CPC1301 Optocoupler with High-Voltage Darlington Output INTEGRATED CIRCUITS DIVISION Parameter Breakdown Voltage - BVCEO Current Transfer Ratio - CTR Rating 350 1000-8000 Description Units VP % The CPC1301 is a unidirectional input optocoupler with a high-voltage Darlington output. Light output from the highly efficient infrared LED activates the optically coupled silicon NPN photo-Darlington output transistor. The input LED and the output transistor are separated by a 5000Vrms isolation barrier. Features • • • • 5000Vrms Input/Output Isolation 350VP Breakdown Voltage Small 4-Pin Package Surface Mount Tape & Reel Version Available With a LED current of only 1mA, a current transfer ratio of 1000% to 8000% is guaranteed at the collector of the 350V Darlington output transistor. Applications • • • • • • • Telecom Switching Tip/Ring Circuits Hook Switch Modem Switching (Laptop, Notebook, Pocket Size) Loop Detect Ringing Detect Current Sensing The CPC1301's low input current, high current transfer ratio, high output voltage capability, and large isolation barrier rating make it ideal for many applications such as telecom, industrial, and power control. Approvals • UL 1577 Approved Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN 60950 Certified Component: TUV Certificate B 13 12 82667 003 Ordering Information Part Number CPC1301G CPC1301GR CPC1301GRTR Description 4-Pin DIP (100/Tube) 4-Pin Surface Mount (100/Tube) 4-Pin Surface Mount (1000/Reel) Pin Configuration A K DS-CPC1301-R06 www.ixysic.com 1 4 2 3 C E 1 INTEGRATED CIRCUITS DIVISION CPC1301 Absolute Maximum Ratings @ 25ºC Parameter Breakdown Voltage, BVCEO Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Phototransistor Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 350 5 50 1 150 150 5000 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manfacturing testing requirements. Derate linearly 1.33 mW / oC Derate linearly 1.5 mW / oC Electrical Characteristics @ 25ºC Parameters Output Characteristics Phototransistor Breakdown Voltage Emitter-Collector Breakdown Voltage Phototransistor Output (Dark) Current Saturation Voltage Current Transfer Ratio Output Capacitance Input Characteristics Input Control Current Input Voltage Drop Input Reverse Current Common Characteristics Input to Output Capacitance Conditions Symbol Min Typ Max Units ICEO=100µA IE=0.1mA VCEO=200V, IF=0mA IC=10mA, IF=1mA IC=100mA, IF=10mA IF=1mA, VCE=1V VCEO=50V, f=1MHz BVCEO BVECO ICEO 5500 13 100 1 1.2 8000 - VP V nA CTR COUT 350 0.3 1000 - IC=10mA, VCE=1V IF=5mA VR=5V IF VF IR 0.9 - 0.07 1.2 - 1 1.4 10 mA V µA - CI/O - 3 - pF VCE(Sat) V % pF Switching Characteristics @ 25ºC Characteristic Rise Time Fall Time Turn-On Time Storage Time Turn-Off Time Turn-On Time Storage Time Turn-Off Time Symbol tR tF ton tS toff ton tS toff Test Condition VCC=10V IF=10mA RL=100 VCC=10V IF=16mA RL=180 Typ 40 2.6 2.75 20 60 1 40 80 Units IF tF VCE s tR 90% 10% tS t on t off Switching Time Test Circuit VCC RL Pulse Width=5ms Duty Cycle=50% 2 www.ixysic.com IF VCE R06 INTEGRATED CIRCUITS DIVISION CPC1301 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* LED Current (IF) vs. LED Forward Voltage (VF) 100 30 20 10 1 VCE=1.0V 1000 100 Collector Current IC (mA) Collector Current IC (mA) VCE=1.5V VCE=1.5V 100 VCE=1.0V 10 1 10 180 Collector Current vs. Collector-Emitter Voltage Leakage vs. Temperature (VCEO = 350V) 3.0 IF = 5mA 140 120 100 IF = 2mA 80 IF = 1mA 60 IF = 0.5mA 40 Leakage Current (µA) IF = 10mA 160 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Collector-Emitter Voltage V CE (V) IF=2mA -20 2.0 1.5 1.0 0.5 -40 -20 0 20 40 60 Temperature (ºC) 80 0 20 40 60 Temperature (ºC) 80 100 Collector Current vs. Temperature (VCE = 1.2V) IF=10mA 300 IF=5mA 225 150 75 IF=1mA IF=0.5mA -40 -20 0 20 40 60 80 100 Breakdown Voltage vs. Temperature 2.5 0 IF=5mA 1.1 Temperature (ºC) 20 0 IF=10mA 1.2 100 LED Current (mA) 100 10 IF=20mA 1.3 0 0.01 0.1 1 10 LED Forward Current (mA) 1 Breakdown Voltage BVCEO (VP) 0.1 IF=50mA 1.4 375 1000 10,000 1.5 1.0 -40 Collector Current vs. LED Current (IF) CTR vs. LED Current (IF) 100,000 CTR (%) 10 0.1 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage (V) 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage (V) Collector Current IC (mA) 1.6 LED Forward Voltage (V) 40 LED Current (mA) LED Current (mA) 50 LED Forward Voltage vs. Temperature LED Current (IF) vs. LED Forward Voltage (VF) 100 120 450 440 430 420 410 400 390 380 370 -40 -15 10 35 Temperature (ºC) 60 85 Switching Time vs. Load Resistance 1000 Switching Time (Ps) tOFF, IF=16mA 100 tOFF, IF=1.6mA 10 tON, IF=1.6mA 1 tON, IF=16mA 0.1 10 100 1K 10K 100K Load Resistance (:) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1301 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1301G CPC1301GR MSL 1 MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1301GR, the solder reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. For the through-hole device, CPC1301G, and any other processes, the guidelines of J-STD-020 must be observed. Device Maximum Body Temperature (Tc) Time CPC1301GR 250ºC 15 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1301 MECHANICAL DIMENSIONS CPC1301G 0.991 (0.039) PC Board Pattern (Top View) 0.254 (0.010) 3.30 ± 0.050 (0.130 ± 0.002) 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350 ± 0.127 (0.250 ± 0.005) 4.572 ± 0.127 (0.180 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) PIN 1 9.144 ± 0.508 (0.360 ± 0.020) 9º (ALL) 9º (ALL) 7.620 ± 0.250 (0.300 ± 0.010) 2.159 (0.085) 0.457 ± 0.076 (0.018 ± 0.003) 6.350 ± 0.127 (0.250 ± 0.005) 0.508 (0.020) 3.175 (0.125) 2.540 ± 0.127 (0.100 ± 0.005) Dimensions mm (inches) CPC1301GR 2.540 ± 0.127 (0.100 ± 0.005) PCB Land Pattern 3.300 ± 0.050 (0.130 ± 0.002) 0.635 ± 0.254 (0.025 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 (0.375) 7.620 ± 0.254 (0.300 ± 0.010) 8.80 (0.346) 1.60 (0.063) PIN #1 0.991 (0.039) 9º ± 1º (ALL) 2.287 (0.09) 3.480 ± 0.076 (0.137 ± 0.003) 4.572 ± 0.127 (0.180 ± 0.005) 0.254 (0.010) 0.95 (0.037) 2.540 ± 0.127 (0.100 ± 0.005) 2.287 ± 0.127 (0.090 ± 0.005) R06 0.102 min / 0.254 max (0.004 min / 0.010 max) www.ixysic.com Dimensions mm (inches) 5 INTEGRATED CIRCUITS DIVISION CPC1301 CPC1301GRTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00±0.30 (0.630±0.012) B0=5.00 (0.197) K0=4.20 (0.165) K1=3.70 (0.146) A0=10.01 (0.394) P=12.00 (0.472) Dimensions mm (inches) Embossed Carrier Embossment NOTES: 1. All dimensions meet EIA-481-C requirements 2. Unless otherwise noted, tolerances = ±0.10 (0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1301-R06 ©Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/7/2016