PLB171

PLB171
Single-Pole, Normally Closed
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Load Voltage
Load Current
On-Resistance (max)
Input Control Current
Rating
800
80
55
2
Units
VP
mArms / mADC

mA
Features
•
•
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•
•
•
•
•
Specially designed to provide 7mm of separation
between the two output pins, IXYS Integrated Circuits
Division's PLB171 is a single-pole, normally closed
(1-Form-B) Solid State Relay that uses optically
coupled MOSFET technology to provide an enhanced
input-to-output isolation of 5000Vrms.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED.
7mm Separation of Output Pins
800VP Blocking Voltage
5000Vrms Input/Output Isolation
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Surface Mount Package
Flammability Rating UL 94 V-0
The PLB171 is designed to replace, and offers
superior reliability over, electromechanical relays. This
device provides bounce-free switching in a compact
surface-mount package.
Approvals
Applications
•
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Description
Meters (Watt-Hour, Water, Gas)
Industrial Controls
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Medical Equipment—Patient/Equipment Isolation
• UL Certified Component: File E76270
• EN/IEC 60950 Certified Component:
TUV Certificate B 13 12 82667 003
Ordering Information
Part #
PLB171P
PLB171PTR
Description
6-Pin (8-Pin Body) Flatpack (50/Tube)
6-Pin (8-Pin Body) Flatpack, Tape & Reel (1000/Reel)
Pin Configuration
NC
+ Control
– Control
NC
8
1
Load
2
3
5
4
Load
Switching Characteristics of
Normally Closed Devices
Form-B
IF
ILOAD
10%
ton
DS-PLB171-R02
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90%
toff
1
INTEGRATED CIRCUITS DIVISION
PLB171
Absolute Maximum Ratings @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Parameter
Ratings Units
Blocking Voltage
800
VP
Reverse Input Voltage
5
V
Input Control Current
50
mA
Peak (10ms)
1
A
Input Power Dissipation 1
150
mW
Total Power Dissipation 2
800
mW
ESD, Human Body Model
8
kV
Isolation Voltage, Input to Output (60 Seconds)
5000
Vrms
Operational Temperature
-40 to +85
°C
Storage Temperature
-40 to +125
°C
1
2
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous 1
Peak
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate 3
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
3
25oC
Conditions
Symbol
Min
Typ
Max
Units
IF=0mA
IF=0mA , t=10ms
IF=0mA, IL= 10mA
IF=0mA, IL= 80mA
IF=5mA, VL=800VP
IL
ILPK
58
38
-
80
±250
90
55
1
mArms / mADC
mAP
ILEAK
-
ton
toff
COUT
-
0.42
0.5
8
5
5
-
IF=5mA
VR=5V
IF
IF
VF
IR
50
0.9
-
0.2
1.2
-
2
1.4
10
mA
A
V
µA
VIO=0, f=1MHz
CIO
-
3
-
pF
IF=5mA, IL=80mA
(See Timing Diagram)
IF=2mA, VL=20VDC, f=1MHz
IL=80mA
RON

A
ms
pF
@85oC.
Load derates linearly from 80mA @
to 59mA
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 5mA is recommended.
Timing Diagram
IF
IL
2
0 mA
90%
10%
0 mA
ton
toff
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R02
INTEGRATED CIRCUITS DIVISION
PLB171
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Turn-On Time
vs. LED Forward Current
(IL=80mA)
LED Forward Voltage Drop
vs. Temperature
2.0
1.5
1.4
1.3
1.2
IL=10mA
IL=5mA
IL=2mA
1.1
0.7
Turn-Off Time (ms)
IL=50mA
IL=25mA
Turn-On Time (ms)
1.5
1.0
0.5
-40
-20
0
20
40
60
Temperature (ºC)
80
0
100
LED Current to Activate
vs. Temperature
10
15
20
25
LED Forward Current (mA)
0.50
Activate
0.25
Deactivate
-20
0
20
40
60
Temperature (ºC)
80
IF=2mA
2.0
1.5
IF=5mA
1.0
60
IL=80mA
50
40
-20
0
20
40
60
Temperature (ºC)
80
20
40
60
Temperature (ºC)
80
0.2
IF=5mA
80
40
0
-40
-4
-3
-2
-1
0
1
Load Voltage (V)
2
3
950
900
850
100
80
60
40
20
-40
-20
0
20
40
60
Temperature (ºC)
80
80
100
80
100
20
100
-20
0
20
40
60
Temperature (ºC)
Output Capacitance
vs. Load Voltage
(IF=2mA)
90
0
800
20
40
60
Temperature (ºC)
40
0
-40
4
Output Capacitance (pF)
Leakage Current (nA)
1000
0
60
Typical Leakage Current
vs. Temperature
1050
-20
Maximum Load Current
vs. Temperature
100
80
IF=2mA
0.3
80
100
1100
20
40
60
Temperature (ºC)
0.4
100
Typical Blocking Voltage
vs. Temperature
0
0.5
-40
-120
0
0.6
100
-80
20
30
Turn-Off Time vs. Temperature
(IL=55mA)
120
30
10
15
20
25
LED Forward Current (mA)
0.0
-40
Load Current (mA)
70
5
0.1
Load Current vs. Load Voltage
(IF=0mA)
IL=2mA
-20
0.2
0
0.0
100
Load Current (mA)
On-Resistance (:)
80
-40
0.3
0.8
2.5
90
-20
0.4
0.0
30
0.5
100
-40
0.5
0.7
3.0
On-Resistance vs. Temperature
(IF=0mA)
Blocking Voltage (VP)
5
Turn-On Time vs. Temperature
(IL=55mA)
3.5
Turn-On Time (ms)
LED Forward Current (mA)
0.75
0.00
-40
0.6
0.1
0.0
1.0
Turn-Off Time (ms)
LED Forward Voltage Drop (V)
1.6
Turn-Off Time vs. LED Forward Current
(IL=80mA)
80
70
60
50
40
30
20
10
0
0
5
10
15
Load Voltage (VDC)
20
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R02
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3
INTEGRATED CIRCUITS DIVISION
PLB171
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
PLB171P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device
Classification Temperature (Tc)
Dwell Time (tp)
Max Reflow Cycles
PLB171P
260ºC
30 seconds
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
4
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R02
INTEGRATED CIRCUITS DIVISION
PLB171
Mechanical Dimensions
PLB171P
6.350 ± 0.127
(0.250 ± 0.005)
9.398 ± 0.127
(0.370 ± 0.005)
Recommended PCB Land Pattern
Leadframe
to package
standoff
MIN=0.000
MAX=0.102
(0.004)
2.286 MAX
(0.090) MAX
See Note 3
7.620 TYP
(0.300) TYP
7.62
(0.30)
7.620 ± 0.254
(0.300 ± 0.010)
8.70
(0.3425)
Pin 1
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.127
(0.100 ± 0.005)
0.203 ± 0.025
(0.008 ± 0.001)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
2.159 ± 0.025
(0.085 ± 0.001)
0.864 ± 0.102
(0.034 ± 0.004)
1.55
(0.0610)
Notes:
1. Coplanarity = 0.102mm (0.004”) MAX
2. Leadframe thickness does not include solder
plating (1000 microinches MAX)
3. Sum of package height, standoff, and coplanarity
shall not exceed 2.286mm (0.090”)
2.54
(0.10)
0.65
(0.0255)
Dimensions
mm
(inches)
PLB171PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
P = 12.00
(0.472)
User Direction of Feed
Ao = 10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
5
Specification: DS-PLB171-R02
©Copyright 2016, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
3/18/2016