AOS Semiconductor Product Reliability Report AO4438/AO4438L, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AO4438. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO4438 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. I. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Product Description: The AO4438 uses advanced trench technology to provide excellent RDS(ON) and low gate charge. This device is suitable for use as a load switch or in PWM applications. Standard Product AO4438 is Pb-free (meets ROHS & Sony 259 specifications). AO4438L is a Green Product ordering option. AO4438 and AO4438L are electrically identical. 2 II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Flammability Rating Backside Metallization Moisture Level AO4438 AO4438L (Green Compound) Standard sub-micron Standard sub-micron Low voltage N channel process Low voltage N channel process 8 leads SOIC 8 leads SOIC Cu, S/pad, Ag spot Cu, S/pad, Ag spot Ag epoxy Ag epoxy G: Au 1.3 mils; S: Cu 2mils G: Au 1.3 mils; S: Cu 2mils Epoxy resin with silica filler Epoxy resin with silica filler UL-94 V-0 UL-94 V-0 Ti / Ni / Ag Ti / Ni / Ag Up to Level 1 * Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AO4438 (Standard) & AO4438L (Green) Test Item Test Condition Time Point Lot Attribution Total Sample size Solder Reflow Precondition Standard: 1hr PCT+3 cycle reflow@260°c Green: 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax 0hr Standard: 83 lots Green: 29 lots 17380 pcs 0 168 / 500 hrs 10 lots 820 pcs 0 1000 hrs (Note A*) 77+5 pcs / lot 168 / 500 hrs 10 lots 1000 hrs (Note A*) 100 hrs Standard: 81 lots Green: 16 lots HTGB HTRB HAST Pressure Pot Temperature Cycle Temp = 150°c , Vds=80% of Vdsmax 130 +/- 2°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°c , 29.7psi, RH=100% -65°c to 150°c , air to air 96 hrs 250 / 500 cycles (Note B**) Standard: 83 lots Green: 20 lots (Note B**) Standard: 87 lots Green: 29 lots (Note B**) 820 pcs Number of Failures 0 77+5 pcs / lot 5335 pcs 0 50+5 pcs / lot 5665 pcs 0 50+5 pcs / lot 6380 pcs 0 50+5 pcs / lot 3 III. Result of Reliability Stress for AO4438 (Standard) & AO4438L (Green) Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°°C bake 150°°C bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°°C 5 sec 15 15 leads 0 Note A: The HTGB and HTRB reliability data presents total of available AO4438 and AO4438L burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AO4438 and AO4438L comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 3 MTTF = 37063 years 4