Reliability Report

AOS Semiconductor
Product Reliability Report
AOT474/AOT474L,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive
Sunnyvale, CA 94085
U.S.
Tel: (408) 830-9742
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AOT474. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOT474 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
V.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
Quality Assurance Information
I. Product Description:
The AOT474/L uses a robust technology that is designed to provide efficient and reliable power
conversion even in the most demanding applications, including motor control. With low RDS(ON)
and excellent thermal capability this device is appropriate for high current switching and can
endure adverse operating conditions.
AOT474/AOT474L are electrically Identical.
AOT474 -RoHS Compliant
AOT474L -Halogen Free
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Maximum
Units
Drain-Source Voltage
VDS
75
V
Gate-Source Voltage
VGS
±25
V
Continuous Drain
Current
TA=25°C
127
A
ID
89
Pulsed Drain Current
IDM
240
Avalanche Current
IAR
106
TA=100°C
TA=25°C
Power Dissipation
TA=100°C
Junction and Storage
Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-toAmbient
Maximum Junction-to-Case
A
417
PD
W
208
TJ, TSTG
-55 to 175
Symbol
SteadyState
SteadyState
RθJA
°C
Typ.
Units
13.9
°C/W
65
RθJC
0.36
°C/W
2
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Flammability Rating
Backside Metallization
Moisture Level
AOT474
AOT474L (Green Compound)
Standard sub-micron
Standard sub-micron
Low voltage N channel process Low voltage N channel process
3 leads TO220
3 leads TO220
Bare Cu
Bare Cu
Soft solder
Soft solder
Al 5&15mils
Al 5&15mils
Soft solder
Soft solder
UL-94 V-0
UL-94 V-0
Ti / Ni / Ag
Ti / Ni / Ag
Up to Level 1 *
Up to Level 1*
Note * based on info provided by assembler and mold compound supplier
III. Result of Reliability Stress for AOT474 (Standard) & AOT474L (Green)
Test Item
Test Condition
Time
Point
Lot Attribution
Total
Sample
size
Solder
Reflow
Precondition
Standard: 1hr PCT+3
cycle reflow@260°c
Green: 168hr 85°c
/85%RH +3 cycle
reflow@260°c
Temp = 150°c ,
Vgs=100% of Vgsmax
-
Standard: 24 lots
Green: 8 lots
4345pcs
0
82pcs
0
HTGB
HTRB
HAST
Pressure Pot
Temperature
Cycle
168 / 500
hrs
1 lot
1000 hrs
(Note A*)
168 / 500
hrs
1 lot
1000 hrs
(Note A*)
130°c , 85%RH,
33.3 psi, Vgs = 80% of
Vgs max
100 hrs
Standard : 21 lots
Green: 5 lots
121°c , 29.7psi,
RH=100%
96 hrs
Temp = 150°c ,
Vds=80% of Vdsmax
-65°c to 150°c ,
air to air
250 / 500
cycles
(Note B**)
Standard : 24 lots
Green: 5 lots
(Note B**)
Standard : 16 lots
Green: 8 lots
(Note B**)
Number
of
Failures
77+5 pcs /
lot
82pcs
0
77+5 pcs /
lot
1430pcs
0
50+5 pcs /
lot
1595pcs
0
50+5 pcs /
lot
1320pcs
0
50+5 pcs /
lot
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III. Result of Reliability Stress for AOT474 (Standard) & AOT474L (Green)
Continues
DPA
Internal Vision
Cross-section
X-ray
CSAM
NA
5
5
5
5
5
5
0
NA
5
5
0
Bond Integrity
Room Temp
150°c bake
150°c bake
0hr
250hr
500hr
40
40
40
40 wires
40 wires
40 wires
0
Solderability
245°c
5 sec
15
15 leads
0
Note A: The HTGB and HTRB reliability data presents total of available AOT474 and AOT474L
burn-in data up to the published date.
Note B: The pressure pot, temperature cycle and HAST reliability data for AOT474 and AOT474L
comes from the AOS generic package qualification data.
IV. Reliability Evaluation
FIT rate (per billion): 43
MTTF = 2639 years
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