
RoHS
Description
The MLE Series family of transient voltage suppression
devices are based on the Littelfuse multilayer fabrication
technology. These components are designed to suppress
ESD events, including those specified in IEC 61000-4-2
or other standards used for Electromagnetic Compliance
testing. The MLE Series is typically applied to protect
integrated circuits and other components at the circuit
board level operating at 18VDC, or less.
The fabrication method and materials of these devices
result in capacitance characteristics suitable for high
frequency attenuation/low-pass filter circuit functions,
thereby providing suppression and filtering in a single
device.
Size Table
Metric
EIA
1005
0402
1608
0603
2012
0805
3216
1206
The MLE Series is manufactured from semiconducting
ceramics and is supplied in a leadless, surface mount
package. The MLE Series is compatible with modern reflow
and wave soldering procedures.
Littelfuse Inc. manufactures other Multilayer Series
products. See the ML Series data sheet for higher energy/
peak current transient applications. See the AUML Series
for automotive applications and the MLN Quad Array. For
high–speed applications see the MHS Series.
Applications
•
•
Features
Protection of
components and
circuits sensitive
to ESD Transients
occurring on power
supplies, control
and signal lines
compliance (EMC)
•
Suppression of
ESD events such as
specified in IEC-610004-2 or MIL-STD-883
Method-3015.7, for
electromagnetic
Used in mobile
communications,
computer/EDP
products, medical
products, hand held/
portable devices,
industrial equipment,
including diagnostic
port protection and
I/O interfaces
Additional Information
•
Halogen-Free and
RoHS Compliant
•
•
Rated for ESD
(IEC-61000-4-2)
Leadless 0402, 0603,
0805, and 1206 sizes
•
•
Characterized for
impedance and
capacitance
Operating voltages
up to 18VM(DC)
•
Multilayer ceramic
construction technology
•
operating temp. range
-55ºC to +125ºC
Absolute Maximum Ratings
• For ratings of individual members of a series, see device ratings and specifications table.
Continuous
MLE Series
Units
≤18
V
Operating Ambient Temperature
Range (TA)
-55 to +125
ºC
Storage Temperature Range (TSTG)
-55 to +150
C
Steady State Applied Voltage:
Datasheet
Resources
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
Samples
DC Voltage Range (VM(DC))
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Device Ratings and Specifications
Max Continuous
Working Voltage
-55ºC to 125ºC
Part Number
VNOM at
1mA DC
MIN (V) MAX (V)
22
28
22
28
22
28
(Note 1)
VM(DC)
V18MLE0402N
V18MLE0603N
V18MLE0603LN
(V)
18
18
18
V18MLE0805N
V18MLE0805LN
V18MLE1206N
18
18
18
Nominal
Voltage
22
22
22
28
28
28
Performance Specifications (25ºC)
Maximum Clamping
Maximum ESD Clamp
Voltage at Specified
Voltage (Note 2)
Current (8/20µs)
VC
8kV Contact
15kV Air
Typical
Capacitance
at 1MHz
(V)
50 at 1A
50 at 1A
50 at 1A
(V)
<125
<75
<100
Clamp (V)
<110
<110
<140
(pF)
<55
<125
<100
50 at 1A
50 at 1A
50 at 1A
<70
<75
<65
<75
<135
<65
<500
<290
<1700
(Note 3)
(Note 4)
NOTES:
1. For applications of 18VDC or less. Higher voltages available, contact your Littelfuse Sales Representative.
2.Tested with IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
3.Direct discharge to device terminals (IEC preferred test method).
4.Corona discharge through air (represents actual ESD event).
5.Capacitance may be customized, contact your Littelfuse Sales Representative.
6.Leakage current ratings are at 18 VDC and 25µA maximum.
7. The typical capacitance rating is the discrete component test result.
Peak Current and Energy Derating Curve
100
PERCENT OF RATED VALUE
30
NOMINAL VOLTAGE AT 1mADC
For applications exceeding 125ºC ambient temperature, the peak
surge current and energy ratings must be reduced as shown
below.
Nominal Voltage Stability to Multiple ESD Impulses
(8kV Contact Discharges per IEC 61000-4-2)
80
60
40
25
20
15
10
5
0
20
0
-55
50
60
70
80
90
100
110
120
100
1000
10000
CURRENT (A)
FIGURE 2. NOMINAL VOLTAGE STABILITY TO MULTIPLE
ESD IMPULSES (8KV CONTACT DISCHARGES
PER IEC 61000-4-2)
130 140 150
AMBIENT TEMPERATURE ( oC)
Figure 1
10
1
Figure 2
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
Standby Current at Normalized Varistor Voltage and
Temperature
Impedance (Z) vs Frequency Typical Characteristic
100
-0402
1.0
-0603
10
0.8
-0805
IMPEDANCE (Z)
NORMALIZED VARISTOR VOLTAGE (V)
1.2
25O
0.6
85O
0.4
0.1
125O
0.2
0.01
0.0
0.0001
Figure 3
-1206
1
0.001
0.01
0.1
10
1
CURRENT (mA)
FIGURE 3. STANDBY CURRENT AT NORMALIZED VARISTOR
VOLTAGE AND TEMPERATURE
Figure 4
100
1000
10000
FREQUENCY (MHz)
FIGURE 4. IMPEDANCE (Z) vs FREQUENCY
TYPICAL CHARACTERISTIC
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Device Characteristics
Clamping Voltage Over Temperature (VC at 10A)
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance model (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100µA, typically 25µA;
for 0402 size below 20µA, typically 5µA.
CLAMPING VOLTAGE (V)
100
V26MLA1206
Typical Temperature Dependance of the Characteristic
Curve in the Leakage Region
V5.5MLA1206
10
-60
-40
-20
0
Figure 6
VNOM VALUE AT 25 oC (%)
SUPPRESSOR VOLTAGE IN PERCENT OF
100%
20
40
60
80
TEMPERATURE ( oC)
100
120
140
FIGURE 12. CLAMPING VOLTAGE OVER TEMPERATURE
(VC AT 10A)
Energy Absorption/Peak Current Capability
25
10%
1E -9
o
50o 75o
1E -8
100o 125 oC
1E -7
Figure 5
1E -6
1E -5
1E -4
1E -3
1E -2
SUPPRESSOR CURRENT (ADC)
FIGURE 10. TYPICAL TEMPERATURE DEPENDANCE OF THE CHARACTERISTIC
CURVE IN THE LEAKAGE REGION
Speed of Response
The Multilayer Suppressor is a leadless device. Its
response time is not limited by the parasitic lead
inductances found in other surface mount packages.
The response time of the ZNO dielectric material is less
than 1ns and the MLE can clamp very fast dV/dT events
such as ESD. Additionally, in "real world" applications,
the associated circuit wiring is often the greatest
factor effecting speed of response. Therefore, transient
suppressor placement within a circuit can be considered
important in certain instances.
Energy dissipated within the MLE is calculated by
multiplying the clamping voltage, transient current
and transient duration. An important advantage of the
multilayer is its interdigitated electrode construction within
the mass of dielectric material. This results in excellent
current distribution and the peak temperature per energy
absorbed is very low. The matrix of semiconducting grains
combine to absorb and distribute transient energy (heat)
(see Speed of Response). This dramatically reduces peak
temperature; thermal stresses and enhances device
reliability.
As a measure of the device capability in energy and peak
current handling, the V26MLA1206A part was tested with
multiple pulses at its peak current rating (3A, 8/20µs). At
the end of the test, 10,000 pulses later, the device voltage
characteristics are still well within specification.
Repetitive Pulse Capability
Multilayer Internal Construction
100
PEAK CURRENT = 3A
8/20 s DURATION, 30s BETWEEN PULSES
FIRED CERAMIC
DIELECTRIC
VOLTAGE
METAL
ELECTRODES
V26MLA1206
METAL END
TERMINATION
DEPLETION
10
REGION
0
Figure 8
DEPLETION
REGION
Figure 7
GRAINS
FIGURE 11. MULTILAYER INTERNAL CONSTRUCTION
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
2000
4000
6000
8000
NUMBER OF PULSES
FIGURE 13.
REPETITIVE PULSE CAPABILITY
10000
12000
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
Reflow Solder Profile
The recommended solder for the MLE suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
230
230
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MLE chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
230
Figure 9
5.
Wave Solder Profile5.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
5.
Figure 10
6.
6.
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel Barrier Termination finish for the
optimum Lead–free solder performance.
RAMP RATE260˚C
MAXIMUM TEMPERATURE
<3˚C/s
60 - 150 SEC
20 - 40 SECONDS
WITHIN 5˚C
6.
> 217˚C
Lead–free Re-flow Profile
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
60 - 150 SEC
> 217˚C
PREHEAT ZONE
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
PREHEAT ZONE
RAMP RATE
<3˚C/s
60 - 150 SEC
5.0
6.0
> 217˚C
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free Wave
soldering, the Wave Solder Profile still applies.
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
RAMP RATE
<3˚C/s
FIGURE 7. LEAD-FREE RE-FLOW 5.0
PROFILE6.0
7.0
7.0
PREHEAT ZONE
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
5.0
6.0
7.0
Figure 11
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Product Dimensions (mm)
PAD LAYOUT DEMENSIONS
CHIP LAYOUT DIMENSIONS
C
E
B
NOTE
D
L
A
W
NOTE: Avoid metal runs in this area.
Note:
Avoid
metal
runs
this
area,parts
partsare
arenot
Note:
Avoid
metal
runs
in in
this
area,
not recommended
in applications
recommended
for usefor
in use
applications
usingusing
silver
Silver
(Ag)paste.
epoxy paste.
(Ag)
expoxy
Dimension
1206 Size
0805 Size
IN
MM
A
0.160
B
0.065
0603 Size
IN
MM
4.06
0.120
1.65
0.050
0402 Size
IN
MM
IN
MM
3.05
0.100
2.54
0.067
1.70
1.27
0.030
0.76
0.020
0.51
C
0.040
1.02
0.040
1.02
0.035
0.89
0.024
0.61
D (max.)
0.071
1.80
0.043
1.10
1.00
0.02 -/+ 0.01
0.50 -/+ 0.25
0.02 -/+ 0.01
0.50 -/+ 0.25
L
0.125 -/+
0.012
3.20 -/+ 0.03
W
0.06 -/+ 0.011
1.60 -/+ 0.28
0.024
0.010 -/+
0.006
0.039 -/+
0.004
0.020 -/+
0.004
0.60
E
0.040
0.015 -/+
0.008
0.063 -/+
0.006
0.032 -/+
0.006
0.079 -/+
0.008
0.049 -/+
0.008
2.01 -/+ 0.2
1.25 -/+ 0.2
0.4 -/+ 0.2
1.6 -/+ 0.15
0.8 -/+ 0.15
Part Numbering System
V 18 MLE 1206 X X X
PACKING OPTIONS (see Packaging section for quantities)
T: 13in (330mm) Diameter Reel, Plastic Carrier Tape
H: 7in (178mm) Diameter Reel, Plastic Carrier Tape
R: 7in (178mm) Diameter Reel, Paper Carrier Tape
DEVICE FAMILY
Littelfuse TVSS Device
MAXIMUM DC
WORKING VOLTAGE
END TERMINATION OPTION
N: Nickel Barrier (Ni/Sn)
MULTILAYER SERIES
DESIGNATOR
CAPACITANCE OPTION
No Letter: Standard
L: Low Capacitance Version
DEVICE SIZE:
i.e., 120 mil x 60 mil
(3mm x 1.5mm)
Packaging*
Quantity
Device Size
13” Inch Reel
('T' Option)
7” Inch Reel
('H' Option)
7” Inch Reel
('R' Option)
Bulk Pack
('A' Option)
1206
10,000
2,500
N/A
2500
0805
10,000
2,500
N/A
2500
0603
10,000
2,500
4,000
2500
0402
N/A
N/A
10,000
N/A
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15
0.25 -/+ 0.15
1.0 -/+ 0.1
0.5 -/+ 0.1
Metal-Oxide Varistors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Tape and Reel Specifications
D0
PRODUCT
IDENTIFYING
LABEL
P0
For T and H Pack Options: PLASTIC CARRIER TAPE
For R Pack Options: EMBOSSED PAPER CARRIER TAPE
P2
E
F
K0
W
B0
t1
D1
P1
Symbol
A0
Description
EMBOSSMENT
TOP TAPE
178mm
OR 330mm
DIA. REEL
8mm
NOMINAL
Dimensions in Millimeters
0402 Size
0603, 0805 & 1206 Sizes
A0
Width of Cavity
Dependent on Chip Size to Minimize Rotation.
B0
Length of Cavity
Dependent on Chip Size to Minimize Rotation.
K0
Depth of Cavity
Dependent on Chip Size to Minimize Rotation.
W
Width of Tape
8 -/+ 0.2
8 -/+ 0.3
F
Distance Between Drive Hole Centers and Cavity Centers
3.5 -/+ 0.05
3.5 -/+ 0.05
E
Distance Between Drive Hole Centers and Tape Edge
1.75 -/+ 0.1
1.75 -/+ 0.1
P1
Distance Between Cavity Centers
2 -/+ 0.05
4 -/+ 0.1
P2
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
2 -/+ 0.1
2 -/+ 0.1
P0
Axial Drive Distance Between Drive Hole Centers
4 -/+ 0.1
4 -/+ 0.1
D0
Drive Hole Diameter
1.55 -/+ 0.05
1.55 -/+ 0.05
D1
Diameter of Cavity Piercing
N/A
1.05 -/+ 0.05
T1
Top Tape Thickness
0.1 Max
0.1 Max
Notes :
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/15