http://datasheet.sii-ic.com/en/temperature_sensor/S5852A_E.pdf

S-5852A Series
www.sii-ic.com
HIGH-ACCURACY DIGITAL TEMPERATURE SENSOR
WITH THERMOSTAT FUNCTION
© SII Semiconductor Corporation, 2015-2016
Rev.1.1_00
The S-5852A Series is a high-accuracy digital temperature sensor with thermostat function, which operates in 1.7 V to 3.6 V
2
voltage ranges. The S-5852A Series interfaces with exteriors via I C-bus and operates at 1.0 MHz maximum. The
2
temperature detection signal is output by using the thermostat function which can be set by the I C-bus. Moreover, a
2
substantial reduction in current consumption may be achieved by using the shutdown mode which can be set by the I C-bus.
The operation of the S-5852A Series is explained in the user's manual. Contact our sales office for more information.
Caution
This product is intended to use in general electronic devices such as consumer electronics, office
equipment, and communications devices. Before using the product in medical equipment or automobile
equipment including car audio, keyless entry and engine control unit, contact to SII Semiconductor
Corporation is indispensable.
 Features
• Temperature accuracy, high-accuracy temperature range*1: ±0.5°C typ. / ±1.0°C max. (Ta = 0°C to +65°C)
±0.5°C typ. / ±1.0°C max. (Ta = +75°C to +95°C)
• Temperature resolution:
0.5°C, 0.25°C, 0.125°C, 0.0625°C
(Selectable by the resolution register)
• Temperature sample rate:
7 samples / s min.
• Hysteresis width:
No hysteresis, 1.5°C, 3.0°C, 6.0°C
(Selectable by the configuration register)
• Current consumption:
Shutdown mode at serial bus non-active:
IDD3 = 0.3 μA typ., IDD3 = 3.0 μA max.
Active mode at serial bus non-active:
IDD1 = 40.0 μA typ., IDD1 = 100.0 μA max.
• Operation voltage range:
1.7 V to 3.6 V
• Operation frequency:
1.0 MHz max. (VDD = 2.2 V to 3.6 V)
400 kHz max. (VDD = 1.7 V to 2.2 V)
• Thermostat function:
Dual trip mode, single trip mode
(Selectable by the configuration register)
• Noise suppression:
Schmitt trigger and noise filter on input pins (SCL, SDA)
• Operation temperature range:
Ta = −40°C to +125°C
• Lead-free (Sn 100%), halogen-free
*1.
The option of the high-accuracy temperature range can be selected.
 Applications
•
•
•
•
•
Solid state drive
Hard disk drive
Notebook PC, tablet PC
Refrigerator
Air conditioning system


 Package
• HSNT-8(2030)
1
HIGH-ACCURACY DIGITAL TEMPERATURE SENSOR WITH THERMOSTAT FUNCTION
Rev.1.1_00
S-5852A Series
 Block Diagram
A0
A1
Power-on reset
A2
SCL
SDA
VSS
Pointer register
Serial interface
circuit
Temperature sensor register
Capabilities register
Configuration register
Dual trip HIGH limit register
Dual trip LOW limit register
Single trip HIGH limit register
Temperature
sensor
 A/D
converter
Ambient temperature register
Resolution register
Figure 1
2
VDD
Thermostat
circuit
TMS
HIGH-ACCURACY DIGITAL TEMPERATURE SENSOR WITH THERMOSTAT FUNCTION
Rev.1.1_00
S-5852A Series
 Product Name Structure
1. Product name
S-5852A B
C
x
C
-
A8T1
U
4
Environmental code
U:
Lead-free (Sn 100%), halogen-free
Package abbreviation and IC packing specifications*1
A8T1: HSNT-8(2030), Tape
Operation temperature range
C:
Ta = −40°C to +125°C
High-accuracy temperature range
A:
Ta = +75°C to +95°C
B:
Ta = 0°C to +65°C
Temperature accuracy
C:
±0.5°C typ. / ±1.0°C max.
Operation voltage
B:
VDD = 1.7 V min.
*1.
Refer to the tape drawing.
2. Package
Table 1 Package Drawing Codes
Package Name
HSNT-8(2030)
Dimension
Tape
Reel
Land
PP008-A-P-SD
PP008-A-C-SD
PP008-A-R-SD
PP008-A-L-SD
3. Product name list
Table 2
Product Name
S-5852ABCBC-A8T1U4
Operation Voltage
Temperature Accuracy
High-accuracy
Temperature Range
Operation Temperature
Range
1.7 V min.
±0.5°C typ. / ±1.0°C max.
Ta = 0°C to +65°C
Ta = −40°C to +125°C
Remark Please contact our sales office for S-5852ABCAC-A8T1U4.
3
HIGH-ACCURACY DIGITAL TEMPERATURE SENSOR WITH THERMOSTAT FUNCTION
Rev.1.1_00
S-5852A Series
 Pin Configuration
1. HSNT-8(2030)
Top view
Table 3
1
8
4
5
Bottom view
8
1
5
4
*1
Pin No.
1
2
3
4
5
6
7
8
Symbol
A0
A1
A2
VSS
SDA*2
*2
SCL
_______
TMS
VDD
Description
Slave address input pin
Slave address input pin
Slave address input pin
GND pin
Serial data I/O pin
Serial clock input pin
Temperature switch output (Thermostat output) pin
Power supply pin
Figure 2
*1. Connect the heat sink of backside at shadowed area to the board, and set electric potential open or GND.
However, do not use it as the function of electrode.
*2. Do not use it in "High-Z".
4
HIGH-ACCURACY DIGITAL TEMPERATURE SENSOR WITH THERMOSTAT FUNCTION
Rev.1.1_00
S-5852A Series
 Absolute Maximum Ratings
Table 4
Item
Power supply voltage
Input voltage (SCL, A0, A1, A2)
I/O voltage (SDA)
_______
Output voltage (TMS)
Symbol
Absolute Maximum Rating
Unit
−0.3 to +4.3
−0.3 to +4.3
−0.3 to +4.3
V
V
V
VDD
VIN
VIO
VOUT
−0.3 to +4.3
Operation ambient temperature
Topr
−40 to +125
Storage temperature
Tstg
−65 to +150
Caution The absolute maximum ratings are rated values exceeding which the product could
physical damage. These values must therefore not be exceeded under any conditions.
V
°C
°C
suffer
 Recommended Operation Conditions
Table 5
Item
Power supply voltage
Operation ambient temperature
High level input voltage
Low level input voltage
Symbol
VDD
Topr
VIH
VIL
Min.
Max.
Unit
1.7
−40
0.7 × VDD
−0.3
3.6
+125
3.6
0.3 × VDD
V
°C
V
V
 Pin Capacitance
Table 6
(Ta = +25°C, fSCL = 1.0 MHz, VDD = 2.5 V)
Item
Input capacitance
I/O capacitance
Output capacitance
Symbol
CIN
CI/O
COUT
Condition
VIN = 0 V (SCL, A0, A1, A2)
VI/O = 0 V (SDA)
_______
VOUT = 0 V (TMS)
Min.
−
−
−
Max.
6
8
8
Unit
pF
pF
pF
5
HIGH-ACCURACY DIGITAL TEMPERATURE SENSOR WITH THERMOSTAT FUNCTION
Rev.1.1_00
S-5852A Series
 DC Electrical Characteristics
Table 7
Item
Current consumption
at active mode
Current consumption
at shutdown mode
Symbol
IDD1
IDD2
IDD3
IDD4
Condition
Min.
Typ.
Max.
Unit
Active mode at serial bus non-active
Active mode at serial bus active
Shutdown mode at serial bus non-active
Shutdown mode at serial bus active
−
−
−
−
40.0
−
0.3
−
100.0
400.0
3.0
400.0
μA
μA
μA
μA
Table 8
Symbol
Item
Input leakage current
ILI
Output leakage current
ILO
Input current 1
IIL
Input current 2
IIH
Input impedance 1
ZIL
Input impedance 2
ZIH
Low level output voltage
VOL
Low level output current 1 IOL1
Low level output current 2 IOL2
6
Condition
SCL, SDA
VIN = V_______
SS to VDD
SDA, TMS
VOUT = VSS to VDD
A0, A1, A2
VIN < 0.3 × VDD
A0, A1, A2
VIN > 0.7 × VDD
A0, A1, A2
VIN = 0.3 × VDD
A0, A1, A2
VIN = 0.7
×V
_______ DD
SDA, TMS
IOL = 3.0
mA
_______
SDA, TMS
V, 2.2 V ≤ VDD ≤ 3.6 V
VOL = 0.4
_______
SDA, TMS
VOL = 0.6 V, 1.7 V ≤ VDD ≤ 2.2 V
Min.
Max.
Unit
−
1.0
μA
−
1.0
μA
−
50.0
μA
−
2.0
μA
30
−
kΩ
800
−
kΩ
−
0.4
V
20
−
mA
6
−
mA
HIGH-ACCURACY DIGITAL TEMPERATURE SENSOR WITH THERMOSTAT FUNCTION
Rev.1.1_00
S-5852A Series
 AC Electrical Characteristics
Table 9 Measurement Conditions
Input pulse voltage
Input pulse rising / falling time
Output reference voltage
Output load
Input pulse voltage
0.2 × VDD to 0.8 × VDD
20 ns or less
0.3 × VDD to 0.7 × VDD
100 pF + 1 kΩ pull-up
reisitance
Output reference voltage
0.8 × VDD
0.7 × VDD
0.3 × VDD
0.2 × VDD
Figure 3 Input / Output Waveform during AC Measurement
Table 10
Item
Symbol
VDD = 1.7 V to 3.6 V
VDD = 2.2 V to 3.6 V
Min.
Max.
Min.
Max.
Unit
SCL clock frequency
fSCL
0
400
0
1000
kHz
SCL clock time "L"
tLOW
1.3
−
0.5
−
μs
SCL clock time "H"
tHIGH
0.6
−
0.26
−
μs
SDA output delay time
tAA
0.1
0.9
0.1
0.45
μs
SDA output hold time
tDH
50
−
50
−
ns
SCL, SDA rising time
tR
0.02
0.3
−
0.12
μs
SCL, SDA falling time
tF
−
0.12
μs
tSU.DAT
0.02
100
0.3
Data input setup time
−
50
−
ns
Data input hold time
tHD.DAT
0
−
ns
tSU.STA
0
0.6
−
Start condition setup time
−
0.26
−
μs
Start condition hold time
tHD.STA
0.6
−
0.26
−
μs
Stop condition setup time
tSU.STO
0.6
−
0.26
−
μs
Bus release time
tBUF
1.3
−
0.5
−
μs
Noise suppression time
tI
−
50
−
50
ns
tHIGH
tF
tLOW
tR
SCL
tHD.STA
tHD.DAT
tSU.STA
tSU.DAT
tSU.STO
SDA
(Input)
tAA
tDH
tBUF
SDA
(Output)
Figure 4 Bus Timing
7
HIGH-ACCURACY DIGITAL TEMPERATURE SENSOR WITH THERMOSTAT FUNCTION
Rev.1.1_00
S-5852A Series
 Temperature Characteristics
Table 11
Item
Temperature accuracy*1
Temperature resolution
Symbol
Condition
Min.
Typ.
Max.
Unit
TACC1
Ta = 0°C to +65°C
−
±0.5
±1.0
°C
TACC2
Ta = −40°C to +125°C
−
−
±3.0
°C
TRES
Default value
−
0.25
−
°C
−
−
35
ms
−
−
70
ms
−
−
140
ms
−
−
140
ms
tCONV1
tCONV2
Temperature conversion time
tCONV3
tCONV4
TRES[1:0] = "00" setting
LSB = 0.5°C
TRES[1:0] = "01" setting
LSB = 0.25°C
TRES[1:0] = "10" setting
LSB = 0.125°C
TRES[1:0] = "11" setting
LSB = 0.0625°C
*1. TRES[1:0] = "11" setting
 Precautions
• Do not operate these ICs in excess of the absolute maximum ratings. Attention should be paid to the power supply
voltage, especially. The surge voltage which exceeds the absolute maximum ratings can cause latch-up and
malfunction. Perform operations after confirming the detailed operation condition in the datasheet.
• Operations with moisture on this IC's pins may occur malfunction by short-circuit between pins. Especially, in
occasions like picking this IC up from low temperature tank during the evaluation. Be sure that there is no frost on this
IC's pins to prevent malfunction by short-circuit.
Also attention should be paid in using on environment, which is easy to dew for the same reason.
• Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic
protection circuit.
• SII Semiconductor Corporation claims no responsibility for any and all disputes arising out of or in connection with
any infringement of the products including this IC upon patents owned by a third party.
8
HIGH-ACCURACY DIGITAL TEMPERATURE SENSOR WITH THERMOSTAT FUNCTION
Rev.1.1_00
S-5852A Series
 Characteristics (Typical Data)
1. Current consumption at active mode (IDD1) vs. Temperature (Ta)
100
IDD1 [A]
80
VDD = 3.6 V
VDD = 2.5 V
60
40
20
VDD = 1.7 V
0
40 25
0
25
50
75
100
125
Ta [C]
2. Current consumption at shutdown mode (IDD3) vs. Temperature (Ta)
3.0
IDD3 [A]
2.5
2.0
VDD = 3.6 V
VDD = 2.5 V
VDD = 1.7 V
1.5
1.0
0.5
0.0
40 25
0
25
50
75
100
125
Ta [C]
3. Current consumption at active mode (IDD2) vs. SCL clock frequency (fSCL)
Ta = +25°C
400
IDD2 [A]
300
VDD = 3.6 V
VDD = 2.5 V
VDD = 1.7 V
200
100
0
0
200
400
600
800
1000
fSCL [kHz]
4. Low level output current (IOLn) vs. Low level output voltage (VOL)
Ta = +25°C
IOLn [mA]
40
VDD = 3.6 V
30
20
VDD = 1.7 V
10
0
VDD = 2.5 V
0
0.1
0.2
0.3
0.4
0.5
0.6
VOL [V]
Remark n = 1, 2
9
HIGH-ACCURACY DIGITAL TEMPERATURE SENSOR WITH THERMOSTAT FUNCTION
Rev.1.1_00
S-5852A Series
TRES[1:0] = "11" setting
4.0
3.0
2.0
1.0
0.0
1.0
2.0
3.0
4.0
40 25
TACCn max.
VDD = 1.7 V
VDD = 2.5 V
VDD = 3.6 V
VDD = 2.5 V, TRES[1:0] = "11" setting,
number of measurement = 100 pieces
0.50
TACCn [C]
TACCn [C]
5. Temperature accuracy (TACCn) vs. Temperature (Ta)
Average 6
0.25
25
50
75
100
125
0.25
0.50
Average 6
0
Ta [C]
Remark
Average
0.00
TACCn min.
0
Average 3
10
20
Average 3
30
40
50
60 65
Ta [C]
n = 1, 2
6. Temperature conversion time (tCONV4) vs. Temperature (Ta)
TRES [1:0] = "11" setting
150
VDD = 3.6 V
tCONV4 [ms]
125
100
75
50
VDD = 2.5 V
VDD = 1.7 V
25
0
40 25
0
25
50
75
100
125
Ta [C]
7. Thermal response time (Temperature vs. Time)
When HSNT-8(2030) mounted on the evaluation board is put into the liquid of +100°C from the air of +25°C.
VDD = 3.0 V
Temperature [°C]
100
90
80
70
60
50
40
30
20
2 0 2 4 6 8 10 12 14 16 18 20 22 24 26
Time [s]
Remark Evaluation board
Dimensions: 22 mm × 21 mm
Thickness: 1.6 mm
10
2.0±0.1
8
5
1
4
+0.05
0.08 -0.02
0.23±0.1
(1.70)
No. PP008-A-P-SD-1.1
0.5
The heat sink of back side has different electric
potential depending on the product.
Confirm specifications of each product.
Do not use it as the function of electrode.
TITLE
DFN-8/HSNT-8-A-PKG Dimensions
No.
PP008-A-P-SD-1.1
SCALE
UNIT
mm
SII Semiconductor Corporation
+0.1
ø1.5 -0
2.0±0.05
4.0±0.1
0.25±0.05
+0.1
ø1.0 -0
0.60±0.05
4.0±0.1
2.3±0.05
4 321
5 6 78
Feed direction
No. PP008-A-C-SD-1.0
TITLE
DFN-8/HSNT-8-A-Carrier Tape
No.
PP008-A-C-SD-1.0
SCALE
UNIT
mm
SII Semiconductor Corporation
+1.0
9.0 - 0.0
11.4±1.0
Enlarged drawing in the central part
ø13±0.2
(60°)
(60°)
No. PP008-A-R-SD-1.0
TITLE
DFN-8/HSNT-8-A-Reel
No.
PP008-A-R-SD-1.0
SCALE
UNIT
QTY.
5,000
mm
SII Semiconductor Corporation
1.6
0.30
0.50
No. PP008-A-L-SD-1.0
TITLE
No.
DFN-8/HSNT-8-A
-Land Recommendation
PP008-A-L-SD-1.0
SCALE
UNIT
mm
SII Semiconductor Corporation
Disclaimers (Handling Precautions)
1.
All the information described herein (product data, specifications, figures, tables, programs, algorithms and
application circuit examples, etc.) is current as of publishing date of this document and is subject to change without
notice.
2.
The circuit examples and the usages described herein are for reference only, and do not guarantee the success of
any specific mass-production design.
SII Semiconductor Corporation is not responsible for damages caused by the reasons other than the products or
infringement of third-party intellectual property rights and any other rights due to the use of the information described
herein.
3.
SII Semiconductor Corporation is not responsible for damages caused by the incorrect information described herein.
4.
Take care to use the products described herein within their specified ranges. Pay special attention to the absolute
maximum ratings, operation voltage range and electrical characteristics, etc.
SII Semiconductor Corporation is not responsible for damages caused by failures and/or accidents, etc. that occur
due to the use of products outside their specified ranges.
5.
When using the products described herein, confirm their applications, and the laws and regulations of the region or
country where they are used and verify suitability, safety and other factors for the intended use.
6.
When exporting the products described herein, comply with the Foreign Exchange and Foreign Trade Act and all
other export-related laws, and follow the required procedures.
7.
The products described herein must not be used or provided (exported) for the purposes of the development of
weapons of mass destruction or military use. SII Semiconductor Corporation is not responsible for any provision
(export) to those whose purpose is to develop, manufacture, use or store nuclear, biological or chemical weapons,
missiles, or other military use.
8.
The products described herein are not designed to be used as part of any device or equipment that may affect the
human body, human life, or assets (such as medical equipment, disaster prevention systems, security systems,
combustion control systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment,
aviation equipment, aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle
use or other uses. Do not use those products without the prior written permission of SII Semiconductor Corporation.
Especially, the products described herein cannot be used for life support devices, devices implanted in the human
body and devices that directly affect human life, etc.
Prior consultation with our sales office is required when considering the above uses.
SII Semiconductor Corporation is not responsible for damages caused by unauthorized or unspecified use of our
products.
9.
Semiconductor products may fail or malfunction with some probability.
The user of these products should therefore take responsibility to give thorough consideration to safety design
including redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing
injury or death, fires and social damage, etc. that may ensue from the products' failure or malfunction.
The entire system must be sufficiently evaluated and applied on customer's own responsibility.
10. The products described herein are not designed to be radiation-proof. The necessary radiation measures should be
taken in the product design by the customer depending on the intended use.
11. The products described herein do not affect human health under normal use. However, they contain chemical
substances and heavy metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips
may be sharp. Take care when handling these with the bare hands to prevent injuries, etc.
12. When disposing of the products described herein, comply with the laws and ordinances of the country or region where
they are used.
13. The information described herein contains copyright information and know-how of SII Semiconductor Corporation.
The information described herein does not convey any license under any intellectual property rights or any other
rights belonging to SII Semiconductor Corporation or a third party. Reproduction or copying of the information
described herein for the purpose of disclosing it to a third-party without the express permission of SII Semiconductor
Corporation is strictly prohibited.
14. For more details on the information described herein, contact our sales office.
1.0-2016.01
www.sii-ic.com