LOC112

LOC112
Linear Optocoupler
INTEGRATED CIRCUITS DIVISION
Parameter
LED Operating Range
K3, Transfer Gain
Isolation, Input to Output
Rating
2-10
0.733-1.072
3750
Description
Units
mA
-
Vrms
Features
•
•
•
•
•
•
•
•
•
•
0.01% Servo Linearity
THD -87dB Typical
Wide Bandwidth (>200kHz)
Couples Analog and Digital Signals
High Gain Stability
Low Input/Output Capacitance
Low Power Consumption
8-Pin Flatpack or DIP Package
Surface Mount and Tape & Reel Versions Available
VDE Compatible
Applications
• Modem Transformer Replacement With No
Insertion Loss
• Digital Telephone Isolation
• Power Supply Feedback Voltage/Current
• Medical Sensor Isolation
• Audio Signal Interfacing
• Isolation of Process Control Transducers
The LOC112 Single Linear Optocoupler features an
infrared LED optically coupled with two photodiodes.
One feedback (input) photodiode is used to generate
a control signal that provides a servomechanism
to the LED drive current, thus compensating
for the LED's nonlinear time and temperature
characteristics. The other (output) photodiode
provides an output signal that is linear with respect
to the servo LED current. The product features
wide bandwidth, high input to output isolation and
excellent servo linearity.
Approvals
• UL Recognized Component: File # E76270
• CSA Certified Component: Certificate # 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate # B 13 12 82667 003
Ordering Information
Part Number
LOC112
LOC112P
LOC112PTR
LOC112S
LOC112STR
Description
8-Pin DIP (50/Tube)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1000/Reel)
8-Pin Surface Mount (50/tube)
8-Pin Surface Mount (1000/Reel)
Each tube or reel will contain only devices of one K3-sorted value.
Devices will be individually marked with the letter of their K3 bin.
K3 Sorted Bins
Bin D = 0.733 - 0.805
Bin E = 0.806 - 0.886
Bin F = 0.887 - 0.974
Bin G = 0.975 - 1.072
Devices of any available bin will be shipped.
Pin Configuration
- LED
+ LED
C1
A1
DS-LOC112-R07
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1
8
2
7
3
6
4
5
N/C
N/C
C2
A2
1
INTEGRATED CIRCUITS DIVISION
LOC112
Absolute Maximum Ratings @ 25ºC
Parameter
Reverse LED Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation1
Total Package Dissipation2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / °C
2
Derate linearly 6.67 mW / °C
Ratings
5
100
1
150
500
3750
-40 to +85
-40 to +125
Units
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Electrical Characteristics @ 25ºC
Parameter
Input Characteristics
LED Voltage Drop
Reverse LED Current
Coupler/Detector Characteristics
Dark Current
K1, Servo Gain (IC1/IF)
K2, Forward Gain (IC2/IF)
K3, Transfer Gain (K2/K1=IC2/IC1)
K3, Transfer Gain Linearity (non-servoed)
K3 Temperature Coefficient
Common-Mode Rejection Ratio
Total Harmonic Distortion
Frequency Response 1
Input/Output Capacitance
1
2
Conditions
Symbol
Min
Typ
Max
Units
IF = 2 - 10mA
VR = 5V
VF
IR
0.9
-
1.2
-
1.4
10
V
A
IF=0mA, VC1-A1=VC2-A2=15V
ID
K1
K2
K3
K3
K3/T
CMRR
THD
0.004
0.004
0.733
-96
25
0.030
0.030
1.072
1
-80
nA
%
% / ºC
dB
dB
f-3dB
-
-
kHz
CIO
-
1
0.007
0.007
0.005
130
-87
200
40
3
-
pF
IF=2 - 10mA, VC1-A1=VC2-A2=15V
IF=2 - 10mA
IF=2 - 10mA, VC1-A1=VC2-A2= 5V
V=20VP-P , RL=2k, f=100Hz
f0=350Hz, 0dBm
Photoconductive Configuration
Photovoltaic Configuration
VIO=0V, f=1MHz
Refer to Application Note, AN-107, for LOC112 configurations.
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INTEGRATED CIRCUITS DIVISION
LOC112
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Forward Current
vs. LED Forward Voltage
60
40
30
20
LED Forward Voltage Drop (V)
100
50
LED Current (mA)
LED Current (mA)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Current
vs. LED Forward Voltage
10
1
0.1
10
1.0
1.1
1.2
1.3
1.4
0.01
1.5
1.1
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
LED Forward Voltage (V)
Servo Gain
vs. LED Current & Temperature
Servo-Photocurrent
vs. LED Current & Temperature
Servo-Photocurrent (PA)
0ºC
25ºC
50ºC
70ºC
85ºC
0.012
0.008
0.004
0ºC
25ºC
50ºC
70ºC
85ºC
120
100
80
60
40
20
0
0.000
0
2
4
6
8
LED Current (mA)
10
12
0
2
4
6
8
LED Current (mA)
10
IF=50mA
IF=20mA
IF=10mA
1.5
1.4
1.3
1.2
IF=5mA
IF=2mA
IF=1mA
1.1
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Normalized Servo-Photocurrent
vs. LED Current & Temperature
140
0.016
Servo Gain
1.0
Normalized Servo-Photocurrent
0
1.6
12
4.0
0ºC
25ºC
50ºC
70ºC
85ºC
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
2
4
6
8
LED Current (mA)
10
12
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R07
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3
INTEGRATED CIRCUITS DIVISION
LOC112
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture
Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the
latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
LOC112 / LOC112S
LOC112P
MSL 1
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device
Classification Temperature (TC)
Dwell Time (tp)
Max Reflow Cycles
LOC112
LOC112S
LOC112P
250ºC
250ºC
240ºC
30 seconds
N/A
3
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
4
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R07
INTEGRATED CIRCUITS DIVISION
LOC112
Mechanical Dimensions
LOC112
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
LOC112P
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
2.286 MAX.
(0.090 MAX.)
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
8.70
(0.3425)
1.55
(0.0610)
0.203 ± 0.013
(0.008 ± 0.0005)
9.652 ± 0.381
(0.380 ± 0.015)
PCB Land Pattern
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
Dimensions
mm
(inches)
LOC112S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
R07
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5
INTEGRATED CIRCUITS DIVISION
LOC112
LOC112PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
Ao = 10.30
(0.406)
P = 12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
LOC112STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
K0 =4.90
(0.193)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-LOC112-R07
©Copyright 2016, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
2/1/2016