1/4 Structure Silicon Monolithic Integrated Circuit Product Series 5ch Sensorless System Motor Driver for MD Type BD6603KVT Features ・Operates at low power supply voltage (2.3V min.) ・Power DMOS output with low ON resistance (0.8Ω typ.) ・Incorporates a charge pump circuit for VG boost ・3-phase full-wave sensorless driving system for spindle ・4ch, 2-value control H-bridges for sled/focus/tracking/head up/down ・2ch half-bridges for spindle/sled VM power supply ○Absolute maximum ratings (Ta=25°C) Parameter Symbol Power supply voltage for control circuit Power supply voltage for driver block Limit Unit VCC 7 V VM 7 V Power supply voltage for pre-driver block VG 15 V Input voltage VIN 0~VCC V Output current Iomax *500 mA Pd **1250 mW Power dissipation Operating temperature range Topr -25~+75 ℃ Storage temperature range Tstg -55~+150 ℃ Tjmax +150 ℃ Junction temperature *Must not exceed Pd or ASO, Tjmax=150℃. **Reduced by 10.0mW/°C over Ta=25°C, when mounted on a glass epoxy board (70mm70mm1.6mm). ○Operating conditions (Ta=-25~+75℃) Parameter Power supply voltage Pulse input frequency Symbol Min. Typ. VCC 2.3 VM - VG VM+3 9 14 V fin - - 200 kHz REV. B Max. Unit 3.0 6.5 V - 6.5 V 2/4 ○Electrical characteristics (Unless otherwise specified, Ta=25°C, VCC=3V, VM=2.5V, fin=176kHz) Parameter Circuit current Output ON resistance Symbol Limit Unit Conditions Min. Typ. Max. ICC - 5.6 8.0 mA at operation in all blocks IST - 16 50 μA at standby in all blocks RON - 0.8 1.2 Ω upper and lower ON resistance in total VG=10V ~Boost circuit~ VG1 7.5 8.9 10.0 V each input L VG2 6.0 7.3 9.5 V at operation in all blocks Self propelled oscillating frequency fOSC 125 250 400 kHz External clock synchronous range fSYNC - - 500 kHz - +10 mV Output voltage ~Oscillation circuit~ input from EXTCLK pin ~Spindle (3-phase full-wave sensorless driver) block~ Position detection comparator offset VCO -10 Detection comparator input range VCD 0 - VCC-1.0 V CST charge current ICTO -0.9 -2.1 -3.3 μA CST=1V CST discharge current ICTI 2.0 3.6 5.3 mA CST=1V CSL charge current ICLO -4.0 -8.0 -12 μA CSL=VCC-0.4V CSL discharge current ICLI 2.0 5.5 5.3 μA CSL=VCC-0.4V Brake comparator input current IBR - - 2.0 μA BRK=VCC Brake comparator input offset VBO -15 - +15 mV Brake comparator input range VBD 0 - VCC-1.5 V FG output L voltage VOLF - 0.2 0.3 V Io=500μA ~Sled, focus, tracking, head up/down, PWM power supply (H-bridge, half-bridge driver) block~ Logic H level input voltage VINH VCC-0.4 - - Logic L level input voltage VINL - - 0.4 V IINH1 - - 1 μA VIN=3V IINH2 - 350 600 μA VIN=3V EXTCLK pin VIN=0V Logic H level input current Logic L level input current Output propagation delay time Minimum input pulse width V IINL -1 - - μA TRISE - 0.2 1 μsec TFALL - 0.1 0.7 μsec tmin 200 - - nsec ◎This product is not designed for protection against radioactive rays. REV. B output pulse width 2/3tmin or more 3/4 ○Package outlines Type BD6603KVT Lot No. TQFP64V outlines (Unit:mm) ○Pin No./Pin name + + SPCOM SPCOM SPVIN VCC1,2 SPUIN BRK- BRK+ ○Block diagram + CSL2 CSL1 Slope Signal SPW OUT Drive VG CLK OUT IN1 EXT PW1 PW SLED MOTOR IN4R Pre Drive Pre Drive IN3F IN3R IN2F IN4F IN2 PW Pre Drive IN2R Pre Drive IN1F PW2 OUT Pre Drive VG Pre Drive OUT OUT SPV SPV Pre C1M IN1R C1P C2P Charge Pump Oscillator C2M STHB Stand-by STALL TSD Phase Control FG Logic CST + REV. B NO. Pin name NO. Pin name 1 PWIN2 33 CSL1 2 IN1F 34 FG 3 IN1R 35 IN4R 4 IN2F 36 IN4F 5 IN2R 37 IN3R 6 H1PG2 38 IN3F 7 H1ROUT 39 H4PG1 8 H1VM 40 H4FOUT 9 H1FOUT 41 H4VM 10 H1PG1 42 H4ROUT H4PG2 11 H2PG2 43 12 H2ROUT 44 H3PG1 13 H2VM 45 H3FOUT 14 H2FOUT 46 H3VM 15 H2PG1 47 H3ROUT 16 BRK- 48 H3PG2 17 BRK+ 49 VG 18 SPUIN 50 C2M 19 SPVIN 51 C2P 20 SPWIN 52 C1M 21 SPCOM 53 C1P 22 SGND 54 EXTCLK 23 ASGND 55 STHB 24 SPPG2 56 STALL 25 SPUOUT 57 VCC1 26 SPVM2 58 VCC2 27 SPVOUT 59 PW2VM 28 SPPG1 60 PW2OUT 29 SPWOUT 61 PWPG 30 SPVM1 62 PW1OUT 31 CST 63 PW1VM 32 CSL2 64 PWIN1 4/4 ○Notes on the use (1) Absolute maximum ratings If the input voltage or the operating temperature range exceeds absolute maximum ratings, IC may be damaged. No destruction mode (e.g., short-circuiting or open) can be specified in that case. If such special mode as will exceed absolute maximum ratings is assumed, take the physical safety measures, such as a fuse. (2) Power supply lines The regenerated current by BEMF of the motor will return. Therefore, take measures, such as the insertion of a capacitor between the power supply and GND as the pass of the regenerated current. Determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. (3) Ground potential Ensure a minimum GND pin potential in all operating conditions. (4) Design for heat Use the design for heat that allows for a sufficient margin in light of the power dissipation (Pd) in actual using conditions. (5) Operation in strong magnetic field Use caution when using the IC in the strong magnetic field as doing so may cause the IC to malfunction. (6) ASO When using the IC, make settings so that the output transistors for the motor will not be used under conditions in excess of the absolute maximum ratings and ASO. (7) Thermal shutdown circuit This IC incorporates thermal shutdown circuit(TSD circuit). When the chip temperature becomes the one shown in below, TSD circuit operates and makes the coil output to motor open. It is designed to shut the IC off from runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD ON temperature[℃] (typ.) 175 (8) Hysteresis emperature [℃] 20 (typ.) Ground wiring pattern When having both small signal and large current GND, it is recommended to isolate the two GND patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause voltage variations of the small signal GND. Be careful not to change the GND wiring pattern of any external parts, either. REV. 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