CPC1394

CPC1394
Single-Pole, Normally Open
4-Pin OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
600
120
35
Description
Units
VP
mArms / mADC

The CPC1394 is a single-pole, normally-open
(1-Form-A) Solid State Relay with an enhanced input
to output isolation barrier of 5000Vrms.
The relay output is constructed with efficient
MOSFET switches that use IXYS Integrated Circuits
Division's patented OptoMOS architecture. The input,
a highly efficient infrared LED, controls the optically
coupled output.
Features
•
•
•
•
•
•
•
5000Vrms Input/Output Isolation
600VP Blocking Voltage
100% Solid State
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Small 4-Pin Package
Approvals
• UL Certified Component: File E76270
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
Applications
•
•
•
•
•
•
•
•
•
•
Ordering Information
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment—Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
Part Number
CPC1394G
CPC1394GV
CPC1394GR
CPC1394GRTR
Description
4-Pin DIP (100/Tube)
4-Pin DIP V-Bend (100/Tube)
4-Pin Surface Mount (100/Tube)
4-Pin Surface Mount (1000/Reel)
Pin Configuration
+ Control
– Control
1
4
2
3
Load
Load
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
DS-CPC1394-R04
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toff
1
INTEGRATED CIRCUITS DIVISION
CPC1394
Absolute Maximum Ratings @ 25ºC
Parameter
Peak Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Package Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33mW / ºC
2
Derate linearly 3mW / ºC
Ratings
600
5
50
1
100
550
5000
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
mW
mW
Vrms
ºC
ºC
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current
Continuous
Peak
On-Resistance 1
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 2
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
Conditions
Symbol
Min
Typ
Max
Units
t=10ms
IL=120mA
VL=600VP
IL
ILPK
RON
ILEAK
-
26
-
120
±400
35
1
mArms / mADC
mAP

IF=5mA, VL=10V
(See Timing Diagram)
IF=0mA, VL=50V, f=1MHz
ton
toff
COUT
-
0.85
0.46
50
5
3
-
IL=120mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.2
0.9
-
0.45
0.4
1.2
-
2
1.4
10
VIO=0V, f=1MHz
CIO
-
3
-
A
ms
pF
mA
V
A
pF
Measurement taken within 1 second of on-time.
For operation at temperatures >60ºC, a minimum LED drive current of 4mA is recommended.
Timing Diagram
IF
0 mA
90%
IL
2
10%
0 mA
ton
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R04
INTEGRATED CIRCUITS DIVISION
CPC1394
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mA)
Typical Turn-On Time
(N=50, IF=5mA, IL=120mA)
20
25
25
20
15
10
Device Count (N)
Device Count (N)
Device Count (N)
30
15
10
5
5
0
0
Device Count (N)
25
15
10
5
0
0.35
0.40 0.45 0.50
LED Current (mA)
0.55
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=120mA)
Typical Blocking Voltage Distribution
(N=50)
20
15
10
5
1.0
-40
1.4
0
20
40
60
Temperature (ºC)
80
3
2
1
10
0.8
0.6
0.4
20
30
LED Current (mA)
40
0
20
40
60
LED Forward Voltage (V)
80
100
0.51
0.49
0.47
0
10
800
2.5
IF=2mA
2.0
1.5
IF=5mA
1.0
20
30
LED Current (mA)
40
50
Typical Turn-Off Time
vs. Temperature
(IL=70mA)
900
IF=5mA
700
600
IF=2mA
500
400
300
0.5
-20
0.53
50
Typical Turn-On Time
vs. Temperature
(IL=70mA)
3.0
1.0
715
0.45
0
Typical IF for Switch Operation
vs. Temperature
(IL=70mA)
1.2
0.2
-40
4
100
690 695 700 705 710
Blocking Voltage (VP)
0.55
0
-20
685
Typical Turn-Off Time
vs. LED Forward Current
(IL=70mA)
Turn-Off Time (Ps)
1.1
IF=5mA
IF=2mA
5
680
Turn-Off Time (ms)
Turn-On Time (ms)
1.2
Turn-On Time (ms)
LED Forward Voltage (V)
1.3
10
Typical Turn-On Time
vs. LED Forward Current
(IL=70mA)
5
1.4
15
25.50 25.75 26.00 26.25 26.50 26.75 27.00
On-Resistance (:)
1.6
Forward Current (mA)
20
0
0.60
IF=50mA
IF=20mA
IF=10mA
5
0.34 0.37 0.40 0.43 0.46 0.49 0.52 0.55
Turn-Off Time (ms)
Typical LED Forward Voltage Drop
vs. Temperature
1.5
10
0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00
Turn-On Time (ms)
0
0.30
15
0
1.255
Typical IF for Switch Operation
(N=50, IL=120mA)
20
Device Count (N)
1.235 1.240 1.245 1.250
LED Forward Voltage (V)
Device Count (N)
1.230
20
-40
-20
0
20
40
60
Temperature (ºC)
80
100
200
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R04
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3
INTEGRATED CIRCUITS DIVISION
CPC1394
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical On-Resistance
vs. Temperature
(IF=2mA, IL=70mA)
0.15
25
20
Load Current (mA)
30
0.05
0.00
-0.05
-0.10
-0.15
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Blocking Voltage
vs. Temperature
100
Leakage Current (nA)
Blocking Voltage (VP)
725
700
675
650
625
600
-40
-20
0
20
40
60
Temperature (ºC)
80
100
110
100
90
70
-4
750
120
80
-3
-2
-1
0
1
Load Voltage (V)
2
3
Typical Leakage vs. Temperature
(VL=600V)
40
20
0
20
40
60
Temperature (ºC)
80
0
20
40
60
Temperature (ºC)
80
100
10s
100s
Energy Rating Curve
60
-20
-20
1.0
80
0
-40
-40
4
Load Current (A)
15
-40
Maximum Load Current
vs. Temperature
(IF=2mA)
130
0.10
Load Current (A)
On-Resistance (:)
35
Typical Load Current
vs. Load Voltage
(IF=2mA)
100
0.8
0.6
0.4
0.2
0.0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R04
INTEGRATED CIRCUITS DIVISION
CPC1394
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1394G / CPC1394GV
CPC1394GR
MSL 1
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1394GR, the solder
reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed.
For the through-hole devices, CPC1394G and CPC1394GV, and any other processes, the guidelines of J-STD-020
must be observed.
Device
Maximum Body Temperature (Tc)
Time
CPC1394GR
250ºC
15 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
R04
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5
INTEGRATED CIRCUITS DIVISION
CPC1394
MECHANICAL DIMENSIONS
CPC1394G
0.991
(0.039)
PC Board Pattern (Top View)
0.254
(0.010)
3.30 ± 0.050
(0.130 ± 0.002)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
PIN 1
9º (ALL)
9º (ALL)
7.620 ± 0.250
(0.300 ± 0.010)
2.159
(0.085)
0.457 ± 0.076
(0.018 ± 0.003)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
0.508
(0.020)
3.175
(0.125)
2.540 ± 0.127
(0.100 ± 0.005)
Dimensions
mm
(inches)
CPC1394GV
0.254
(0.010)
0.991
(0.039)
3.30 ± 0.050
(0.130 ± 0.002)
PC Board Pattern (Top View)
10.160 ± 0.508
(0.400 ± 0.020)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.050
(0.250 ± 0.002)
4.572 ± 0.050
(0.180 ± 0.002)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.050
(0.100 ± 0.002)
6
2.540 ± 0.127
(0.100 ± 0.005)
10.160 ± 0.127
(0.400 ± 0.005)
Pin 1
9º (ALL)
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
1.778
(0.070)
0.127
(0.005)
Dimensions
mm
(inches)
2.92
(0.115)
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INTEGRATED CIRCUITS DIVISION
CPC1394
CPC1394GR
2.540 ± 0.127
(0.100 ± 0.005)
PCB Land Pattern
3.300 ± 0.050
(0.130 ± 0.002)
0.635 ± 0.254
(0.025 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
9.525
(0.375)
7.620 ± 0.254
(0.300 ± 0.010)
8.80
(0.346)
1.60
(0.063)
PIN #1
0.991
(0.039)
3.480 ± 0.076
(0.137 ± 0.003)
4.572 ± 0.127
(0.180 ± 0.005)
9º ± 1º
(ALL)
2.287
(0.09)
0.95
(0.037)
0.254
(0.010)
2.540 ± 0.127
(0.100 ± 0.005)
Dimensions
mm
(inches)
0.102 min / 0.254 max
(0.004 min / 0.010 max)
2.287 ± 0.127
(0.090 ± 0.005)
CPC1394GRTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00±0.30
(0.630±0.012)
B0=5.00
(0.197)
K0=4.20
(0.165)
K1=3.70
(0.146)
A0=10.01
(0.394)
P=12.00
(0.472)
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-CPC1394-R04
©Copyright 2016, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
1/7/2016